STS3414. N-Channel Enhancement Mode Field Effect Transistor
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1 reen Product T3 amhop icroelectronics C orp. N-Channel Enhancement ode Field Effect Traistor PRODUCT UARY D ID RD(ON) (mω) ax = 3 =.5 =2.5 FEATURE uper high dee cell design for low RD(ON). Rugged and reliable. OT-23 package. OT-23 D D ABOLUTE AXIU RATIN (T A =25 C unless otherwise noted) ymbol D I D I D P D T J, T T Parameter Drain-ource oltage ate-ource oltage Drain Current-Continuous a -Pulsed b aximum Power Dissipation a Operating Junction and torage Temperature Range T A=25 C T A =25 C Limit 3 ± to 5 Units A 5 A W C THERAL CHARACTERITIC R JA Thermal Resistance, Junction-to-Ambient a C/W Details are subject to change without notice.
2 ELECTRICAL CHARACTERITIC (TA=25 C unless otherwise noted) ymbol Parameter Conditio in Typ ax Units OFF CHARACTERITIC BD Drain-ource Breakdown oltage =, ID=25uA 3 ID Zero ate oltage Drain Current D=2, = ua I ate-body Leakage Current = ±2, D= ± na ON CHARACTERITIC (th) ate Threshold oltage D=, ID=25uA RD(ON) g F Forward Traconductance D=5., ID=A 3 DYNAIC CHARACTERITIC CI Input Capacitance pf D=5,= CO Output Capacitance 2 pf f=.hz CR Reverse Trafer Capacitance 37 pf WITCHIN CHARACTERITIC td(on) tr td(off) tf Qg Qgs Qgd Drain-ource On-tate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total ate Charge ate-ource Charge ate-drain Charge c c =.5, ID=3A 5 m ohm DD=5 ID=A = REN= ohm D=5,ID=A,= 9.3 nc D=5,ID=A,=.5. nc D=5,ID=A, = DRAIN-OURCE DIODE CHARACTERITIC AND AXIU RATIN I aximum Continuous Drain-ource Diode Forward Current.25 A b D Diode Forward oltage =,I=.25A.82.2 Notes a.urface ounted on FR Board,t < _ sec. b.pulse Test:Pulse Width < _ 3us, Duty Cycle < _ 2%. c.uaranteed by design, not subject to production testing. =, ID=A 37 5 m ohm =2.5, ID=A m ohm nc nc 2
3 ID, Drain Current(A) =3.5 = =3 =2.5 =2 ID, Drain Current(A) Tj=25 C 25 C -55 C D, Drain-to-ource oltage() Figure. Output Characteristics , ate-to-ource oltage() Figure 2. Trafer Characteristics 2.75 RD(on)(m Ω) 8 2 =.5 = RD(on), On-Resistance Normalized =.5 ID=3A = ID=A Tj( C ) ID, Drain Current(A) Tj, Junction Temperature( C ) Figure 3. On-Resistance vs. Drain Current Figure. On-Resistance ariation with Drain and ate oltage Current and Temperature th, Normalized ate-ource Threshold oltage D= ID=25uA BD, Normalized Drain-ource Breakdown oltage ID=25uA Tj, Junction Temperature( C ) Figure 5. ate Threshold ariation with Temperature Tj, Junction Temperature( C ) Figure. Breakdown oltage ariation with Temperature 3
4 RD(on)(m Ω) C 75 C 25 C ID=A Is, ource-drain current(a) 2 25 C 25 C 75 C 2 8, ate-to-ource oltage() Figure 7. On-Resistance vs. ate-ource oltage D, Body Diode Forward oltage() Figure 8. Body Diode Forward oltage ariation with ource Current C, Capacitance(pF) 5 Ciss 3 2 Coss Crss , ate to ource oltage() 8 2 D=5 ID=A D, Drain-to-ource oltage() Qg, Total ate Charge(nC) Figure 9. Capacitance Figure. ate Charge 5 witching Time() TD(off ) Tr Tf TD(on) D =5,ID=A = ID, Drain Current(A) R D (O N) Limit DC ms ms. = ingle Pulse T A=25 C. 3 ms us Rg, ate Resistance(Ω) Figure. switching characteristics D, Drain-ource oltage() Figure 2. aximum afe Operating Area
5 R EN IN DD R L D OUT td(on) OUT IN % ton toff tr td(off) 9% 9% % INE R TE D % 9% 5% 5% tf PULE WIDTH Figure 3. witching Test Circuit Figure. witching Waveforms Normalized Traient Thermal Resistance.5.2 P D.. t.5 t2.2. R thj A (t)=r (t) * R thja 2. R thja= ee Datasheet. 3. T J-TA = P D* R thja (t) ingle Pulse. Duty Cycle, D=t/t quare Wave Pulse Duration(sec) Normalized Thermal Traient Impedance Curve 5
6 PACKAE OUTLINE DIENION OT 23 A L F J B C I H E D (TYP.) F I J L
7 OT-23 Tape and Reel Data OT-23 Carrier Tape TR FEED DIRECTION UNIT: PACKAE OT-23 A B K D D E E E2 P P P2 T OT-23 Reel W N K R H W UNIT: TAPE IZE REEL IZE N W W H K R
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M4N3P N-CHANNEL ENHANCEMENT-MOE POWER MOFET Low gate charge B 3V imple drive requirement R (ON) 7mΩ Fast switching I 4A escription TO-22 Power MOFETs from ilicon tandard provide the designer with the best
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SOT-.9 -. +.. -. +. Unit: mm Features VDS (V) = V ID =.8 A (VGS = V) RDS(ON) < 6mΩ (VGS = V) RDS(ON) < mω (VGS =.V). -. +..9 -. +..9 -. +.. -. +.... -. +. Pb Free Package May be Available. The G Suffix
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DESCRIPTION The STP35 is the P-Channel logic enhancement mode power field effect transistor is produced using high cell density. advanced trench technology to provide excellent RDS(ON). This device is
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DESCRIPTION The is the N-Channel logic enhancement mode power field effect transistor is produced using high cell density. advanced trench technology to provide excellent RDS(ON). low gate charge and operation
More informationSGP100N09T. Symbol Parameter SGP100N09T Unit. 70* -Continuous (TA = 100 )
SUPER-SEMI SUPER-MOSFET Super Gate Metal Oxide Semiconductor Field Effect Transistor 100V Super Gate Power Transistor SG*100N09T Rev. 1.01 Jun. 2016 SGP100N09T 100V N-Channel MOSFET Description The SG-MOSFET
More informationV DS -20V I D (at V GS =-4.5V) -5A R DS(ON) (at V GS = -1.8V) ESD protected SOT23 D G G
2V PChannel MOFET eneral escription The AO345A uses advanced trench technology to provide excellent R (ON), low gate charge and operation with gate voltages as low as.8v. This device is suitable for use
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AO43/AOI43/AOY43 3V PChannel MOFET eneral escription The AO43/AOI43/AOY43 uses advanced trench technology to provide excellent R (ON), low gate charge and low gate resistance. With the excellent thermal
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3V PChannel MOFET eneral escription The AO741 uses advanced trench technology to provide excellent R (ON), low gate charge, and operation with gate voltages as low as.5v, in the small OT33 footprint. It
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V P-Channel Enhancement-Mode MOSFET VDS= -V RDS(ON), Vgs@-.5V, Ids@-.A = mω RDS(ON), Vgs@-.5V, Ids@-.A = 15 mω Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance
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WNM2046 Single N-Channel, 20V, 0.71A, Power MOSFET Http://www.sh-willsemi.com (V) 20 Typical Rds(on) (Ω) 20@ =4.5V 60@ =2.5V 0.315@ =1.8V G S escriptions FN1006-3L The WNM2046 is N-Channel enhancement
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AO2357/AOI2357 3V PChannel MOFET eneral escription Latest advanced trench technology Low R (ON) High Current Capability RoH and HalogenFree Compliant Product ummary V 3V I (at V =V) 7A R (ON) (at V =V)
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DESCRIPTION is the N-Channel enhancement mode power field effect transistors are using trench DMOS technology. This advanced trench technology devices are well suited for high efficiency fast switching
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M25N3Q-HF N-hannel RoH evice Halogen Free Features - ingle rive Requirement..2(5.).5(4.7).(.25).7(.7) - Low On-resistance. - Fast witching haracteristic. - ynamic dv/dt rating..57(4.).5(3.).244(6.2).22(5.)
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AO347 3V PChannel MOFET eneral escription The AO347 uses advanced trench technology to provide excellent R (ON) with low gate charge. This device is suitable for use as a load switch or in PWM applications.
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DESCRIPTION The is the N-Channel logic enhancement mode power field effect transistor is produced using high cell density. Advanced trench technology to provide excellent RDS(ON). This high density process
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SMD Type P-Channel Enhancement IRLML640 (KRLML640) Features Ultra low on-resistance. P-Channel. Fast switching. 2.4 - + SOT-23 3 2.9 - + 0.4 - + 2.3 - + 0.55 0.4 Unit: mm 0.95 - +.9 - + -0.0 +0.05 0-0.38
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M5P3Q8-HF P-hannel RoH evice Halogen Free Features - imple drive requirement - Low on-resistance - Fast switching speed Mechanical data.2(5.).89(4.8).(.25).8(.9).65(.65).57(.45) - Epoxy : UL 94- rated
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N- & annel Enhancement Mode P3ND5G PRODUCT SUMMARY V (BR)DSS R DS(ON) I D annel 3 mω 5A annel -3 36mΩ -9A G D S G D S D/D SG S G G : GATE D : DRAIN S : SOURCE ABSOLUTE MAXIMUM RATINGS (T C = 5 C Unless
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DKG2 Aug. 2 Features Low on-state resistance Built-in gate protection diode SMD PKG Package TO252 Applications DC / DC converter Switching Internal Equivalent Circuit D(2) Key Specifications V (BR)DSS
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DESCRIPTION The SPN9910 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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FEATURES New technology for high voltage device Low RDS(on) low conduction losses Small package Ultra low gate charge cause lower driving requirement 100% avalanche tested Halogen Free APPLICATION Power
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Single, PNP, -30V, -A, Power Transistor with 20V N-MOSFET Http//:www.willsemi.com Descriptions The is PNP bipolar power transistor with 20V N-MOSFET. This device is suitable for use in charging circuit
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DESCRIPTION The SPN4842 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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DESCRIPTION The SPN4842 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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