FC8J33040L FC8J33040L. Dual N-channel MOSFET. Doc No. TT4-EA Revision. 2. For switching For DC-DC Converter. Internal Connection.
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1 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L FC8J334L Dual N-channel MOSFET For switching For DC-DC Converter 8.9 Unit: mm.3. Features Low drain-source On-state Resistance : RDS(on) typ = 48 m (VGS = 4. V) High-speed switching : Qg =.8 nc Halogen-free / RoHS compliant (EU RoHS / UL-94 V- / MSL:Level compliant) Marking Symbol: A Basic Part Number : Dual Nch MOS 33V (Individual) (.8).. Tr. Source. Tr. Drain. Tr. Gate. Tr. Drain 3. Tr. Source. Tr. Drain 4. Tr. Gate 8. Tr. Drain Packaging Embossed type (Thermo-compression sealing) : 3 pcs / reel (standard) Panasonic JEITA Code WMini8-F SC- Absolute Maximum Ratings Ta = C Tr., Tr. Parameter Symbol Rating Unit Drain-source Voltage VDS 33 V Gate-source Voltage VGS V Drain Current (Steady State) * Drain Current (t = s) * ID. Drain Current (Pulsed) *,* IDp A Source Current (Pulsed) ISp (Body Diode) *,* (BD) Total Power Dissipation (Steady State) * PD Total Power Dissipation (t = s) *.3 W Channel Temperature Operating Ambient Temperature Tch Topr -4 to + 8 C C Storage Temperature Range Tstg - to + C Note) * Device mounted on a glass-epoxy board (See Figure ) * Pulse test: Ensure that the channel temperature does not exceed C. Internal Connection 8 (S) (G) 3 (S) Pin Name 4 (G). Tr. Source. Tr. Drain. Tr. Gate. Tr. Drain 3. Tr. Source. Tr. Drain 4. Tr. Gate 8. Tr. Drain Figure FR4 Glass-Epoxy Board.4 mm.4 mm.8 mm of
2 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L Electrical Characteristics Ta = C 3 C Tr., Tr. Static Characteristics Parameter Symbol Conditions Min Typ Max Unit Drain-source Breakdown Voltage VDSS ID = ma, VGS = V 33 V Zero Gate Voltage Drain Current IDSS VDS = 33 V, VGS = V A Gate-source Leakage Current IGSS VGS = V, VDS = V A Gate-source Threshold Voltage Vth ID =. ma, VDS = V. V Drain-source On-state Resistance * RDS(on) ID =. A, VGS = V 3 38 RDS(on) ID =. A, VGS = 4. V 48 8 m Dynamic Characteristics Input Capacitance Ciss VDS = V, VGS = V Output Capacitance Coss 4 f = MHz Reverse Transfer Capacitance Crss 3 Turn-on Delay Time * td(on) VDD = V, VGS = to V Rise Time * tr ID =. A 3 Turn-off Delay Time * td(off) VDD = V, VGS = to V Fall Time * tf ID =. A 9 Total Gate Charge Qg.8 VDD = V, VGS = to 4. V, Gate-source Charge Qgs. ID = A Gate-drain Charge Qgd. pf ns nc Body Diode Characteristic Diode Forward Voltage * VSD IS =. A, VGS = V.8. V Note). Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 3 Measuring methods for transistors.. * Pulse test: Ensure that the channel temperature does not exceed C. * Measurement circuit for Turn-on Delay Time/Rise Time/Turn-off Delay Time/Fall Time of
3 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L * Measurement circuit for Turn-on Delay Time/Rise Time/Turn-off Delay Time/Fall Time VDD = V ID =. A V V Vin PW = s D.C. % D Vout Vin G S Vin 9% % 9% 9% Vout % % td(on) tr td(off) tf 3 of
4 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L ID - VDS ID - VGS 4 VGS =. V 4. V 4. V Drain current ID (A) 3 3. V 3. V Drain current ID (A) Ta = 8-4 Drain-source Voltage VDS (V)...3 Drain-source voltage VDS (V) VDS - VGS.8 ID =. A.. A.4.. A 4 8 Gate-source Voltage VGS (V) Capacitance - VDS Drain-source On-state Resistance RDS(on) (mω) 3 4 Gate-source voltage VGS (V) RDS(on) - ID VGS = 4. V. V Drain current ID (A) Dynamic Input/Output Characteristics Capacitance C (pf) Ciss Coss Crss Gate-source Voltage VGS (V) VDD = V. Drain-source Voltage VDS (V) 4 8 Total Gate Charge Qg (nc) 4 of
5 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L Gate-source Threshold Voltage Vth (V)... Vth - Ta - Temperature ( ) PD - Ta Drain-source On-state Resistance RDS(on) (mω) 8 4 RDS(on) - Ta VGS = 4. V V - Temperature ( ) Total Power Dissipation PD (W).. Mounted on a glass-epoxy board (.4 x.4 x.8 mm) Temperature Ta ( C) Rth -tsw Safe Operating Area Thermal Resistance Rth ( C/W). Pulse Width tsw (s) Drain Current ID (A). IDp=A Operation in this area is limited by RDS(on) Ta= C, Glass epoxy board (.4.4 t.8mm) coated with copper foil, which has more than 3mm. ms ms ms s DC... Drain-source Voltage VDS (V) of
6 Established : --3 Revised : 3--3 Doc No. TT4-EA-33 FC8J334L WMini8-F Unit : mm.9± ±..8±. 3 4 ( ) ( ). to..8±. (.) (.) Land Pattern (Reference) (Unit : mm) of
7 Request for your special attention and precautions in using the technical information and semiconductors described in this book () If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. () The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. () When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. () Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. () This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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