ESD0P2RF-02LRH ESD0P2RF-02LS

Transcription

1 Bidirectional Ultra Low Capacitance TVS Diode ESD / transient protection of RF signal lines according to: IEC6004 (ESD): ±0kV (contact) IEC60044 (EFT): 40 A (5 / 50 ns) IEC60045 (Surge): 3 A (8 / 0 µs) Extremely small form factor down to 0.6 x 0.3 x 0.3 mm³ Very low dynamic resistance Max. working voltage: ±5.3 V Extremely low capacitance: 0. pf typ. Very low reverse current < na typ. Very low series inductance down to 0. nh typ. Pbfree (RoHS compliant) package Qualified according AEC Q Applications ESD protection of sensitive RF signal lines RF antenna protection, frontend module GPS, mobile TV, FM radio, RKE, UWB ESD0PRF0LRH ESD0PRF0LS Type Package Configuration Marking ESD0PRF0LRH ESD0PRF0LS TSLP7 TSSLP line, bidirectional line, bidirectional T T 0098

2 Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit ESD contact discharge ), contact V ESD 0 kv Peak pulse current (t p = 8 / 0 µs) ) I pp 3 A Operating temperature range T op C Storage temperature T stg V ESD according to IEC6004 I pp according to IEC60045 Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics Reverse working voltage V RWM V Breakdown voltage I (BR) = ma, from pin to I (BR) = ma, from pin to V (BR) 7 7 Reverse current V R = 5.3 V Clamping voltage I PP = A, t p = 8/0 µs ) I PP = 3 A, t p = 8/0 µs ) I R < 50 na V CL V 6 < Diode capacitance C T pf V R = 0 V, f = MHz 0.3 V R = 0 V, f = GHz 0. Dynamic resistance ( tp=30ns ) R D Ω Series inductance L S nh ESD0PRF0LS 0. ESD0PRF0LRH I pp according to IEC

3 Clamping voltage, V cl = ƒ(i pp ) t p = 8 / 0 µs Reverse current I R = ƒ(v R ) T A = Parameter 7 V 7 A C 4 Vcl 3 IR C 9 +5 C A 4 I pp Diode capacitance C T = ƒ (V R ) f = MHz V 6.5 VR Line capacitance C T = ƒ (f) V R = Parameter pf 0.5 pf 0.3 CT 0.5 CT 0.3 VR=0V VR=3.3V VR=5.3V V 6 V R MHz 3000 f

4 Line capacitance C T = ƒ(t A ) V R = Parameter, f = MHz.5 pf.3.. CT VR=5.3V VR=3.3V VR=0V C 5 T A

5 Application example ESD0PRF... line, bidirectional Connector Protected line, signal level up to ± 5.3 V (bidirectional) ESD sensitive I/O device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin (or pin ) should be connected directly to a ground plane on the board

6 Package TSLP7 ESD0PRF... Package Outline Top view Bottom view 0.05 MAX. 0.6 ±0.05 Cathode marking 0.65 ±0.05 ) Dimension applies to plated terminal ) 0.5 ±0.035 ) 0.5 ±0.035 ±0.05 Foot Print For board assembly information please refer to Infineon website "Packages" Copper Solder mask Stencil apertures Marking Layout (Example) BAR900LRH Type code Cathode marking Laser marking Standard Packing Reel ø80 mm = Pieces/Reel Reel ø330 mm = Pieces/Reel (optional) Cathode marking

7 Package TSSLP ESD0PRF

8 Edition Published by Infineon Technologies AG 876 München, Germany Infineon Technologies AG 007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered