Microwave Technology
|
|
- Lambert Patrick
- 6 years ago
- Views:
Transcription
1 GUC (Dr. Hany Hammad) 9/5/06 Microwave Technology (COMM 903) Contents Introduction: Course contents. Assessment. eferences. Microwave Sources. Transistor Model Extraction. Signal flow graphs. COMM (903) Lecture #
2 GUC (Dr. Hany Hammad) 9/5/06 Course Contents Active Microwave & F Circuits Analysis & Design Noise, Microwave Sources, Amplifiers, Mixers & Oscillators. Metamaterials and Transmission Lines Basic properties, Transmission Line Implementations and Applications. Teaching Assistant (Tutorials) En. anda El Khosht Teaching Assistant (Advanced Comm. Lab.) Eng. asmine Abdella eferences David M. Pozar, Microwave Engineering, 3rd Edition, Wiley. Lecture Notes COMM (903) Lecture #
3 GUC (Dr. Hany Hammad) 9/5/06 Assessment Quizzes (-3) 5 Tutorial Assignments 5 Project 0 Mid Term Examination 5 Final Examination 45 Total 00 Microwave Sources Solid State Sources Low Power & Low Frequencies Sources Microwave Tubes High Power &/or high frequencies Sources Microwave Engineering, 3rd Edition by David M. Pozar Copyright 004 John Wiley & Sons COMM (903) Lecture # 3
4 GUC (Dr. Hany Hammad) 9/5/06 Microwave Tubes Types of Microwave Tubes: Klystron TWT (Traveling Wave Tubes) Helix TWT. Coupled cavity TWT. Magnetron. Gyroton. Gridded Tube. CFA (crossed field amplifiers) Solid State Sources Advantages: Small Size. Low Cost. Compatibility with microwave integrated circuits. Disadvantages: Low power. Low frequencies. COMM (903) Lecture # 4
5 GUC (Dr. Hany Hammad) 9/5/06 Solid State Sources Can be categorized as: Two terminal devices Ex.: Diodes. Three terminal devices Ex.: Transistor oscillators. Diode Sources Most common diode sources: Gunn diode. IMPATT diode. Directly convert DC bias to F power in the frequency range of to 00 GHz. COMM (903) Lecture # 5
6 GUC (Dr. Hany Hammad) 9/5/06 Gunn Diode Even though everyone uses this term! It s more accurate name is a Transferred Electron Device (TED). Why isn't it a "real" diode? Because it only uses N-type semiconductor. Gunn diodes have been around since John Gunn discovered that bulk N-type GaAs can be made to have a negative resistance effect. Three regions exist: two of them are heavily N-doped on each terminal, with a thin layer of lightly doped material in between. Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House Gunn Diode Two Gunn diode sources. The unit on the left is a mechanically tunable E-band source, while the unit on the right is a varactor-tuned V-band source. Microwave Engineering, 3rd Edition by David M. Pozar Copyright 004 John Wiley & Sons COMM (903) Lecture # 6
7 GUC (Dr. Hany Hammad) 9/5/06 FET Small Signal Models COMM (903) Lecture # 7
8 GUC (Dr. Hany Hammad) 9/5/06 The GaAs MESFET Structure Cross sectional view of the GaAs MESFET structure shows the depletion region below the gate The contact of the gate is made of metal-semiconductor Schottky Contact rather than a metal-oxide-semiconductor (MOS) structure, which is used in the MOSFET device. This approach minimizes the device s gate to source capacitance, which otherwise would degrade the high-frequency gain performance. Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House The GaAs MESFET g f m T w sv h d gm C sat g m = intrinsic device transconductance h d = depletion-layer depth w = gate width s = semiconductor dielectric constant v sat = saturated carrier velocity f T = Unity-current-gain frequency C = gate to source capacitance At frequencies above f T the current passing through the C is greater than that produced by the transconductance, therefore, f T represents a fundamental high-frequency limit. C f T w l h s g g d vsat l For optimum high-frequency performance, the device designer must either increase the saturated carrier velocity or decrease the gate length. COMM (903) Lecture # 8
9 GUC (Dr. Hany Hammad) 9/5/06 Device Characterization and Modeling Small signal model Intrinsic & Extrinsic elements is determined using the hot and cold deembedded S-parameters measurements. Large Signal model is determined by using the semi-empirical method, and it uses the measured pulsed dc I-V data of the device and no assumptions are made relating to the physical operation of the device itself. One key issue in S-parameters measurements is the accurate calibration of the network analyzer. The calibration of the instrument should remove unwanted and repeatable information, such as the effects of non-ideal transmission lines, connectors, and circuit parasitic. Small-signal device modeling procedure Cold V ds = 0 V V = -3 V (pinch off) Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House COMM (903) Lecture # 9
10 GUC (Dr. Hany Hammad) 9/5/06 Hot S-parameters Extraction C dc = diople layer capacitance g & d represent the device s gate and drain resistance. s & L s are the source resistance and inductance. The extrinsic parameters C gp, C dp, L g, L d, g, s and d. The gate and drain bond-pad capacitance (C pg and C pd ) in the modeling process. Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House Cold S-parameters Extraction Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House COMM (903) Lecture # 0
11 GUC (Dr. Hany Hammad) 9/5/06 Cold S-parameters Extraction Z Z Z C c g s j Lg Ls C j c Zc s Ls C c d s j Ld Ls C C ab a b g s d e Z c e Zc e Z Z c Z b ab C c c C C C bc bc b c c Lg Ls Cab Im Z c Ls Cb c Ld Ls Cbc Im Z Im Z Hot S-parameters Extraction v + - g g m e j mo jc j g e C j mo ds i j jc ji C jc C C ds Broadband Microwave Amplifiers by Bal S. Virdee, Avtar S. Virdee, & Ben. Banyamin Copyright 004 Artech House COMM (903) Lecture #
12 GUC (Dr. Hany Hammad) 9/5/06 Model Extraction C Im C g Im C e Im C i mo e Im e C e Im( ) C Ci C Im e C / sin C ds Im ds e C i g mo g m g mo e j S-parameters files COMM (903) Lecture #
13 GUC (Dr. Hany Hammad) 9/5/06 Extraction Steps Measure the S-parameters and save as.sp file. Load file into Matlab (load file name.sp) Convert the sp to y-parameters using the equations (or using sy command in matlab. MESFET Model Extraction Project Gate I C I Drain + v C - V g m v V ds C ds i Source I V V I V V COMM (903) Lecture # 3
14 GUC (Dr. Hany Hammad) 9/5/06 Finding & In case of V =0 Gate I C I Drain + v C - V g m v V ds C =0 ds i Gate Source C I I Drain + v C V - g m v V =0 i Source Finding & Gate I V j C I + v C V - g m v V =0 i Source I v I V V i V jc gmv jc V jc jc jc gmv jc i i I V I V V V 0 0 jc gm jc jc i i jc COMM (903) Lecture # 4
15 GUC (Dr. Hany Hammad) 9/5/06 Finding & jc jc jc jc C Ci jc i jc i jc jc jc i jc i i Ci C j C D D D C i Finding & Gate I C + v C V - V g m v ds Cds i I Drain Source Gate I C I Drain V ds Source I V jc C Cds V I V V 0 V 0 ds jc ds COMM (903) Lecture # 5
16 GUC (Dr. Hany Hammad) 9/5/06 Extracted Model Parameters NE3000 V ds = V I d = 0 ma 4 C.5480 F pF 3 C.780 F pf i g m S sec 0.359psec 4 C ds F pF ds esults (Measured Vs Calculated from extracted Model) 4 x e( ) (S) Measured Calculated freq. (GHz) m( ) (S) Measured Calculated freq. (GHz) COMM (903) Lecture # 6
17 GUC (Dr. Hany Hammad) 9/5/06 esults (Measured Vs Calculated from extracted Model) 0.5 x e( ) (S) Measured Calculated freq. (GHz) m( ) (S) 0 x Measured Calculated freq. (GHz) esults (Measured Vs Calculated from extracted Model) e( ) (S) Measured Calculated freq. (GHz) m( ) (S) Measured Calculated freq. (GHz) COMM (903) Lecture # 7
18 GUC (Dr. Hany Hammad) 9/5/06 esults (Measured Vs Calculated from extracted Model) 5.3 x ( ) (S) Measured Calculated freq. (GHz) m( ) (S) Measured Calculated freq. (GHz) COMM (903) Lecture # 8
Simulation of GaAs MESFET and HEMT Devices for RF Applications
olume, Issue, January February 03 ISSN 78-6856 Simulation of GaAs MESFET and HEMT Devices for RF Applications Dr.E.N.GANESH Prof, ECE DEPT. Rajalakshmi Institute of Technology ABSTRACT: Field effect transistor
More informationPrepared by: Dr. Rishi Prakash, Dept of Electronics and Communication Engineering Page 1 of 5
Microwave tunnel diode Some anomalous phenomena were observed in diode which do not follows the classical diode equation. This anomalous phenomena was explained by quantum tunnelling theory. The tunnelling
More informationFigure 12-1 (p. 578) Block diagram of a sinusoidal oscillator using an amplifier with a frequencydependent
Figure 12-1 (p. 578) Block diagram of a sinusoidal oscillator using an amplifier with a frequencydependent feedback path. Figure 12-2 (p. 579) General circuit for a transistor oscillator. The transistor
More informationECE 340 Lecture 40 : MOSFET I
ECE 340 Lecture 40 : MOSFET I Class Outline: MOS Capacitance-Voltage Analysis MOSFET - Output Characteristics MOSFET - Transfer Characteristics Things you should know when you leave Key Questions How do
More informationCONTENTS. 2.2 Schrodinger's Wave Equation 31. PART I Semiconductor Material Properties. 2.3 Applications of Schrodinger's Wave Equation 34
CONTENTS Preface x Prologue Semiconductors and the Integrated Circuit xvii PART I Semiconductor Material Properties CHAPTER 1 The Crystal Structure of Solids 1 1.0 Preview 1 1.1 Semiconductor Materials
More informationConduction Characteristics of MOS Transistors (for fixed Vds)! Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor
Conduction Characteristics of MOS Transistors (for fixed Vds)! Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris,
More informationTopic 2. Basic MOS theory & SPICE simulation
Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris, Ch 2 & 5.1-5.3 Rabaey, Ch 3) URL: www.ee.ic.ac.uk/pcheung/
More informationConduction Characteristics of MOS Transistors (for fixed Vds) Topic 2. Basic MOS theory & SPICE simulation. MOS Transistor
Conduction Characteristics of MOS Transistors (for fixed Vds) Topic 2 Basic MOS theory & SPICE simulation Peter Cheung Department of Electrical & Electronic Engineering Imperial College London (Weste&Harris,
More informationActive Technology for Communication Circuits
EECS 242: Active Technology for Communication Circuits UC Berkeley EECS 242 Copyright Prof. Ali M Niknejad Outline Comparison of technology choices for communication circuits Si npn, Si NMOS, SiGe HBT,
More informationLecture - 18 Transistors
Electronic Materials, Devices and Fabrication Dr. S. Prarasuraman Department of Metallurgical and Materials Engineering Indian Institute of Technology, Madras Lecture - 18 Transistors Last couple of classes
More informationReg. No. : Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Second Semester
WK 5 Reg. No. : Question Paper Code : 27184 B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER 2015. Time : Three hours Second Semester Electronics and Communication Engineering EC 6201 ELECTRONIC DEVICES
More informationPhysics of Semiconductor Devices
Physics of Semiconductor Devices S. M. SZE Member of the Technical Staff Bell Telephone Laboratories, Incorporated Murray Hill, New Jersey WILEY-INTERSCIENCE A Division of John Wiley & Sons New York London
More informationLecture 16: MOS Transistor models: Linear models, SPICE models. Context. In the last lecture, we discussed the MOS transistor, and
Lecture 16: MOS Transistor models: Linear models, SPICE models Context In the last lecture, we discussed the MOS transistor, and added a correction due to the changing depletion region, called the body
More informationElectronic Circuits for Mechatronics ELCT 609 Lecture 6: MOS-FET Transistor
Electronic Circuits for Mechatronics ELCT 609 Lecture 6: MOS-FET Transistor Assistant Professor Office: C3.315 E-mail: eman.azab@guc.edu.eg 1 Introduction Why we call it Transistor? The name came as an
More informationLecture 13. Metal Oxide Semiconductor Field Effect Transistor (MOSFET) MOSFET 1-1
Lecture 13 Metal Oxide Semiconductor Field Effect Transistor (MOSFET) MOSFET 1-1 Outline Continue MOSFET Qualitative Operation epletion-type MOSFET Characteristics Biasing Circuits and Examples Enhancement-type
More informationFET(Field Effect Transistor)
Field Effect Transistor: Construction and Characteristic of JFETs. Transfer Characteristic. CS,CD,CG amplifier and analysis of CS amplifier MOSFET (Depletion and Enhancement) Type, Transfer Characteristic,
More informationDepletion-mode operation ( 공핍형 ): Using an input gate voltage to effectively decrease the channel size of an FET
Ch. 13 MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor : I D D-mode E-mode V g The gate oxide is made of dielectric SiO 2 with e = 3.9 Depletion-mode operation ( 공핍형 ): Using an input gate voltage
More informationLecture 15. Field Effect Transistor (FET) Wednesday 29/11/2017 MOSFET 1-1
Lecture 15 Field Effect Transistor (FET) Wednesday 29/11/2017 MOSFET 1-1 Outline MOSFET transistors Introduction to MOSFET MOSFET Types epletion-type MOSFET Characteristics Comparison between JFET and
More informationThree Terminal Devices
Three Terminal Devices - field effect transistor (FET) - bipolar junction transistor (BJT) - foundation on which modern electronics is built - active devices - devices described completely by considering
More informationI E I C since I B is very small
Figure 2: Symbols and nomenclature of a (a) npn and (b) pnp transistor. The BJT consists of three regions, emitter, base, and collector. The emitter and collector are usually of one type of doping, while
More informationQUESTION BANK SUB. NAME: RF & MICROWAVE ENGINEERING SUB. CODE: EC 2403 BRANCH/YEAR/: ECE/IV UNIT 1 TWO PORT RF NETWORKS- CIRCUIT REPRESENTATION
QUESTION BANK SUB. NAME: RF & MICROWAVE ENGINEERING SUB. CODE: EC 2403 SEM: VII BRANCH/YEAR/: ECE/IV UNIT 1 TWO PORT RF NETWORKS- CIRCUIT REPRESENTATION 1. What is RF? 2. What is an RF tuner? 3. Define
More informationFully integrated CMOS transmitter design considerations
Semiconductor Technology Fully integrated CMOS transmitter design considerations Traditionally, multiple IC chips are needed to build transmitters (Tx) used in wireless communications. The difficulty with
More informationMICROWAVE ENGINEERING-II. Unit- I MICROWAVE MEASUREMENTS
MICROWAVE ENGINEERING-II Unit- I MICROWAVE MEASUREMENTS 1. Explain microwave power measurement. 2. Why we can not use ordinary diode and transistor in microwave detection and microwave amplification? 3.
More information1W High Linearity and High Efficiency GaAs Power FETs
1W High Linearity and High Efficiency GaAs Power FETs FEATURES! 1W Typical Power at 6 GHz PHOTO ENLARGEMENT! Linear Power Gain: G L = 13 db Typical at 6 GHz! High Linearity: IP3 = 4 dbm Typical at 6 GHz!
More informationNAME: Last First Signature
UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE 130: IC Devices Spring 2003 FINAL EXAMINATION NAME: Last First Signature STUDENT
More informationEC 1402 Microwave Engineering
SHRI ANGALAMMAN COLLEGE OF ENGINEERING & TECHNOLOGY (An ISO 9001:2008 Certified Institution) SIRUGANOOR,TRICHY-621105. DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING EC 1402 Microwave Engineering
More informationEE 330 Lecture 27. Bipolar Processes. Special Bipolar Processes. Comparison of MOS and Bipolar Proces JFET. Thyristors SCR TRIAC
EE 330 Lecture 27 Bipolar Processes Comparison of MOS and Bipolar Proces JFET Special Bipolar Processes Thyristors SCR TRIAC Review from a Previous Lecture B C E E C vertical npn B A-A Section B C E C
More informationSmall Signal Modelling of InGaAs/InAlAs phemt for low noise applications
Small Signal Modelling of InGaAs/InAlAs phemt for low noise applications N. Ahmad and M. Mohamad Isa School of Microelectronic Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, 26 Arau, Perlis,
More informationSYED AMMAL ENGINEERING COLLEGE
SYED AMMAL ENGINEERING COLLEGE (Approved by the AICTE, New Delhi, Govt. of Tamilnadu and Affiliated to Anna University, Chennai) Established in 1998 - An ISO 9001:2008 Certified Institution Dr. E.M.Abdullah
More informationModule IV, Lecture 2 DNP experiments and hardware
Module IV, Lecture 2 DNP experiments and hardware tunnel diodes, Gunn diodes, magnetrons, traveling-wave tubes, klystrons, gyrotrons Dr Ilya Kuprov, University of Southampton, 2013 (for all lecture notes
More informationPulse IV and pulsed S-parameter Parametric Analysis with AMCAD PIV & AGILENT PNA-X
Pulse IV and pulsed S-parameter Parametric Analysis with AMCAD PIV & AGILENT PNA-X Tony Gasseling gasseling@amcad-engineering.com 1 Components PA Design Flow Measurement system Measurement Data base Circuits
More informationLOW NOISE L TO K-BAND GaAs MESFET SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX NFOPT 1
FEATURES LOW NOISE FIGURE NF = 1.6 db TYP at f = 1 GHz HIGH ASSOCIATED GAIN GA = 9.5 db TYP at f = 1 GHz LG = 0.3 µm, WG = 80 µm EPITAXIAL TECHNOLOGY LOW PHASE NOISE DESCRIPTION The features a low noise
More information1286 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 7, JULY MOSFET Modeling for RF IC Design
1286 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 52, NO. 7, JULY 2005 MOSFET Modeling for RF IC Design Yuhua Cheng, Senior Member, IEEE, M. Jamal Deen, Fellow, IEEE, and Chih-Hung Chen, Member, IEEE Invited
More informationQUESTION BANK EC6201 ELECTRONIC DEVICES UNIT I SEMICONDUCTOR DIODE PART A. It has two types. 1. Intrinsic semiconductor 2. Extrinsic semiconductor.
FATIMA MICHAEL COLLEGE OF ENGINEERING & TECHNOLOGY Senkottai Village, Madurai Sivagangai Main Road, Madurai - 625 020. [An ISO 9001:2008 Certified Institution] QUESTION BANK EC6201 ELECTRONIC DEVICES SEMESTER:
More informationA Spline Large-Signal FET Model Based on Bias-Dependent Pulsed I V Measurement
2598 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 50, NO. 11, NOVEMBER 2002 A Spline Large-Signal FET Model Based on Bias-Dependent Pulsed I V Measurement Kyoungmin Koh, Hyun-Min Park, and
More informationSession 10: Solid State Physics MOSFET
Session 10: Solid State Physics MOSFET 1 Outline A B C D E F G H I J 2 MOSCap MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor: Al (metal) SiO2 (oxide) High k ~0.1 ~5 A SiO2 A n+ n+ p-type Si (bulk)
More informationFUNDAMENTALS OF MODERN VLSI DEVICES
19-13- FUNDAMENTALS OF MODERN VLSI DEVICES YUAN TAUR TAK H. MING CAMBRIDGE UNIVERSITY PRESS Physical Constants and Unit Conversions List of Symbols Preface page xi xiii xxi 1 INTRODUCTION I 1.1 Evolution
More informationA New Model for Thermal Channel Noise of Deep-Submicron MOSFETS and its Application in RF-CMOS Design
IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 36, NO. 5, MAY 2001 831 A New Model for Thermal Channel Noise of Deep-Submicron MOSFETS and its Application in RF-CMOS Design Gerhard Knoblinger, Member, IEEE,
More informationI. Introduction Abstract
122 High Frequency Equivalent Circuit of GaAs Depletion and Enhancement FETs for Large Signal Modelling M. Berroth and R. Bosch Fraunhofer nstitute for Applied Solid State Physics Eckerstr. 4, D7800 Freiburg,
More informationChapter 1. Introduction
EECS3611 Analog Integrated Circuit esign Chapter 1 Introduction EECS3611 Analog Integrated Circuit esign Instructor: Prof. Ebrahim Ghafar-Zadeh, Prof. Peter Lian email: egz@cse.yorku.ca peterlian@cse.yorku.ca
More informationParameter Estimation of a High Frequency Cascode Low Noise Amplifier Model
Parameter Estimation of a High Frequency Cascode Low Noise Amplifier Model by Kefei Wang A Thesis Submitted to the Faculty of the Worcester Polytechnic Institute In partial fulfillment of the requirements
More informationLecture 4. MOS transistor theory
Lecture 4 MOS transistor theory 1.7 Introduction: A MOS transistor is a majority-carrier device, in which the current in a conducting channel between the source and the drain is modulated by a voltage
More informationField - Effect Transistor
Page 1 of 6 Field - Effect Transistor Aim :- To draw and study the out put and transfer characteristics of the given FET and to determine its parameters. Apparatus :- FET, two variable power supplies,
More informationLECTURE 6 BROAD-BAND AMPLIFIERS
ECEN 54, Spring 18 Active Microwave Circuits Zoya Popovic, University of Colorado, Boulder LECTURE 6 BROAD-BAND AMPLIFIERS The challenge in designing a broadband microwave amplifier is the fact that the
More informationField Effect Transistors (npn)
Field Effect Transistors (npn) gate drain source FET 3 terminal device channel e - current from source to drain controlled by the electric field generated by the gate base collector emitter BJT 3 terminal
More informationUNIT-4. Microwave Engineering
UNIT-4 Microwave Engineering Microwave Solid State Devices Two problems with conventional transistors at higher frequencies are: 1. Stray capacitance and inductance. - remedy is interdigital design. 2.Transit
More informationECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha
ECE520 VLSI Design Lecture 2: Basic MOS Physics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Semiconductor
More informationChapter 8. Field Effect Transistor
Chapter 8. Field Effect Transistor Field Effect Transistor: The field effect transistor is a semiconductor device, which depends for its operation on the control of current by an electric field. There
More informationMOSFET short channel effects
MOSFET short channel effects overview Five different short channel effects can be distinguished: velocity saturation drain induced barrier lowering (DIBL) impact ionization surface scattering hot electrons
More informationSRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DEEMED UNIVERSITY)
SRM INSTITUTE OF SCIENCE AND TECHNOLOGY (DEEMED UNIVERSITY) QUESTION BANK I YEAR B.Tech (II Semester) ELECTRONIC DEVICES (COMMON FOR EC102, EE104, IC108, BM106) UNIT-I PART-A 1. What are intrinsic and
More informationDEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING QUESTION BANK SUBJECT NAME & CODE: EC2403 & RF AND MICROWAVE ENGINEERING UNIT I
FATIMA MICHAEL COLLEGE OF ENGINEERING & TECHNOLOGY Senkottai Village, Madurai Sivagangai Main Road, Madurai -625 020 An ISO 9001:2008 Certified Institution DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING
More informationELEC-E8421 Components of Power Electronics
ELEC-E8421 Components of Power Electronics MOSFET 2015-10-04 Metal-Oxide-Semiconductor Field-Effect-Transistor (MOSFET) Vertical structure makes paralleling of many small MOSFETs on the chip easy. Very
More informationDesign of Gate-All-Around Tunnel FET for RF Performance
Drain Current (µa/µm) International Journal of Computer Applications (97 8887) International Conference on Innovations In Intelligent Instrumentation, Optimization And Signal Processing ICIIIOSP-213 Design
More informationDC - 20 GHz Discrete power phemt
DC - 20 GHz Discrete power phemt Product Description The TriQuint is a discrete 0.6 mm phemt which operates from DC-20 GHz. The is designed using TriQuint s proven standard 0.3um power phemt production
More informationMEASUREMENT AND INSTRUMENTATION STUDY NOTES UNIT-I
MEASUREMENT AND INSTRUMENTATION STUDY NOTES The MOSFET The MOSFET Metal Oxide FET UNIT-I As well as the Junction Field Effect Transistor (JFET), there is another type of Field Effect Transistor available
More informationLecture 020 ECE4430 Review II (1/5/04) Page 020-1
Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 LECTURE 020 ECE 4430 REVIEW II (READING: GHLM - Chap. 2) Objective The objective of this presentation is: 1.) Identify the prerequisite material as taught
More informationDigital Electronics. By: FARHAD FARADJI, Ph.D. Assistant Professor, Electrical and Computer Engineering, K. N. Toosi University of Technology
K. N. Toosi University of Technology Chapter 7. Field-Effect Transistors By: FARHAD FARADJI, Ph.D. Assistant Professor, Electrical and Computer Engineering, K. N. Toosi University of Technology http://wp.kntu.ac.ir/faradji/digitalelectronics.htm
More informationLecture 020 ECE4430 Review II (1/5/04) Page 020-1
Lecture 020 ECE4430 Review II (1/5/04) Page 020-1 LECTURE 020 ECE 4430 REVIEW II (READING: GHLM - Chap. 2) Objective The objective of this presentation is: 1.) Identify the prerequisite material as taught
More informationvalue of W max for the device. The at band voltage is -0.9 V. Problem 5: An Al-gate n-channel MOS capacitor has a doping of N a = cm ;3. The oxi
Prof. Jasprit Singh Fall 2001 EECS 320 Homework 10 This homework is due on December 6 Problem 1: An n-type In 0:53 Ga 0:47 As epitaxial layer doped at 10 16 cm ;3 is to be used as a channel in a FET. A
More informationDirect calculation of metal oxide semiconductor field effect transistor high frequency noise parameters
Direct calculation of metal oxide semiconductor field effect transistor high frequency noise parameters C. H. Chen and M. J. Deen a) Engineering Science, Simon Fraser University, Burnaby, British Columbia
More informationi. At the start-up of oscillation there is an excess negative resistance (-R)
OSCILLATORS Andrew Dearn * Introduction The designers of monolithic or integrated oscillators usually have the available process dictated to them by overall system requirements such as frequency of operation
More informationGovernment of Karnataka Department of Technical Education Board of Technical Examinations, Bengaluru
Prerequisites Government of Karnataka Department of Technical Education Board of Technical Examinations, Bengaluru Title: Basics of Semiconductor Devices Code : 15EC21T Semester : 2 Group : Core Teaching
More information6.976 High Speed Communication Circuits and Systems Lecture 5 High Speed, Broadband Amplifiers
6.976 High Speed Communication Circuits and Systems Lecture 5 High Speed, Broadband Amplifiers Michael Perrott Massachusetts Institute of Technology Copyright 2003 by Michael H. Perrott Broadband Communication
More informationDifference between BJTs and FETs. Junction Field Effect Transistors (JFET)
Difference between BJTs and FETs Transistors can be categorized according to their structure, and two of the more commonly known transistor structures, are the BJT and FET. The comparison between BJTs
More informationITT Technical Institute. ET1310 Solid State Devices Onsite Course SYLLABUS
ITT Technical Institute ET1310 Solid State Devices Onsite Course SYLLABUS Credit hours: 4.5 Contact/Instructional hours: 56 (34 Theory Hours, 22 Lab Hours) Prerequisite(s) and/or Corequisite(s): Prerequisites:
More informationLaboratory #5 BJT Basics and MOSFET Basics
Laboratory #5 BJT Basics and MOSFET Basics I. Objectives 1. Understand the physical structure of BJTs and MOSFETs. 2. Learn to measure I-V characteristics of BJTs and MOSFETs. II. Components and Instruments
More informationAlternative Channel Materials for MOSFET Scaling Below 10nm
Alternative Channel Materials for MOSFET Scaling Below 10nm Doug Barlage Electrical Requirements of Channel Mark Johnson Challenges With Material Synthesis Introduction Outline Challenges with scaling
More informationRF and Microwave Semiconductor Technologies
RF and Microwave Semiconductor Technologies Muhammad Fahim Ul Haque, Department of Electrical Engineering, Linköping University muhha@isy.liu.se Note: 1. This presentation is for the course of State of
More informationMOS Capacitance and Introduction to MOSFETs
ECE-305: Fall 2016 MOS Capacitance and Introduction to MOSFETs Professor Peter Bermel Electrical and Computer Engineering Purdue University, West Lafayette, IN USA pbermel@purdue.edu 11/4/2016 Pierret,
More informationKeysight Technologies Solid State Switches. Application Note
Keysight Technologies Solid State Switches Application Note Introduction Selecting the right switch technology for your application RF and microwave switches are used extensively in microwave systems for
More informationLecture-45. MOS Field-Effect-Transistors Threshold voltage
Lecture-45 MOS Field-Effect-Transistors 7.4. Threshold voltage In this section we summarize the calculation of the threshold voltage and discuss the dependence of the threshold voltage on the bias applied
More informationVALLIAMMAI ENGINEERING COLLEGE SRM Nagar, Kattankulathur
VALLIAMMAI ENGINEERING COLLEGE SRM Nagar, Kattankulathur 603 203. DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING SUBJECT QUESTION BANK : EC6201 ELECTRONIC DEVICES SEM / YEAR: II / I year B.E.ECE
More informationBasic Electronics. Introductory Lecture Course for. Technology and Instrumentation in Particle Physics Chicago, Illinois June 9-14, 2011
Basic Electronics Introductory Lecture Course for Technology and Instrumentation in Particle Physics 2011 Chicago, Illinois June 9-14, 2011 Presented By Gary Drake Argonne National Laboratory Session 3
More informationAnalog Electronics. Electronic Devices, 9th edition Thomas L. Floyd Pearson Education. Upper Saddle River, NJ, All rights reserved.
Analog Electronics BJT Structure The BJT has three regions called the emitter, base, and collector. Between the regions are junctions as indicated. The base is a thin lightly doped region compared to the
More information8. Characteristics of Field Effect Transistor (MOSFET)
1 8. Characteristics of Field Effect Transistor (MOSFET) 8.1. Objectives The purpose of this experiment is to measure input and output characteristics of n-channel and p- channel field effect transistors
More informationField-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism;
Chapter 3 Field-Effect Transistors (FETs) 3.1 Introduction Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; The concept has been known
More informationEE70 - Intro. Electronics
EE70 - Intro. Electronics Course website: ~/classes/ee70/fall05 Today s class agenda (November 28, 2005) review Serial/parallel resonant circuits Diode Field Effect Transistor (FET) f 0 = Qs = Qs = 1 2π
More informationFIELD EFFECT TRANSISTORS MADE BY : GROUP (13)/PM
FIELD EFFECT TRANSISTORS MADE BY : GROUP (13)/PM THE FIELD EFFECT TRANSISTOR (FET) In 1945, Shockley had an idea for making a solid state device out of semiconductors. He reasoned that a strong electrical
More informationAnalog IC Design. Lecture 1,2: Introduction & MOS transistors. Henrik Sjöland. Dept. of Electrical and Information Technology
Analog IC Design Lecture 1,2: Introduction & MOS transistors Henrik.Sjoland@eit.lth.se Part 1: Introduction Analogue IC Design (7.5hp, lp2) CMOS Technology Analog building blocks in CMOS Single- and multiple
More informationOptical Fiber Communication Lecture 11 Detectors
Optical Fiber Communication Lecture 11 Detectors Warriors of the Net Detector Technologies MSM (Metal Semiconductor Metal) PIN Layer Structure Semiinsulating GaAs Contact InGaAsP p 5x10 18 Absorption InGaAs
More informationOBJECTIVE TYPE QUESTIONS
OBJECTIVE TYPE QUESTIONS Q.1 The breakdown mechanism in a lightly doped p-n junction under reverse biased condition is called (A) avalanche breakdown. (B) zener breakdown. (C) breakdown by tunnelling.
More informationR.K.YADAV. 2. Explain with suitable sketch the operation of two-cavity Klystron amplifier. explain the concept of velocity and current modulations.
Question Bank DEPARTMENT OF ELECTRONICS AND COMMUNICATION SUBJECT- MICROWAVE ENGINEERING(EEC-603) Unit-III 1. What are the high frequency limitations of conventional tubes? Explain clearly. 2. Explain
More informationField Effect Transistor (FET) FET 1-1
Field Effect Transistor (FET) FET 1-1 Outline MOSFET transistors ntroduction to MOSFET MOSFET Types epletion-type MOSFET Characteristics Biasing Circuits and Examples Comparison between JFET and epletion-type
More informationFET Channel. - simplified representation of three terminal device called a field effect transistor (FET)
FET Channel - simplified representation of three terminal device called a field effect transistor (FET) - overall horizontal shape - current levels off as voltage increases - two regions of operation 1.
More informationQuestions on JFET: 1) Which of the following component is a unipolar device?
Questions on JFET: 1) Which of the following component is a unipolar device? a) BJT b) FET c) DJT d) EFT 2) Current Conduction in FET takes place due e) Majority charge carriers only f) Minority charge
More information. From the above data, determine the network is symmetric or not.
Velammal College of Engineering and Technology, Madurai Department of Electronics and Communication Engineering Question Bank Subject Name: EC2353 Antennas And Wave Propagation Faculty: Mrs G VShirley
More informationME 4447 / 6405 Student Lecture. Transistors. Abiodun Otolorin Michael Abraham Waqas Majeed
ME 4447 / 6405 Student Lecture Transistors Abiodun Otolorin Michael Abraham Waqas Majeed Lecture Overview Transistor? History Underlying Science Properties Types of transistors Bipolar Junction Transistors
More informationSolid State Devices- Part- II. Module- IV
Solid State Devices- Part- II Module- IV MOS Capacitor Two terminal MOS device MOS = Metal- Oxide- Semiconductor MOS capacitor - the heart of the MOSFET The MOS capacitor is used to induce charge at the
More informationUNIT 3 Transistors JFET
UNIT 3 Transistors JFET Mosfet Definition of BJT A bipolar junction transistor is a three terminal semiconductor device consisting of two p-n junctions which is able to amplify or magnify a signal. It
More informationSt.MARTIN S ENGINEERING COLLEGE Dhulapally, Secunderabad
St.MARTIN S ENGINEERING COLLEGE Dhulapally, Secunderabad 500014. Department of Electronics and Communication Engineering SUB: MICROWAVE ENGINEERING SECTION: ECE IV A & B NAME OF THE FACULTY: S RAVI KUMAR,T.SUDHEER
More information4H-SiC Planar MESFET for Microwave Power Device Applications
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.5, NO.2, JUNE, 2005 113 4H-SiC Planar MESFET for Microwave Power Device Applications Hoon Joo Na*, Sang Yong Jung*, Jeong Hyun Moon*, Jeong Hyuk Yim*,
More informationThe Common Source JFET Amplifier
The Common Source JFET Amplifier Small signal amplifiers can also be made using Field Effect Transistors or FET's for short. These devices have the advantage over bipolar transistors of having an extremely
More informationUNIT IX ELECTRONIC DEVICES
UNT X ELECTRONC DECES Weightage Marks : 07 Semiconductors Semiconductors diode-- characteristics in forward and reverse bias, diode as rectifier. - characteristics of LED, Photodiodes, solarcell and Zener
More informationMicrowave Semiconductor Devices
INDEX Avalanche breakdown, see reverse breakdown, Avalanche condition, 61 generalized, 62 Ballistic transport, 322, 435, 450 Bandgap, III-V-compounds, 387 Bandgap narrowing, Si, 420 BARITT device, 111,
More informationExam Below are two schematics of current sources implemented with MOSFETs. Which current source has the best compliance voltage?
Exam 2 Name: Score /90 Question 1 Short Takes 1 point each unless noted otherwise. 1. Below are two schematics of current sources implemented with MOSFETs. Which current source has the best compliance
More informationUNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s.
UNIT-I FIELD EFFECT TRANSISTOR 1. Explain about the Field Effect Transistor and also mention types of FET s. The Field Effect Transistor, or simply FET however, uses the voltage that is applied to their
More informationECE 3040 Dr. Alan Doolittle.
ECE 3040 Dr. Alan Doolittle I have thoroughly enjoyed meeting each of you and hope that I have had a positive influence on your carriers. Please feel free to consult with me in your future work. If I can
More informationIntegrated diodes. The forward voltage drop only slightly depends on the forward current. ELEKTRONIKOS ĮTAISAI
1 Integrated diodes pn junctions of transistor structures can be used as integrated diodes. The choice of the junction is limited by the considerations of switching speed and breakdown voltage. The forward
More informationLESSON PLAN. LESSON PLAN DURATION : - 15 weeks (from JULY 2018 to NOVEMBER 2018)
LESSON PLAN NAME OF THE FACULTY DISCIPLINE SEMESTER SUBJECT : - HIMANSHU YADAV : - ECE : - FIFTH : - MICROWAVE ENGG LESSON PLAN DURATION : - 15 weeks (from JULY 2018 to NOVEMBER 2018) WORK LOAD (LECTURE/PRACTICAL)
More informationExperiment 3. 3 MOSFET Drain Current Modeling. 3.1 Summary. 3.2 Theory. ELEC 3908 Experiment 3 Student#:
Experiment 3 3 MOSFET Drain Current Modeling 3.1 Summary In this experiment I D vs. V DS and I D vs. V GS characteristics are measured for a silicon MOSFET, and are used to determine the parameters necessary
More information