Data Sheet. HSMP-383x Surface Mount RF PIN Diodes. Description/Applications. Features. Package Lead Code Identification (Top View)

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HSMP-383x Surface Mount RF PIN Diodes Data Sheet Description/Applications The HSMP-383x series of general purpose PIN diodes are designed for two classes of applications.

1 HSMP-383x Surface Mount RF PIN Diodes Data Sheet Description/Applications The HSMP-383x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (C T ) and Total Resistance (R T ) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPIC model is not available for PIN diodes as SPIC does not provide for a key PIN diode characteristic, carrier lifetime. Features Diodes Optimized for: Low Capacitance Switching Low Current Attenuator Surface Mount SOT-23 Package Single and Dual Versions Tape and Reel Options Available Low Failure in Time (FIT) Rate [] Lead-free Note:. For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) SINGL SRIS #0 COMMON ANOD #2 COMMON CATHOD #3 #4

2 Absolute Maximum Ratings [] T C = 25 C Symbol Parameter Units Absolute Maximum I f Forward Current ( ms Pulse) Amp P t Total Device Dissipation mw [2] 250 P iv Peak Inverse Voltage Same as V BR T j Junction Temperature C 50 T STG Storage Temperature C -65 to 50 Notes:. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at T LAD = 25 C. Derate to zero at maximum rated temperature. PIN General Purpose Diodes, lectrical Specifications T C = 25 C Minimum Maximum Maximum Part Package Breakdown Series Total Number Marking Lead Voltage Resistance Capacitance HSMP- Code Code Configuration V BR (V) R S (Ω) C T (pf) 3830 K0 0 Single K2 2 Series 3833 K3 3 Common Anode 3834 K4 4 Common Cathode Test Conditions V R = V BR I F = ma V R = 50 V Measure f = MHz f = MHz I R 0 ma Typical Parameters at T C = 25 C Part Number Series Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HSMP- R S (Ω) τ (ns) T rr (ns) C T (pf) 383x V Test Conditions I F = ma I F = 50 ma V R = 0 V f = MHz I R = 250 ma I F = 20 ma 90% Recovery 2

3 Typical Parameters at T C = 25 C (unless otherwise noted), Single Diode I F FORWARD CURRNT (ma) C 25C 50C V F FORWARD VOLTAG (ma) TOTAL CAPACITANC (pf) MHz GHz MHz RVRS VOLTAG (V) RF RSISTANC (OHMS) I F FORWARD CURRNT (ma) Figure. Forward Current vs. Forward Voltage. Figure 2. RF Capacitance vs. Reverse Bias. Figure 3. RF Resistance at 25C vs. Forward Bias Current. INPUT INTRCPT POINT (dbm) Diode Mounted as a Series Attenuator in a 50 Ohm Microstrip and Tested at 23 MHz DIOD RF RSISTANC () Figure 4. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuators. INPUT INTRCPT POINT (dbm) Diode Mounted as a Series Attenuator in a 50 Ohm Microstrip and Tested at 23 MHz I F FORWARD CURRNT (ma) Figure 5. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switches. T rr - RVRS RCOVRY TIM (ns) 0 HSMP-3830 V R = 5V V R = 0V V R = 20V FORWARD CURRNT (ma) Figure 6. Reverse Recovery Time vs. Forward Current for Various Reverse Voltage. 3

4 Typical Applications for Multiple Diode Products RF RF 2 RF RF 2 2 Figure 7. Simple SPDT Switch, Using Only Positive Current. Figure 8. High Isolation SPDT Switch, Dual Bias. RF RF 2 RF RF 2 Figure 9. Switch Using Both Positive and Negative Current. Figure 0. Very High Isolation SPDT Switch, Dual Bias. 4

5 Typical Applications for Multiple Diode Products (continued) VARIABL INPUT RF IN/OUT FIXD VOLTAG Figure. Four Diode π Attenuator. See AN048 for details. Figure 2. High Isolation SPST Switch (Repeat Cells as Required). 5

6 Package Dimensions Outline 23 (SOT-23) Recommended PCB Pad Layout for Avago s SOT 23 Products e2 e XXX A e B D Notes: XXX-package marking Drawings are not to scale A SYMBOL A A B C D e e e2 L C L DIMNSIONS (mm) MIN MAX Dimensions in inches mm Package Characteristics Lead Material...Alloy 42 Lead Finish...Tin % (Lead-free option) Maximum Soldering Temperature C for 5 seconds Minimum Lead Strength...2 pounds pull Typical Package Inductance... 2 nh Typical Package Capacitance pf (opposite leads) Ordering Information Specify part number followed by option. For example: HSMP - 383x - XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Diode Profile Option Descriptions -BLKG = Bulk -TRG = 3K pc. Tape and Reel, Device Orientation; See Figure 3 -TR2G = 0K pc. Tape and Reel, Device Orientation; See Figure 3 Tape and Reeling conforms to lectronic Industries RS-48, Taping of Surface Mounted Components for Automated Placement. 6

7 Device Orientation For Outlines SOT-23 RL TOP VIW 4 mm ND VIW CARRIR TAP 8 mm ABC ABC ABC ABC USR FD DIRCTION COVR TAP Note: "AB" represents package marking code. "C" represents date code. Figure 3. Options -TR, -TR2 for SOT-23 Packages. Tape Dimensions and Product Orientation For Outline SOT-23 P D P 2 P 0 F W t D 9 MAX Ko 8 MAX 3.5 MAX A 0 B 0 CAVITY PRFORATION DSCRIPTION SYMBOL SIZ (mm) SIZ (INCHS) LNGTH WIDTH DPTH PITCH BOTTOM HOL DIAMTR DIAMTR PITCH POSITION A 0 B 0 K 0 P D D P ± ± ± ± ± ± ± ± ± ± ± ± ± CARRIR TAP WIDTH THICKNSS W t ± ± DISTANC BTWN CNTRLIN CAVITY TO PRFORATION (WIDTH DIRCTION) CAVITY TO PRFORATION (LNGTH DIRCTION) F P ± ± ± ± For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright Avago Technologies. All rights reserved. Obsoletes N AV02-425N - June 2, 2009

Surface Mount RF PIN Diodes. Technical Data. HSMP-383x Series. Features. Package Lead Code Identification (Top View)

Surface Mount RF PIN Diodes. Technical Data. HSMP-383x Series. Features. Package Lead Code Identification (Top View) Surface Mount RF PIN Diodes Technical Data HSMP-383x Series Features Diodes Optimized for: Low Capacitance Switching Low Current Attenuator Surface Mount SOT-23 Package Single and Dual Versions Tape and