655 nm Precision Optical Reflective Sensor Technical Data

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1 55 nm Precision Optical Reflective Sensor Technical Data HEDS-5 Features Focused Emitter and Detector in a Single Package 55 nm Visible Emitter.7 mm (.7) Resolution TO-5 Miniature Sealed Package Photodiode Output Description The HEDS-5 is a fully integrated module designed for applications requiring optical reflective sensing. The module contains a 55 nm visible emitter and a matched I.C. photodetector. A bifurcated aspheric lens is used to image the active areas of the emitter and the detector to a single spot.7 mm (. in.) in front of the package. The output signal is a current generated by the photodiode. Applications Applications for the HEDS-5 include bar code scanning, pattern recognition and verification, object sizing, optical limit switching, tachometry, textile thread counting and defect detection, dimensional monitoring, line locating, paper edge detection, and any application where precision optical reflective sensing is desired. Mechanical Considerations The HEDS-5 is packaged in a high profile pin TO-5 metal can with a glass window. The emitter and photodetector chips are mounted on the header at the base of the package. Positioned above these active elements is a Package Dimensions 5. (.) C L MAXIMUM SIGNAL POINT REFERENCE PLANE.7 ±.5 (. ±.). (.) 9. (.37).5 (.335) 5. (.). (.3).73 (.9). (.73).33 (.3) 7.79 (.37). (.5).73 (.9) 5. (.).7 (.5).5 (.53). (.) S.P. NOTES:. ALL DIMENSIONS IN MILLIMETERS AND (INCHES).. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY. 3. THE REFERENCE PLANE (R.P.) IS THE TOP SURFACE OF THE PACKAGE.. NICKEL CAN AND GOLD PLATED LEADS. 5. S.P. = SEATING PLANE.. THE LEAD DIAMETER IS.5 mm (. IN.) TYP. R.P.

2 bifurcated aspheric acrylic lens that focuses them to the same point. The sensors can be rigidly secured by commercially available two piece TO-5 style heat sinks, such as Thermalloy 5, Aavid Engineering 357, or pin. inch diameter pin circle sockets. These fixtures provide a stable reference platform for affixing the HEDS-5 to a circuit board. In applications requiring contact scanning, protective focusing tips are available. Focusing tips are available in either metal or polycarbonate packages using a sapphire ball as the contact surface. The Agilent part numbers are HEDS-3, HBCS-999, HBCS-999, HBCS-A99, and HBCS-A999. Electrical Operation The detector of the sensor is a single photodiode. Figure 7 shows photocurrent being supplied from the cathode of the photodiode to an inverting input of the operational amplifier. The cathode of the 55 nm emitter is physically and electrically connected to the case-substrate of the device. Applications that require modulation or switching of the should be designed to have the cathode connected to the electrical ground of the system. Applications where ambient light is present will require a special drive and recovery circuit to achieve the full resolution of the sensor. Application Note provides data and schematics to support HEDS-5 sensor operation in ambient light conditions. A reliability data sheet is available for the HEDS-5 precision optical reflective sensor. SCHEMATIC DIAGRAM CONNECTION DIAGRAM REFLECTOR REFERENCE PLANE Z R S 7 R S 3 5 PIN # FUNCTION PHOTODIODE CATHODE HEADER GROUND ** ANODE PHOTODIODE ANODE **CUSTOMER SHOULD NOT CONNECT GROUND TO PIN. INTERNAL CONNECTION TO PIN WILL BE DELETED IN THE FUTURE. CASE, SUBSTRATE TOP VIEW R S CHARACTERISTIC NOT DEFINED Absolute Maximum T A = 5 C Parameter Symbol Min. Max. Units Note Operating Temperature T A - 7 C Storage Temperature T S - 75 C Lead Soldering Temperature C for sec. Average Forward Current I f 5 ma Peak Forward Current I fp (data pending) Reverse Input Voltage V r 5 V Photodiode Bias (-V = forward bias) V d V 3 (See next page for Notes.)

3 3 Electrical/Optical Characteristics at T A = 5 C Parameter Symbol Min. Typ. Max. Units Conditions Note Figure Reflected Photocurrent I pr 5 na I f = 35 ma, 5,,,, 7 Quality Factor <Q>..95. I f = 35 ma, Maximum Signal Point (MSP) Z..7.5 mm, 7 (.5) (.) (.7) (inch) Forward Voltage V f.7. V I f = 35 ma 3 Reverse Breakdown Voltage BVR 5. V I r = µa Photodiode Dark Current I d 5 pa V d = 5 V, I f = Peak Wavelength lambda 55 7 nm I f = 35 ma 5 I pr Temperature Coefficient K e -. / C 9 System Optical Step d.5 mm Response Size (OSR) (.) (inch) Notes:. CAUTION: The thermal constraints of the acrylic lens will not permit conventional wave soldering procedures. The typical preheat and post-soldering cleaning procedures and dwell times can subject the lens to thermal stresses beyond the absolute maximum ratings and can cause it to defocus.. (Reliability tests are proceeding data not yet available.) 3. I d (max) = µa. Recommended operation: V d (min) = V V d (max) = 5 V Exceeding maximum conditions may cause permanent damage to photodiode or to chip metallization.. Measured from a reflector coated with 99% diffuse reflective white paint (Kodak ) positioned.7 mm (. in.) from the reference plane. (See Photocurrent Test Circuit for test connection.) Measured physically is the total photocurrent, I pt, which consists of a signal (reflected from target) component, I pr, and a component induced by reflection internal to the sensor (stray), I ps. I pt = I pr + I ps Specified is the reflected signal component, I pr. 5. See Bin Table.. <Q> = I pr /I pt. 7. Measured from the reference plane (R.P.) of the sensor.. Leakage current of photodiode measured in the dark. 9. Photocurrent variation with temperature varies with output which follows a natural exponential law: I p (T) = I p (T o )*exp[k e (T-T o )].. OSR size is defined as the distance for a %-9% step response of I pr as the sensor moves over an abrupt step from opaque white to black, or from opaque white to free space (no reflection).. Sensor contains no ambient light filtering see Figure for relative response of detector. In bright ambient light conditions, signal may be a small portion of total signal. AC coupling and additional signal processing may be necessary. Reference Application Note.

4 EMITTER.5 mm DIA. JUNCTION BIN # BIN TABLE I pr LIMITS MIN. MAX. na OPTICAL SYSTEM BAFFLE ACRYLIC SEAL Product Marking The photocurrent binning of the sensor is incorporated as part of the date code format, assigned at time of test CTYYWWan, where: C = letter identifying country of assembly S = Singapore If blank = USA T = tester code designation letter (single letter) YY = last two digits of year WW = week number in year a = single lot code letter (A - Z), sequential assignment during week n = bin number DETECTOR. mm SQUARE REFLECTOR LENS GLASS SENSING AREA See Figure 7 for suggestion in the application of photocurrent bins. Test algorithm bins units to the lowest bin number if a unit is in the overlap region. Such units can cross bin boundaries as temperature changes. (Ambient temperature affects efficiency slightly and may cause several percent change in I pr ). Bin numbers are for reference only and do not constitute an absolute guarantee. REFERENCE PLANE Z The output of all s degrade with time, depending on drive conditions and temperature. I f +V f R S I PT na-meter The entire available distribution of parts, appropriately marked, will be shipped. Single bin orders cannot be supplied. CASE, SUBSTRATE Figure. Photocurrent Test Circuit.

5 5 PHOTOCURRENT AT I F = 35 ma, 5 C V F FORWARD VOLTAGE V I F FORWARD CURRENT ma. µa µa µa ma ma ma I F FORWARD CURRENT Figure. Relative Reflected Photocurrent. Figure 3. Forward Voltage vs. Forward Current. PHOTOCURRENT TO MSP..... MSP =.5 mm SENSOR MSP RANGE MSP =. mm 5.5. DISTANCE FROM REFERENCE PLANE OF SENSOR mm LIGHT OUTPUT ( TO 5 C VALUE) WAVELENGTH nm - C C 5 C 7 C Figure. Photocurrent Variation with Distance. Figure nm Emitter Typical Spectral Distribution. RESPONSE TO PEAK WAVELENGTH nm Figure. Relative Spectral Response of Sensor.

6 REFLECTOR REFERENCE PLANE Z C R f I f I PT + +5 V V O = [(R + R )/R ] x R f x I PT V O C R R S CASE, SUBSTRATE Figure 7. Sensor with Transimpedance Amplifier. R C LIMITS BANDWIDTH OF PRE-AMP. C AC-COUPLING MAY BE NECESSARY IN HIGH LIGHT AMBIENT CONDITIONS. R f FOR OPTIMUM PERFORMANCE, R f SHOULD BE SELECTED TO MATCH BIN NUMBER OF SENSORS SO AS TO MAINTAIN V O IN DESIRED RANGE. d SYSTEM RESPONSE mm..... CUSP PERPENDICULAR TO EDGE OF STEP % 9 % % WHITE LENS CUSP PARALLEL TO EDGE OF STEP DISTANCE FROM REFERENCE PLANE OF SENSOR mm SIGNAL d BLACK Figure. System Optical Step Response Variation with Distance. Warranty and Service Agilent Optical Reflective Sensor is warranted for a period of one year after purchase covering defects in material and workmanship. Agilent will repair or, at its option, replace products that prove to be defective in material or workmanship under proper use during the warranty period. NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. AGILENT IS NOT LIABLE FOR CONSEQUENTIAL DAMAGES. For additional warranty or service information please contact your local Agilent sales representative or authorized distributor. Data subject to change. Copyright 999 Agilent Technologies Obsoletes 595-7E 59-75E (/99)

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