NJU7116 SUPER LOW OPERATING CURRENT AND LOW OFFSET VOLTAGE TINY SINGLE CMOS COMPARATOR

Transcription

1 SUPER LOW OPERATING CURRENT AND LOW OFFSET VOLTAGE TINY SINGLE CMOS COMPARATOR GENERAL DESCRIPTION PACKAGE OUTLINE The NJU7 is a super low operating current and low offset voltage tiny single CMOS comparator with CMOS output. The operating current is μa ( typ ), and the operating of.8v to.v. The input offset voltage is lower than.mv ( max ). Furthermore, the NJU7 is packaged with very small SOT NJU7F DFN-G; therefore it can be especially applied to battery operated portable items. NJU7KG FEATURES Super Low Operating Current ( I DD =.μa typ. ) Single Power Supply ( V DD =.8 to.v ) Low Offset Voltage ( V IO =.mv max.@.v ) Low Bias Current ( I IB =pa typ. ) CMOS ( Push-pull ) Output Package Outline SOT, DFN-G CMOS Technology PIN CONFIGURATION (Top View) NJU7F (Top View) (Bottom View) NJU7KG NJU7KG The NC pin and the PAD should connect with a VSS terminal. EQUIVALENT CIRCUIT Ver

2 ABSOLUTE MAXIMUM RATINGS ( Ta= C ) PARAMETER SYMBOL RATINGS UNIT Supply Voltage V DD 7 V Differential Input Voltage V ID ± 7 ( note) V Common Mode Input Voltage V IC -. to 7( note) V Power Dissipation SOT-- DFN-G P D 9 (note ) / (note ) (note ) / 9 (note ) mw Operating Temperature Range T opr - to + C Storage Temperature Range T stg - to + C ( note) For supply voltage less than 7V, the absolute maximum rating is equal to the supply voltage. ( note ) Decoupling capacitor should be connected between V DD and V SS due to the stabilized operation for the circuit. ( note ) EIA/JEDEC STANDARD Test board (7.x.x.mm, layers, FR-) mounting ( note ) EIA/JEDEC STANDARD Test board (7.x.x.mm, layers, FR-) mounting ( note ) Mounted on glass epoxy board. (...mm: based on EIA/JEDEC standard, Layers FR-, with Exposed Pad) ( note ) Mounted on glass epoxy board. (...mm: based on EIA/JEDEC standard, Layers FR-, with Exposed Pad) (For Layers: Applying mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD-) ( note7 ) The NC pin and the PAD should connect with a VSS terminal. ( note8 ) The NC pin is electrically not connected to the die in a package. ( note9 ) The PAD is electrically connected to the backside of the die. The PAD cannot be used as VSS terminal. ELECTRICAL CHARACTERISTICS ( Ta= C,V DD =.V,R L = ) PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Operating Voltage V DD.8 -. V Input Offset Voltage V IO V IN=/V DD - -. mv Input Offset Current I IO - - pa Input Bias Current I IB - - pa Input Common Mode Voltage Range V ICM ~. - - V High Level Output Voltage V OH I OH=mA V Low Level Output Voltage V OL I OL=-mA - -. V Common Mode Rejection Ratio CMR V IC=/V DD - - db Supply Voltage Rejection Ratio SVR V DD=.8~.V - - db Operating Current I DD No Load,V O=V -. μa SWITCHING CHARACTERISTICS ( Ta= C,V DD =.V,f=kHz,C L =pf ) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT Propagation Delay Over Drive=mV -.. t PHL V High to Low TTL Level Step In. IC=V μs Propagation Delay Over Drive=mV -.. t PLH V Low to High TTL Level Step In. IC=V -. - μs Propagation Delay Time Lag t PD t PLH- t PHL -.. μs Output Signal Falling Time t THL Over Drive=mV - - ns Output Signal Rising Time t TLH Over Drive=mV - - ns - - Ver.-7-

3 TYPICAL CHARACTERISTICS. Operating Current vs. Operating Voltage V SS =V, V IN +=V DD / Operating Current vs. Temperature V SS =V, V IN +=V DD / Operating Current [μa]...9 Operating Current [μa] V DD =.8V Supply Voltage V DD [V] Input Offset Voltage vs. Temperature V SS =V, V IN +=V DD / Input Offset Voltage vs. Temperature V SS =V, V IN +=V - - V DD =.8V 8 V DD =.8V - - Input Offset Voltage vs. Operating Voltage V SS =V, V IN +=V DD / 8 Input Offset Voltage vs. Operating Voltage V SS =V, V IN +=V 8 Ta=-ºC Ta=ºC Ta=ºC Ta=-ºC Ta=ºC Ta=ºC Operating Voltage V DD [V] Operating Voltage V DD [V] Ver

4 TYPICAL CHARACTERISTICS Output Source Current vs. Temperature V SS =V, V OH =V DD -.V Output Sink Current vs. Temperature V SS =V, V OL =V SS +.V Output Source Current [ma] V DD =.8V Output Sink Current [ma] V DD =.8V Propagation Delay(Low to High) [μs] 7 Propagation Delay vs. Temperature V DD =.V, V SS =V, V IN -=V DD /, Vod=mV, C L =pf Propagation Delay(High to Low) [μs] Propagation Delay vs. Temperature V DD =.V, V SS =V, V IN -=V DD /, Vod=mV, C L =pf - - Ver.-7-

5 SWITCHING CHARACTERISTICS MEASUREMENT CIRCUIT TIMING WAVEFORM Ver

6 PACKAGE DIMENSIONS.9±. ~.9±..MIN ±...9±..MAX ±...MAX.±. Unit: mm SOT-- Package - - Ver.-7-

7 PACKAGE DIMENSIONS Unit: mm DFN-G Package [CAUTION] The specifications on this databook are only given for information, without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. Ver