D3.1 / CCAP Compliant. 1.2 GHz. Make-Before-Break (MBB) Splitter/Combiner Module Specifications

Transcription

1 RF Signal Management Passive Products Features: D. / CCAP Compliant. GHz RU Chassis (front view) Available in -00 MHz (equalized) or - MHz (non-equalized) High passive isolation to support CCAP/D. Plain versions available with no port padding or monitor port Patented make-before-break attenuator pad design for hitless signal balancing Chassis supports both passive & active modules Clear chassis door provides protection & clear view of modules Clear pad cover for quick inspection of pad/eq values High quality, precision F or BNC connectors Available in RU, RU, & RU chassis One year warranty on all passive modules Designed to exceed NEBS requirements for grounding/bonding Certifications: FCC Class B, U/L, NEBS Level GHz. GHz Pad & Monitor Modules with Make-Before-Break Attenuation (front view) Make-Before-Break (MBB) Splitter/Combiner Module Specifications SPECIFICATIONS N-MCFM0H MEASUREMENT FREQUENCY MIN (db) NOM (db) MAX (db) INSERTION LOSS (-way) INSERTION LOSS (-way) MHz... 0 MHz... 0 MHz MHz MHz MHz MHz... 0 MHz... 0 MHz... 0 MHz MHz... MHz... FLATNESS 0- MHz < 0. < 0. TEST LOSS & FLATNESS 0- MHz 9 0 ISOLATION (Min) -TO- 0- MHz 0 RETURN LOSS (Min) ANY -0 MHz -00 MHz MHz 0 RFI (Min) - MHz 00 NOTES: Device to device isolation >. Test point is relative to the common. Page of

2 Make-Before-Break (MBB) Splitter/Combiner Module Specifications (cont d) SPECIFICATIONS -WAY WITH TP & MBB DUAL -WAY WITH TP & MBB TRIPLE -WAY WITH TP & MBB N-M**M0 N-M**M0H N-M**M0 N-M**M0H N-M**M0 N-M**M0H FREQUENCY RANGE F min - F max -00 MHz - MHz -00 MHz - MHz -00 MHz - MHz MEASUREMENT FREQUENCY MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) INSERTION LOSS MHz MHz MHz MHz MHz MHz FLATNESS 0-F max MHz <.0 < 0. <.0 < 0. <.0 < 0. TEST POINT -F max MHz RETURN LOSS -0 MHz 0-00 MHz MHz ** - st * = S (splitter), C (combiner) or X (one splitter, one combiner); nd * = F or B (BNC) connectors. BNC not available in H ( MHz) versions. Plain Splitter/Combiner Module Specifications SPECIFICATIONS PLAIN -WAY PLAIN SINGLE/DUAL -WAY PLAIN SINGLE/TRIPLE -WAY N-MP* N-MPFH N-MP* / N-MP* N-MPFH N-MP* / N-MP* N-MPFH FREQUENCY RANGE F min - F max -00 MHz - MHz -00 MHz - MHz -00 MHz - MHz MEASUREMENT FREQUENCY MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) MIN (db) MAX (db) INSERTION LOSS MHz MHz MHz MHz MHz MHz FLATNESS 0-F max MHz <.0 < 0. <.0 < 0. <.0 < 0. RETURN LOSS * = F or B (BNC) connectors. -0 MHz MHz MHz Page of

3 Functional Schematics Make-Before-Break (MBB) Splitter/Combiner Module -way Splitter Dual -way Splitter Dual -way Splitter/Combiner with Monitor Triple -way Splitter N-MS*M0* N-MS*M0* N-MX*M0* DETAIL (TYP ) N-MS*M0* -way Combiner Dual -way Combiner -way/-way Combiner Triple -way Combiner N-MC*M0* N-MC*M0* N-MCFM0H DETAIL (TYP ) N-MC*M0* Plain Splitter/Combiner Module Plain -way Splitter/Combiner Plain -way Splitter/Combiner Plain -way Splitter/Combiner N-MP** N-MP** Plain Dual -way Splitter/ Combiner Plain Triple -way Splitter/ Combiner N-MP** N-MP** N-MP** Page of

4 Ordering Information Make-Before-Break (MBB) Splitter/Combiner Module Example Part Number: N-MC F M0 H : Module Type: C = Combiner with Pad/Monitor S = Splitter with Pad/Monitor : Connector Type: F = F : Configuration: = : X = Splitter and Combiner with Pad/Monitor - x: Module only B = BNC (not available in H versions) = x:* = x:* : Make-Before-Break Attenuation: M0 = Default : Frequency: H =. GHz Blank =.00 GHz Part Number Description. GHz Splitter/Combiner Modules with Pad & Monitor N-MCFM0H N-MSFM0H N-MXFM0H N-MCFM0H N-MSFM0H N-MCFM0H N-MSFM0H N-MCFM0H Combiner with Monitor,. GHz, F Connector, x:, Default Splitter with Monitor,. GHz, F Connector, x:, Default Splitter/Combiner with Monitor,. GHz, F Connector, x:, Default Combiner with Monitor,. GHz, F Connector, x:, Default Splitter with Monitor,. GHz, F Connector, x:, Default Combiner with Monitor,. GHz, F Connector, :, Default Splitter with Monitor,. GHz, F Connector, :, Default Combiner with Monitor,. GHz, F Connector, x:, x:, Default GHz Splitter/Combiner Modules with Pad & Monitor N-MCFM0 N-MSFM0 N-MXFM0 N-MCFM0 N-MSFM0 N-MCFM0 N-MSFM0 N-MCBM0 N-MSBM0 N-MXBM0 N-MCBM0 N-MSBM0 N-MCBM0 N-MSBM0 Combiner with Monitor, GHz, F Connector, x:, Default Splitter with Monitor, GHz, F Connector, x:, Default Splitter/Combiner with Monitor, GHz, F Connector, x:, Default Combiner with Monitor, GHz, F Connector, x:, Default Splitter with Monitor, GHz, F Connector, x:, Default Combiner with Monitor, GHz, F Connector, :, Default Splitter with Monitor, GHz, F Connector, :, Default Combiner with Monitor, GHz, BNC Connector, x:, Default Splitter with Monitor, GHz, BNC Connector, x:, Default Splitter/Combiner with Monitor, GHz, BNC Connector, x:, Default Combiner with Monitor, GHz, BNC Connector, x:, Default Splitter with Monitor, GHz, BNC Connector, x:, Default Combiner with Monitor, GHz, BNC Connector, :, Default Splitter with Monitor, GHz, BNC Connector, :, Default * x: and x: housed in a single module. Plain Splitter/Combiner Module Example Part Number: N-M P F H : Module Type: P = Plain Splitter/Combiner : Connector Type: F = F B = BNC : Configuration: = : = : = : = x:* = x:* : Frequency: H =. GHz Blank =.00 GHz Part Number Description. GHz Plain Splitter/Combiner Modules N-MPFH Plain,. GHz, F Connector, : N-MPFH Plain,. GHz, F Connector, x: N-MPFH Plain,. GHz, F Connector, x: GHz Plain Splitter/Combiner Modules N-MPF Plain, GHz, F Connector, : N-MPF Plain, GHz, F Connector, : N-MPF Plain, GHz, F Connector, : N-MPF Plain, GHz, F Connector, x: N-MPF Plain, GHz, F Connector, x: N-MPB Plain, GHz, BNC Connector, : N-MPB Plain, GHz, BNC Connector, : N-MPB Plain, GHz, BNC Connector, : N-MPB Plain, GHz, BNC Connector, x: N-MPB Plain, GHz, BNC Connector, x: * x: and x: housed in a single module. Page of

5 RF MODULE SPECIFICATIONS* ENVIRONMENTAL OPERATING TEMPERATURE STORAGE TEMPERATURE STORAGE HUMIDITY ELECTRICAL EMI (EXTERNAL) INTERNAL ISOLATION OF DUAL/TRIPLE MODULES TEST POINT RETURN LOSS, IN/OUT RETURN LOSS, TP ISOLATION, -TO- FLATNESS IMPEDANCE OTHER DIMENSIONS WEIGHT RF Module Specifications 0 C to +0 C (+ F to + F) -0 C to +0 C (-0 F to + F) -9% Non-condensing < -0c < -c Splitter: Measured between INPUT & TP ITOR Combiner: Measured relative to OUTPUT +/- db Accuracy from Nominal > > db > Defined as MAX +/- db Deviation from Linear Trend Line Ω Nominal. H x 0. W x. D (0.9H x.w x 0.D cm). lbs (0. kg) * Unless otherwise stated by module specific table & applies from F min to F max SignalOn Series is a registered trademark of ATX in the United States and/or other countries. Products or features contained herein may be covered by one or more U.S. or foreign patents. Other non-atx product and company names mentioned in this data sheet are the property of their respective companies. Printed in Canada -0 Clements Road West, Ajax, ON LS H Canada Tel (90) -0 Toll Free (00) - Fax (90) -9 Toll Free Fax () -9 support@atxnetworks.com Page of ISO 900 REGISTERED Rev. 0/ (ANW09)