Automotive P-Channel 40 V (D-S) 175 C MOSFET

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1 Automotive P-Channel 4 V (D-S) 75 C MOSFET SQM43EL TO-263 S G S D G Top View D P-Channel MOSFET PRODUCT SUMMARY V DS (V) -4 R DS(on) () at V GS = - V.3 R DS(on) () at V GS = -4.5 V.38 I D (A) -2 Configuration Single Package TO-263 FEATURES TrenchFET power MOSFET Package with low thermal resistance % R g and UIS tested AEC-Q qualified Material categorization: for definitions of compliance please see ABSOLUTE MAXIMUM RATINGS (, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS -4 Gate-Source Voltage V GS ± 2 V -2 Continuous Drain Current a I D -2 Continuous Source Current (Diode conduction) a I S -2 A Pulsed Drain Current b I DM -3 Single Pulse Avalanche Current I AS -6 L =. mh Single Pulse Avalanche Energy E AS 8 mj 375 Maximum Power Dissipation b P D 25 W Operating Junction and Storage Temperature Range T J, T stg -55 to +75 C THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT Junction-to-Ambient PCB mount c R thja 4 Junction-to-Case (Drain) R thjc.4 C/W Notes a. Package limited. b. Pulse test; pulse width 3 μs, duty cycle 2 %. c. When mounted on " square PCB (FR4 material). S7-7-Rev. A, 23-Jan-7 Document Number: 7297 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 SQM43EL SPECIFICATIONS (, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V DS V GS = V, I D = -25 μa V Gate-Source Threshold Voltage V GS(th) V DS = V GS, I D = -25 μa Gate-Source Leakage I GSS V DS = V, V GS = ± 2 V - - ± na Zero Gate Voltage Drain Current I DSS V GS = V V DS = -4 V, T J = 25 C μa V GS = V V DS = -4 V V GS = V V DS = -4 V, T J = 75 C On-State Drain Current a I D(on) V GS = - V V DS -5 V A Notes a. Pulse test; pulse width 3 μs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. V GS = - V I D = -3 A Drain-Source On-State Resistance a R DS(on) V GS = - V I D = -3 A, T J = 25 C V GS = - V I D = -3 A, T J = 75 C V GS = -4.5 V I D = -25 A Forward Transconductance b g fs V DS = -5 V, I D = -25 A S Dynamic b Input Capacitance C iss Output Capacitance C oss V GS = V V DS = -25 V, f = MHz pf Reverse Transfer Capacitance C rss Total Gate Charge c Q g Gate-Source Charge c Q gs V GS = - V V DS = -2 V, I D = -8 A nc Gate-Drain Charge c Q gd - - Gate Resistance R g f = MHz Turn-On Delay Time c t d(on) Rise Time c t r V DD = -2 V, R L = Turn-Off Delay Time c t d(off) I D -8 A, V GEN = - V, R g = ns Fall Time c t f Source-Drain Diode Ratings and Characteristics b Pulsed Current a I SM A Forward Voltage V SD I F = -8 A, V GS = V V Body diode reverse recovery time t rr ns Body diode reverse recovery charge Q rr nc I F = -5 A, di/dt = A/μs Reverse recovery fall time t a ns Reverse recovery rise time t b Body diode peak reverse recovery current I RM(REC) A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S7-7-Rev. A, 23-Jan-7 2 Document Number: 7297 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 SQM43EL TYPICAL CHARACTERISTICS (T A = 25 C, unless otherwise noted) 2 5 V GS = V thru 4 V V GS = 3 V T C =-55 C V GS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics g fs - Transconductance (S) T C = -55 C R DS(on) - On-Resistance (Ω) V GS = V V GS = 4.5 V Transconductance On-Resistance vs. Drain Current C - Capacitance (pf) C oss C iss V GS - Gate-to-Source Voltage (V) I D = 8 A V DS = 2 V C rss Q g - Total Gate Charge (nc) Capacitance Gate Charge S7-7-Rev. A, 23-Jan-7 3 Document Number: 7297 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 SQM43EL TYPICAL CHARACTERISTICS (T A = 25 C, unless otherwise noted) R DS(on) - On-Resistance (Normalized) I D = 3 A V GS = V V GS = 4.5 V T J - Junction Temperature ( C) I S - Source Current (A)... T J = 5 C T J = 25 C V SD - Source-to-Drain Voltage (V) On-Resistance vs. Junction Temperature Source Drain Diode Forward Voltage.25.5 R DS(on) - On-Resistance (Ω) T J = 5 C V GS(th) Variance (V) I D = 25 μa I D = 5 ma. T J = 25 C V GS - Gate-to-Source Voltage (V) T J - Temperature ( C) On-Resistance vs. Gate-to-Source Voltage Threshold Voltage -4 I DM limited I D = ma T J - Junction Temperature ( C) I D limited Limited by R DS(on) () μs ms ms ms, s, s, DC. Single pulse BVDSS limited... () V GS > minimum V GS at which R DS(on) is specified Drain Source Breakdown vs. Junction Temperature Safe Operating Area S7-7-Rev. A, 23-Jan-7 4 Document Number: 7297 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

5 SQM43EL THERMAL RATINGS (T A = 25 C, unless otherwise noted) Normalized Effective Transient Thermal Impedance Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient Duty Cycle =.5 Normalized Effective Transient Thermal Impedance Single Pulse Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Note The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction to Ambient (25 C) - Normalized Transient Thermal Impedance Junction to Case (25 C) are given for general guidelines only to enable the user to get a ball park indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size " x " x.62", double sided with 2 oz. copper, % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions. maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see S7-7-Rev. A, 23-Jan-7 5 Document Number: 7297 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

6 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 27 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 8-Feb-7 Document Number: 9

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