300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR Description. Applications

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1 300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR Description Pin Assignments The is a 300mA, 5.0V fixed output voltage, low-dropout linear regulator with ±1% output voltage accuracy. The device includes pass element, error amplifier, band-gap, current limit and thermal shutdown circuitry. The device is turned on when EN pin is set to logic high level. The characteristics of low-dropout voltage and low-quiescent current make it suitable for low-power applications, for example, battery powered devices. The typical quiescent current is 35μA. Built-in, current-limit and thermal-shutdown functions prevent IC from damage in fault conditions. IN GND EN 1 2 (Top View) 3 4 SOT25 (Fixed Output) 5 OUT NC (Top View) EN 1 6 GND IN U-DFN (Fixed Output) NC NC OUT This device is only available as a 5.0V fixed version. Please contact your local sales office for any other voltage options. The is packaged in SOT25 and U-DFN Features Applications 300mA Low Dropout Regulator with EN Very Low I Q 35µA Fixed Output at 5.0V - V IN(MIN) 5.5V High PSRR: 65dB at 1kHz Fast Start-up Time 220µs Stable with Low ESR, 1µF Ceramic Output Capacitor Excellent Load/Line Transient Response Low Dropout 150mV at 300mA Current Limit and Short Circuit Protection Thermal Shutdown Protection Ambient Temperature Range -40ºC to +85 C SOT25, and U-DFN Available in Green Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Smart Phones MP3/MP4s Battery-Powered Devices Bluetooth Headsets Battery Chargers LCD TVs Multifunction Monitors Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds 1 of 13

2 Typical Applications Circuit V IN V OUT IN OUT AP7335 1µF Enable EN 1µF GND Fixed Output Pin Descriptions Package Name Pin Number SOT25 (Fixed) U-DFN (Fixed) Function IN 1 3 Voltage input pin. Bypass to ground through at least 1µF MLCC capacitor GND 2 2 Ground EN 3 1 Enable input, active high NC 4 5, 6 No connection OUT 5 4 Voltage output pin. Bypass to ground through 1µF MLCC capacitor Functional Block Diagram IN OUT EN Gate Driver Current Limit and Thermal Shutdown R 0.8V R GND Fixed Version 2 of 13

3 Absolute Maximum Ratings A = +25 C, unless otherwise specified.) (Note 4) Symbol Parameter Rating Unit V IN Input Voltage 6.5 V V OUT, V EN OUT, EN Voltage V IN V I LIMIT Continuous Load Current per Channel Internal Limited ma T ST Storage Temperature Range -65 to +150 C ESD HBM Human Body Model ESD Protection 2,000 V ESD MM Machine Model ESD Protection 200 V Note: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Recommended Operating Conditions (@T A = +25 C, unless otherwise specified.) Symbol Parameter Min Max Unit V IN Input voltage (Note 6) 5.5 (Note 6) 6 V I OUT Output Current (Note 5) ma T A Operating Ambient Temperature C Notes: 5. The device maintains a stable, regulated output voltage without a load current. 6. V IN(MIN) = 5.5V for 5.0V, V OUT at 300mA I OUT. 3 of 13

4 Electrical Characteristics A = +25 C, unless otherwise specified.) (T A = +25 C, V IN = 5.5 to 6V, C IN = 1μF, C OUT = 1μF, V EN = 2V, unless otherwise stated) Symbol Parameter Test Conditions Min Typ. Max Unit V OUT Output Voltage Accuracy T A = -40 C to +85 C, I OUT = 10% of I OUT-Max -1-1 % V OUT /V Line Regulation V IN = 5.5V to 6V, IN/V OUT V EN = V IN, I OUT = 1mA %/V V OUT /V OUT Load Regulation V IN = 5.5V to 6V, I OUT = 1mA to 300mA % V DROPOUT Dropout Voltage (Note 7) I OUT = 300mA mv I Q Input Quiescent Current V EN = V IN, I OUT = 0mA μa I SHDN Input Shutdown Current V EN = 0V, I OUT = 0mA μa I LEAK Input Leakage Current V EN = 0V, OUT Grounded μa T ST Start-up Time V EN = 0V to 2.0V in 1μs, I OUT = 300mA μs PSRR PSRR V IN = 5.5V DC + 0.5V PPAC, f = 1kHz, I OUT = 50mA db I SHORT Short-circuit Current V IN = V IN-Min to V IN-Max, V OUT < 0.2V (Fixed) ma I LIMIT Current limit V IN = V IN-Min to V IN-Max, V OUT/R OUT = 1.2A ma V IL En Input Logic Low Voltage V IN = V IN-Min to V IN-Max V V IH En Input Logic High Voltage V IN = V IN-Min to V IN-Max V I EN En Input Current V IN = 0V or V IN-Max -1-1 μa T SHDN Thermal Shutdown Threshold C T HYS Thermal Shutdown Hysteresis C θ JA Thermal Resistance Junction-to-Ambient SOT25 (Note 8) U-DFN (Note 8) C/W Notes: 7. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value. 8. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad layout. 4 of 13

5 Performance Characteristics Start-Up Time Start-Up Time V EN=0 to 2V (1V/div) V IN=5.5V C IN=C OUT=1μF V EN=0 to 2V (1V/div) V IN=5.5V C IN=C OUT=1μF V OUT=5.0V (2V/div) With No Load V OUT=5.0V (2V/div) With 300mA Load Time (40μs/div) Line Transient Response Time (40μs/div) Line Transient Response V IN=5.5V to 6.0V (1V/div) t R= t F=2μs C IN=None, C OUT=1μF V IN=5.5V to 6.0V (1V/div) t R= t F =2μs C IN=None, C OUT=1μF V OUT=5.0V (10mV/div) V OUT=5.0V (10mV/div) I OUT=300mA (200mA/div) I OUT=30mA (50mA/div) V IN=V EN=5.5V C IN=C OUT=1μF t R= t F =1μs Time (40μs/div) Load Transient Response V IN=V EN=5.5V C IN=C OUT=1μF t R= t F =1μs Time (40μs/div) Load Transient Response V OUT=5.0V (100mV/div) V OUT=5.0V (100mV/div) I OUT=10mA to 150mA (200mA/div) I OUT=10mA to 300mA (200mA/div) Time (100μs/div) Time (100μs/div) 5 of 13

6 Short-circuit Current(mA) Current limit(ma) NEW PRODUCT PSRR(dB) Dropout Voltage(mV) Performance Characteristics (Cont.) PSRR I OUT =50mA 200 Dropout Voltage vs Output Current V OUT =5.0V C V IN =5.5V+0.5V PPAC V OUT =5.0V C IN =none, C OUT =1μF T A =25 C I OUT =300mA Frequency(kHz) C -45 C Output Current(mA) Short-circuit Current vs Temperature Current limit vs Temperature V IN =5.5V V IN =5.5V V OUT =5.0V Temperature( ) Temperature( ) 6 of 13

7 Application Note Input Capacitor A 1μF ceramic capacitor is recommended between IN and GND pins to decouple input power supply glitch and noise. The amount of the capacitance may be increased without limit. This input capacitor must be located as close as possible to the device to assure input stability and reduce noise. For PCB layout, a wide copper trace is required for both IN and GND pins. A lower ESR capacitor type allows the use of less capacitance, while higher ESR type requires more capacitance. Output Capacitor The output capacitor is required to stabilize and improve the transient response of the LDO. The is stable with very small ceramic output capacitors. Using a ceramic capacitor value that is at least 1μF with ESR > 15mΩ on the output ensures stability. Higher capacitance values help to improve line and load transient response. The output capacitance may be increased to keep low undershoot and overshoot. Output capacitor must be placed as close as possible to OUT and GND pins. 100 Region of Stable C OUT ESR vs. Load Current 10 COUT ESR (Ω) Stable Range V IN=5.5V C IN=C OUT=1μF Unstable Range Load Current (ma) No Load Stability No minimum load is required to keep the device stable. The device will remain stable and regulated in no load condition. ON/OFF Input Operation The is turned on by setting the EN pin high, and is turned off by pulling it low. If this feature is not used, the EN pin should be tied to IN pin to keep the regulator output on at all time. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under V IL and V IH. Current Limit Protection When output current at OUT pin is higher than current limit threshold, the current limit protection will be triggered and clamp the output current to approximately 650mA to prevent overcurrent and to protect the regulator from damage due to overheating. Short Circuit Protection When OUT pin is short-circuit to GND, short circuit protection will be triggered and clamp the output current to approximately 160mA. This feature protects the regulator from overcurrent and damage due to overheating. Thermal Shutdown Protection Thermal protection disables the output when the junction temperature rises to approximately +145 C, allowing the device to cool down. When the junction temperature reduces to approximately +130 C the output circuitry is enabled again. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the heat dissipation of the regulator, protecting it from damage due to overheating. Ultra Fast Start-Up After enabled, the is able to provide full power in as little as tens of microseconds, typically 220µs, without sacrificing low ground current. This feature will help load circuitry move in and out of standby mode in real time, eventually extend battery life for mobile phones and other portable devices. 7 of 13

8 Application Note Fast Transient Response Fast transient response LDO can extend battery life. TDMA-based cell phone protocols such as Global System for Mobile Communications (GSM) have a transmit/receive duty factor of only 12.5 percent, enabling power savings by putting much of the baseband circuitry into standby mode in between transmit cycles. In baseband circuits, the load often transitions virtually instantaneously from 100µA to 100mA. To meet this load requirement, the LDO must react very quickly without a large voltage drop or overshoot a requirement that cannot be met with conventional, general-purpose LDO. The s fast transient response from 0 to 300mA provides stable voltage supply for fast DSP and GSM chipset with fast changing load. Low Quiescent Current The, consuming only around 35µA for all input range, provides great power saving in portable and low power applications. Power Dissipation The device power dissipation and proper sizing of the thermal plane that is connected to the thermal pad is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by: P D = (V IN - V OUT) X I OUT The maximum power dissipation, handled by the device, depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be calculated by the following equation: ( 145C - T P D (max@t A) = A ) RJA Ordering Information Device Package Code Packaging 7 Tape and Reel (Note 9) Quantity Part Number Suffix W-7 W SOT25 3,000/Tape & Reel -7 SN-7 SN U-DFN ,000/Tape & Reel -7 Note: 9. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at 8 of 13

9 Marking Information (1) SOT25 (Top View) 5 47 XX Y W X XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : G = Green Device Package Identification Code W-7 SOT25 TP (2) U-DFN (Top View) XX Y W X XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : G = Green Device Package Identification Code SN-7 U-DFN TP 9 of 13

10 Package Outline Dimensions (All dimensions in mm.) Please see for the latest version. (1) Package Type: SOT25 A K J H D B C N L M SOT25 Dim Min Max Typ A B C D 0.95 H J K L M N All Dimensions in mm (2) Package Type: U-DFN A1 A3 A Seating Plane E2/2 E E2 D D2 D2/2 R0.100 Pin #1 ID U-DFN Dim Min Max Typ A A A b D D e E E L All Dimensions in mm L e b 10 of 13

11 Suggested Pad Layout Please see for the latest version. (1) Package Type: SOT25 C2 C2 Z G Y C1 Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C C X (2) Package Type: U-DFN X C Y G X X1 Y1 G Value Dimensions (in mm) C 0.65 G 0.15 X 0.37 X Y 0.45 Y of 13

12 Taping Orientation (Note 10) For U-DFN Note: 10. The taping orientation of the other package type can be found on our website at 12 of 13

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