Product Specification ML-3865-B1 MEMS silicon microphone

Transcription

1 Product Specification ML-3865-B1 MEMS silicon microphone Description ML B1 is high-performance analog bottom-port silicon microphone that receives the sound signal from the hole on PCB. By using our own innovative and unique MEMS silicon microphone chip design, MicroLink Senstech provides a series of packaged MEMS silicon microphones with compact size to achieve high performance such as high SNR, high sensitivity, excellent reliability and broad frequency response. This series of MEMS microphones find wide applications in cell phones, tablets, wearable devices and other portable electronic devices. The ML B1 has a sensitivity of -38dBV/Pa (tolerance of ±1dBV/Pa) with a signal-to-noise ratio of 65 db, an extreme low total harmonic distortion of 0.1% at 94 db SPL and very high acoustic overload point of 127 db SPL. Features Gold coated metal housing package with buried capacitor and resistor inside PCB, immune to RF/EM interference. High mechanical strength, high temperature resistance and excellent reliability. Wide frequency response range, high sensitivity and high signal-to-noise ratio. Withstand multiple times of SMT reflow process. Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 1/8

2 Applications Cell phones/smartphones, tablets, learning machines/game stations, MP3/DC/DV, computers/laptops, Bluetooth headsets/headphones, wearable smart systems, IoT related devices, etc. Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 2/8

3 Acoustic and electrical specifications Parameter Symbol Test condition Value Min Type Max Unit Sensitivity Sens 94dB dbv/pa Signal to Noise Ratio SNR 94dB db(a) Output Impedance 1 khz 100 Ω Supply Voltage VDD V Current Consumption IDD A Dimension mm 3 Directivity Frequency Response Power Supply Rejection Ratio Total Harmonic Distortion Acoustic Overload Point Omnidirectional F 100~10k Hz PSRR THD+N 217Hz, 0.1Vpp Square on VDD -66 db 94 db 1kHz % 104 db 1kHz 0.2 % AOP 10% 1kHz db SPL Frequency response Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 3/8

4 Mechanical specifications Dimension Pin # Pin Name Description Item Dimension Tolerance Length(L) 3.76 mm ±0.1 mm Width(W) 2.95 mm ±0.1 mm Height(H) 1.10 mm ±0.1 mm 1 VOUT Signal output 2 GND Ground 3 GND Ground 4 VDD Power 5 GND Ground 6 GND Ground Block diaphragm V DD 1.5 µf Power Output Output GND GND 10 k Ground Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 4/8

5 Reflow profile Recommended reflow profile limits Description Average temperature change rate (TSMAX to TP) Parameter(lead-free) 3 0 C/second max. Preheat Reflow Peak temperature Minimum temperature (TSMIN) Maximum temperature (TSMAX) Time (TSMIN to TSMAX) (ts) Temperature (TL) Time (tl) Temperature (TP) Time(tP) C C seconds C seconds C seconds Cooling rate(tp to TSMAX) Time required from 25 0 C to peak temperature 6 0 C/second max 8 minutes max Notes: 1) The air speed during reflow process should be low to avoid impurity entering the acoustic hole during reflow process. 2) Do not wash or clean the product to avoid impurity entering the product. 3) Do not carry out the reflow process more than 5 times. If the melting point of solder is lower, the peak temperature should be accordingly reduced. Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 5/8

6 Reliability index Test item Description Reference Test under constant temperature and humidity Thermal shock 168 hours continuous testing under 85 0 C and 85% humidity condition Alternating temperature shock test between C and C JESD22-A101A-B IEC High temperature test 168 hours continuous testing at C IEC Low temperature test 168 hours continuous testing at C IEC Drop test Drop test at 1.5m height IEC ESD 8KV DC voltage discharge test with direct contact to lid while unit is grounded, and 4KV DC voltage test above acoustic hole. IEC Vibration test 15 mins vibration test from Hz IEC Reflow test Mechanical Shock 5 cycles reflow process (Peak temperature: C) 3 pulses of 10,000 G in the X, Y, and Z direction IEC , Test Ea Notes: After reliability tests are performed, the sensitivity of the microphones shall not deviate more than 1 db from its initial value. After 3 reflow cycles, the sensitivity of the microphone shall not deviate more than 1dB from its initial value. Part number Sensitivity SNR Bottom port Sensitivity tolerance B 1 17 A 0001 Lot Number Month Year Notes : 1) The year code is the last digit of year, e.g. the year code of 2017 is 17 ; 2) The month codes comprise 0-9 and 3 letters of the alphabet A-C. 1-9 represent January to September and A-C represent October, November and December. Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 6/8

7 Packaging and marking detail Carrier ba nd di agram Zoom 3865-B1 17A0001 Notes: 1) Dice are packaged in black carrier band which uses anti-electrostatic material. Each volume of packaged products is 5000 pcs. 2) The space between two dice is 8 mm packaged in the carrier band with 12-mm width rolled in the reel of 12-inch diameter. 3) The first 50 pcs and the last 20 pcs are vacant. 4) The package requirements mentioned below is the company's standard delivery specifications. If you need special packages, please contact our sales staff. 5) All dimensions are in millimeters (mm) with tolerance of ± 0.3 mm. Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 7/8

8 Remarks Do not apply over 30 psi of air pressure into the port hole. Do not carry out washing or cleaning of device board using liquid. Do not apply vacuum when repacking into sealed bags. The nozzle should avoid touching the port hole while SMT assembly. Version updates Version Updated Content Updated Date 1.0 Setup Contact Shanghai MicroLink Senstech Co. Lte Address:Building 3, 439 Chunxiao Road, Zhangjiang High-Tech Park, Shanghai (China), Zip code Tel.: Fax: Website: Version 1.0 Shanghai MicroLink Senstech Copyright Reserved 8/8