HCPL-4701/-4731/-070A/-073A Very Low Power Consumption High Gain Optocouplers HCPL-4731/073A

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1 HCPL-/-/-A/-A Very Low Power Consumption High Gain Optocouplers Data Sheet Features Ultra low input current capability - µa Specified for V operation Typical power consumption: < mw Input power: < µw Output power: < µw Will operate with V CC as low as. V High current transfer ratio: % at I F = µa TTL and CMOS compatible output Specified ac and dc performance over temperature: C to C Safety approval: UL recognized V rms for minute and V rms* for minute per UL CSA approved IEC/EN/DIN EN -- approved with V IORM = V peak (Option ) for HCPL- -pin product compatible with N/N9 and HCPL-/HCPL- Available in -Pin DIP and SOIC- footprint Through hole and surface mount assembly available Applications Battery operated applications ISDN telephone interface Ground isolation between logic families TTL, LSTTL, CMOS, HCMOS, HL-CMOS, LV-HCMOS Low input current line receiver EIA RS-C line receiver Telephone ring detector AC line voltage status indicator low input power dissipation Low power systems ground isolation Portable system I/O interface Functional Diagram HCPL-/A HCPL-/A NC V CC ANODE V CC ANODE V B CATHODE CATHODE CATHODE NC GND ANODE GND TRUTH TABLE LED ON LOW OFF HIGH * V rms/ Minute rating is for Option (HCPL- and HCPL-) products only. A. µf bypass capacitor connected between pins and is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

2 Description These devices are very low power consumption, high gain single and dual channel optocouplers. The HCPL- represents the single channel -Pin DIP configuration and is pin compatible with the industry standard N9. The HCPL- represents the dual channel -Pin DIP configuration and is pin compatible with the popular standard HCPL-. The HCPL-A and HCPL-A are the equivalent single and dual channel products in an SO- footprint. Each channel can be driven with an input current as low as µa and has a typical current transfer ratio of %. These high gain couplers use an AlGaAs LED and an integrated high gain photodetector to provide an extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage results in TTL compatible saturation voltages and high speed operation. Where desired, the V CC and terminals may be tied together to achieve conventional Darlington operation (single channel package only). These devices are designed for use in CMOS, LSTTL or other low power applications. They are especially well suited for ISDN telephone interface and battery operated applications due to the low power consumption. A % minimum current transfer ratio is guaranteed from C to C operating temperature range at µa of LED current and V CC V. The SO- does not require through holes in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. Selection Guide Widebody -Pin DIP Package Hermetic ( Mil) Small Outline SO- ( mil) Single and Dual Single Dual Minimum Absolute Dual Single Channel Channel Channel Single Input ON Maxi- Channel Channel Package Package Package Channel Current Minimum mum Packages Package HCPL- HCPL- HCPL- Package (I F ) CTR V CC HCPL- N9 [] [] [] [] HCNW9 []. ma % V N [] [] [] [] HCNW []. ma % V HCPL- A A µa % V. ma % V [] [] [] [] Notes:. Technical data are on separate Avago publication.

3 Ordering Information HCPL-, HCPL-, HCPL-A and HCPL-A are UL Recognized with Vrms for minute per UL and are approved under CSA Component Acceptance Notice #, File CA. Option Part RoHS non RoHS Surface Gull Tape UL Vrms/ IEC/EN/DIN Number Compliant Compliant Package Mount Wing & Reel Minute rating EN -- Quantity -E no option mil DIP- per tube -E - X X per tube -E - X X X per reel HCPL- -E - X per tube HCPL- -E - X X X per tube -E - X X X X per reel -E - X per tube -E - X X X per tube -E - X X X X per reel -E no option SO- per tube HCPL-A -E - X X X per reel HCPL-A -E - X per tube -E - X X X X per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example : HCPL--E to order product of mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN -- Safety Approval and RoHS compliant. Example : HCPL-A to order product of Surface Mount Small Outline SO- package and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation #XXX is used for existing products, while (new) products launched since July, and RoHS compliant will use XXXE.

4 Schematic HCPL- and HCPL-A HCPL- and HCPL-A V CC I CC I F I CC VCC ANODE V F CATHODE I F I O V F I O VO I B V B GND V F I O SHIELD I F SHIELD GND USE OF A. µf BYPASS CAPACITOR CONNECTED BETWEEN PINS AND IS RECOMMENDED (SEE NOTE )

5 Package Outline Drawings -Pin DIP Package (HCPL-, HCPL-) 9. ±. (. ±.). ±. (. ±.) TYPE NUMBER OPTION CODE*. ±. (. ±.) A XXXXZ DATE CODE YYWW.9 (.) MAX.. (.) MAX.. ±. (. ±.). (.) MAX. TYP (..) -.). ±. (. ±.).9 (.) MIN.. (.) MAX.. ±. (. ±.). (.) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION "V" = OPTION OPTION NUMBERS AND NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX. -Pin DIP Package with Gull Wing Surface Mount Option (HCPL-, HCPL-) LAND PATTERN RECOMMENDATION 9. ±. (. ±.). (.). ±. (. ±.).9 (.). (.). (.).9 (.) MAX.. (.) MAX.. ±. (. ±.) 9. ±. (. ±.). ±. (. ±.).. -. (..) -.). ±. (. ±.).. ±. (.) (. ±.) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (. INCHES).. ±. (. ±.) NOM. NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX.

6 Small-Outline SO- Package (HCPL-A, HCPL-A) LAND PATTERN RECOMMENDATION.9 ±. (. ±.) PIN ONE XXX YWW. ±. (. ±.). (.) BSC.99 ±. (. ±.) TYPE NUMBER (LAST DIGITS) DATE CODE. (.).9 (.).9 (.9) *. ±. (. ±.) X. (.). ±. (. ±.). (.). ±. (.9 ±.) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH). ±. (. ±.) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (. INCHES) MAX.. (.) MIN.. ±. (. ±.) NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX. Solder Reflow Thermal Profile TEMPERATURE ( C) PREHEATING RATE C C/. C/SEC. REFLOW HEATING RATE. C ±. C/SEC. C C C C C/. C. C ±. C/SEC. PREHEATING TIME C, 9 SEC. PEAK TEMP. C SEC. SEC. SEC. PEAK TEMP. C SOLDERING TIME C PEAK TEMP. C ROOM TEMPERATURE TIGHT TYPICAL LOOSE TIME (SECONDS) Note: Non-halide flux should be used. Figure a. Solder Reflow Thermal Profile.

7 Recommended Pb-Free IR Profile TEMPERATURE T p /- C T L C RAMP-UP C/SEC. MAX. T smax - C T smin t s PREHEAT to SEC. t C to PEAK Figure b. Pb-Free IR Profile. t p t L TIME WITHIN C of ACTUAL PEAK TEMPERATURE - SEC. RAMP-DOWN C/SEC. MAX. to SEC. TIME NOTES: THE TIME FROM C to PEAK TEMPERATURE = MINUTES MAX. T smax = C, T smin = C Note: Non-halide flux should be used. Regulatory Information The HCPL-/ and HCPL- A/A have been approved by the following organizations: UL Recognized under UL, Component Recognition Program, File E. CSA Approved under CSA Component Acceptance Notice #, File CA. IEC/EN/DIN EN -- Approved under: IEC --:99 A: EN --: A: DIN EN -- (VDE Teil ):-. (Option only) Insulation Related Specifications -Pin DIP ( Mil) SO- Parameter Symbol Value Value Units Conditions Minimum External Air L()..9 mm Measured from input terminals to Gap (External output terminals, shortest distance Clearance) through air. Minimum External L().. mm Measured from input terminals to Tracking (External output terminals, shortest distance Creepage) path along body. Minimum Internal Plastic.. mm Through insulation distance, conductor Gap (Internal Clearance) to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Tracking Resistance CTI Volts DIN IEC / VDE Part (Comparative Tracking Index) Isolation Group IIIa IIIa Material Group DIN VDE, /9, Table ) Option surface mount classification is Class A in accordance with CECC.

8 IEC/EN/DIN EN -- Insulation Related Characteristics (HCPL- OPTION ONLY) Description Symbol Characteristic Units Installation classification per DIN VDE /.9, Table for rated mains voltage V rms for rated mains voltage V rms Climatic Classification // Pollution Degree (DIN VDE /.9) Maximum Working Insulation Voltage V IORM V peak Input to Output Test Voltage, Method b* V IORM x. = V PR, % Production Test with t m = sec, V PR V peak Partial Discharge < pc Input to Output Test Voltage, Method a* V IORM x. = V PR, Type and sample test, V PR 9 V peak t m = sec, Partial Discharge < pc Highest Allowable Overvoltage* (Transient Overvoltage, t ini = sec) V IOTM V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure, Thermal Derating curve.) Case Temperature T S C Input Current I S,INPUT ma Output Power P S,OUTPUT mw Insulation Resistance at T S, V IO = V R S > 9 Ω I-IV I-III *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN --, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.

9 Absolute Maximum Ratings (No Derating Required up to C) Parameter Symbol Minimum Maximum Units Storage Temperature T S - C Operating Temperature T A - C Average Forward Input Current (HCPL-/) I F(AVG) ma Average Forward Input Current (HCPL-A/A) I F(AVG) ma Peak Transient Input Current (HCPL-/) I FPK ma (% Duty Cycle, ms Pulse Width) Peak Transient Input Current (HCPL-A/A) I FPK ma (% Duty Cycle, ms Pulse Width) Reverse Input Voltage V R. V Input Power Dissipation (Each Channel) P I mw Output Current (Each Channel) I O ma Emitter Base Reverse Voltage (HCPL-/A) V EB. V Output Transistor Base Current (HCPL-/A) I B ma Supply Voltage V CC -. V Output Voltage -. V Output Power Dissipation (Each Channel) P O mw Total Power Dissipation (Each Channel) P T mw Lead Solder Temperature (for Through Hole Devices) C for sec.,. mm below seating plane Reflow Temperature Profile See Package Outline Drawings section (for SOIC- and Option #) Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC *. V Forward Input Current (ON) I F(ON) µa Forward Input Voltage (OFF) V F(OFF). V Operating Temperature T A C *See Note. 9

10 Electrical Specifications C T A C,. V V CC V,. ma I F(ON) ma, V V F(OFF). V, unless otherwise specified. All Typicals at T A = C. See note. Device Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note Current CTR k % I F = µa, =. V, Transfer V CC =. V Ratio k I F =. ma, V CC =. V k I F = µa k I F =. ma Logic Low L.. V I F = µa, I O = µa, Output Voltage.. I F =. ma, I O =. ma Logic High I OH. µa = V CC = to V, Output Current I F = ma. = V CC = V, I F = ma Logic Low I CCL /A.. ma I F = µa = Open Supply Current. I F =. ma /A.. I F = µa.. I F =. ma Logic High I CCH /A <. µa I F = ma = Open Supply Current /A <. Input Forward V F... V I F = to µa, Voltage T A = C.9. I F = to µa Input Reverse BV R.. V I R = µa, T A = C Breakdown Voltage. I R = µa Temperature V F / T A -. mv/ C I F = µa Coefficient of Forward Voltage -. I F =. ma Input Capacitance C IN pf f = MHz, V F = V *All typical values at T A = C and V CC = V, unless otherwise noted.

11 Switching Specifications (AC) Over Recommended Operating Conditions T A = C to C, V CC = V to V, unless otherwise specified. Device Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note Propagation t PHL µs I F = µa, R L = to kω,, 9 9, Delay Time V CC =. to V to Logic Low T A = C I F =. ma, at Output R L =. kω Propagation t PLH µs I F = µa, R L = to kω,, 9 9, Delay Time V CC =. to V to Logic High T A = C I F =. ma, Output / 9 R L =. kω A/A Common Mode CM H,, V/µs I F = ma, R L =. to kω,, Transient V CM = V p-p, Immunity at T A = C, Logic High Output Common Mode CM L,, V/µs I F =. ma, R L =. to kω,, Transient V CM = V p-p, Immunity at T A = C Logic Low Output, I F = µa, R L = to kω, V CM = V p-p V CC =. to V, T A = C *All typical values at T A = C and V CC = V, unless otherwise noted. Package Characteristics Device Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note Input-Output Momentary V ISO V rms RH %,, Withstand Voltage** t = min., Option T A = C, a Resistance R I-O Ω V I-O = VDC (Input-Output) RH % Capacitance C I-O. pf f = MHz (Input-Output) Insulation Leakage I I-I. µa RH %, t = s, Current (Input-Input) A V I-I = VDC Resistance (Input-Input) R I-I Ω Capacitance C I-I. pf f = MHz (Input-Input) A. *All typical values at T A = C and V CC = V. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN -- Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note entitled Optocoupler Input-Output Endurance Voltage.

12 Notes:. Specification information is available form the factory for. V operation. Call your local field sales office for further information.. DC CURRENT TRANSFER RATIO is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times %.. Device considered a two terminal device: pins,,, and shorted together, and pins,,, and shorted together.. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage V RMS for second (leakage detection current limit, I I-O µa. a. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage V RMS for second (leakage detection current limit, I I-O µa. This test is performed before the % production test for partial discharge (Method b) shown in the IEC/EN/DIN EN -- Insulation Characteristics Table.. Measured between pins and shorted together, and pins and shorted together.. Common transient immunity in a Logic High level is the maximum tolerable (positive) dv CM /dt on the leading edge of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., >. V). Common transient immunity in a Logic Low level is he maximum tolerable (negative) dv CM /dt on the trailing edge of the common mode pulse, V CM, to assure that the output will remain in a Logic Low state (i.e., <. V).. In applications where dv/dt may exceed, V/µs (such as static discharge) a series resistor, R CC, should be included to protect the detector IC form destructively high surge currents. The recommended value is R CC = Ω.. Use of a. µf bypass capacitor connected between pins and adjacent to the device is recommended. 9. Pin open for single channel product.. Use of resistor between pins and will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below kω for single channel product.. The Applications Information section of this data sheet references the HCPL-XX part family, but applies equally to the HCPL-A and HCPL- A parts. I O OUTPUT CURRENT ma 9 T A = C V CC = V. I F =. ma I F =. ma I F =. ma I F =. ma I F =. ma OUTPUT VOLTAGE V. I O OUTPUT CURRENT ma T A = C V CC = V. I F = µa I F = µa I F = µa I F = µa I F = µa OUTPUT VOLTAGE V. NORMALIZED CURRENT TRANSFER RATIO C C C.. NORMALIZED I F = µa =. V V CC = V I F FORWARD CURRENT ma Figure. DC Transfer Characteristics (I F =. ma to. ma). Figure. DC Transfer Characteristics (I F = µa to µa). Figure. Current Transfer Ratio vs. Forward Current. I O OUTPUT CURRENT ma 9 =. V V CC = V C C C I F FORWARD CURRENT ma.. V F I F T A = C I P PROPAGATION DELAY µs I F =. ma R L =. kω t PLH t PHL I F INPUT DIODE FORWARD CURRENT ma V F FORWARD VOLTAGE T A TEMPERATURE C Figure. Output Current vs. Input Diode Forward Current. Figure. Input Diode Forward Current vs. Forward Voltage. Figure. Propagation Delay vs. Temperature.

13 V V CM V % t r 9% 9% % tf I F B A R CC (SEE NOTE ) V Ω. µf R L SWITCH AT A: I = ma F V V FF SWITCH AT B: I F =. ma L V CM PULSE GEN. Figure. Test Circuit for Transient Immunity and Typical Waveforms. I F V PULSE GEN. Z O = Ω t r = ns I F R L V (SATURATED RESPONSE) t PHL. V. V L t PLH % DUTY CYCLE /f < µs I F MONITOR R M. µf * C L = pf Figure 9. Switching Test Circuit. * C L IS APPROXIMATELY pf, WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. Applications Information Low-Power Operation Current Gain There are many applications where low-power isolation is needed and can be provided by the single-channel HCPL-, or the dual-channel HCPL- lowpower optocouplers. Either or both of these two devices are referred to in this text as HCPL- XX product(s). These optocouplers are Avago s lowest input current, low-power optocouplers. Low-power isolation can be defined as less than a milliwatt of input power needed to operate the LED of an optocoupler (generally less than µa). This level of input forward current conducting through the LED can control a worst-case total output (I ol ) and power supply current (I ccl ) of two and a half milliamperes. Typically, the HCPL-XX can control a total output and supply current of ma. The output current, I O is determined by the LED forward current multiplied by the current gain of the optocoupler, I O =I F (CTR)/%. In particular with the HCPL-XX optocouplers, the LED can be driven with a very small I F of µa to control a maximum I O of µa with a worst case design Current Transfer Ratio (CTR) of %. Typically, the CTR and the corresponding I ol, are times larger. For low-power operation, Table lists the typical power dissipations that occur for both the. Vdc and Vdc HCPL-XX optocoupler applications. These approximate power dissipation values are listed respectively for the LED, for the output V CC and for the opencollector output transistor. Those values are summed together for a comparison of total power dissipation consumed in either the. Vdc or Vdc applications.

14 Table. Typical HCPL- Power Dissipation for V and V Applications Power Dissipation V CC =. Vdc V CC = Vdc (µw) I F = µa I F = µa I F = µa I F = µa P LED P Vcc P [] O-C P [] TOTAL µw 9 µw µw, µw Notes:. R L of kω open-collector (o-c) pull-up resistor was used for both. Vdc and Vdc calculations.. For typical total interface circuit power consumption in. Vdc application, add to P TOTAL approximately µw for µa (, µw for µa) LED current-limiting resistor, and 9 µw for the kω pull-up resistor power dissipations. Similarly, for Vdc applications, add to P TOTAL approximately µw for µa (, µw for µa) LED current-limiting resistor and, µw for the kω pull-up resistor power dissipations. Propagation Delay When the HCPL-XX optocoupler is operated under very low input and output current conditions, the propagation delay times will lengthen. When lower input drive current level is used to switch the high-efficiency AlGaAs LED, the slower the charge and discharge time will be for the LED. Correspondingly, the propagation delay times will become longer as a result. In addition, the split-darlington (open-collector) output amplifier needs a larger, pull-up load resistance to ensure the output current is within a controllable range. Applications that are not sensitive to longer propagation delay times and that are easily served by this HCPL- XX optocoupler, typically µs or greater, are those of status monitoring of a telephone line, power line, battery condition of a portable unit, etc. For faster HCPL-XX propagation delay times, approximately µs, this optocoupler needs to operate at higher I F ( µa) and I o ( ma) levels. Applications Battery-Operated Equipment Common applications for the HCPL-XX optocoupler are within battery-operated, portable equipment, such as test or medical instruments, computer peripherals and accessories where energy conservation is required to maximize battery life. In these applications, the optocoupler would monitor the battery voltage and provide an isolated output to another electrical system to indicate battery status or the need to switch to a backup supply or begin a safe shutdown of the equipment via a communication port. In addition, the HCPL-XX optocouplers are specified to operate with Vdc CMOS logic family of devices to provide logicsignal isolation between similar or different logic circuit families. Telephone Line Interfaces Applications where the HCPL- XX optocoupler would be best used are in telephone line interface circuitry for functions of ring detection, on-off hook detection, line polarity, line presence and supplied-power sensing. In particular, Integrated Services Digital Network (ISDN) applications, as illustrated in Figure, can severely restrict the input power that an optocoupler interface circuit can use (approximately mw). Figure shows three isolated signals that can be served by the small input LED current of the HCPL-XX dualand single-channel optocouplers. Very low, total power dissipation occurs with these series of devices. Switched-Mode Power Supplies Within Switched-Mode Power Supplies (SMPS) the less power consumed the better. Isolation for monitoring line power, regulation status, for use within a feedback path between primary and secondary circuits or to external circuits are common applications for optocouplers. Low-power HCPL-XX optocoupler can help keep higher energy conversion efficiency for the SMPS. The block diagram of Figure shows where low-power isolation can be used.

15 TELEPHONE LINE ISOLATION BARRIER -WIRE ISDN LINE PROTECTION CIRCUIT RECEIVE TRANSMIT HCPL- LINE POLARITY PRIMARY SECONDARY POWER ISOLATION BARRIER VAC PRIMARY PWER SUPPLY EMERGENCY POWER SECONDARY POWER HCPL- SWITCHED MODE POWER SUPPLY LINE PRESENCE TELEPHONE LINE INTERFACE CIRCUIT SECONDARY/ EMERGENCY POWER V CC V CC RETURN NOTE: THE CIRCUITS SHOWN IN THIS FIGURE REPRESENT POSSIBLE, FUNCTIONAL APPLICATION OF THE HCPL-XX OPTOCOUPLER TO AN ISDN LINE INTERFACE. THIS CIRCUIT ARRANGEMENT DOES NOT GUARANTEE COMPLIANCE, CONFORMITY, OR ACCEPTANCE TO AN ISDN, OR OTHER TELECOMMUNICATION STANDARD, OR TO FCC OR TO OTHER GOVERNMENTAL REGULATORY AGENCY REQUIREMENTS. THESE CIRCUITS ARE RECOMMENDATIONS THAT MAY MEET THE NEEDS OF THESE APPLICATIONS. Agilent DOES NOT IMPLY, REPRESENT, NOR GUARANTEE THAT THESE CIRCUIT ARRANGEMENTS ARE FREE FROM PATENT INFRINGEMENT. Figure. HCPL-XX Isolated Monitoring Circuits for -Wire ISDN Telephone Line. ISOLATION BARRIER / VAC EMI FILTER AND CURRENT LIMITER SWITCHING ELEMENT RECTIFIER AND FILTER GND CONTROL CIRCUIT ERROR FEEDBACK VIA CNR SOFT START COMMAND POWER SUPPLY FILTER CAPACITOR HCPL- INTERRUPT FLAG POWER DOWN Figure. Typical Optical Isolation Used for Power-Loss Indication and Regulation Signal Feedback. RECOMMENDED V CC FILTER. µf Ω µf R L V CC HCPL- OR HCPL- Figure. Recommended Power Supply Filter for HCPL-XX Optocouplers.

16 Data Communication and Input/Output Interfaces In data communication, the HCPL-XX can be used as a line receiver on a RS--C line or this optocoupler can be part of a proprietary data link with low input current, multi-drop stations along the data path. Also, this low-power optocoupler can be used within equipment that monitors the presence of highvoltage. For example, a benefit of the low input LED current ( µa) helps the input sections of a Programmable Logic Controller (PLC) monitor proximity and limit switches. The PLC I/O sections can benefit from low input current optocouplers because the total input power dissipation when monitoring the high voltage ( Vac - Vac) inputs is minimized at the I/O connections. This is especially important when many input channels are stacked together. Circuit Design Issues Power Supply Filtering Since the HCPL-XX is a highgain, split-darlington amplifier, any conducted electrical noise on the V CC power supply to this optocoupler should be minimized. A recommended V CC filter circuit is shown in Figure to improve the power supply rejection (psr) of the optocoupler. The filter should be located near the combination of pin and pin to provide best filtering action. This filter will drastically limit any sudden rate of change of V CC with time to a slower rate that cannot interfere with the optocoupler. Common-Mode Rejection & LED Driver Circuits With the combination of a highefficiency AlGaAs LED and a high-gain amplifier in the HCPL- XX optocoupler, a few circuit techniques can enhance the common-mode rejection (CMR) of this optocoupler. First, use good high-frequency circuit layout practices to minimize coupling of common-mode signals between input and output circuits. Keep input traces away from output traces to minimize capacitive coupling of interference between input and output sections. If possible, parallel, or shunt switch the LED current as shown in Figure, rather than series switch the LED current as illustrated in Figure. Not only will CMR be enhanced with these circuits (Figures and ), but the switching speed of the optocoupler will be improved as well. This is because in the parallel switched case the LED current is current-steered into or away from the LED, rather than being fully turned off as in the series switched case. Figure illustrates this type of circuit. The Schottky diode helps quickly to discharge and pre-bias the LED in the off state. If a common-mode voltage across the optocoupler suddenly attempts to inject a current into the off LED anode, the Schottky diode would divert the interfering current to ground. The combination of the Schottky diode forward voltage and the Vol saturation voltage of the driver output stage (on-condition) will keep the LED voltage at or below. V. This will prevent the LED (off-condition) from conducting any significant forward current that might cause the HCPL-XX to turn on. Also, if the driver stage is an active totem-pole output, the Schottky diode allows the active output pull-up section to disconnect from the LED and pull high. As shown in Figure, most active output driver integrated circuits can source directly the forward current needed to operate the LED of the HCPL-XX optocoupler. The advantage of using the silicon diode in this circuit is to conduct charge out of the LED quickly when the LED is turned off. Upon turn-on of the LED, the silicon diode capacitance will provide a rapid charging path (peaking current) for the LED. In addition, this silicon diode prevents commonmode current from entering the LED anode when the driver IC is on and no operating LED current exists. In general, series switching the low input current of the HCPL-XX LED is not recommended. This is particularly valid when in a high common-mode interference environment. However, if series switching of the LED current must be done, use an additional pull-up resistor from the cathode of the LED to the input V CC as shown in Figure. This helps minimize any differential-mode current from conducting in the LED while the LED is off, due to a common-mode signal occurring on the input V CC (anode) of the LED. The commonmode signal coupling to the anode and cathode could be slightly different. This could potentially create a LED current to flow that would rival the normal, low input current needed to operate the optocoupler. This additional parallel resistor can help shunt any leakage current around the LED should the drive circuit, in the off state, have any significant leakage current on the order of µa. With the use of this parallel resistor, the total drive current conducted when the LED is on is the sum of the parallel resistor and LED currents. In the series circuit of Figure with the LED off, if a common-mode voltage were to couple to the LED cathode, there can be enough imbalance of common-mode voltage across the LED to cause a LED current to flow and, inadvertently, turn on the optocoupler. This series, switching circuit has no protection against a negative-transition, input commonmode signal.

17 V CC. µf. µf R = V CC V F I F ACTIVE OUTPUT OR OPEN COLLECTOR * R FOR V CC = Vdc, I F = µa R = 9 kω (TYPICAL) R = kω (WORST CASE) HCPL-XX ACTIVE OUTPUT * R R = H V F I F FOR V CC = Vdc, I F = µa R = kω (TYPICAL) R = kω (WORST CASE) HCPL-XX * USE ANY STANDARD SCHOTTKY DIODE. * USE ANY SIGNAL DIODE. Figure. Recommended Parallel LED Driver Circuit for HCPL-/-. Figure. Recommended Alternative LED Driver Circuit for HCPL-/-. R = V CC V F VOL I F. V R = I OH MAX V CC. µf. µf R ACTIVE OUTPUT OR OPEN COLLECTOR R TOTAL DRIVE CURRENT USED: ITOTAL = FOR V CC = Vdc, I F = µa R = kω (TYPICAL) R = kω (WORST CASE) R =. kω AT I OH = µa I TOTAL = µa (TYPICAL) HCPL-XX V CC V F L R V CC L R OUTPUT POWER P S, INPUT CURRENT I S P S (mw) I S (ma) T S CASE TEMPERATURE C Figure. Series LED Driver Circuit for HCPL-/-. Figure. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright Avago Technologies Limited. All rights reserved. Obsoletes 99-EN AV-EN June,

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