Features. Description. AM01476v1. Table 1. Device summary. Order codes Marking Package Packaging. STW70N60M2 70N60M2 TO-247 Tube

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1 N-channel 600 V, 0.03 Ω typ., 68 A MDmesh M2 Power MOSFET in a TO-247 package Features Datasheet production data Order codes V T Jmax R DS(on) max I D STW70N60M2 650 V Ω 68 A TO Extremely low gate charge Excellent output capacitance (C oss ) profile 100% avalanche tested Zener-protected Figure 1. Internal schematic diagram G(1) D(2) Applications Switching applications Description This device is an N-channel Power MOSFET developed using MDmesh M2 technology. Thanks to its strip layout and an improved vertical structure, the device exhibits low on-resistance and optimized switching characteristics, rendering it suitable for the most demanding high efficiency converters. S(3) AM01476v1 Table 1. Device summary Order codes Marking Package Packaging STW70N60M2 70N60M2 TO-247 Tube September 2014 DocID Rev 4 1/13 This is information on a product in full production. 13

2 Contents STW70N60M2 Contents 1 Electrical ratings Electrical characteristics Electrical characteristics (curves) Test circuits Package mechanical data Revision history /13 DocID Rev 4

3 Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V GS Gate-source voltage ± 25 V I D Drain current (continuous) at T C = 25 C 68 A I D Drain current (continuous) at T C = 100 C 43 A I (1) DM Drain current (pulsed) 272 A P TOT Total dissipation at T C = 25 C 450 W dv/dt (2) Peak diode recovery voltage slope 15 V/ns dv/dt (3) MOSFET dv/dt ruggedness 50 V/ns T stg Storage temperature T j Max. operating junction temperature - 55 to 150 C 1. Pulse width limited by safe operating area. 2. I SD 68 A, di/dt 400 A/µs; V DS peak < V (BR)DSS, V DD = 400 V. 3. V DS 480 V Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 0.28 C/W R thj-amb Thermal resistance junction-ambient max 50 C/W Table 4. Avalanche characteristics Symbol Parameter Value Unit I AR E AS Avalanche current, repetitive or not repetitive (pulse width limited by T jmax ) Single pulse avalanche energy (starting T j =25 C, I D = 10 A; V DD =50) 10 A 1500 mj DocID Rev 4 3/13

4 Electrical characteristics STW70N60M2 2 Electrical characteristics (T C = 25 C unless otherwise specified) Table 5. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown voltage Zero gate voltage drain current (V GS = 0) I D = 1 ma, V GS = V V DS = 600 V 1 µa V DS = 600 V, T C =125 C 100 µa I GSS Gate-body leakage current (V DS = 0) V GS = ± 25 V ±10 µa V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa V R DS(on) Static drain-source on-resistance V GS = 10 V, I D = 34 A Ω Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance pf C oss Output capacitance V DS = 100 V, f = 1 MHz, pf C rss V GS = 0 Reverse transfer capacitance pf (1) Equivalent output C oss eq. capacitance V DS = 0 to 480 V, V GS = pf R G Intrinsic gate resistance f = 1 MHz, I D = Ω Q g Total gate charge V DD = 480 V, I D = 68 A, nc Q gs Gate-source charge V GS = 10 V nc Q gd Gate-drain charge (see Figure 15) nc 1. C oss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS Table 7. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time V DD = 300 V, I D = 34 A, ns t r Rise time R G = 4.7 Ω, V GS = 10 V ns t d(off) Turn-off-delay time (see Figure 14 and ns t f Fall time Figure 19) ns 4/13 DocID Rev 4

5 Electrical characteristics Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 68 A I (1) SDM Source-drain current (pulsed) A V (2) SD Forward on voltage I SD = 68 A, V GS = V t rr Reverse recovery time ns Q rr Reverse recovery charge I SD = 68 A, di/dt = 100 A/µs V DD = 60 V (see Figure 18) - 12 µc I RRM Reverse recovery current - 45 A t rr Reverse recovery time I SD = 68 A, di/dt = 100 A/µs ns Q rr Reverse recovery charge V DD = 60 V, T j = 150 C - 18 µc I RRM Reverse recovery current (see Figure 18) - 50 A 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID Rev 4 5/13

6 Electrical characteristics STW70N60M2 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance ID (A) AM17966v1 K δ=0.5 AM09125v Operation in this area is Limited by max RDS(on) Tj=150 C Tc=25 C Single pulse VDS(V) Figure 4. Output characteristics 10µs 100µs 1ms 10ms Single pulse Zth=k Rthj-c d=tp/t tp(s) Figure 5. Transfer characteristics tp t ID (A) 150 VGS=7, 8, 9, 10V 6V AM17967v1 ID (A) 150 VDS=17V AM17968v V V 0 3V VDS(V) Figure 6. Gate charge vs gate-source voltage VGS(V) Figure 7. Static drain-source on-resistance VGS (V) 10 VDS VDD=480V ID=68A AM17969v1 VDS (V) 500 RDS(on) (Ω) VGS=10V AM17970v Qg(nC) ID(A) 6/13 DocID Rev 4

7 Electrical characteristics Figure 8. Capacitance variations Figure 9. Output capacitance stored energy C (pf) AM17971v1 Eoss (µj) AM17972v Ciss Coss Crss VDS(V) Figure 10. Normalized gate threshold voltage vs temperature VDS(V) Figure 11. Normalized on-resistance vs temperature VGS(th) (norm) 1.1 ID=250µA AM17973v1 RDS(on) (norm) 2.2 ID=34A AM17974v TJ( C) Figure 12. Normalized V DS vs temperature TJ( C) Figure 13. Source-drain diode forward characteristics VDS (norm) 1.09 ID=1mA AM15975v1 VSD (V) 1 TJ=-50 C AM17976v TJ=25 C TJ=150 C TJ( C) ISD(A) DocID Rev 4 7/13

8 Test circuits STW70N60M2 3 Test circuits Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit VDD VGS VD RG RL D.U.T μf 3.3 μf VDD Vi=20V=VGMAX 2200 μf 12V IG=CONST 2.7kΩ 47kΩ 100Ω 100nF D.U.T. 1kΩ VG PW 47kΩ PW 1kΩ AM01468v1 AM01469v1 Figure 16. Test circuit for inductive load switching and diode recovery times Figure 17. Unclamped inductive load test circuit G 25 Ω D S A D.U.T. B A FAST DIODE B A B D L=100μH μf μf VDD VD ID L 2200 μf 3.3 μf VDD G RG S Vi D.U.T. AM01470v1 Pw AM01471v1 Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform ton toff tdon tr tdoff tf 0 90% 10% VDS 10% 90% VGS 90% 0 10% AM01473v1 8/13 DocID Rev 4

9 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. DocID Rev 4 9/13

10 Package mechanical data STW70N60M2 Figure 20. TO-247 drawing _G 10/13 DocID Rev 4

11 Package mechanical data Table 9. TO-247 mechanical data Dim. mm. Min. Typ. Max. A A b b b c D E e L L L P R S DocID Rev 4 11/13

12 Revision history STW70N60M2 5 Revision history Table 10. Document revision history Date Revision Changes 28-Feb First release. 13-Mar Dec Sep Minor text changes Modified: test condition in Table 7 Modified: title Modified: Table 4, R DS(on) typical value in Table 5, the entire typical values in Table 6, 7 and 8 Updated: Section 3: Test circuits Added: Section 2.1: Electrical characteristics (curves) Minor text changes Updated values intable 4 Updated description and features in cover page Minor text changes 12/13 DocID Rev 4

13 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved DocID Rev 4 13/13

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