SB320 - SB3100 T A. = 25 C unless otherwise noted. Symbol Parameter Value Units

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1 SB3 - SB30 SB3-SB30 Features 3.0 ampere operation at T A = 75 C with no thermal runaway. For use in low voltage, high frequency inverters free wheeling, and polarity protection applications. DO-AD COLOR BAND DENOTES CATHODE 3.0 Ampere Schottky Barrier Rectifiers Absolute Maximum Ratings* T A = 25 C unless otherwise noted Symbol Parameter Value Units I F(AV) Average Rectified Current 3.0 A.375 " lead T A = 75 C I FSM Non-repetitive Peak Forward Surge Current 8.3 ms single half-sine-wave 80 A Superimposed on rated load (JEDEC method) P D Total Device Dissipation Derate above 25 C W mw/ C R θja Thermal Resistance, Junction to Ambient 40 C/W T stg Storage Temperature Range -65 to +25 C T J Operating Junction Temperature -65 to +25 C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Electrical Characteristics T A = 25 C unless otherwise noted Symbol Parameter Device Units V RRM Maximum Repetitive Reverse Voltage V V RMS Maximum RMS Voltage V V R DC Reverse Voltage (Rated V R) V I RM Maximum Reverse Current T A = 25 C 0.5 rated V R T A = 0 C ma V FM Maximum Forward 3.0 A mv I rr C Maximum Full Load Reverse Current, Full Cycle T A = 0 C 30 ma Typical Junction Capacitance 80 pf V R = 4.0 V, f =.0 MHz 0 Fairchild Semiconductor Corporation SB3-SB30, Rev. A

2 Typical Characteristics FORWARD CURRENT (A) Forward Current Derating Curve SINGLE PHASE HALF WAVE 60HZ RESISTIVE OR INDUCTIVE LOAD.375" 9.5 mm LEAD LENGTHS FORWARD CURRENT (A) Schottky Barrier Rectifiers (continued) Forward Characteristics T = 25 º J C Pulse Width = 0µS SB3-SB340 SB350-SB360 SB380-SB30 SB3-SB LEAD TEMPERATURE ( º C) FORWARD VOLTAGE (V) FORWARD SURGE CURRENT (A) Non-Repetitive Surge Current 8.3ms Single Half Sine-Wave JEDEC Method NUMBER OF CYCLES AT 60Hz REVERSE CURRENT (ma) 0 0. Reverse Characteristics SB3 SB360 SB30 T J = 25 º C T J = 75 º C T = 25 º J C REVERSE VOLTAGE (V) CAPACITANCE (pf) Junction Capacitance REVERSE VOLTAGE (V) SB3-SB30, Rev. A

3 DO-AD/AE Tape and Reel Data DO-AD/AE Packaging Configuration: Figure.0 F63TNR or Human Readable Label Corrugated Outer liner DO-AD/AE TNR Intermediate Container Options White (Anode) Red/Blue (Cathode) DO-AD/AE Packaging Information Table : Figure 2.0 DO-AD/AE Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size (inch diameter) Inside Tape Spacing (mm) Int Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Under package code P3 TNR x340x4 6,250. AD/. AE.50 AD/. AE Kraft Paper wounded between layers 340mm x 340mm x 4mm (6,250 max) F63TNR Label sample LOT: CBVK74B09 FSID: N5400 QTY: 250 SPEC: D/C: T0030 QTY: SPEC REV: D/C2: QTY2: CPN: FAIRCHILD SEMICONDUCTOR INTERNATIONAL Human Readable Label sample (F63TNR)3.2 CAUTION: This container provides protection for static sensitive devices. Handle devices with caution upon removal. MADE IN ONE OR MORE OF THE FOLLOWING COUNTRIES: PHILIPPINES (MACTAN, EXPORT PROCESSING ZONE), MALAYSIA, CHINA, S. KOREA, TAIWAN, THAILAND, SINGAPORE AND JAPAN. I.D. N5400 Qty ANTI-STATIC D/C T0030 Lot 250 CBVK74B09 G DO-AD/AE Taping Dimension: Figure 5.0 L H TAPING DIMENSIONS INCH MM MILS NOTES A Overall width / +.69/ +66.5/ F B A / B 2.047± ± ±27 Inside Tape Spacing L2 C 0.0 ± ± ±5.7 Component Pitch D 0.047(max).2(max) 47(max) Component Misalignment E 0.022(max) 0.55(max) 22(max) Tape Mismatch E C D F 0.027(max) ±0.69 ±27 Units in line w/ one another G 0.26(min) 3.2(min) 26(min) Lead amount between tapes H Lead amount beyond tapes L-L2 ±0.027 ±0.69 ±27 Delta between two leads REEL DIMENSIONS ITEM DESCRIPTION SYMBOL MINIMUM MAXIMUM D2 D Reel Diameter D Arbor Hole Diameter (Standard) D Core Diameter D Flange to Flange Outer Width W Note: All Dimensions are in inches W D3 00 Fairchild Semiconductor International August 00, Rev. A

4 DO-AD Package Dimensions DO-AD (FS PKG Code P3) : Scale : on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram):..0 min (25.4) (9.53) (7.24) 0.2 (5.60) 0.90 (4.83) (.32) (.22) 00 Fairchild Semiconductor International August 999, Rev. A

5 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx Bottomless CoolFET CROSSVOLT DOME E 2 CMOS TM EnSigna TM FACT FACT Quiet Series FAST DISCLAIMER LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms FASTr GlobalOptoisolator GTO HiSeC ISOPLANAR MICROWIRE OPTOLOGIC OPTOPLANAR PACMAN POP PowerTrench QFET QS QT Optoelectronics Quiet Series SILENT SWITCHER SMART START SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TinyLogic UHC VCX FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Formative or In Design First Production Full Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G

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