DATASHEET ISL Features. Applications. Ordering Information. Pinout. 55V, 1A Peak Current H-Bridge FET Driver. FN6382 Rev.0.

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1 DATASHEET ISL830 55V, A Peak Current H-Bridge FET Driver The ISL830 is a medium-frequency H-Bridge FET driver capable of A (typ) of peak drive current that is designed to drive high- and low-side N-Channel MOSFETs in mediumvoltage applications. Optimized for PWM motor control and uninterruptible power supply systems, the ISL830 enables simple and flexible bridge-based design. With typical inputto-output propagation delays as low as 5ns and with a userprogrammable dead-time range of 0.µs to 4.5µs, the ISL830 is ideal for switching frequencies up to 00kHz. The dead-time of the ISL830 is programmable via a single resistor. The ISL830's four independent driver control inputs (ALI, AHI, BLI, and BHI) allow driving of every possible switch combination except those that would cause a shoot-through condition. A global disable input, DIS, overrides input control and causes the ISL830 to refresh the bootstrap capacitor when pulled low. Integrated undervoltage protection and shoot-through protection ensure reliable system operation. The ISL830 is available in compact 6 Ld SOIC and 6 Ld PDIP packages and operates over the range of -55 C to +5 C. Ordering Information PART NUMBER ISL830IBZ (Note) ISL830IBZT (Note) ISL830IPZ (Note) PART MARKING TEMP. RANGE ( C) PACKAGE 830IBZ -55 to +5 6 Ld SOIC (N) (Pb-free) 6 Ld SOIC (N) Tape and Reel (Pb-free) ISL830IPZ -55 to +5 6 Ld PDIP** (Pb-free) PKG. DWG. # M6.5 M6.5 E6.3 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 00% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/ JEDEC J STD-00. **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Features FN638 Rev.0.00 Independently Drives 4 N-Channel FETs in Half Bridge or Full Bridge Configurations Bootstrap Supply Max Voltage: 70VDC Drives a 000pF Load in Free Air at +50 C with Rise and Fall Times of 5ns (typ) User-Programmable Dead Time from 0. to 4.5 s DIS (Disable) Overrides Input Control and Refreshes Bootstrap Capacitor when Pulled Low Input Logic Thresholds Compatible with 5V to 5V Logic Levels Shoot-Through Protection Undervoltage Protection Pb-Free Plus Anneal Available (RoHS Compliant) Applications UPS Systems DC Motor Controls Full Bridge Power Supplies Switching Power Amplifiers Noise Cancellation Systems Battery Powered Vehicles Peripherals Medium/Large Voice Coil Motors Related Literature - TB363, Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs) Pinout BHB BHI BLI ALI DEL V SS AHI DIS ISL830 (PDIP, SOIC) TOP VIEW 6 BHO 5 BHS 4 BLO 3 ALO V DD AHS 0 AHO 9 AHB FN638 Rev.0.00 Page of

2 Application Block Diagram 55V V BHO BHS BHI BLO BLI ISL830 LOAD ALI AHI ALO AHS AHO GND GND Functional Block Diagram U/V LEVEL SHIFT DRIVER 9 0 AHB AHO BHB BHO 6 DRIVER LEVEL SHIFT U/V BHI AHS BHS 5 AHI 7 TURN-ON DELAY TURN-ON DELAY DIS 8 V DD V DD DETECTOR UNDERVOLTAGE TURN-ON DELAY DRIVER 3 ALO BLO 4 DRIVER TURN-ON DELAY ALI 4 DEL 5 BLI 3 V SS 6 FN638 Rev.0.00 Page of

3 Typical Application (PWM Mode Switching) 55V BHB BHO 6 PWM INPUT DELAY RESISTOR V BHI BLI ALI DEL V SS BHS 5 BLO 4 ALO 3 V DD AHS V LOAD 7 AHI AHO 0 DIS 8 DIS AHB 9 FROM OPTIONAL OVERCURRENT LATCH GND R DIS TO OPTIONAL CURRENT CONTROLLER OR OVERCURRENT LATCH + - R SH GND FN638 Rev.0.00 Page 3 of

4 Absolute Maximum Ratings Supply Voltage, V DD V to 6V Logic I/O Voltages V to V DD +0.3V Voltage on AHS, BHS V (Transient) to 65V (-55 C to+50 C) Voltage on AHB, BHB V AHS, BHS -0.3V to V AHS, BHS +V DD Voltage on ALO, BLO V SS -0.3V to V DD +0.3V Voltage on AHO, BHO... V AHS, BHS -0.3V to V AHB, BHB +0.3V Input Current, DEL mA to 0mA Phase Slew Rate V/ns NOTE: All voltages are relative V SS unless otherwise specified. Operating Conditions Supply Voltage, V DD V to +5V Voltage on V SS V to +.0V Voltage on AHB, BHB V to +55V Voltage on AHB, BHB V AHS, BHS +7.5V to V AHS, BHS +V DD Input Current, DEL mA to -00 A Thermal Information Thermal Resistance JA ( C/W) SOIC Package PDIP Package* Maximum Power Dissipation See Curve Storage Temperature Range C to +50 C Operating Max. Junction Temperature C Lead Temperature (Soldering 0s) C (For SOIC - Lead Tips Only)) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. +50 C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +50 C junction may trigger the shutdown of the device even before +50 C, since this number is specified as typical. Electrical Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00k T J = +5 C T J = -55 C TO +50 C PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS SUPPLY CURRENTS AND UNDER VOLTAGE PROTECTION V DD Quiescent Current I DD All inputs = 0V, R DEL = 00k ma All inputs = 0V, R DEL = 0k ma V DD Operating Current I DDO f = 50kHz, no load ma 50kHz, no load, R DEL = 0k ma AHB, BHB Off Quiescent Current I AHBL, I BHBL AHI = BHI = 0V ma AHB, BHB On Quiescent Current I AHBH, I BHBH AHI = BHI = V DD A AHB, BHB Operating Current I AHBO, I BHBO f = 50kHz, CL = 000pF ma AHS, BHS Leakage Current I HLK V AHS = V BHS = 55V A V AHB = V BHB = 70V V DD = Not Connected V DD Rising Undervoltage Threshold V DDUV V V DD Falling Undervoltage Threshold V DDUV V Undervoltage Hysteresis UVHYS V AHB, BHB Undervoltage Threshold VHBUV Referenced to AHS and BHS V INPUT PINS: ALI, BLI, AHI, BHI, and DIS Low Level Input Voltage V IL Full Operating Conditions V High Level Input Voltage V IH Full Operating Conditions V Input Voltage Hysteresis mv Low Level Input Current I IL V IN = 0V, Full Operating Conditions A High Level Input Current I IH V IN = 5V, Full Operating Conditions A TURN-ON DELAY PIN DEL Dead Time T DEAD R DEL = 00k s R DEL = 0k s FN638 Rev.0.00 Page 4 of

5 Electrical Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00k (Continued) PARAMETER SYMBOL TEST CONDITIONS T J = +5 C T J = -55 C TO +50 C MIN TYP MAX MIN MAX GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, and BHO Low Level Output Voltage V OL I OUT = 50mA V High Level Output Voltage V DD -V OH I OUT = -50mA V Peak Pullup Current I O + V OUT = 0V A Peak Pulldown Current I O - V OUT = V A UNITS Switching Specifications V DD = V AHB = V BHB = V, V SS = V AHS = V BHS = 0V, R DEL = 00k, C L = 000pF. T J = +5 C T J = -55 C TO +50 C PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX MIN MAX UNITS Lower Turn-off Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-off Propagation Delay (AHI-AHO, BHI-BHO) Lower Turn-on Propagation Delay (ALI-ALO, BLI-BLO) Upper Turn-on Propagation Delay (AHI-AHO, BHI-BHO) T LPHL ns T HPHL ns T LPLH ns T HPLH ns Rise Time T R ns Fall Time T F ns Minimum Input Pulse Width T PWIN-ON/OFF ns Output Pulse Response to 50ns Input Pulse T PWOUT ns Disable Turn-off Propagation Delay (DIS - Lower Outputs) Disable Turn-off Propagation Delay (DIS - Upper Outputs) Disable Turn-on Propagation Delay (DIS - ALO and BLO) Disable Turn-on Propagation Delay (DIS- AHO and BHO) T DISLOW ns T DISHIGH ns T DLPLH ns T DHPLH R DEL = 0k s Refresh Pulse Width (ALO and BLO) T REF-PW ns TRUTH TABLE INPUT OUTPUT ALI, BLI AHI, BHI VDDUV VHBUV DIS ALO, BLO AHO, BHO X X X X 0 0 X X X X X X 0 X NOTE: X signifies that input can be either a or 0. FN638 Rev.0.00 Page 5 of

6 Pin Descriptions PIN NUMBE R SYMBOL DESCRIPTION BHB B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap diode and positive side of bootstrap capacitor to this pin. BHI B High-side Input. Logic level input that controls BHO driver (Pin 6). BLI (Pin 3) high level input overrides BHI high level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides BHI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 3 BLI B Low-side Input. Logic level input that controls BLO driver (Pin 4). If BHI (Pin ) is driven high or not connected externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin 8) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 4 ALI A Low-side Input. Logic level input that controls ALO driver (Pin 3). If AHI (Pin 7) is driven high or not connected externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin 8) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 5 DEL Turn-on DELay. Connect resistor from this pin to V SS to set timing current that defines the dead time between drivers. All drivers turn-off with no adjustable delay, so the DEL resistor guarantees no shoot-through by delaying the turn-on of all drivers. The voltage across the DEL resistor is approximately V DD -V. 6 V SS Chip negative supply, generally will be ground. 7 AHI A High-side Input. Logic level input that controls AHO driver (Pin 0). ALI (Pin 4) high level input overrides AHI high level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides AHI high level input. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 8 DIS DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs. When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to 5V (no greater than V DD ). 9 AHB A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap diode and positive side of bootstrap capacitor to this pin. 0 AHO A High-side Output. Connect to gate of A High-side power MOSFET. AHS A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of bootstrap capacitor to this pin. V DD Positive supply to control logic and lower gate drivers. De-couple this pin to V SS (Pin 6). 3 ALO A Low-side Output. Connect to gate of A Low-side power MOSFET. 4 BLO B Low-side Output. Connect to gate of B Low-side power MOSFET. 5 BHS B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of bootstrap capacitor to this pin. 6 BHO B High-side Output. Connect to gate of B High-side power MOSFET. FN638 Rev.0.00 Page 6 of

7 Timing Diagrams X = A OR B, A AND B HALVES OF BRIDGE CONTROLLER ARE INDEPENDENT T LPHL T HPHL DIS=0 and UV XLI XHI XLO XHO T HPLH T LPLH T R (0% - 90%) T F (0% - 90%) FIGURE. INDEPENDENT MODE DIS=0 and UV XLI XHI = HI OR NOT CONNECTED XLO XHO FIGURE. BISTATE MODE T DLPLH T DIS DIS or UV T REF-PW XLI XHI XLO XHO T DHPLH FIGURE 3. DISABLE FUNCTION FN638 Rev.0.00 Page 7 of

8 Performance Curves I DD SUPPLY CURRENT (ma) V DD = 6V V DD = V V DD = 0V V DD = 8V V DD = 5V JUNCTION TEMPERATURE ( C) FIGURE 4. I DD SUPPLY CURRENT vs TEMPERATURE AND V DD SUPPLY VOLTAGE I DD SUPPLY CURRENT (ma) kHz 00kHz 50kHz 0kHz JUNCTION TEMPERATURE ( C) FIGURE 5. V DD SUPPLY CURRENT vs TEMPERATURE AND SWITCHING FREQUENCY (000pF LOAD) 8 LOADED, NL BIAS CURRENTS (ma) pF LOAD NO LOAD FREQUENCY (khz) FIGURE 6. FLOATING (IXHB) BIAS CURRENT vs FREQUENCY AND LOAD PEAK GATE CURRENT (A) SOURCE and SINK BIAS BIAS SUPPLY VOLTAGE (V) AT +5 C FIGURE 7. GATE SOURCE/SINK PEAK CURRENT vs BIAS SUPPLY VOLTAGE AT +5 C..4 NORMALIZED GATE SINK/SOURCE CURRENT (A) JUNCTION TEMPERATURE ( C) FIGURE 8. GATE CURRENT vs TEMPERATURE, NORMALIZED TO +5 C V DD -V OH (V) -40 C 0 C. -55 C +5 C +5 C +50 C V DD SUPPLY VOLTAGE (V) FIGURE 9. V DD -V OH vs BIAS VOLTAGE TEMPERATURE FN638 Rev.0.00 Page 8 of

9 Performance Curves (Continued) V OL (V) C 0 C -55 C +5 C C +50 C V DD SUPPLY VOLTAGE (V) FIGURE 0. V OL vs BIAS VOLTAGE AND TEMPERATURE 5 V DD, BIAS SUPPLY VOLTAGE (V) LOWER U/V RESET LOWER U/V SET UPPER U/V SET/RESET JUNCTION TEMPERATURE ( C) FIGURE. UNDERVOLTAGE TRIP VOLTAGES vs TEMPERATURE PROPAGATION DELAYS (ns) UPPER t ON UPPER t OFF LOWER t ON LOWER t OFF JUNCTION TEMPERATURE ( C) FIGURE. UPPER LOWER TURN-ON/TURN-OFF PROPAGATION DELAY vs TEMPERATURE DIS TO TURN-ON/OFF TIME (ns) DISHTON DISHTOFF DISLOFF DISLTON JUNCTION TEMPERATURE ( C) FIGURE 3. UPPER/LOWER DIS(ABLE) TO TURN-ON/OFF vs TEMPERATURE ( C).5 LEVEL-SHIFT CURRENT (ma).5 TOTAL POWER DISSIPATION (W) SOIC 6 PIN DIP QUIESCENT BIAS COMPONENT SWITCHING FREQUENCY (khz) FIGURE 4. FULL BRIDGE LEVEL-SHIFT CURRENT vs FREQUENCY (khz) AMBIENT TEMPERATURE ( C) FIGURE 5. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE FN638 Rev.0.00 Page 9 of

10 Performance Curves (Continued) 0 4 V DD = 5V DEAD TIME (ns) 000 V DD = 9V V DD = V DEAD TIME RESISTANCE (k ) FIGURE 6. DEAD-TIME vs DEL RESISTANCE AND BIAS SUPPLY (V DD ) VOLTAGE FN638 Rev.0.00 Page 0 of

11 Dual-In-Line Plastic Packages (PDIP) INDEX AREA BASE PLANE SEATING PLANE D B -C- -A- N 3 N/ B D e D E NOTES:. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control.. Dimensioning and tolerancing per ANSI Y4.5M Symbols are defined in the MO Series Symbol List in Section. of Publication No Dimensions A, A and L are measured with the package seated in JE- DEC seating plane gauge GS D, D, and E dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.00 inch (0.5mm). 6. E and e A are measured with the leads constrained to be perpendicular to datum -C-. 7. e B and e C are measured at the lead tips with the leads unconstrained. e C must be zero or greater. 8. B maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.00 inch (0.5mm). 9. N is the maximum number of terminal positions. 0. Corner leads (, N, N/ and N/ + ) for E8.3, E6.3, E8.3, E8.3, E4.6 will have a B dimension of inch ( mm). -B- A 0.00 (0.5) M C A A L B S A e C E C L e A C e B E6.3 (JEDEC MS-00-BB ISSUE D) 6 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A A A B B , 0 C D D E E e 0.00 BSC.54 BSC - e A BSC 7.6 BSC 6 e B L N Rev. 0 /93 FN638 Rev.0.00 Page of

12 Small Outline Plastic Packages (SOIC) N INDEX AREA 3 e D B 0.5(0.00) M C A M E -B- -A- -C- SEATING PLANE A B S H 0.5(0.00) M B A 0.0(0.004) NOTES:. Symbols are defined in the MO Series Symbol List in Section. of Publication Number 95.. Dimensioning and tolerancing per ANSI Y4.5M Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.5mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.5mm (0.00 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.04 inch) or greater above the seating plane, shall not exceed a maximum value of 0.6mm (0.04 inch). 0. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. L M h x 45 C M6.5 (JEDEC MS-0-AC ISSUE C) 6 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A A B C D E e BSC.7 BSC - H h L N Rev. 6/05 Copyright Intersil Americas LLC 006. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see Intersil products are manufactured, assembled and tested utilizing ISO900 quality systems as noted in the quality certifications found at Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see FN638 Rev.0.00 Page of