QUALITY & RELIABILITY
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- Frank Gerard Richards
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1 QUALITY & RELIABILITY 4 Gbps & 2.5 Gpbs Oxide Isolated VCSEL Reliability Report SUMMARY AOC has developed a second generation oxide isolated VCSEL for use in 4Gbps and 2.5Gbps applications. This product incorporates a 14 micron diameter aperture and has other design features aimed at improved high-speed performance. The same basic chip is used for array applications as well as single-channel products, and it does incorporate AOC's STABILAZE technology. This note describes reliability testing performed to qualify the 14 micron diameter oxide aperture VCSEL. INTRODUCTION For nine years AOC has been intensively studying the reliability of VCSELs. The earliest reliability studies on commercially available VCSELs were published by AOC starting in During this time we have generated many millions of actual device-hours of life test data supporting the derivation and updating of the reliability models we have published for the AOC proton-implanted VCSEL. For the past several years AOC has been studying the reliability of oxide-isolated VCSEL technology in support of the design and product release of AOC s oxide VCSEL in These multiple life studies have generated over eight million actual device-hours of burn-in data. We applied the reliability testing and analysis methodology developed for the proton VCSEL to the oxide VCSEL. Likewise, most of the device fabrication processes are identical or similar for the oxide and proton VCSEL, including factory, equipment, and personnel. For these reasons the reliability results for this VCSEL should not be considered in isolation; rather, the long experience and huge amount of data we have gathered for the proton VCSEL and previously-released oxide VCSEL need to be taken into account to supplement the specific data collected for this oxide VCSEL device.
2 ESD SENSITIVITY Ten devices were tested per Human Body Model with sensitivity voltage found between 400 Volts and 525 Volts, with typical sensitivity of 450 Volts. No latent degradation was found. RELIABILITY TESTING METHODOLOGY The reliability testing methodology for the oxide VCSEL is essentially identical to that used for the past nine years for the proton VCSEL and larger-diameter oxide VCSEL. Chips that pass probe-level testing are packaged as TO-style components, typically with the VCSEL chip mounted directly onto the header. Following successful completion of the AOC's STABILAZE wafer stabilization process or short component burn-in, and parametric testing used for AOC s production devices, the components are subjected to life testing. The life test protocol consists of burn-in at constant temperature and a fixed current, with the devices periodically removed from the oven and tested at room temperature. The testing interval depends upon the particular temperature/current condition (shorter intervals for higher stress). Failure is defined as a 2 db reduction in total output power at 6mA dc current, close to the expected typical average current. We never extrapolate to presumed failure time but instead include only actual failures in our analysis. LIFE-TESTING The burn-in test results to-date for this product were done on five wafers from four different epi and processing lots, showing 100 failures in 423 units for 2,140,861 total devicehours. Most of the groups are continuing to undergo burn-in. Some of the devices were single-element chips and others were arrays, where a single element was tested. A group was subjected to -65 o C ambient to check for mechanical stress that may cause failures at low temperature operation no issues have been found. It is important to note that all of these burn-in groups completed several initial burn-in test reading increments without failures, supporting the lack of infant mortality observation. Reliability analysis is identical to that used previously for our VCSELs. Reliasoft s Weibull ++ software is used to model the failure distribution for both the proton and oxide VCSELs, the lognormal distribution consistently provides the best fit. For this distribution the natural logarithm of the failure times are distributed normally, and the distribution can be described with two parameters: the median lifetime (eμ) and a slope parameter (s), which is the standard deviation of the logarithms of failure times. For s in our range the lognormal distribution indicates a wear-out failure mechanism predominates. As has been the case for all of AOC s VCSELs, no significant infant mortality or random failures were found, only wear-out failures. A large median lifetime implies a long mean-time-to-failure (MTTF), although those figures are not the same. A small s indicates a narrow range of failure times and implies few early failures will occur, making this parameter a very important one for users, who are generally more interested in the early failure rate than the mean-timeto-failure (or if they are not they should be!). The data for the groups with a large number of failures shows the lognormal s parameter is about 0.76, not far from the larger aperture oxide VCSEL and proton VCSEL figures. The acceleration model used is the Arrhenius model, which depends on the junction temperature. As in the past, the acceleration model includes an additional dependence upon current squared. This reliability data includes 9 different burnin groups, with 50+% failures to date (through 7122 hours burn-in) at the 3 highest stress conditions, a low % failure rate for 3 more of the groups and no failures to date for 3 of the 9 groups. The stress conditions were relatively closely spaced in junction temperature, making activation energy derivation difficult using this data alone. Nevertheless, the 14um oxide VCSEL data is consistent with the activation energy of 0.7 ev and additional squared current factor previously derived for the AOC's proton and other oxide VCSEL products.
3 RELIABILITY RESULTS Using the lognormal distribution derived from the groups with failures, combined with the acceleration model described above, reliability can be modeled at operating conditions of interest. The resultant curve of reliability for the 14 micron oxide VCSEL is compared to AOC s other oxide and proton VCSEL reliability curves in the adjoining figure, each at their expected typical operating currents. This shows that the 14 micron oxide VCSEL reliability is within about a factor of three of the larger diameter oxide and proton VCSEL curves. Based on this reliability model, the curves on figure 2 can be used to predict the operating time to attain any particular cumulative failure percentage, for various application temperatures and currents. Note that for high-speed applications the average current can be taken to be the dc current. Keep in mind that, as for all models especially reliability models, there are bands of uncertainty around each of these curves. Figure 1. Comparative reliability of different designs at 40 C and nominal operating currents (10, 8, and 6.5 ma for Proton, 17 µm, and 14 µm respectively). Figure 2. Cumulative Failure Rate Curves (Lognormal Plots) for various ambient temperatures at 6.5mA operation. Cumulative Failure Rate Curves (Lognormal Plots) for various average currents at 40?C ambient operation
4 ARRAY RELIABILITY The preceding data is for single elements (although some of the test data was taken on a single element of an array). To apply the reliability data to arrays, note first that the elements may be treated independently; elements do not affect adjacent elements thermally, for example. The key point in array reliability is to note that the lognormal distribution of the VCSEL means that array time-to-failure is not just the single element number divided by the number of elements in the array. Rather, the failure rates are factored by number of array elements and the resulting difference in time-to-failure is taken from the lognormal plot, as in the plot below. For this operating condition the time to 1% failure for a 4 element array is about 69% that of a single element, and the time to 1% failure for a 12 element array is about 54% that of a single element. 1 This is not mathematically rigorous in that it ignores multiple-element array failures, but that would be a very minor adjustment, especially for low failure rates
5 ADVANCED OPTICAL COMPONENTS Finisar s ADVANCED OPTICAL COMPONENTS division was formed through strategic acquisition of key optical component suppliers. The company has led the industry in high volume Vertical Cavity Surface Emitting Laser (VCSEL) and associated detector technology since VCSELs have become the primary laser source for optical data communication, and are rapidly expanding into a wide variety of sensor applications. VCSELs superior reliability, low drive current, high coupled power, narrow and circularly symmetric beam and versatile packaging options (including arrays) are enabling solutions not possible with other optical technologies. ADVANCED OPTICAL COMPONENTS is also a key supplier of Fabrey-Perot (FP) and Distributed Feedback (DFB) Lasers, and Optical Isolators (OI) for use in single mode fiber data and telecommunications networks LOCATION Allen, TX - Business unit headquarters, VCSEL wafer growth, wafer fabrication and TO package assembly. Fremont, CA Wafer growth and fabrication of 1310 to 1550nm FP and DFB lasers. AOC CAPABILITIES ADVANCED OPTICAL COMPONENTS advanced capabilities include: 1, 2, 4, 8, and 10Gbps serial VCSEL solutions 1, 2, 4, 8, and 10Gbps serial SW DETECTOR solutions VCSEL and detector arrays 1, 2, 4, 8, and 10Gbps FP and DFB solutions at 1310 and 1550nm 1, 2, 4, 8, and 10Gbps serial LW DETECTOR solutions Optical Isolators from 1260 to 1600nm range Laser packaging in TO46, TO56, and Optical subassemblies with SC, LC, and MU interfaces for communication networks VCSELs operating at 670nm, 780nm, 980nm, and 1310nm in development Sensor packages include surface mount, various plastics, chip on board, chipscale packages, etc. Custom packaging options Shanghai, PRC Optical passives assembly, including optical isolators and splitters. SALES AND SERVICE Finisar s ADVANCED OPTICAL COMPONENTS division serves its customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing or name of the nearest Authorized Distributor, contact a nearby sales office or call the number listed below. Phone: MY-VCSEL USA (toll free) USA (Direct dial) 44 (0) Europe China & Taiwan Japan Asia Pacific & Korea Fax: USA support@adopco.com WEB: Finisar Corporation. All rights reserved. Finisar is a registered trademark of Finisar Corporation. Features and specifications are subject to change without notice. 09/08 Rev. B
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