EMI Suppression Filters (for DC)/ Chip Inductors for Automotive

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1 EMI Suppression Filters (for DC)/ Chip Inductors for Automotive

2 Explanation of category in this catalog Infotainment Powertrain, Safety The product for entertainment equipment like car navigations, car audios, and body control equipment like wipers, power windows. The product for high reliability applications like powertrain and safety, in addition to infotainment applications. Explanation of symbols in this catalog All Products AEC-Q2 compliant product* eflow OK eflow soldering applicable FlowOK Flow soldering applicable * Deviation may be submitted. Please contact us for details. EMI Suppression Filters (for DC) Meets large current lines Meets high frequency noise up to 1-2GHz Meets ultra high frequency noise up to 1GHz Chip Inductors Max height xxmm Low dc Low DC resistance type Bias Bias current characteristics improved E12 step inductance variation E24 step inductance variation Hi Q type Tight inductance tolerance available EU ohs Compliant All the products in this catalog comply with EU ohs. EU ohs is "the European Directive 211/65/EU on the estriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment." For more details, please refer to our website 'Murata's Approach for EU ohs' (

3 Contents Product specifications are as of July 214. Application Examples EMI Suppression Filters (for DC) 2 Contents 7 EMI Suppression Filters (for DC) Product Guide 8 ablp 1 anfp 82 adlp/plp 12 abn 125 ads/vf/bn EMI Suppression Filters (Lead Type) 131 adp Microchip Transformer (Balun) 144 Chip Inductors Contents 151 Classification and Structure of Chip Inductors 152 Chip Inductors Product Guide 154 ainductors for Power Lines 156 ainductors for General Circuits 197 af Inductors 27 Quick eference 234 Introduction of Web Site Design Support Software SimSurfing 235

4 Application Examples Car Navigation System Video I/F Line (Differential Signal lines) Camera ear Monitor Common Mode Choke Coil DLW21S DLM11S p18 p17 High Frequency Circuit Card Slot Video I/F LCD Monitor Touch Panel Video Signal Lines 3 Terminal LC Filter NFL p89 F Inductor LQW LQH31H p216 p198 AM/FM//TV ANT ANT HDD DVD/CD/MD Tuner Gyro LCD Controller System LSI Graphic IC CLK Audio Lines Large Current Type EMIFILr DLW5B BLM_P ETC SP p14 p12 ANT GPS VICS NAVI CPU DSP AMP AM SP ANT W-LAN Bluetoothr DC Power Lines Power Inductors LQH p171 General Signal Line Ferrite Bead BLM p12 I/F DC-DC Converter I/F Line LQM_P p158 Common Mode Choke Coil DLW43SH p111 Speed Meter emote Controller Battery 2

5 Application Examples Car Camera System Single Ended Signal Line Ferrite Bead Single Ended Signal Line Ferrite Bead BLM p12 BLM p12 T-type/π-type LC filter T-type/π-type LC filter NFL p89 NFL p89 Car Navigation Camera Module Display Single Ended Signals or Graphic Processor Single Ended Signals or CMOS or CCD Sensor Differential Signals Differential Signals DC-DC Converter Camera Power Differential Signal Line Common Mode Choke Power Line Power Inductor Battery Power Line Power Inductor DLW21S p18 LQH_P p171 LQH_P p171 DLM11S p17 LQM_P p158 Differential Signal Line LQM_P p158 Ferrite Bead BLM p12 Common Mode Choke DLW21S p18 Ferrite Bead BLM p12 DLM11S p17 3

6 Application Examples Electronic Control Unit Air-bag ECU ABS ECU Door lock ECU Meter panel ECU Steering ECU Electronic fuel injector ECU Vcc Line Large Current Type EMIFILr NFE p85 I/F Line Common Mode Choke Coil DLW43SH p111 NFM_HC BLM_P p87 p12 Vcc CAN/Flexay Controller Bus Driver For Motor VFC p135 Vcc CPU Inverter Motor DC Power Line Vcc DC-DC Converter Battery Large Current Type EMIFILr BN p125 NFM_HC BLM_P PLT1 p87 p12 p112 4

7 Application Examples Smart Keyless Entry F Circuit F Inductor LQP p212 CAN-BUS Common Mode Choke Coil LQG p28 DLW43SH p111 LQW p216 Key F eceiver Battery SAW Filter F IC MCU (CAN-BUS) CAN Transceiver MCU OM F(Tx) Power Supply tal MCU OM Temp. Sensor Pressure Sensor LF (x) Power Line Power Inductor F Circuit F Inductor LQP LQG LQW p212 p28 p216 LF (x) LF Transmitter (Immobilizer) LQH_P LQM_P p171 p158 Ferrite Bead BLM_P p12 5

8 Application Examples Telematics Circuit Power Line Power Inductor LQH_P LQM_P p171 p158 Power Line Ferrite Bead BLM_P p12 Ferrite Bead BLM_P p12 PA DC/DC For PA PMIC BBIC APU FIC ANT Front End Block Battery Single Ended Signals Differential Signals LNA Date / Clock Lines Ferrite Bead for GHz ange Noise BLM 3 Terminal LC Filter NFL p12 p89 Differential Signal Line Common Mode Choke DLW21S DLM11S p18 p17 F Circuit F Inductor LQP LQG p212 p28 LQW p216 6

9 EMI Suppression Filters (for DC) Contents Product Guide 8 ablp ing 1 Product Detail 12!Caution/Notice 76 Soldering and Mounting 77 Packaging 81 anfp ing 82 Product Detail 85!Caution/Notice 94 Soldering and Mounting 96 Packaging 11 adlp/plp ing 12 Product Detail 14!Caution/Notice 114 Soldering and Mounting 117 Packaging 123 abn Product Detail 125!Caution/Notice 127 Soldering and Mounting 128 Packaging 13 ads/vf/bn EMI Suppression Filters (Lead Type) ing 131 Product Detail 133!Caution/Notice 138 Soldering and Mounting 14 Packaging 143 adp Microchip Transformer (Balun) ing 144 Product Detail 145!Caution/Notice 146 Soldering and Mounting 147 Packaging 149 Lead Type

10 EMI Suppression Filters (for DC) Product Guide BL p For General Band Noise For GHz Band Noise For High-GHz Band Noise Inductor Type Universal Type [ Power Lines / Signal Lines ] Signal Lines Type For General Signal Lines For High Speed Signal Lines Power Lines Type Universal Type [ Power Lines / Signal Lines ] Signal Lines Type Signal Lines Type Series Size at 1MHz Effective Frequency ange (Applicable Frequency anges are only for reference.) in inch (in mm) kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz p15 BLM3A 21 (63) p25 BLM15A 42 (15) p17 BLM3AG 21 (63) p27 BLM15AG 42 (15) p41 BLM18AG 63 (168) p51 BLM21AG 85 (212) p19 BLM3B 21 (63) p29 BLM15B 42 (15) p44 BLM18B 63 (168) p53 BLM21B 85 (212) BLM3P* BLM3PG BLM15P* p13 33 (1.5A) 21 (63) 22 (1.8A) 8 (1A) p12 33 (.75A) 21 (63) 22 (.9A) p21 33 (3A) 8 (2.3A) 18 (1.5A) 33 (1.2A) 6 (.9A) 42 (15) 6 (2.5A) 12 (2A) 22 (1.4A) 47 (1A) p23 3 (2.2A) 8 (1.5A) BLM15PG/PD* 42 (15) 1 (1A) 6 (1.7A) 12 (1.3A) BLM18PG* p35 33 (3A) 12 (2A) 22 (1.4A) 47 (1A) 63 (168) 3 (1A) 6 (.5A) 18 (1.5A) 33 (1.2A) p49 3 (4A) 22 (2A) BLM21PG* 85 (212) 22 (6A) 6 (3.5A) 12 (3A) 33 (1.5A) p57 5 (3.5A) 39 (2A) BLM31PG* 126 (3216) 33 (6A) 12 (3.5A) 6 (1.5A) p59 75 (3.5A) 47 (2A) BLM41PG* 186 (4516) 6 (6A) 18 (3.5A) 1 (1.5A) p37 BLM18KG* 3 (5A) 7 (3.5A) 22 (2.2A) 47 (1.5A) 63 (168) (Low DC esistance Type) 26 (6A) 1 (3A) 12 (3A) 33 (1.7A) 6 (1.3A) p39 BLM18SG* 7 (4A) 22 (2.5A) 63 (168) (Low DC esistance Type) 26 (6A) 12 (3A) 33 (1.5A) BLE32PN BLM3EB* BLM15EG* BLM18EG* p61 p64 p67 p72 p69 BLM18HE* 63 (168) BLM3HG p62 p62 BLM3HD 21 (63) p62 BLM3HB 21 (63) p65 BLM15HG 42 (15) p65 BLM15HD 42 (15) BLM15HB BLM18HG BLM18HD p65 p69 p (3225) 21 (63) 42 (15) 63 (168) 21 (63) 42 (15) 63 (168) 63 (168) p69 BLM18HB 63 (168) p68 BLM15GG 42 (15) p68 BLM15GA 42 (15) p75 BLM18GG 63 (168) 3 25 (.6A) 5 (.4A) 12 (2A) 33 (.5A) 47 (.5A) 1 (2A) 22 (2A/1A) 39 (.5A) 6 (.5A) (.7A) 12 (1.5A) (.6A) 6 (.8A) 15 (.5A) * The derating of rated current is required for some items according to the operating temperature on each product page. NFp Capacitor Type Universal Type [ Power Lines / Signal Lines ] Series NFM21HC NFM31HK* Size Capacitance (F) Effective Frequency ange (Applicable Frequency anges are only for reference.) in inch (in mm) 1p 1p 1p 1p.1μ 1μ 1μ 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz p87 85 (212) p (3216)

11 LC Combined Type Signal Lines Type Series Size in inch (in mm) p89 NFL18T 63 (168) Cut-off Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz LC Combined Type Universal Type [ Power Lines / Signal Lines ] Series NFE31T NFE61HT p85 p86 Size in inch (in mm) 126 (3216) 276 (6816) 1 Capacitance (pf) Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz Inductor Type Universal Type [ Power Lines / Signal Lines ] Series Size in inch (in mm) p9 NF32BW 121 (3225) at 1MHz Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz DLp Common Mode Choke Coils Series Size in inch (in mm) Common Mode at 1MHz Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz Signal Lines Type For Differential Signal Lines DLM11S DLW21S DLW31S p17 p18 p11 54 (121) 85 (212) 126 (3216) Universal Type [ Power Lines / Signal Lines ] DLW5BS* p14 p15 DLW5AT*/DLW5BT* 22 (55) (536) (55) Common Mode Choke Coils Signal Lines Type For Differential Signal Lines Series Size in inch (in mm) p111 DLW43S 1812 (4532) Common Mode Inductance (μh) at 1MHz Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz PLp Large Current Common Mode Choke Coil for Automotive Available Power Lines Type BN Block EMIFILr Power Lines Type Lead Type Series PLT1H* PLT5BP* Series BN24H1* BN25H1* BN26H1* BN27H1* BN12H1* Size in inch (in mm) p112 p113 p125 p125 p125 p125 p136 Height (mm) max. 45 Common Mode at 1MHz ated Voltage (Vdc) ated Current (A) Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz DSp 3-Terminal Capacitor Lead Type Universal Type [ Power Lines / Signal Lines ] DSS1 Series p133 Height (mm) 7.5 max. Capacitance (F) 1p 1p 1n 1n 1n Effective Frequency ange (Applicable Frequency anges are only for reference.) 1kHz 1kHz 1MHz 1MHz 1MHz 1GHz 1GHz VFp Lead Type Capacitor with Varistor Function Power Lines Type Series Height (mm) Capacitance p135 VFC2 6. max. 1.μF Varistor Voltage 27V * The derating of rated current is required for some items according to the operating temperature on each product page. 9

12 BL p ing () BL q M w 18 AG 12 S 1 e r t y u i D o Lead Type qproduct ID Product ID BL wtype E M edimensions (LgW) s Type DC Bias Characteristics Improved Type Ferrite Bead Single Type Dimensions (LgW).6g.3mm 1.g.5mm 1.6g.8mm 2.g1.25mm 3.2g1.6mm 3.2g2.5mm 4.5g1.6mm EIA rcharacteristics/applications * 1 Characteristics/Applications AG For General Use A BA BB BC For High-speed Signal Lines BD B PD PG For Power Lines PN P KG For Power Lines (Low DC esistance Type) SG HG For GHz Band General Use EB For GHz Band High-speed Signal Lines (Low Direct Current Type) EG For GHz Band General Use (Low DC esistance Type) HB HD For GHz Band High-speed Signal Lines HE GA For High-GHz Band High-speed Signal Lines GG For High-GHz Band General Use * 1 Frequency characteristics vary with each code. timpedance Expressed by three figures. The unit is in ohm (Ω) at 1MHz. The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. yelectrode Expressed by a letter. Ex.) S/T A W ucategory H Electrode Sn Plating Au Plating Ag/Pd Category Infotainment Powertrain, Safety inumber of Circuits Number of Circuits 1 1 Circuit Series BLM3/15/18/21 BLM3/15 BLM15/18 BLM3/15/18/21 BLM3/15 BLM3/15/18/21 BLM15 BLM15 BLM3/15/18/21/31/41 BLE32 BLM3/15 BLM18 BLM3/15/18 BLM3 BLM15/18 BLM3/15/18 BLM3/15/18 BLM18 BLM15 BLM15/18 For Automotive Continued on the following page. 1

13 BLp ing opackaging Packaging Series K Embossed Taping (ø33mm eel) BLE, BLM21 * 1 /31/41 L Embossed Taping (ø18mm eel) B Bulk All Series J Paper Taping (ø33mm eel) BLM3/15/18 /21 * 2 D Paper Taping (ø18mm eel) * 1 BLM21BD222Sp1/BLM21BD272Sp1 only. * 2 Except for BLM21BD222Sp1/BLM21BD272Sp1 Lead Type 11

14 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM3PGSeries 21/63 (inch/mm) 21 size for power lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Packaging c Equivalent Circuit (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM3PG22S1p 22 25% 9mA.65 max BLM3PG33S1p 33 25% 75mA.9 max c Impedance-Frequency Characteristics (Main Items) 8.15±.5.6±.3.3±.3.3±.3 : Electrode (in mm) Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk BLM3PG33S1 BLM3PG22S Lead Type c Impedance-Frequency Characteristics BLM3PG22S BLM3PG33S

15 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM3PSeries 21/63 (inch/mm) Improved DC resistance meets larger current. c Appearance/ Dimensions c ated Value (p: packaging code) c Impedance-Frequency Characteristics (Main Items) For Infotainment Number of Circuits: BLM3P8S1 BLM3P33S1 BLM3P22S1.15±.5.6±.3.3±.3 For Powertrain/Safety ±.3 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM3P_Sp1 series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 2. ated Current (A) ated Current Operating Temperature ( C) efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM3P22S1p 22 25% 18mA.4 max BLM3P33S1p 33 25% 15mA.55 max BLM3P8S1p 8 25% 1mA.13 max Continued on the following page. Lead Type 13

16 BLM3P c Impedance-Frequency Characteristics BLM3P22S1 BLM3P33S1 4 6 BLM3P8S Lead Type

17 Power lines Signal lines Universal Type BLM3ASeries 21/63 (inch/mm) High spec ferrite bead ultra low DC resistance and wide impedance line up. Fit for both power lines and signal lines. c Appearance/ Dimensions.6±.3.3±.3.3±.3 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1.15±.5 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) ated Current DC esistance Operating Temperature ange BLM3A1S1p 1 (Typ.) 1mA.5 max BLM3A8S1p 8 25% 5mA.18 max BLM3A121S1p 12 25% 45mA.23 max BLM3A241S1p 24 25% 35mA.38 max BLM3A61S1p 6 25% 25mA.85 max BLM3A12S1p 1 25% 2mA 1.25 max BLM3A12S1 BLM3A61S1 BLM3A241S1 BLM3A121S1 BLM3A8S1 BLM3A1S c Impedance-Frequency Characteristics BLM3A1S BLM3A8S BLM3A121S Continued on the following page. Lead Type 15

18 BLM3A c Impedance-Frequency Characteristics BLM3A241S1 BLM3A61S BLM3A12S Lead Type

19 Signal Lines Type BLM3AGSeries 21/63 (inch/mm) 21 size for general signal lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.15±.5.6±.3.3±.3 For Powertrain/Safety.3±.3 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM3AG1S1p 1 (Typ.) 5mA.1 max BLM3AG7S1p 7 (Typ.) 2mA.4 max BLM3AG8S1p 8 25% 2mA.4 max BLM3AG121S1p 12 25% 2mA.5 max BLM3AG241S1p 24 25% 2mA.8 max BLM3AG61S1p 6 25% 1mA 1.5 max BLM3AG12S1p 1 25% 1mA 2.5 max c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics BLM3AG12S1 BLM3AG61S1 BLM3AG241S1 BLM3AG121S1 BLM3AG8S1 BLM3AG7S1 BLM3AG1S BLM3AG1S BLM3AG7S BLM3AG8S Continued on the following page. Lead Type 17

20 BLM3AG c Impedance-Frequency Characteristics BLM3AG121S1 BLM3AG241S1 2 5 BLM3AG61S Lead Type BLM3AG12S

21 Signal Lines Type BLM3BSeries 21/63 (inch/mm) 21 size for high speed signal lines. c Appearance/ Dimensions.6±.3.3±.3.3±.3 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1.15±.5 : Electrode c Equivalent Circuit (esistance element becomes dominant at high frequencies.) (in mm) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM3BD75S1p 75 25% 3mA.4 max BLM3BD121S1p 12 25% 25mA.5 max BLM3BD241S1p 24 25% 2mA.8 max BLM3BD471S1p 47 25% 215mA 1.5 max BLM3BD61S1p 6 25% 2mA 1.7 max BLM3BB1S1p 1 25% 3mA.4 max BLM3BB22S1p 22 25% 2mA.5 max BLM3BB47S1p 47 25% 2mA.7 max BLM3BB75S1p 75 25% 2mA 1. max BLM3BB121S1p 12 25% 1mA 1.5 max BLM3BC33S1p 33 25% 15mA.85 max BLM3BC56S1p 56 25% 1mA 1.5 max BLM3BC8S1p 8 25% 1mA 1.4 max c Impedance-Frequency Characteristics (Main Items) BLM3BD Series BLM3BB Series BLM3BD61S1 BLM3BD471S1 BLM3BD241S1 BLM3BD121S1 BLM3BD75S BLM3BB121S1 BLM3BB75S1 4 BLM3BB47S1 BLM3BB22S1 2 BLM3BB1S Continued on the following page. Lead Type 19

22 BLM3B c Impedance-Frequency Characteristics (Main Items) BLM3BC Series BLM3BD121S BLM3BC8S1 BLM3BC56S1 BLM3BC33S BLM3BD241S1 5 c Impedance-Frequency Characteristics BLM3BD75S BLM3BD471S BLM3BD61S BLM3BB1S BLM3BB22S BLM3BB47S1 BLM3BB75S1 BLM3BB121S Lead Type BLM3BC33S BLM3BC56S BLM3BC8S

23 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM15PSeries 42/15 (inch/mm) 3A max., high performance type for power lines up to 6ohm. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.25±.1 1.±.5 For Powertrain/Safety.5±.5 c Impedance-Frequency Characteristics (Main Items).5±.5 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM15P33S1p 33 25% 3mA.22 max BLM15P6S1p 6 25% 25mA.32 max BLM15P8S1p 8 25% 23mA.38 max BLM15P121S1p 12 25% 2mA.55 max BLM15P181S1p 18 25% 15mA.9 max BLM15P221S1p 22 25% 14mA.1 max BLM15P331S1p 33 25% 12mA.15 max BLM15P471S1p 47 25% 1mA.2 max BLM15P61S1p 6 25% 9mA.23 max BLM15P61S1 BLM15P471S1 BLM15P331S1 BLM15P221S1 BLM15P181S1 BLM15P121S1 BLM15P8S1 BLM15P6S1 BLM15P33S c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM15P series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) Continued on the following page. Lead Type 21

24 BLM15P c Impedance-Frequency Characteristics BLM15P33S1 BLM15P6S1 6 1 BLM15P8S BLM15P121S1 BLM15P181S1 BLM15P221S BLM15P331S Lead Type BLM15P471S BLM15P61S

25 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM15PG/BLM15PDSeries 42/15 (inch/mm) 42 size for power lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.25±.1 1.±.5 For Powertrain/Safety.5±.5 c Impedance-Frequency Characteristics (Main Items).5±.5 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM15PG1S1p 1 (Typ.) 1mA.25 max BLM15PD3S1p 3 25% 22mA.35 max BLM15PD6S1p 6 25% 17mA.6 max BLM15PD8S1p 8 25% 15mA.7 max BLM15PD121S1p 12 25% 13mA.9 max BLM15PG1S1 BLM15PD121S1 BLM15PD8S1 BLM15PD6S1 BLM15PD3S1 c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM15PD series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) Continued on the following page. Lead Type 23

26 BLM15PG/BLM15PD c Impedance-Frequency Characteristics BLM15PG1S1 BLM15PD3S BLM15PD6S BLM15PD8S1 BLM15PD121S Lead Type

27 Power lines Signal lines Universal Type BLM15ASeries 42/15 (inch/mm) High spec ferrite bead low DC resistance and wide impedance line up. Fit for both power lines and signal lines. c Appearance/ Dimensions.25±.1 1.±.5.5±.5.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM15A1S1p mA.15 max BLM15A3S1p 3 25% 11mA.6 max BLM15A7S1p 7 25% 78mA.1 max BLM15A121S1p 12 25% 7mA.13 max BLM15A221S1p 22 25% 6mA.18 max BLM15A61S1p 6 25% 5mA.34 max BLM15A12S1p 1 25% 35mA.49 max c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics BLM15A12S1 BLM15A61S1 BLM15A221S1 BLM15A121S1 BLM15A7S1 BLM15A3S1 BLM15A1S BLM15A1S BLM15A3S BLM15A7S Continued on the following page. Lead Type 25

28 BLM15A c Impedance-Frequency Characteristics BLM15A121S1 BLM15A221S1 2 4 BLM15A61S Lead Type BLM15A12S

29 Signal Lines Type BLM15AGSeries 42/15 (inch/mm) 42 size for general signal lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.25±.1 1.±.5 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics.5±.5.5±.5 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM15AG1S1p BLM15AG1SH1p 1 (Typ.) 1mA.25 max./.5 max BLM15AG7S1p BLM15AG7SH1p 7 (Typ.) 6mA/5mA.15 max BLM15AG121S1p BLM15AG121SH1p 12 25% 55mA/5mA.19 max./.25 max BLM15AG221S1p BLM15AG221SH1p 22 25% 45mA/3mA.29 max./.35 max BLM15AG61S1p BLM15AG61SH1p 6 25% 3mA.52 max./.6 max BLM15AG12S1p BLM15AG12SH1p 1 25% 3mA/2mA.65 max./1. max BLM15AG_S Series BLM15AG12S1 BLM15AG61S1 BLM15AG221S1 BLM15AG121S1 BLM15AG7S1 BLM15AG1S BLM15AG1S BLM15AG1SH BLM15AG_SH Series BLM15AG221SH1 BLM15AG121SH1 BLM15AG7SH1 BLM15AG1SH1 BLM15AG12SH1 BLM15AG61SH BLM15AG7S Continued on the following page. Lead Type 27

30 BLM15AG c Impedance-Frequency Characteristics BLM15AG7SH1 BLM15AG121S BLM15AG121SH BLM15AG221S1 BLM15AG221SH1 BLM15AG61S1/BLM15AG61SH BLM15AG12S1/BLM15AG12SH Lead Type

31 Signal Lines Type BLM15BSeries 42/15 (inch/mm) 42 size for high speed signal lines, low DC resistance. c Appearance/ Dimensions.25±.1 1.±.5.5±.5.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM15B75S1p 75 25% 6mA.15 max BLM15B121S1p 12 25% 6mA.17 max BLM15B221S1p 22 25% 45mA.27 max BLM15B471S1p 47 25% 35mA.41 max BLM15B61S1p 6 25% 35mA.46 max BLM15B12S1p 1 25% 3mA.65 max BLM15B182S1p 18 25% 25mA.9 max c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics BLM15B75S BLM15B182S1 BLM15B12S1 BLM15B61S1 BLM15B471S1 BLM15B221S1 BLM15B121S1 BLM15B75S BLM15B121S BLM15B221S Continued on the following page. Lead Type 29

32 BLM15B c Impedance-Frequency Characteristics BLM15B471S1 BLM15B61S BLM15B12S Lead Type BLM15B182S

33 Signal Lines Type BLM15BSeries 42/15 (inch/mm) 42 size for high speed signal lines. c Appearance/ Dimensions.25±.1.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 1.±.5.5±.5 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM15BD75S1p 75 25% 3mA.2 max BLM15BD121S1p 12 25% 3mA.3 max BLM15BD221S1p 22 25% 3mA.4 max BLM15BD471S1p BLM15BD471SH1p 47 25% 2mA.6 max BLM15BD61S1p BLM15BD61SH1p 6 25% 2mA.65 max BLM15BD12S1p BLM15BD12SH1p 1 25% 2mA.9 max BLM15BD182S1p BLM15BD182SH1p 18 25% 1mA/2mA 1.4 max BLM15BB5S1p BLM15BB5SH1p 5 25% 5mA.8 max BLM15BB1S1p BLM15BB1SH1p 1 25% 3mA.1 max BLM15BB22S1p BLM15BB22SH1p 22 25% 3mA.2 max BLM15BB47S1p BLM15BB47SH1p 47 25% 3mA.35 max BLM15BB75S1p BLM15BB75SH1p 75 25% 3mA.4 max BLM15BB121S1p BLM15BB121SH1p 12 25% 3mA.55 max BLM15BB221S1p BLM15BB221SH1p 22 25% 2mA.8 max BLM15BC121S1p 12 25% 35mA.45 max BLM15BC241S1p 24 25% 25mA.7 max BLM15BA5S1p 5 25% 3mA.1 max BLM15BA1S1p 1 25% 3mA.2 max BLM15BA22S1p 22 25% 3mA.3 max BLM15BA33S1p 33 25% 3mA.4 max BLM15BA47S1p 47 25% 2mA.6 max BLM15BA75S1p 75 25% 2mA.8 max Continued on the following page. Lead Type 31

34 BLM15B c Impedance-Frequency Characteristics (Main Items) BLM15BD_S Series 2 BLM15BD_SH Series BLM15BD182S1 BLM15BD12S1 BLM15BD61S1 BLM15BD471S1 BLM15BD221S1 BLM15BD121S1 BLM15BD75S BLM15BD182SH1 BLM15BD12SH1 BLM15BD61SH1 BLM15BD471SH BLM15BB_S Series BLM15BB_SH Series BLM15BB221S1 BLM15BB121S1 BLM15BB75S1 BLM15BB47S1 BLM15BB22S1 BLM15BB1S1 BLM15BB5S BLM15BB221SH1 BLM15BB121SH1 BLM15BB75SH1 BLM15BB47SH1 BLM15BB22SH1 BLM15BB1SH1 BLM15BB5SH1 Lead Type BLM15BC_S Series BLM15BC241S1 BLM15BC121S BLM15BA_S Series BLM15BA75S1 BLM15BA47S1 BLM15BA33S1 BLM15BA22S1 BLM15BA1S1 BLM15BA5S Continued on the following page. 32

35 BLM15B c Impedance-Frequency Characteristics BLM15BD75S BLM15BD121S BLM15BD221S BLM15BD471S1/BLM15BD471SH1 1 BLM15BD61S1/BLM15BD61SH1 1 BLM15BD12S1/BLM15BD12SH BLM15BD182S1/BLM15BD182SH BLM15BB5S1/BLM15BB5SH BLM15BB1S1/BLM15BB1SH BLM15BB22S1/BLM15BB22SH1 BLM15BB47S1/BLM15BB47SH1 BLM15BB75S1/BLM15BB75SH BLM15BB121S1/BLM15BB121SH BLM15BB221S1/BLM15BB221SH BLM15BC121S Continued on the following page. Lead Type 33

36 BLM15B c Impedance-Frequency Characteristics BLM15BC241S BLM15BA22S1 6 BLM15BA5S BLM15BA33S1 1 BLM15BA1S BLM15BA47S BLM15BA75S Lead Type

37 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM18PGSeries 63/168 (inch/mm) 63 size for power lines. c Appearance/ Dimensions.4±.2 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4.8±.15 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.15.8±.15 : Electrode c Equivalent Circuit (esistance element becomes dominant at high frequencies.) (in mm) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM18PG3S1p BLM18PG3SH1p 3 (Typ.) 1mA.5 max BLM18PG33S1p BLM18PG33SH1p 33 25% 3mA.25 max BLM18PG6S1p BLM18PG6SH1p 6 (Typ.) 5mA.1 max BLM18PG121S1p BLM18PG121SH1p 12 25% 2mA.5 max BLM18PG181S1p BLM18PG181SH1p 18 25% 15mA.9 max BLM18PG221S1p BLM18PG221SH1p 22 25% 14mA.1 max BLM18PG331S1p BLM18PG331SH1p 33 25% 12mA.15 max BLM18PG471S1p BLM18PG471SH1p 47 25% 1mA.2 max Number of Circuits: 1 c Impedance-Frequency Characteristics (Main Items) BLM18PG_S Series BLM18PG471S1 BLM18PG331S1 BLM18PG221S1 BLM18PG181S1 BLM18PG121S1 BLM18PG6S1 BLM18PG33S1 BLM18PG3S BLM18PG_SH Series BLM18PG331SH1 BLM18PG221SH1 BLM18PG181SH1 BLM18PG121SH1 BLM18PG6SH1 BLM18PG33SH1 BLM18PG3SH1 BLM18PG471SH Continued on the following page. Lead Type 35

38 BLM18PG c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM18PG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) c Impedance-Frequency Characteristics BLM18PG3S1/BLM18PG3SH BLM18PG121S1/BLM18PG121SH1 2 BLM18PG33S1/BLM18PG33SH BLM18PG181S1/BLM18PG181SH1 3 BLM18PG6S1/BLM18PG6SH BLM18PG221S1/BLM18PG221SH1 3 Lead Type BLM18PG331S1/BLM18PG331SH BLM18PG471S1/BLM18PG471SH

39 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM18KGSeries 63/168 (inch/mm) 6A max., high performance type for power lines up to 6ohm. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.4±.2 1.6±.15.8±.15 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) T BLM18KG_Tp.6±.15 BLM18KG_Sp.8±.15 T : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM18KG26T1p 26 25% 6mA.7 max BLM18KG3T1p 3 25% 5mA.1 max BLM18KG7T1p 7 25% 35mA.22 max BLM18KG11T1p 1 25% 3mA.3 max BLM18KG121T1p 12 25% 3mA.3 max BLM18KG221S1p 22 25% 22mA.5 max BLM18KG331S1p 33 25% 17mA.8 max BLM18KG471S1p 47 25% 15mA.13 max BLM18KG61S1p 6 25% 13mA.15 max BLM18KG61S1 BLM18KG471S1 BLM18KG331S1 BLM18KG221S1 BLM18KG121T1 BLM18KG11T1 BLM18KG7T1 BLM18KG3T1 BLM18KG26T Continued on the following page. Lead Type 37

40 BLM18KG c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM18KG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 6 5 c Impedance-Frequency Characteristics BLM18KG26T BLM18KG3T1 4 ated Current (ma) Operating Temperature ( C) BLM18KG11T1 BLM18KG121T BLM18KG7T BLM18KG221S Lead Type BLM18KG331S BLM18KG471S BLM18KG61S

41 Power Lines Type *Please refer to the products designed for both power lines and signal lines. BLM18SGSeries 63/168 (inch/mm) 6A max., high performance type for power lines. c Appearance/ Dimensions 1.6±.15.8±.15.5±.15 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 3 B Packing in Bulk 1.4±.2 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) ated Current DC esistance Operating Temperature ange BLM18SG26T1p 26 25% 6mA.7 max BLM18SG7T1p 7 25% 4mA.2 max BLM18SG121T1p 12 25% 3mA.25 max BLM18SG221T1p 22 25% 25mA.4 max BLM18SG331T1p 33 25% 15mA.7 max BLM18SG331T1 BLM18SG221T1 BLM18SG121T1 BLM18SG7T1 BLM18SG26T1 c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM18SG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) Continued on the following page. Lead Type 39

42 BLM18SG c Impedance-Frequency Characteristics BLM18SG26T1 BLM18SG7T BLM18SG121T Lead Type BLM18SG221T1 BLM18SG331T

43 Signal Lines Type *Please refer to BLM15A for downsizing. BLM18AG_SSeries 63/168 (inch/mm) 63 size for general signal lines. c Appearance/ Dimensions.4±.2 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4.8±.15 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.15.8±.15 : Electrode c Equivalent Circuit (esistance element becomes dominant at high frequencies.) (in mm) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM18AG121S1p BLM18AG121SH1p 12 25% 5mA.18 max BLM18AG151S1p BLM18AG151SH1p 15 25% 5mA.25 max BLM18AG221S1p BLM18AG221SH1p 22 25% 5mA.25 max BLM18AG331S1p BLM18AG331SH1p 33 25% 5mA.3 max BLM18AG471S1p BLM18AG471SH1p 47 25% 5mA.35 max BLM18AG61S1p BLM18AG61SH1p 6 25% 5mA.38 max BLM18AG12S1p BLM18AG12SH1p 1 25% 4mA.5 max c Impedance-Frequency Characteristics (Main Items) BLM18AG_S Series BLM18AG12S1 BLM18AG61S1 BLM18AG471S1 BLM18AG331S1 BLM18AG221S1 BLM18AG151S1 BLM18AG121S BLM18AG_SH Series BLM18AG121SH1 BLM18AG12SH1 BLM18AG61SH1 BLM18AG471SH1 BLM18AG331SH1 BLM18AG221SH1 BLM18AG151SH Continued on the following page. Lead Type 41

44 BLM18AG_S c Impedance-Frequency Characteristics BLM18AG121S1/BLM18AG121SH BLM18AG331S1/BLM18AG331SH1 5 BLM18AG151S1/BLM18AG151SH BLM18AG471S1/BLM18AG471SH1 6 BLM18AG221S1/BLM18AG221SH BLM18AG61S1/BLM18AG61SH BLM18AG12S1/BLM18AG12SH Lead Type

45 Signal Lines Type *for conductive glue mounting. BLM18AG_WSeries 63/168 (inch/mm) 63 size for general signal lines. for conductive glue mounting. c Appearance/ Dimensions.4±.2.8±.15 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.15.8±.15 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) ated Current DC esistance Operating Temperature ange BLM18AG471WH1p 47 25% 2mA.2 max BLM18AG12WH1p 1 25% 2mA.7 max BLM18AG12WH1 BLM18AG471WH c Impedance-Frequency Characteristics BLM18AG471WH1 BLM18AG12WH Lead Type 43

46 Signal Lines Type *Please refer to BLM15B for downsizing. BLM18BSeries 63/168 (inch/mm) 63 size for high speed signal lines. c Appearance/ Dimensions.4±.2 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4.8±.15 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.15.8±.15 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. Lead Type c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM18BD47S1p BLM18BD47SH1p 47 25% 5mA.3 max BLM18BD121S1p BLM18BD121SH1p 12 25% 2mA.4 max BLM18BD151S1p BLM18BD151SH1p 15 25% 2mA.4 max BLM18BD221S1p BLM18BD221SH1p 22 25% 2mA.45 max BLM18BD331S1p BLM18BD331SH1p 33 25% 2mA.5 max BLM18BD421S1p BLM18BD421SH1p 42 25% 2mA.55 max BLM18BD471S1p BLM18BD471SH1p 47 25% 2mA.55 max BLM18BD61S1p BLM18BD61SH1p 6 25% 2mA.65 max BLM18BD12S1p BLM18BD12SH1p 1 25% 1mA.85 max BLM18BD152S1p BLM18BD152SH1p 15 25% 5mA 1.2 max BLM18BD182S1p BLM18BD182SH1p 18 25% 5mA 1.5 max BLM18BD222S1p BLM18BD222SH1p 22 25% 5mA 1.5 max BLM18BD252S1p BLM18BD252SH1p 25 25% 5mA 1.5 max BLM18BB5S1p BLM18BB5SH1p 5 25% 7mA.5 max BLM18BB1S1p BLM18BB1SH1p 1 25% 7mA.1 max BLM18BB22S1p BLM18BB22SH1p 22 25% 6mA.2 max BLM18BB47S1p BLM18BB47SH1p 47 25% 55mA.25 max BLM18BB6S1p BLM18BB6SH1p 6 25% 55mA.25 max BLM18BB75S1p BLM18BB75SH1p 75 25% 5mA.3 max BLM18BB121S1p BLM18BB121SH1p 12 25% 5mA.3 max BLM18BB141S1p BLM18BB141SH1p 14 25% 45mA.35 max BLM18BB151S1p BLM18BB151SH1p 15 25% 45mA.37 max BLM18BB221S1p BLM18BB221SH1p 22 25% 45mA.45 max BLM18BB331S1p BLM18BB331SH1p 33 25% 4mA.58 max BLM18BB471S1p BLM18BB471SH1p 47 25% 3mA.85 max BLM18BA5S1p BLM18BA5SH1p 5 25% 5mA.2 max BLM18BA1S1p BLM18BA1SH1p 1 25% 5mA.25 max BLM18BA22S1p BLM18BA22SH1p 22 25% 5mA.35 max BLM18BA47S1p BLM18BA47SH1p 47 25% 3mA.55 max BLM18BA75S1p BLM18BA75SH1p 75 25% 3mA.7 max BLM18BA121S1p BLM18BA121SH1p 12 25% 2mA.9 max Continued on the following page. 44

47 BLM18B c Impedance-Frequency Characteristics (Main Items) BLM18BD_S Series (47 42 ) BLM18BD421S1 BLM18BD331S1 BLM18BD221S1 BLM18BD151S1 BLM18BD121S1 BLM18BD47S BLM18BD_S Series (47 25 ) BLM18BD252S1 BLM18BD222S1 BLM18BD182S1 BLM18BD152S1 BLM18BD12S1 BLM18BD61S1 BLM18BD471S BLM18BD_SH Series BLM18BB_S Series (5 75 ) 28 BLM18BD252SH1 BLM18BD222SH BLM18BD182SH1 BLM18BD152SH1 BLM18BD12SH1 BLM18BD61SH1 BLM18BD471SH1 BLM18BD421SH1 BLM18BD331SH1 BLM18BD47SH1 BLM18BD221SH1 BLM18BD151SH1 BLM18BD121SH BLM18BB75S1 BLM18BB6S1 BLM18BB47S1 BLM18BB22S1 BLM18BB1S1 BLM18BB5S BLM18BB_S Series (12 47 ) BLM18BB471S1 BLM18BB331S1 BLM18BB221S1 BLM18BB151S1 BLM18BB141S1 BLM18BB121S1 BLM18BB_SH Series (5 47 ) BLM18BB47SH1 BLM18BB22SH1 1 BLM18BB1SH1 5 5 BLM18BB5SH BLM18BB_SH Series (6 47 ) BLM18BB471SH1 BLM18BB331SH1 BLM18BB221SH1 BLM18BB151SH1 BLM18BB141SH1 BLM18BB121SH1 BLM18BB75SH1 BLM18BB6SH BLM18BA_S Series (5 22 ) BLM18BA22S1 BLM18BA1S1 BLM18BA5S Continued on the following page. Lead Type 45

48 BLM18B c Impedance-Frequency Characteristics (Main Items) BLM18BA_S Series (47 12 ) 1 75 BLM18BA_SH Series (5 22 ) BLM18BA121S1 BLM18BA75S1 BLM18BA47S1 3 BLM18BA22SH1 BLM18BA1SH BLM18BA5SH BLM18BA_SH Series (47 12 ) BLM18BA121SH1 BLM18BA75SH1 BLM18BA47SH Lead Type c Impedance-Frequency Characteristics BLM18BD47S1/BLM18BD47SH BLM18BD221S1/BLM18BD221SH BLM18BD121S1/BLM18BD121SH BLM18BD331S1/BLM18BD331SH BLM18BD151S1/BLM18BD151SH BLM18BD421S1/BLM18BD421SH Continued on the following page. 46

49 BLM18B c Impedance-Frequency Characteristics BLM18BD471S1/BLM18BD471SH1 BLM18BD61S1/BLM18BD61SH BLM18BD12S1/BLM18BD12SH BLM18BD152S1/BLM18BD152SH1 BLM18BD182S1/BLM18BD182SH1 BLM18BD222S1/BLM18BD222SH BLM18BD252S1/BLM18BD252SH BLM18BB5S1/BLM18BB5SH BLM18BB1S1/BLM18BB1SH BLM18BB22S1/BLM18BB22SH1 BLM18BB47S1/BLM18BB47SH1 BLM18BB6S1/BLM18BB6SH BLM18BB75S1/BLM18BB75SH BLM18BB121S1/BLM18BB121SH BLM18BB141S1/BLM18BB141SH Continued on the following page. Lead Type 47

50 BLM18B c Impedance-Frequency Characteristics BLM18BB151S1/BLM18BB151SH1 BLM18BB221S1/BLM18BB221SH BLM18BB331S1/BLM18BB331SH BLM18BB471S1/BLM18BB471SH1 BLM18BA5S1/BLM18BA5SH1 BLM18BA1S1/BLM18BA1SH BLM18BA22S1/BLM18BA22SH BLM18BA47S1/BLM18BA47SH BLM18BA75S1/BLM18BA75SH BLM18BA121S1/BLM18BA121SH1 1 Lead Type

51 Power Lines Type BLM21PGSeries 85/212 (inch/mm) 85 size for power lines. c Appearance/ Dimensions.5±.2.85±.2 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 2.± ±.2 EIA CODE : 85 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLM21PG22S1p BLM21PG22SH1p 22 25% 6mA.9 max BLM21PG3S1p BLM21PG3SH1p 3 (Typ.) 4mA.14 max BLM21PG6S1p BLM21PG6SH1p 6 25% 35mA.2 max BLM21PG121S1p BLM21PG121SH1p 12 25% 3mA.3 max BLM21PG221S1p BLM21PG221SH1p 22 25% 2mA.45 max BLM21PG331S1p BLM21PG331SH1p 33 25% 15mA.7 max c Impedance-Frequency Characteristics (Main Items) BLM21PG_S Series 5 BLM21PG331S1 4 BLM21PG221S1 3 BLM21PG121S1 BLM21PG6S1 2 BLM21PG3S1 BLM21PG22S BLM21PG_SH Series 5 BLM21PG331SH1 4 BLM21PG221SH1 3 BLM21PG121SH1 BLM21PG6SH1 2 BLM21PG3SH1 BLM21PG22SH Continued on the following page. Lead Type 49

52 BLM21PG c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM21PG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 6 ated Current (ma) Operating Temperature ( C) Lead Type c Impedance-Frequency Characteristics BLM21PG22S1/BLM21PG22SH BLM21PG121S1/BLM21PG121SH BLM21PG3S1/BLM21PG3SH BLM21PG221S1/BLM21PG221SH BLM21PG6S1/BLM21PG6SH BLM21PG331S1/BLM21PG331SH

53 Signal Lines Type BLM21AGSeries 85/212 (inch/mm) 85 size for general signal lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.5±.2 2.±.2 For Powertrain/Safety 1.25±.2.85±.2 EIA CODE : 85 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM21AG121S1p BLM21AG121SH1p 12 25% 8mA.1 max BLM21AG151S1p BLM21AG151SH1p 15 25% 8mA.1 max BLM21AG221S1p BLM21AG221SH1p 22 25% 8mA.13 max BLM21AG331S1p BLM21AG331SH1p 33 25% 7mA.16 max BLM21AG471S1p BLM21AG471SH1p 47 25% 7mA.19 max BLM21AG61S1p BLM21AG61SH1p 6 25% 6mA.21 max BLM21AG12S1p BLM21AG12SH1p 1 25% 5mA.28 max c Impedance-Frequency Characteristics (Main Items) BLM21AG_S Series 12 BLM21AG12S1 BLM21AG61S1 9 BLM21AG471S1 BLM21AG331S1 BLM21AG221S1 6 BLM21AG151S1 BLM21AG121S BLM21AG_SH Series BLM21AG12SH1 BLM21AG61SH1 BLM21AG471SH1 BLM21AG331SH1 BLM21AG221SH1 BLM21AG151SH1 BLM21AG121SH Continued on the following page. Lead Type 51

54 BLM21AG c Impedance-Frequency Characteristics BLM21AG121S1/BLM21AG121SH1 BLM21AG151S1/BLM21AG151SH1 2 2 BLM21AG221S1/BLM21AG221SH BLM21AG331S1/BLM21AG331SH1 BLM21AG471S1/BLM21AG471SH1 BLM21AG61S1/BLM21AG61SH BLM21AG12S1/BLM21AG12SH Lead Type

55 Signal Lines Type BLM21BSeries 85/212 (inch/mm) 85 size for high speed signal lines. c Appearance/ Dimensions E 2.± ±.2 T c Packaging All except for BLM21BD222S1/21BD272S1 Minimum Packaging Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 T E BLM21B (exclude items below).85±.2.5±.2 BLM21BD222Sp1 1.25±.2.5±.2 BLM21BD272Sp1 1.25±.2.3±.2 : Electrode (in mm) BLM21BD222S1/21BD272S1 only Minimum Packaging Quantity L 18mm Plastic Tape 3 K 33mm Plastic Tape 1 B Bulk(Bag) 1 c Equivalent Circuit c ated Value (p: packaging code) (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. Impedance Operating ated Current DC esistance For Infotainment For Powertrain/Safety (at 1MHz/2 C) Temperature ange BLM21BD121S1p BLM21BD121SH1p 12 25% 2mA.25 max BLM21BD151S1p BLM21BD151SH1p 15 25% 2mA.25 max BLM21BD221S1p BLM21BD221SH1p 22 25% 2mA.25 max BLM21BD331S1p BLM21BD331SH1p 33 25% 2mA.3 max BLM21BD421S1p BLM21BD421SH1p 42 25% 2mA.3 max BLM21BD471S1p BLM21BD471SH1p 47 25% 2mA.35 max BLM21BD61S1p BLM21BD61SH1p 6 25% 2mA.35 max BLM21BD751S1p BLM21BD751SH1p 75 25% 2mA.4 max BLM21BD12S1p BLM21BD12SH1p 1 25% 2mA.4 max BLM21BD152S1p BLM21BD152SH1p 15 25% 2mA.45 max BLM21BD182S1p BLM21BD182SH1p 18 25% 2mA.5 max BLM21BD222T1p BLM21BD222TH1p 22 25% 2mA.6 max BLM21BD222S1p BLM21BD222SH1p 225 (Typ.) 2mA.6 max BLM21BD272S1p BLM21BD272SH1p 27 25% 2mA.8 max BLM21BB5S1p BLM21BB5SH1p 5 25% 1mA.2 max BLM21BB6S1p BLM21BB6SH1p 6 25% 8mA.13 max BLM21BB75S1p BLM21BB75SH1p 75 25% 7mA.16 max BLM21BB121S1p BLM21BB121SH1p 12 25% 6mA.19 max BLM21BB151S1p BLM21BB151SH1p 15 25% 6mA.21 max BLM21BB21S1p BLM21BB21SH1p 2 25% 5mA.26 max BLM21BB221S1p BLM21BB221SH1p 22 25% 5mA.26 max BLM21BB331S1p BLM21BB331SH1p 33 25% 4mA.33 max BLM21BB471S1p BLM21BB471SH1p 47 25% 4mA.4 max Number of Circuits: 1 Continued on the following page. Lead Type 53

56 BLM21B c Impedance-Frequency Characteristics (Main Items) BLM21BD_S, T Series BLM21BD152S1 BLM21BD12S1 BLM21BD751S1 BLM21BD61S1 BLM21BD471S1 BLM21BD421S1 BLM21BD331S1 BLM21BD221S1 BLM21BD151S1 BLM21BD121S1 BLM21BD272S1 BLM21BD222S1 BLM21BD222T1 BLM21BD182S BLM21BD_SH, TH Series BLM21BD471SH1 BLM21BD331SH1 BLM21BD221SH1 BLM21BD151SH1 BLM21BD121SH1 BLM21BD751SH1 BLM21BD61SH1 BLM21BD421SH BLM21BD272SH1 BLM21BD222SH1 BLM21BD222TH1 BLM21BD182SH1 BLM21BD152SH1 BLM21BD12SH1 BLM21BB_S Series BLM21BB_SH Series BLM21BB471S1 BLM21BB331S1 BLM21BB221S1 BLM21BB151S1 BLM21BB121S1 BLM21BB6S1 BLM21BB5S1 BLM21BB21S1 BLM21BB75S BLM21BB471SH1 BLM21BB331SH1 BLM21BB221SH1 BLM21BB121SH1 BLM21BB151SH1 BLM21BB6SH1 BLM21BB5SH1 BLM21BB21SH1 BLM21BB75SH c Impedance-Frequency Characteristics BLM21BD121S1/BLM21BD121SH1 3 BLM21BD151S1/BLM21BD151SH BLM21BD221S1/BLM21BD221SH1 48 Lead Type BLM21BD331S1/BLM21BD331SH BLM21BD421S1/BLM21BD421SH BLM21BD471S1/BLM21BD471SH Continued on the following page. 54

57 BLM21B c Impedance-Frequency Characteristics BLM21BD61S1/BLM21BD61SH1 BLM21BD751S1/BLM21BD751SH BLM21BD12S1/BLM21BD12SH BLM21BD152S1/BLM21BD152SH1 BLM21BD182S1/BLM21BD182SH1 BLM21BD222T1/BLM21BD222TH BLM21BD222S1/BLM21BD222SH BLM21BD272S1/BLM21BD272SH BLM21BB5S1/BLM21BB5SH BLM21BB6S1/BLM21BB6SH1 BLM21BB75S1/BLM21BB75SH1 BLM21BB121S1/BLM21BB121SH BLM21BB151S1/BLM21BB151SH BLM21BB21S1/BLM21BB21SH BLM21BB221S1/BLM21BB221SH Continued on the following page. Lead Type 55

58 BLM21B c Impedance-Frequency Characteristics BLM21BB331S1/BLM21BB331SH1 BLM21BB471S1/BLM21BB471SH Lead Type 56

59 Power Lines Type BLM31PGSeries 126/3216 (inch/mm) 126 size for power lines. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuits: 1.7±.3 3.2±.2 1.6±.2 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) 1.1±.2 : Electrode (in mm) Impedance (at 1MHz/2 C) c Packaging Packaging c Equivalent Circuit Minimum Quantity L ø18mm Embossed Taping 3 K ø33mm Embossed Taping 1 B Packing in Bulk 1 (esistance element becomes dominant at high frequencies.) ated Current efer to pages from p.77 to p.8 for mounting information. DC esistance Operating Temperature ange BLM31PG33S1p BLM31PG33SH1p 33 25% 6mA.9 max BLM31PG5S1p BLM31PG5SH1p 5 (Typ.) 35mA.15 max BLM31PG121S1p BLM31PG121SH1p 12 25% 35mA.2 max BLM31PG391S1p BLM31PG391SH1p 39 25% 2mA.5 max BLM31PG61S1p BLM31PG61SH1p 6 25% 15mA.8 max BLM31PG_S Series BLM31PG61S1 BLM31PG391S1 BLM31PG121S1 BLM31PG5S1 BLM31PG33S1 BLM31PG_SH Series BLM31PG391SH1 BLM31PG121SH1 BLM31PG5SH1 BLM31PG61SH1 2 2 BLM31PG33SH Continued on the following page. Lead Type 57

60 BLM31PG c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM31PG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 6 ated Current (ma) Operating Temperature ( C) Lead Type c Impedance-Frequency Characteristics BLM31PG33S1/BLM31PG33SH BLM31PG391S1/BLM31PG391SH BLM31PG5S1/BLM31PG5SH BLM31PG61S1/BLM31PG61SH BLM31PG121S1/BLM31PG121SH

61 Power Lines Type BLM41PGSeries 186/4516 (inch/mm) 186 size for power lines. c Appearance/ Dimensions.7±.3 1.6±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 25 K ø33mm Embossed Taping 8 B Packing in Bulk 1 4.5±.2 1.6±.2 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) c Impedance-Frequency Characteristics (Main Items) BLM41PG_S Series (6 75 ) For Infotainment Number of Circuits: BLM41PG75S1 BLM41PG6S1 For Powertrain/Safety Impedance (at 1MHz/2 C) BLM41PG_S Series (18 1 ) ated Current BLM41PG12S1 BLM41PG471S1 BLM41PG181S1 DC esistance Operating Temperature ange BLM41PG6S1p BLM41PG6SH1p 6 (Typ.) 6mA.9 max BLM41PG75S1p BLM41PG75SH1p 75 (Typ.) 35mA.15 max BLM41PG181S1p BLM41PG181SH1p 18 25% 35mA.2 max BLM41PG471S1p BLM41PG471SH1p 47 25% 2mA.5 max BLM41PG12S1p BLM41PG12SH1p 1 25% 15mA.9 max BLM41PG_SH Series (6 18 ) BLM41PG75SH1 BLM41PG181SH1 BLM41PG6SH BLM41PG_SH Series (47 1 ) 12 BLM41PG12SH1 9 6 BLM41PG471SH Continued on the following page. Lead Type 59

62 BLM41PG c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM41PG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 6 ated Current (ma) Operating Temperature ( C) Lead Type c Impedance-Frequency Characteristics BLM41PG6S1/BLM41PG6SH BLM41PG471S1/BLM41PG471SH BLM41PG75S1/BLM41PG75SH BLM41PG12S1/BLM41PG12SH BLM41PG181S1/BLM41PG181SH

63 Power Lines Type BLE32PNSeries 121/3225 (inch/mm) 1A max., large current chip ferrite bead inductor. c Appearance/ Dimensions 3.2±.2 2.5±.2 2.±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 15 K ø33mm Embossed Taping 7 B Packing in Bulk 1.7±.3 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) Impedance (at 1MHz/2 C) ated Current DC esistance Operating Temperature ange BLE32PN3S1p 3 1 1mA 1.6m max BLE32PN3S c Impedance-Frequency Characteristics BLE32PN3S Lead Type 61

64 Signal Lines Type BLM3HSeries 21/63 (inch/mm) 21 size for GHz band noise. c Appearance/ Dimensions.6±.3.3±.3.3±.3 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1.15±.5 : Electrode c Equivalent Circuit (esistance element becomes dominant at high frequencies.) (in mm) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Impedance (at 1MHz/2 C) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM3HG61S1p 6 25% 1 4% 15mA 1.6 max BLM3HG12S1p 1 25% 18 4% 125mA 2.6 max BLM3HG122S1p 12 25% 2 4% 1mA 3.5 max BLM3HD331S1p 33 25% 75 4% 2mA 1. max BLM3HD471S1p 47 25% 1 4% 175mA 1.3 max BLM3HD61S1p 6 25% 15 4% 15mA 1.7 max BLM3HD12S1p 1 25% 23 4% 12mA 2.9 max BLM3HB191S1p 19 25% 115 4% 15mA 2. max Number of Circuits: 1 c Impedance-Frequency Characteristics (Main Items) BLM3HG Series 25 2 BLM3HD Series 25 2 BLM3HD12S1 Lead Type BLM3HG122S1 BLM3HG12S1 BLM3HG61S BLM3HD61S1 BLM3HD471S1 BLM3HD331S Continued on the following page. 62

65 BLM3H c Impedance-Frequency Characteristics (Main Items) BLM3HB Series BLM3HB191S c Impedance-Frequency Characteristics BLM3HG61S BLM3HD331S BLM3HG12S BLM3HD471S BLM3HG122S BLM3HD61S BLM3HD12S BLM3HB191S Lead Type 63

66 Power lines Signal lines Universal Type BLM3ESeries 21/63 (inch/mm) For GHz band noise and capable of large current. c Appearance/ Dimensions.6±.3.3±.3.3±.3 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 1.15±.5 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. Lead Type c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics Impedance (at 1MHz/2 C) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM3EB25S1p 25 25% 15 4% 6mA.26 max BLM3EB5S1p 5 25% 255 4% 4mA.58 max BLM3EB5S1 BLM3EB25S BLM3EB25S BLM3EB5S c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM3E series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) 15 64

67 Signal Lines Type BLM15HSeries 42/15 (inch/mm) 42 size for GHz band noise. c Appearance/ Dimensions.25±.1.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 1.±.5.5±.5 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM15HG61S1p BLM15HG61SH1p 6 25% 1 4% 3mA.7 max BLM15HG12S1p BLM15HG12SH1p 1 25% 14 4% 25mA 1.1 max BLM15HD61S1p BLM15HD61SH1p 6 25% 14 4% 3mA.85 max BLM15HD12S1p BLM15HD12SH1p 1 25% 2 4% 25mA 1.25 max BLM15HD182S1p BLM15HD182SH1p 18 25% 27 4% 2mA 2.2 max BLM15HB121S1p 12 25% 5 4% 3mA.7 max BLM15HB221S1p 22 25% 9 4% 25mA 1. max c Impedance-Frequency Characteristics (Main Items) BLM15HG_S Series (For General Signal Lines) BLM15HG61S1 BLM15HG12S BLM15HD_S Series (For High Speed Signal Lines) BLM15HD182S1 BLM15HD12S1 BLM15HD61S BLM15HG_SH Series BLM15HG61SH1 BLM15HG12SH BLM15HD_SH Series BLM15HD182SH1 BLM15HD12SH1 BLM15HD61SH Continued on the following page. Lead Type 65

68 BLM15H c Impedance-Frequency Characteristics (Main Items) BLM15HB_S Series (For High Speed Signal Lines) BLM15HB221S1 BLM15HB121S c Impedance-Frequency Characteristics BLM15HG61S1/BLM15HG61SH BLM15HD12S1/BLM15HD12SH BLM15HG12S1/BLM15HG12SH BLM15HD182S1/BLM15HD182SH BLM15HD61S1/BLM15HD61SH BLM15HB121S Lead Type BLM15HB221S

69 Power lines Signal lines Universal Type BLM15EGSeries 42/15 (inch/mm) For GHz band noise, also capable to large current. c Appearance/ Dimensions.25±.1 1.±.5.5±.5.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety c Impedance-Frequency Characteristics (Main Items) c Impedance-Frequency Characteristics Impedance (at 1MHz/2 C) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM15EG121S1p 12 25% 145 (Typ.) 15mA.95 max BLM15EG221S1p 22 25% 27 (Typ.) 7mA.28 max BLM15EG221S1 BLM15EG121S BLM15EG121S BLM15EG221S c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM15E series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) 9 5 Lead Type 67

70 Signal Lines Type BLM15GSeries 42/15 (inch/mm) Available up to high-ghz band noise. c Appearance/ Dimensions.25±.1.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 1.±.5.5±.5 B Packing in Bulk 1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM15GG221S1p 22 25% 6 4% 3mA.7 max BLM15GG471S1p 47 25% 12 4% 2mA 1.3 max BLM15GA75S1p 75 25% 1 4% 2mA 1.3 max BLM15GG471S1 BLM15GG221S1 BLM15GA75S Lead Type c Impedance-Frequency Characteristics BLM15GG221S BLM15GG471S BLM15GA75S

71 Signal Lines Type *Please refer to BLM15H for downsizing. BLM18HSeries 63/168 (inch/mm) 63 size for GHz band noise. BLM18HE also supports power lines. c Appearance/ Dimensions.4±.2 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4.8±.15 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.15.8±.15 : Electrode c Equivalent Circuit (esistance element becomes dominant at high frequencies.) (in mm) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM18HG471S1p BLM18HG471SH1p 47 25% 6 (Typ.) 2mA.85 max BLM18HG61S1p BLM18HG61SH1p 6 25% 7 (Typ.) 2mA 1. max BLM18HG12S1p BLM18HG12SH1p 1 25% 1 (Typ.) 1mA 1.6 max BLM18HE61S1p 6 25% 6 (Typ.) 8mA.25 max BLM18HE12S1p 1 25% 1 (Typ.) 6mA.35 max BLM18HE152S1p 15 25% 15 (Typ.) 5mA.5 max BLM18HD471S1p BLM18HD471SH1p 47 25% 1 (Typ.) 1mA 1.2 max BLM18HD61S1p BLM18HD61SH1p 6 25% 12 (Typ.) 1mA 1.5 max BLM18HD12S1p BLM18HD12SH1p 1 25% 17 (Typ.) 5mA 1.8 max BLM18HB121S1p 12 25% 5 4% 2mA.5 max BLM18HB221S1p 22 25% 11 4% 1mA.8 max BLM18HB331S1p 33 25% 16 4% 5mA 1.2 max BLM18HG_S Series (For General Signal Lines) BLM18HG_SH Series (For General Signal Lines) 2 2 BLM18HG12S1 15 BLM18HG61S1 BLM18HG471S BLM18HG12SH1 15 BLM18HG61SH1 BLM18HG471SH Continued on the following page. Lead Type 69

72 BLM18H c Impedance-Frequency Characteristics (Main Items) BLM18HE_S Series (For High Speed Signal Lines) 25 BLM18HD_S Series (For High Speed Signal Lines) 3 2 BLM18HE152S1 25 BLM18HD12S1 BLM18HD61S BLM18HE12S1 BLM18HE61S BLM18HD471S BLM18HD_SH Series (For High Speed Signal Lines) BLM18HB_S Series (For High Speed Signal Lines) BLM18HD12SH1 BLM18HD61SH1 BLM18HD471SH BLM18HB331S1 BLM18HB221S1 BLM18HB121S1 Lead Type c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM18HE series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) Continued on the following page. 7

73 BLM18H c Impedance-Frequency Characteristics BLM18HG471S1/BLM18HG471SH1 BLM18HG61S1/BLM18HG61SH BLM18HG12S1/BLM18HG12SH BLM18HE61S1 BLM18HE12S1 BLM18HE152S BLM18HD471S1/BLM18HD471SH BLM18HD61S1/BLM18HD61SH BLM18HD12S1/BLM18HD12SH BLM18HB121S1 BLM18HB221S1 BLM18HB331S Lead Type 71

74 Power lines Signal lines Universal Type BLM18EGSeries 63/168 (inch/mm) For GHz band noise, also capable to large current. c Appearance/ Dimensions 1.6±.15.8±.15 T c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1.4±.2 B Packing in Bulk 1 T BLM18EGpppTp1.5±.15 BLM18EGpppSp1.8±.15 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM18EG11T1p BLM18EG11TH1p 1 25% 14 (Typ.) 2mA.45 max BLM18EG121S1p BLM18EG121SH1p 12 25% 145 (Typ.) 2mA.4 max BLM18EG181SH1p 18 25% 26 (Typ.) 2mA.5 max BLM18EG221S1p 22 25% 26 (Typ.) 2mA.5 max BLM18EG221T1p BLM18EG221TH1p 22 25% 3 (Typ.) 1mA.15 max BLM18EG331T1p BLM18EG331TH1p 33 25% 45 (Typ.) 5mA.21 max BLM18EG391T1p BLM18EG391TH1p 39 25% 52 (Typ.) 5mA.3 max BLM18EG471S1p BLM18EG471SH1p 47 25% 55 (Typ.) 5mA.21 max BLM18EG61S1p BLM18EG61SH1p 6 25% 7 (Typ.) 5mA.35 max BLM18EG_T1 Series 1 BLM18EG_TH1 Series Lead Type BLM18EG391T1 6 BLM18EG331T1 BLM18EG221T1 4 BLM18EG11T BLM18EG391TH1 6 BLM18EG331TH1 BLM18EG221TH1 4 BLM18EG11TH Continued on the following page. 72

75 BLM18EG c Impedance-Frequency Characteristics (Main Items) BLM18EG_S1 Series 1 BLM18EG61S1 8 BLM18EG471S1 BLM18EG_SH1 Series 1 BLM18EG61SH1 8 BLM18EG471SH BLM18EG221S1 BLM18EG121S BLM18EG181SH1 BLM18EG121SH c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for BLM18EG series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature ( C) c Impedance-Frequency Characteristics BLM18EG11T1/BLM18EG11TH BLM18EG121S1/BLM18EG121SH BLM18EG181SH Continued on the following page. Lead Type 73

76 BLM18EG c Impedance-Frequency Characteristics BLM18EG221S1 BLM18EG221T1/BLM18EG221TH1 4 4 BLM18EG331T1/BLM18EG331TH BLM18EG391T1/BLM18EG391TH1 BLM18EG471S1/BLM18EG471SH1 BLM18EG61S1/BLM18EG61SH Lead Type

77 Signal Lines Type BLM18GGSeries 63/168 (inch/mm) Available up to high-ghz band noise. c Appearance/ Dimensions.35±.15.8±.1 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 1.6±.1.8±.1 : Electrode (in mm) c Equivalent Circuit (esistance element becomes dominant at high frequencies.) efer to pages from p.77 to p.8 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuits: 1 For Powertrain/Safety Impedance (at 1MHz/2 C) c Impedance-Frequency Characteristics (Main Items) Impedance (at 1GHz/2 C) ated Current DC esistance Operating Temperature ange BLM18GG471S1p 47 25% 18 3% 2mA BLM18GG471S c Impedance-Frequency Characteristics BLM18GG471S Lead Type 75

78 BLp!Caution/Notice Chip!Caution/Notice Ferrite Bead Chip Ferrite SMD Bead Type o ating 1. About the ated Current Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. 2. About the Excessive Surge Current Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.please contact us in advance in case of applying the surge current.!caution o Soldering and Mounting Please pay special attention when mounting chip ferrite beads BLM_A/P/K/S series bead inductor BLE series in close proximity to other products that radiate heat. The heat generated by other products may deteriorate the insulation resistance and cause excessive heat in this component. Notice Lead Type o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling equirements> 1. Storage Period BLM15E/15H/15G series should be used within 12 months, the other series should be used within 6 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. o Notice (Soldering and Mounting) 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. BLM18AG_WH is designed for conductive glue mounting method. Please refer to Mounting infomation. Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a o Handling 1. esin Coating Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. 2. Handling of a Substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 76

79 BL p Soldering and Mounting 1. Standard Land Pattern Dimensions BLE32 BLM3 BLM15 BLM18 BLM21 BLM31 BLM41 o Type BLM3 BLM15 Soldering BLM18 BLM21 a b c o pp Type ated Current (A) BLM3A BLM3Pp BLM3EB BLM15A BLM15PD BLM15PG BLM15P BLM18PG BLM18KG BLM18SG BLM21PG BLM31PG BLM41PG Soldering a b c BLE32PN Land Pad Thickness and Dimension d 18μm 35μm 7μm pp Chip Ferrite SMD Bead Type Soldering Chip and Ferrite Mounting Bead Lead Type 77

80 BLp Soldering and Mounting Soldering Chip and Ferrite Mounting Bead Chip Ferrite SMD Bead Type 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip ferrite beads and bead inductor the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns. When flow soldering the chip ferrite beads and bead inductor apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process. BLM BLE Series Solder Paste Printing Adhesive Application oensure that solder is applied smoothly to a minimum height of.2mm to.3mm at the end surface of the part. oguideline of solder paste thickness: 1-15μm: BLM3 1-2μm: BLM15/18/21/31/41/BLE32 BLM18/21/31/41 Series (Except for BLM18G Series) Coating amount is illustrated in the following diagram. Chip Solid Inductor a: 2 7μm b: 3 35μm c: 5 15μm (in mm) Lead Type 3. Standard Soldering Conditions (1) Soldering Methods Use flow and reflow soldering methods only. Use standard soldering conditions when soldering chip ferrite beads and bead inductor. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Solder: Use Sn-3.Ag-.5Cu solder. Use of Sn-n based solder will deteriorate performance of products. If using BLA series with Sn-n based solder, please contact Murata in advance..2.3mm min. PCB Bonding agent Land Flux: o Use osin-based flux. In case of using A type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. For additional mounting methods, please contact Murata. a b c 78

81 BLp Soldering and Mounting (2) Soldering Profile oflow Soldering Profile ( Sn-3.Ag-.5Cu Solder) Temperature ( C) T1 T3 T2 t2 Heating Limit Profile Standard Profile Chip Ferrite SMD Bead Type Soldering Chip and Ferrite Mounting Bead Series Temp. (T1) Pre-heating Pre-heating t1 Time. (t1) Temp. (T2) Time (s) Standard Profile Heating Time. (t2) Limit Profile Cycle Heating of Flow Temp. (T3) Time. (t2) Cycle of Flow BLM (Except for BLM3/15/18G/18AG_W) BLE 15 C 6s min. 25 C 4 to 6s 2 times max. 265±3 C 5s max. 2 times max. oeflow Soldering Profile (Sn-3.Ag-.5Cu Solder) Series BLM (Except for BLM18AG_W) BLE Temperature ( C) T2 T1 Pre-heating 9s±3s Standard Profile Limit Profile Heating Peak Cycle Heating Peak Temperature Temperature Temp. (T1) Time. (t1) (T2) of eflow Temp. (T3) Time. (t2) (T4) 22 C min. 3 to 6s 245±3 C t1 t2 T4 T3 Time (s) 2 times max. Limit Profile Standard Profile 23 C min. 6s max. 26 C/1s Cycle of eflow 2 times max. (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 15 C 6s min. Soldering iron power output / Tip diameter: 8W max. / ø3mm max. Temperature of soldering iron tip / Soldering time / Times: 35 C max. / 3-4s / 2 times Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. Lead Type 79

82 BLp Soldering and Mounting Soldering Chip and Ferrite Mounting Bead Chip Ferrite SMD Bead Type 4. Mounting on-board with Conductive Glue of BLM18AG_WH1 Please adhere rigidly to the condition below which shows the method of mounting with conductive glue. Please coat print pads with conductive glue using metal mask and metal squeegee, and then mount our products on the substrates with a mount machine or human hand. Please put the substrates into an oven (14 to 15 C) for 3 minutes in order to cure the adhesive. Please check whether the chips and the substrates are connected with the conductive glue or not and there is no electrical short of the conductive glue. Print Pads 1. Board 2. Thickness of Glue 3. ecommended Conductive Glue Board Conductive Glue Ceramic Board or Alumina Board 3 to 5μm PC3 (Manufactured by Heraeus) 5. Cleaning Following conditions should be observed when cleaning chip ferrite beads. (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol type cleaner) (2) Ultrasonic Output: 2W/liter max. Duration: 5 minutes max. Frequency: 28 to 4kHz (3) Cleaning Agent The following list of cleaning agents have been tested on the individual components. Evaluation of final assembly should be completed prior to production. Do not clean BLM18AGpppWH1 series. Before cleaning, please contact Murata engineering. (a) Alcohol cleaning agent Isopropyl alcohol (IPA) (b) Aqueous cleaning agent Pine Alpha ST-1S (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agent has been removed with deionized water. (5) BLM_G type is processed with resin. On rinsing the product, using water for ultrasonic cleaning may affect the resin quality used for the product by water element. In case of set cleaning conditions, please make sure the reliability according to the cleaning conditions. For additional cleaning methods, please contact Murata engineering. Lead Type 8

83 BL p Packaging Minimum Quantity and Dimensions of 8mm Width Paper / Embossed Tape 2.± ±.1 4.±.1 a +.1 ø ±.1 3.5±.5 8.±.3 <Embossed> c d <Paper> BLM3 Chip Ferrite SMD Bead Type Chip Ferrite Packaging Bead Direction of Feed b There are holes in the cavities of the BLM21BD222Sp1/BD272Sp1 and BLM31 only. ø BLE32 only. ø BLM3/15: 2.±.5 BLM18S/18T/BLA2A: 2.±.1 c: Depth of Cavity (Embossed Tape) Dimension of the cavity of embossed tape is measured at the bottom side. c c c: Total Thickness of Tape (Paper Tape) BLM3 BLM15 BLM18A/B/P/H/G BLM18EG/KG_Tp BLM18EG/KG_Sp BLM18S BLM21 BLM31 BLM21BD222Sp1/272Sp1 BLE32 a b Dimensions Dimension of the cavity is measured at the bottom side. c.55 max..8 max. 1.1 max..85 max. 1.1 max..9 max. 1.1 max d Minimum Qty. (pcs.) ø18mm eel ø33mm eel Paper Tape Embossed Tape Paper Tape Embossed Tape Bulk Minimum Quantity and Dimensions of 12mm Width Embossed Tape ø ±.5 4.±.1 4.±.1 a b +.1 ø ±.1.3±.1 5.5±.5 12.±.3 Direction of Feed c c: Depth of Cavity BLM "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity." a Dimensions b c Minimum Qty. (pcs.) ø18mm eel ø33mm eel Bulk 1 (in mm) (in mm) Lead Type 81

84 NFp ing Capacitor () NF q M w 21 e HC r 12 t y 1H u 3 i L o qproduct ID Product ID NF wstructure M edimensions (LgW) rfeatures HC HK Dimensions (LgW) 2.g1.25mm 3.2g1.6mm For Automotive Structure Capacitor Type Features EIA Powertrain, Safety tcapacitance Expressed by three figures. The unit is in pico-farad (pf). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. ycharacteristics U uated Voltage 1A 1C 1H 2A ielectrode/others Electrode 3 Sn Plating opackaging Packaging Series L B D Embossed Taping (ø18mm eel) Bulk Paper Taping (ø18mm eel) NFM31 All series NFM21 Capacitance Temperature Characteristics ±15%, +15/-18% -75 ±12ppm/ C ated Voltage 1V 16V 5V 1V Series NFM Lead Type 82

85 NFp ing LC Combined () NF q L w 18 T 17 H 1A 3 L e r t y u i o qproduct ID Product ID NF ycharacteristics (NFL Series) H Characteristics Cut-off Frequency wstructure L E edimensions (LgW) rfeatures HT T Structure Multilayer, LC Combined Type Block, LC Combined Type Dimensions (LgW) 1.6g.8mm 3.2g1.6mm 6.8g1.6mm For Automotive EIA Features Powertrain, Safety, T Circuit Infotainment, T Circuit tcut-off Frequency (NFL Series) Expressed by three figures. The unit is in hertz (Hz). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. tcapacitance (NFE Series) Expressed by three figures. The unit is in pico-farad (pf). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. ycharacteristics (NFE Series) Capacitance Temperature Characteristics C ±2%, ±22% D +2/-3%, +22/-33% F +3/-8%, +22/-82% ±15% U -75 ±12ppm/ C Other uated Voltage ated Voltage 1A 1E 2A 1V 25V 1V ielectrode Electrode Series 3 9 Sn Plating Others NFL NFE opackaging Packaging Series K L B D Embossed Taping (ø33mm eel) Embossed Taping (ø18mm eel) Bulk Paper Taping (ø18mm eel) NFE NFE NFL18/NFE NFL18 Lead Type 83

86 NFp ing Inductor Type () NF q w 32 e BW r 36 t H y u 1 i o L! qproduct ID ucategory Product ID Category NF For Automotive Infotainment wstructure Structure Inductor Type inumber of Circuits Number of Circuits 1 1 Circuit edimensions (LgW) ospecification 32 Dimensions (LgW) 3.2g2.5mm EIA Specification Standard Type Low dc Type rfeatures BW Features Special Feature Classification timpedance Expressed by three figures. The unit is in ohm (Ω). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. yinductance Tolerance!Packaging K L B Packaging Embossed Taping (ø33mm eel) Embossed Taping (ø18mm eel) Bulk H Features For General Use (LF Solder) Lead Type 84

87 Power lines Signal lines Universal Type NFE31TSeries 126/3216 (inch/mm) Meets 6A, T-type filter with built-in ferrite bead. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment c Insertion Loss Characteristics (Main Items) Insertion Loss (db) NFE31T11C1E9 NFE31T221D1E9 NFE31T471F1E9 NFE31T2221E9.7±.2 1.±.2.7±.2 (1) (2) (3) For Powertrain/Safety 1.6± ± ±.15 (5Ω - 5Ω) : Electrode (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 8 B Packing in Bulk 5 c Equivalent Circuit Capacitance ated Current ated Voltage NFE31T221E9 NFE31T47C1E9 Input (Output) Output (Input) (1) (3) GND (2) No polarity. efer to pages from p.96 to p.1 for mounting information. Insulation esistance (min.) Operating Temperature ange NFE31T221E9p 22pF 3% 6A 25Vdc 1M NFE31T47C1E9p 47pF 5/-2% 6A 25Vdc 1M NFE31T11C1E9p 1pF 8/-2% 6A 25Vdc 1M NFE31T221D1E9p 22pF 5/-2% 6A 25Vdc 1M NFE31T471F1E9p 47pF 5/-2% 6A 25Vdc 1M NFE31T2221E9p 22pF 5% 6A 25Vdc 1M Number of Circuit: Lead Type 85

88 Power lines Signal lines Universal Type NFE61HTSeries 276/6816 (inch/mm) T-type filter with built-in ferrite bead. c Appearance/ Dimensions.7±.2 2.6±.3.7±.2 (1) (2) (3) 1.6±.3 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 25 K ø33mm Embossed Taping 8 B Packing in Bulk ±.3 (in mm) c Equivalent Circuit Input (Output) Output (Input) (1) (3) GND (2) No polarity. Lead Type c ated Value (p: packaging code) For Infotainment Number of Circuit: 1 c Insertion Loss Characteristics (Main Items) Insertion Loss (db) NFE61HT181C2A9 NFE61HT361C2A9 NFE61HT681D2A9 NFE61HT12F2A9 NFE61HT3322A9 For Powertrain/Safety (5Ω - 5Ω) Capacitance ated Current ated Voltage NFE61HT33U2A9 NFE61HT682A9 NFE61HT112A9 efer to pages from p.96 to p.1 for mounting information. Insulation esistance (min.) Operating Temperature ange NFE61HT33U2A9p 33pF 3% 2A 1Vdc 1M NFE61HT682A9p 68pF 3% 2A 1Vdc 1M NFE61HT112A9p 1pF 3% 2A 1Vdc 1M NFE61HT181C2A9p 18pF 3% 2A 1Vdc 1M NFE61HT361C2A9p 36pF 2% 2A 1Vdc 1M NFE61HT681D2A9p 68pF 3% 2A 1Vdc 1M NFE61HT12F2A9p 1pF 8/-2% 2A 1Vdc 1M NFE61HT3322A9p 33pF 8/-2% 2A 1Vdc 1M

89 Power lines Signal lines Universal Type NFM21HCSeries 85/212 (inch/mm) The 3-terminal capacitor has a good noise suppression effect at a high frequency range. c Appearance/ Dimensions.3±.2.6±.2.85±.1 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 B Packing in Bulk 5 2.± ±.1 c Equivalent Circuit (1) (3) (2) (2) : Electrode (in mm) Input (Output) (1) GND (2) Output (Input) (3) No polarity. efer to pages from p.96 to p.1 for mounting information. c ated Value (p: packaging code) For Infotainment Number of Circuit: 1 c Insertion Loss Characteristics (Main Items) For Powertrain/Safety Capacitance ated Current ated Voltage (5Ω - 5Ω) Insulation esistance (min.) Operating Temperature ange NFM21HC22U1H3p 22pF 2% 7mA 5Vdc 1M NFM21HC47U1H3p 47pF 2% 7mA 5Vdc 1M NFM21HC11U1H3p 1pF 2% 7mA 5Vdc 1M NFM21HC2211H3p 22pF 2% 7mA 5Vdc 1M NFM21HC4711H3p 47pF 2% 1mA 5Vdc 1M NFM21HC121H3p 1pF 2% 1mA 5Vdc 1M NFM21HC2221H3p 22pF 2% 1mA 5Vdc 1M NFM21HC2231H3p 22pF 2% 2mA 5Vdc 1M NFM21HC141A3p 1pF 2% 2mA 1Vdc 1M NFM21HC2241A3p 22pF 2% 2mA 1Vdc 1M NFM21HC151C3p 1pF 2% 4mA 16Vdc 5M NFM21HC_1H3 Series NFM21HC_1A3/1C3 Series (5Ω - 5Ω) Insertion Loss (db) NFM21HC2231H3 NFM21HC2221H3 NFM21HC121H3 NFM21HC4711H3 NFM21HC2211H3 NFM21HC11U1H3 NFM21HC47U1H3 NFM21HC22U1H Insertion Loss (db) NFM21HC151C3 NFM21HC141A3 NFM21HC2241A Lead Type 87

90 Power lines Signal lines Universal Type NFM31HKSeries 126/3216 (inch/mm) The 3-terminal capacitor has a good noise suppression effect at a high frequency range, meets 1A. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment Number of Circuit: 1 c Insertion Loss Characteristics (Main Items) Insertion Loss (db) NFM31HK141H3 NFM31HK2231H3 NFM31HK1531H3.4±.3 1.2±.3.4±.3 1.6±.2 3.2±.2 (2) (1) (3) (2) For Powertrain/Safety NFM31HK131H3 NFM31HK132A3.3±.2 1.6±.2 1.3±.2 (5Ω - 5Ω) : Electrode (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 5 c Equivalent Circuit Input (Output) (1) GND Capacitance ated Current ated Voltage Output (Input) (3) c Derating of ated Current When NFM31HK series is used in operating temperatures exceeding +15 C, derating of current is necessary. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current 1 (2) No polarity. efer to pages from p.96 to p.1 for mounting information. Insulation esistance (min.) Operating Temperature ange NFM31HK131H3p 1pF 2% 1A 5Vdc 1M NFM31HK132A3p 1pF 2% 1A 1Vdc 1M NFM31HK1531H3p 15pF 2% 1A 5Vdc 1M NFM31HK2231H3p 22pF 2% 1A 5Vdc 1M NFM31HK141H3p 1pF 2% 6A 5Vdc 1M Lead Type ated Current (A) Operating Temperature ( C) 88

91 Signal Lines Type NFL18TSeries 63/168 (inch/mm) T-type LC filter. educes waveform distortion of high speed signal. c Appearance/ Dimensions (Top View) (Side View) 1.6±.1 (2) (1) (3) (2).2±.1.3±.1.2±.1.8±.1 *1 Directional Marking c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 B Packing in Bulk 1 (Bottom View).2 min..6±.1 : Electrode.15±.1 (in mm) *1 There are no electrical polarity. But there is a directional marking on the top of product to identify inner physical direction. c Equivalent Circuit Input (Output) (1) GND (2) No Polarity. Output (Input) (3) efer to pages from p.96 to p.1 for mounting information. c ated Value (p: packaging code) For Infotainment c Insertion Loss Characteristics (Main Items) Insertion Loss (db) For Powertrain/Safety NFL18T56H1A3 NFL18T76H1A3 NFL18T17H1A3 NFL18T27H1A3 NFL18T37H1A3 NFL18T57H1A3 Nominal Cut-off Frequency Capacitance Inductance ated Current ated Voltage Insulation esistance (min.) Withstand Voltage NFL18T56H1A3p 5MHz 11pF (Typ.) 35nH (Typ.) 75mA 1Vdc 1M 3Vdc NFL18T76H1A3p 7MHz 7pF (Typ.) 23nH (Typ.) 75mA 1Vdc 1M 3Vdc NFL18T17H1A3p 1MHz 5pF (Typ.) 15nH (Typ.) 75mA 1Vdc 1M 3Vdc NFL18T27H1A3p 2MHz 22pF (Typ.) 11nH (Typ.) 1mA 1Vdc 1M 3Vdc NFL18T37H1A3p 3MHz 16pF (Typ.) 74nH (Typ.) 1mA 1Vdc 1M 3Vdc NFL18T57H1A3p 5MHz 1pF (Typ.) 42nH (Typ.) 1mA 1Vdc 1M 3Vdc Operating Temperature ange: Number of Circuits: Lead Type 89

92 Power lines Signal lines Universal Type NF32BW_1Series 121/3225 (inch/mm) For power lines signal lines universal type, 121 size, noise suppression filters. c Appearance/ Dimensions A 2.7± ±.15 A 2.5±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping ±.3 A: 2.8 max. 2.5±.2 c Equivalent Circuit.9±.3 1.3±.2.9±.3 (in mm) (esistance element becomes dominant at high frequencies.) efer to pages from p.96 to p.1 for mounting information. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Impedance (at 1MHz/2 C) Impedance (at 1MHz/2 C) ated * Current DC esistance Operating Temperature ange (Self-temperature rise is included) Operating Temperature ange NF32BW36H1p % 255mA.3 2% NF32BW74H1p % 25mA.45 2% NF32BW9H1p % 175mA.57 2% NF32BW15H1p % 16mA.76 2% NF32BW21H1p % 12mA.12 2% NF32BW32H1p % 1mA.18 2% NF32BW42H1p % 85mA.24 2% NF32BW7H1p - 7 3% 7mA.38 2% NF32BW111H1p % 52mA.57 2% NF32BW151H1p % 45mA.81 2% NF32BW221H1p % 39mA % NF32BW291H1p % 31mA % NF32BW451H1p % 275mA % NF32BW621H1p % 25mA 2.7 2% NF32BW881H1p % 2mA % Number of Circuits: 1 * When ated Current is applied to the Products, self-generation of heat will rise to 4 or less. Lead Type c Impedance-Frequency Characteristics (Main Items) NF32BW451H1 NF32BW151H1 NF32BW42H1 NF32BW15H1 NF32BW36H c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for NF32BW_Hp1 series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) Operating Temperature (Ambient temperature) ( C) Continued on the following page. 9

93 NF32BW_1 c Impedance-Frequency Characteristics NF32BW36H1 NF32BW74H NF32BW9H NF32BW15H1 NF32BW21H1 NF32BW32H NF32BW42H NF32BW7H NF32BW111H NF32BW151H1 NF32BW221H1 NF32BW291H NF32BW451H NF32BW621H NF32BW881H Lead Type 91

94 Power lines Signal lines Universal Type NF32BW_11Series 121/3225 (inch/mm) For power lines signal lines universal type, 121 size, noise suppression filters. c Appearance/ Dimensions 2.7± ± ±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping ±.3 2.5±.2 c Equivalent Circuit.9±.3 1.3±.2.9±.3 (in mm) (esistance element becomes dominant at high frequencies.) efer to pages from p.96 to p.1 for mounting information. Lead Type c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) For Powertrain/Safety Impedance (at 1MHz/2 C) NF32BW151H11 NF32BW65H11 NF32BW21H11 NF32BW98H11 NF32BW33H Impedance (at 1MHz/2 C) ated * Current c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for NF32BW_Hp11 series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (ma) DC esistance Operating Temperature ange (Self-temperature rise is included) Operating Temperature (Ambient temperature) ( C) Operating Temperature ange NF32BW33H11p % 29mA.24 2% NF32BW68H11p % 25mA.36 2% NF32BW84H11p % 24mA.48 2% NF32BW98H11p % 21mA.53 2% NF32BW12H11p % 185mA.64 2% NF32BW19H11p % 18mA.89 2% NF32BW21H11p % 155mA.1 2% NF32BW31H11p % 12mA.155 2% NF32BW52H11p % 11mA.22 2% NF32BW65H11p % 9mA.295 2% NF32BW11H11p - 1 3% 9mA.475 2% NF32BW151H11p % 7mA.685 2% Number of Circuits: 1 * When ated Current is applied to the Products, self-generation of heat will rise to 4 or less. Continued on the following page. 92

95 NF32BW_11 c Impedance-Frequency Characteristics NF32BW33H11 NF32BW68H NF32BW84H NF32BW98H11 NF32BW12H11 NF32BW19H NF32BW21H NF32BW31H NF32BW52H NF32BW65H11 NF32BW11H11 NF32BW151H Lead Type 93

96 NFp!Caution/Notice!Caution/Notice Chip SMD EMIFILr Type o ating 1. About the ated Current Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. 2. About the Excessive Surge Current (NF Series) Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current.!caution o Soldering and Mounting 1. Self-heating Please provide special attention when mounting chip EMIFILr NFMppH series in close proximity to other products that radiate heat. The heat generated by other products may deteriorate the insulation resistance and cause excessive heat in this component. Worst case, results to a short circuit which causes fuming or partial dispersion when the product is used. 2. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure our product. Notice Lead Type o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling equirements> 1. Storage Period The NF series should be used within 12 months. Products to be used after this period should be checked for solderability or bondability with glue. 2. Storage Conditions (1) Storage temperature: -1 to +4 C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. o Notice (Soldering and Mounting) 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Points of Attention about NFM Pattern Forms The loaded stresses are different to a chip depend on PCB materials and structures. When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB and the chip itself. 4. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. Continued on the following page. 94

97 NFp!Caution/Notice o Handling 1. esin Coating (Except for NF Series) Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. esin Coating (NF_W Series) To prevent breaking the wire, avoid touching with sharp material, such as tweezers or other material such as bristles of cleaning brush, to the wire wound portion of this product. To prevent breaking the core, avoid applying excessive mechanical shock to products mounted on the board. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins containing impurities or chloride may possibly. 2. Handling of a Substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting Chip SMD EMIFILr Type!Caution/Notice Lead Type 95

98 NFp Soldering and Mounting Soldering Chip and Mounting EMIFILr Chip SMD EMIFILr Type 1. Standard Land Pattern Dimensions NFp series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum performance from these filters, the ground pattern should be made as large as possible during the PCB design stage. As shown below, one side of the PCB is used for chip mounting, and the other is used for grounding. Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-frequency impedance of the grounding and maximizes the filter's performance. NFM21HC NFM31HK NFL18T o eflow Soldering o eflow Soldering NFM31HK* 1 1mm or more (in case of 1A) NFM21HC Small diameter thru hole ø Small diameter thru hole ø o eflow Soldering NFL18T Small diameter thru hole ø.2-ø.3 Chip mounting side * 1 For large current design, width of signal land pattern should be wider not less than 1mm per 1A (1mm/A). For example, in case of 1A, signal land pattern width should be 1mm or more. (1mm/A*1A=1mm) o Flow Soldering NFM31HK* 1 1mm or more (in case of 1A) Land Pattern + Solder esist Land Pattern Solder esist The chip EMI filter suppresses noise by conducting the high-frequency noise to ground. Therefore, to get enough noise reduction, feed through holes which are connected to ground-plane should be arranged according to the figure to reinforce the ground pattern. NFM21HC is specially adapted for reflow soldering. Chip mounting side Small diameter thru hole ø (in mm) Please contact us if using thinner land pad than 18μm. * 1 For large current design, width of signal land pattern should be wider not less than 1mm per 1A (1mm/A). For example, in case of 1A, signal land pattern width should be 1mm or more. (1mm/A*1A=1mm) Lead Type NFE31T o eflow Soldering NFE31T Small diameter thru hole ø Please contact us if using thinner land pad than 18μm. Continued on the following page. 96

99 NFp Soldering and Mounting NFE61HT o eflow Soldering Small diameter thru hole ø.4 Land Pattern + Solder esist Land Pattern Solder esist o Flow Soldering (Except for NFE61HT332) Small diameter thru hole ø.4 (in mm) NF32BW oflow Soldering oeflow Soldering Chip SMD EMIFILr Type Soldering Chip and Mounting EMIFILr (1) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. (2) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. " Guideline of solder paste thickness NF32BW: 1 to 15μm Products should be located in the sideways direction (Length: a<b) to the mechanical stress. Poor example NF32BW b a Good example Lead Type 97

100 NFp Soldering and Mounting Soldering Chip and Mounting EMIFILr Chip SMD EMIFILr Type 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns. When flow soldering the EMI suppression filter, apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process. Series Solder Paste Printing Adhesive Application NFM21HC NFM31HK oguideline of solder paste thickness: 1-15μm: NFM21HC/31HK NFM21HC NFM31HK NFM31HK Series Apply.6mg of bonding agent at each chip. Do not cover electrodes. (in mm) NFL18T oguideline of solder paste thickness: 1-15μm Bonding agent Coating position of bonding agent NFE31T oguideline of solder paste thickness: 15-2μm Lead Type NFE61HT oguideline of solder paste thickness: 15-2μm Apply 1.mg of bonding agent at each chip Bonding agent 9. Bonding agent * Except for NFE61HT

101 NFp Soldering and Mounting 3. Standard Soldering Conditions (1) Soldering Methods Use flow and reflow soldering methods only. Use standard soldering conditions when soldering chip EMI suppression filters. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Flux: o Use osin-based flux. In case of using A type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. Solder: Use Sn-3.Ag-.5Cu solder. Use of Sn-n based solder will deteriorate performance of products. If using NFM series with Sn-n based solder, please contact Murata in advance. (2) Soldering Profile oflow Soldering Profile (Sn-3.Ag-.5Cu Solder) NFM31HK Series NFE61HT (Except for NFE61HT332) NF32BW oeflow Soldering Profile (Sn-3.Ag-.5Cu Solder) NFM21HC NFM31HK NFE31T NFE61HT NFL18T NF32BW Series Temperature ( C) Temperature ( C) T1 Temp. (T1) Pre-heating T3 T2 Pre-heating t1 Time. (t1) T2 T1 Pre-heating 9s±3s t2 Heating Temp. (T2) t1 t2 For additional mounting methods, please contact Murata. Time (s) T4 T3 Time (s) Limit Profile Standard Profile Standard Profile Heating Time. (t2) 15 C 6s min. 25 C 4 to 6s 15 C 6s min. 25 C 4 to 6s 15 C 6s min. 25 C 4 to 6s Standard Profile Heating Peak Temperature Temp. (T1) Time. (t1) (T2) 22 C min. 3 to 6s 245±3 C 22 C min. 3 to 6s 245±3 C 22 C 3 to 6s 245±3 C Cycle of eflow 2 times max. 2 times max. 2 times max. Limit Profile Standard Profile Cycle of Flow 2 times max. 2 times max. 2 times max. Temp. (T3) 265±3 C 265±3 C 265±3 C Limit Profile Heating Time. (t2) 5s max. 5s max. 5s max. Limit Profile Heating Peak Temperature Temp. (T3) Time. (t2) (T4) 23 C min. 6s max. 26 C/1s 23 C min. 6s max. 26 C/1s 23 C 6s max. 26 C/1s Cycle of Flow 2 times max. 2 times max. 1 time Cycle of eflow 2 times max. 2 times max. 2 times max. Continued on the following page. Chip SMD EMIFILr Type Soldering Chip and Mounting EMIFILr Lead Type 99

102 NFp Soldering and Mounting (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 15 C 6s min. Soldering iron power output / Tip diameter: 3W max. / ø3mm max.* 1 * 1 NF32: 8W max. / ø3mm max. Temperature of soldering iron tip / Soldering time / Times: 35 C max. / 3-4s / 2 times Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. Soldering Chip and Mounting EMIFILr Chip SMD EMIFILr Type 4. Cleaning Following conditions should be observed when cleaning chip EMI filter. (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol type cleaner) (2) Ultrasonic Output: 2W/liter max. Duration: 5 minutes max. Frequency: 28 to 4kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning Agent The following list of cleaning agents have been tested on the individual components. Evaluation of final assembly should be completed prior to production. (a) Alcohol cleaning agent Isopropyl alcohol (IPA) (b) Aqueous cleaning agent Pine Alpha ST-1S (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agent has been removed with deionized water. Lead Type 1

103 NFp Packaging Minimum Quantity and Dimensions of 8mm Width Paper / Embossed Tape (Common to Paper Tape / Embossed Tape) 2.±.5 4.±.1 4.±.1 a +.1 ø ±.1 3.5±.5 8. <Embossed> c d <Paper> 1 NFL18T NFM21HC NFM31HK NFE31T NF32BW Direction of Feed b There are holes in the cavities of the NFM31HK +.2 NFM31HK: ø NFM31HK: 3.5±.1 a Dimensions c: Depth of Cavity (Embossed Tape) Dimension of the cavity of embossed tape is measured at the bottom side. b c.9 max. 1.1 max d Minimum Quantity and Dimensions of 12mm Width Embossed Tape c c: Total Thickness of Tape (Paper Tape) Minimum Qty. (pcs.) ø18mm eel ø33mm eel Paper Tape Embossed Tape Paper Tape Embossed Tape Bulk (in mm) Chip SMD EMIFILr Type Chip Packaging EMIFILr 2.±.5 4.±.1 4.±.1 a b +.1 ø ±.1 5.5± Direction of Feed c NFE61HT Dimensions Minimum Qty. (pcs.) a b c ø18mm eel ø33mm eel Bulk 5 c: Depth of Cavity Dimension of the cavity is measured at the bottom side. (in mm) "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity." Lead Type 11

104 DL p ing () DL q W w 21 S 67 H Q 2 L e r t y u i o! Lead Type qproduct ID Product ID DL wstructure W M edimensions (LgW) A 5B rfeatures (1) S T s Structure Wire Wound Type Multilayer Type Dimensions (LgW) 1.25g1.mm 2.g1.2mm 3.2g1.6mm 4.5g3.2mm 5.g3.6mm 5.g5.mm tcategory (DLW Series) For Automotive H tcategory (DLM Series) N EIA Type Magnetically Shielded One Circuit Type One Circuit Low Profile Type Category Infotainment Powertrain, Safety Category For General yimpedance Typical impedance at 1MHz is expressed by three figures. The unit is in ohm (Ω). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. yinductance (DLW43SH) Expressed by three figures. The unit is micro-henry (μh). The first and second figures are significant digits, and the third figure expresses the number of zeros which follow the two figures. ucircuit S M H T ifeatures (2) (DLW Series) K P Q ifeatures (2) (DLM Series) For Automotive!Packaging Packaging Series K L B Embossed Taping (ø33mm eel) Embossed Taping (ø18mm eel) Bulk DLW43S/DLW5AT/DLW5BS/DLW5BT All Series All Series Circuit Expressed by a letter. Features Expressed by a letter. Features Infotainment onumber of Signal Lines Number of Signal Lines 2 Two Lines 12

105 PL p Common Mode Choke Coil ing () PL q T w 1H e H r 12 t 6 y P u N i B o qproduct ID Product ID wtype PL T eapplications 1H 5BP Common Mode Choke Coils Type DC Type Applications For DC Line High-frequency Type 5.g5.mm Size, for DC Lines rfeatures (1) Features H For Automotive Powertrain, Safety timpedance Expressed by three figures. The unit is ohm (Ω). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. yated Current Expressed by three figures. The unit is ampere (A). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. A decimal point is expressed by the capital letter "." In this case, all figures are significant digits. ufeatures (2) P S ilead Dimensions N opackaging Packaging Series B L K Bulk Embossed Taping (ø178mm/ø18mm eel) Embossed Taping (ø33mm eel) PLT1H, PLT5BP PLT1H, PLT5BP PLT1H Features Expressed by a letter. Lead Dimensions No Lead Terminal (SMD) Lead Type 13

106 .5±.3 Power lines Signal lines Universal Type DLW5BS_TQSeries 22/55 (inch/mm) 22 size, wire-wound common mode choke coil for power lines. c Appearance/ Dimensions 3.±.5 (Top) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 4 K ø33mm Embossed Taping 15 B Packing in Bulk 1 1.7±.3 1.7±.3 3.6±.3 (W) 5.±.3 (1) (2) 1.3±.3 1.3±.3 (4) (3) 1.3±.3.9±.3 (Bottom).5 min. (L) 5.±.3 : Marking : Electrode.45 min. (T) 4.5 max. (in mm) c Equivalent Circuit (1) (4) No polarity. (2) (3) c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) Common mode DLW5BS51TQ2 DLW5BS61TQ2 DLW5BS81TQ2 For Powertrain/Safety DLW5BS51TQ2 DLW5BS61TQ2 DLW5BS81TQ2 Common Mode Impedance (at 1MHz/2 C) Differential mode Common Mode Impedance (at 1MHz/2 C) Lead Type ated Current ated Voltage efer to pages from p.117 to p.12 for mounting information. Insulation esistance (min.) Withstand Voltage DC esistance DLW5BS51TQ2p 28 4% 5 (Typ.).7A 5Vdc 1M 125Vdc.23 max. DLW5BS61TQ2p 12 4% 6 (Typ.) 1.A 5Vdc 1M 125Vdc.12 max. DLW5BS81TQ2p 55 4% 8 (Typ.) 1.5A 5Vdc 1M 125Vdc.56 max. Operating Temperature ange: Number of Circuit: 1 14

107 .5±.3 Power lines Signal lines Universal Type DLW5AT/DLW5BTSeries (15 C available type) Low profile wire-wound common mode choke coil for power lines. c Appearance/ Dimensions DLW5AT_MQ2 1.3±.3 1.7±.3 1.7±.3 1.3±.3 (W) 3.6±.3 (1) (2) (4) (3).9±.3 1.3±.3.5 min. (L) 5.±.3.45 min. (T) 2.2±.15 : Electrode (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 7 K ø33mm Embossed Taping 25 B Packing in Bulk 1 c Equivalent Circuit (1) (4) No polarity. (2) (3) c Appearance/ Dimensions DLW5AT_TQ2 c Appearance/ Dimensions 1.3±.3 1.7±.3 1.7±.3 1.3±.3 (W) 3.6±.3 (1) (2) (4) (3) 1.3±.3.9±.3 3.±.5 (Top).5 min. (L) 5.±.3.45 min. (T) 2.2±.15 : Electrode (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 7 K ø33mm Embossed Taping 25 B Packing in Bulk 1 c Equivalent Circuit (1) (4) c Packaging No polarity. Packaging (2) (3) Minimum Quantity L ø18mm Embossed Taping 7 K ø33mm Embossed Taping 25 DLW5BT_TQ2 1.7±.3 1.7±.3 3.6±.3.5 min. (W) 5.±.3 (L) 5.±.3 (1) (2) 1.3±.3 (Bottom) : Marking 1.3±.3 (4) (3) 1.3±.3 : Electrode.45 min. (T) 2.35±.15.9±.3 (in mm) B Packing in Bulk 1 c Equivalent Circuit (1) (4) No polarity. (2) (3) efer to pages from p.117 to p.12 for mounting information. Continued on the following page. Lead Type 15

108 DLW5AT/DLW5BT c ated Value (p: packaging code) Common Mode ated ated Insulation Withstand DC Impedance esistance For Infotainment For Powertrain/Safety (at 1MHz/2 C) Current Voltage (min.) Voltage esistance DLW5AT5MQ2p 5 (Typ.) 4A 5Vdc 1M 125Vdc.13 max. DLW5AT151MQ2p 15 (Typ.) 3A 5Vdc 1M 125Vdc.2 max. DLW5AT331MQ2p 33 (Typ.) 2.5A 5Vdc 1M 125Vdc.27 max. DLW5AT51MQ2p 5 (Typ.) 2A 5Vdc 1M 125Vdc.34 max. DLW5AT112MQ2p 11 (Typ.) 1.5A 5Vdc 1M 125Vdc.56 max. DLW5AT45TQ2p 45 (Typ.) 4A 5Vdc 1M 125Vdc.13 max. DLW5AT111TQ2p 11 (Typ.) 3A 5Vdc 1M 125Vdc.2 max. DLW5AT231TQ2p 23 (Typ.) 2.5A 5Vdc 1M 125Vdc.27 max. DLW5AT41TQ2p 4 (Typ.) 2A 5Vdc 1M 125Vdc.34 max. DLW5AT51TQ2p 5 (Typ.) 1.5A 5Vdc 1M 125Vdc.56 max. DLW5BT11TQ2p 1 (Typ.) 4A 5Vdc 1M 125Vdc.13 max. DLW5BT251TQ2p 25 (Typ.) 3A 5Vdc 1M 125Vdc.2 max. DLW5BT51TQ2p 5 (Typ.) 2.5A 5Vdc 1M 125Vdc.27 max. DLW5BT12TQ2p 1 (Typ.) 2A 5Vdc 1M 125Vdc.34 max. DLW5BT142TQ2p 14 (Typ.) 1.5A 5Vdc 1M 125Vdc.56 max. Operating Temperature ange: Number of Circuit: 1 c Impedance-Frequency Characteristics (Main Items) DLW5AT_MQ2 Series 1 Common mode DLW5AT_TQ2 Series 1 Common mode 1 1 DLW5AT112MQ2 DLW5AT51MQ2 DLW5AT331MQ2 DLW5AT151MQ2 DLW5AT5MQ2 1 DLW5AT331MQ2 DLW5AT151MQ2 DLW5AT5MQ2 DLW5AT51MQ2 DLW5AT112MQ2 Differential mode DLW5AT51TQ2 DLW5AT41TQ2 DLW5AT231TQ2 DLW5AT111TQ2 DLW5AT45TQ2 DLW5AT51TQ2 1 DLW5AT41TQ2 DLW5AT231TQ2 DLW5AT111TQ2 DLW5AT45TQ2 Differential mode Lead Type DLW5BT_TQ2 Series Common mode DLW5BT142TQ2 DLW5BT12TQ2 DLW5BT51TQ2 DLW5BT251TQ2 DLW5BT11TQ2 1 DLW5BT142TQ2 DLW5BT12TQ2 DLW5BT51TQ2 DLW5BT251TQ2 DLW5BT11TQ2 Differential mode

109 Signal Lines Type DLM11SSeries 54/121 (inch/mm) 54 size multilayer type chip common mode choke coil. c Appearance/ Dimensions.5±.1.3±.1 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 4 B Packing in Bulk 5.55±.1 (1) (4).2± ±.1 (2) (3) 1.±.1 : Electrode c Equivalent Circuit (1) (4) No polarity. (2) (3) (in mm) efer to pages from p.117 to p.12 for mounting information. c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) Common mode For Powertrain/Safety DLM11SN9H2 DLM11SN45H2 Common Mode Impedance (at 1MHz/2 C) DLM11SN9H2 DLM11SN45H2 Differential mode ated Current c Differential Mode Transmission Characteristics (Typ.) Insertion Loss (db) ated Voltage Insulation esistance (min.) Withstand Voltage Lead Type DLM11SN45H2 DLM11SN9H DC esistance DLM11SN45H2p 45 25% 1mA 5Vdc 1M 12.5Vdc.7 25% DLM11SN9H2p 9 25% 1mA 5Vdc 1M 12.5Vdc % Operating Temperature ange: Number of Circuit: 1 17

110 Signal Lines Type Lead Type DLW21SSeries 85/212 (inch/mm) 85 size, wire-wound common mode choke coil for high speed signal line. c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) DLW21S_HQ2 Series Common mode 2.±.2 (1) (2) c ated Value (p: packaging code) (4) (.45) (.45) Differential mode For Infotainment DLW21S121HQ2 DLW21S9HQ2 DLW21S67HQ2 DLW21S9HQ2 DLW21S67HQ2 For Powertrain/Safety DLW21S121HQ2 For Powertrain/Safety (3) (.4) (.4) 1.2±.2 1.2±.2 Common Mode Impedance (at 1MHz/2 C) Common Mode Impedance (at 1MHz/2 C) (.17) : Electrode (in mm) ated Current c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 B Packing in Bulk 5 c Equivalent Circuit (1) (4) No polarity. c Differential Mode Transmission Characteristics (Typ.) DLW21S_HQ2 Series Insertion Loss (db) ated Current ated Voltage (2) (3) efer to pages from p.117 to p.12 for mounting information. DLW21S9HQ ated Voltage Insulation esistance (min.) Insulation esistance (min.) Withstand Voltage Withstand Voltage DC esistance DLW21S67HQ2p 67 25% 32mA 2Vdc 1M 5Vdc.31 max. DLW21S9HQ2p 9 25% 28mA 2Vdc 1M 5Vdc.41 max. DLW21S121HQ2p 12 25% 28mA 2Vdc 1M 5Vdc.41 max. Operating Temperature ange: Number of Circuit: 1 DC esistance DLW21S181Q2p 18 25% 24mA 2Vdc 1M 5Vdc.39 max. DLW21S261Q2p 26 25% 22mA 2Vdc 1M 5Vdc.59 max. DLW21S491Q2p 49 25% 19mA 2Vdc 1M 5Vdc.77 max. Operating Temperature ange: Number of Circuit: 1 Continued on the following page. 18

111 DLW21S c Impedance-Frequency Characteristics (Main Items) DLW21S_Q2 Series 1 Common mode DLW21S491Q2 1 c Differential Mode Transmission Characteristics (Typ.) DLW21S_Q2 Series DLW21S181Q DLW21S261Q2 DLW21S491Q2 DLW21S261Q2 Differential mode Insertion Loss (db) 4 Lead Type

112 Signal Lines Type DLW31SSeries 126/3216 (inch/mm) 126 size wire-wound common mode choke coil. c Appearance/ Dimensions (.25) 1.9±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 3.2±.2 1.6±.2 B Packing in Bulk 5 (1) (2) c Equivalent Circuit (1) (2) (4) (3) (.6) (.6) (.6) (.6) : Electrode (in mm) (4) No polarity. (3) efer to pages from p.117 to p.12 for mounting information. c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) 1 1 Common mode For Powertrain/Safety DLW31SH222SQ2 Common Mode Impedance (at 1MHz/2 C) ated Current ated Voltage Insulation esistance (min.) Withstand Voltage DC esistance DLW31SH222SQ2p 22 25% 8mA 32Vdc 1M 8Vdc 1.6 2% Operating Temperature ange: Number of Circuit: 1 Lead Type DLW31SH222SQ2 Differential mode

113 Signal Lines Type DLW43SSeries 1812/4532 (inch/mm) 1812 size wire-wound common mode choke coil. c Appearance/ Dimensions DLW43S_K 2.6±.2 4.5±.2 (.8) (1) (2) (4) (3) (.6): 1μH (.7): 11, 22, 51μH 3.2±.2 (.3) (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 5 K ø33mm Embossed Taping 25 B Packing in Bulk 1 c Equivalent Circuit (1) (4) No polarity. (2) (3) c Appearance/ Dimensions c ated Value (p: packaging code) 3.2±.2 c Impedance-Frequency Characteristics (Main Items) DLW43S_K Series DLW43S_P Common mode DLW43SH51K2 DLW43SH1K2 2.7±.2 4.5±.2 (.8) (1) (2) (4) (3) (.6) DLW43SH51K2 DLW43SH11K2 DLW43SH22K2 DLW43SH11K2 Differential mode DLW43SH22K2 DLW43SH11K (.3) (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 5 K ø33mm Embossed Taping 25 B Packing in Bulk 1 c Equivalent Circuit (1) (4) DLW43S_P Series DLW43SH11P2 No polarity. Common mode (2) (3) efer to pages from p.117 to p.12 for mounting information. Common Mode ated ated Insulation Withstand DC esistance For Infotainment For Powertrain/Safety Inductance Current Voltage (min.) Voltage esistance DLW43SH11K2p 11µH -3%/+5% (at.1mhz) 36mA 5Vdc 1M 125Vdc.5 max. DLW43SH22K2p 22µH -3%/+5% (at.1mhz) 31mA 5Vdc 1M 125Vdc.6 max. DLW43SH51K2p 51µH -3%/+5% (at 1MHz) 23mA 5Vdc 1M 125Vdc 1. max. DLW43SH11K2p 1µH -3%/+5% (at 1MHz) 2mA 5Vdc 1M 125Vdc 2. max. DLW43SH11P2p 1µH -3%/+8% (at.1mhz) 17mA 5Vdc 1M 125Vdc 2. max. Operating Temperature ange: Number of Circuit: 1 DLW43SH11P2 Differential mode Lead Type 111

114 Power Lines Type Meets large current up to 18A max. c Appearance/ Dimensions PLT1HSeries (12.9x6.6mm) 9.4 max max. (1) (2) 12 (4) (3) 6.6±.2 3.2±.3 2.±.3 2.1±.3 2.1±.3 1.±.2 1.± ±.2 9.1±.2 : Electrode (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 125 K ø33mm Embossed Taping 5 B Packing in Bulk 5 c Equivalent Circuit (1) (4) No polarity. (2) (3) c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Common Mode Impedance (at 1MHz/2 C) ated Current ated Voltage Insulation esistance (min.) efer to pages from p.121 to p.122 for mounting information. Withstand Voltage DC esistance Inductance PLT1HH4518PNp 45 (Typ.) 18A 3Vdc 1M 75Vdc 1.3m.5m.8µH min. PLT1HH1115PNp 1 (Typ.) 15A 3Vdc 1M 75Vdc 1.8m.5m 2.µH min. PLT1HH411PNp 4 (Typ.) 1A 1Vdc 1M 25Vdc 3.6m.5m 6µH min. PLT1HH511PNp 5 (Typ.) 1A 1Vdc 1M 25Vdc 3.6m.5m 9µH min. PLT1HH916PNp 9 (Typ.) 6A 1Vdc 1M 25Vdc 8.m.5m 14µH min. PLT1HH126PNp 1 (Typ.) 6A 1Vdc 1M 25Vdc 8.m.5m 2µH min. Operating Temperature ange (Self-temperature rise is included): (PLT1HH 511/126 PN), (PLT1HH 4518/1115/411/916 PN) Number of Circuit: 1 Lead Type c Impedance-Frequency Characteristics (Main Items) PLT1HH126PN PLT1HH916PN PLT1HH411PN PLT1HH511PN PLT1HH1115PN PLT1HH4518PN c Derating of ated Current In operating temperature exceeding +65 C, derating of current is necessary for PLT1H series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (A) PLT1HH45 PLT1HH11 PLT1HH51 4 PLT1HH Operating Temperature ( C) PLT1HH41 PLT1HH91 112

115 Power Lines Type PLT5BPSeries 22/55 (inch/mm) 15 C available, 22 size, for power lines. c Appearance/ Dimensions 5. max. c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 5.±.2 5.±.2 B Packing in Bulk max. (1) (2) (3.5) (.5) (4) (3) (1.5) : Electrode c Equivalent Circuit (1) (4) No polarity. (2) (3) (in mm) efer to pages from p.121 to p.122 for mounting information. c ated Value (p: packaging code) For Infotainment c Impedance-Frequency Characteristics (Main Items) Common mode PLT5BPH5131 PLT5BPH3137 PLT5BPH2144 PLT5BPH1156 For Powertrain/Safety Operating Temperature ange: Number of Circuit: 1 PLT5BPH5131 PLT5BPH3137 PLT5BPH2144 PLT5BPH1156 Differential mode Common Mode Impedance (at 1MHz/2 C) ated Current c Derating of ated Current In operating temperature exceeding +125 C, derating of current is necessary for PLT5BP series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current A ated Voltage PLT5BPH11 Insulation esistance (min.) Withstand Voltage DC esistance PLT5BPH1156SNp 1 (Typ.) 5.6A 8Vdc 1M 2Vdc 4m 3% PLT5BPH2144SNp 2 (Typ.) 4.4A 8Vdc 1M 2Vdc 7m 3% PLT5BPH3137SNp 3 (Typ.) 3.7A 8Vdc 1M 2Vdc 11m 3% PLT5BPH5131SNp 5 (Typ.) 3.1A 8Vdc 1M 2Vdc 17m 3% ated Current (A) A 3.7A 3.1A PLT5BPH21 PLT5BPH31 PLT5BPH51 2.9A 2.4A 2.2A 1.8A Operating Temperature ( C) Lead Type 113

116 DLp!Caution/Notice o ating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure our product.!caution 2. Mounting Direction Mount s in right direction. Wrong direction, which is 9 degrees rotated from right direction, causes not only open or short circuit but also flames or other serious trouble. o Soldering and Mounting 1. Self-heating Please provide special attention when mounting chip common mode choke coils DLW5 series in close proximity to other products that radiate heat. The heat generated by other products may deteriorate the insulation resistance and cause excessive heat in this component. right direction wrong direction Chip Common!Caution/Notice Mode Choke Coil Chip Common Mode SMD Choke Type Coil Lead Type o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling equirements> 1. Storage Period The DL series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to +4 C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. o Notice (Soldering and Mounting) 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercialpurpose equipment design. Notice o Handling 1. esin Coating (Except for DLW Series.) Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. 2. esin Coating (DLW31S Series) Do not make any resin coating DLW31S series. The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention in selecting resin in case of coating/molding the products with the resin. 3. esin Coating (Except DLW31S Series) The impedance value may change due to high curestress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention in selecting resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. Continued on the following page. 114

117 DLp!Caution/Notice 4. Caution for Use (DLW Series) When you hold products with a tweezer, please hold by the sides. Sharp materials, such as a pair of tweezers, should not touch the winding portion to prevent breaking the wire. Mechanical shock should not be applied to the products mounted on the board to prevent breaking the core. 5. Brushing (DLW21S/DLW31S/DLW43S Series) When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion of this product to prevent the breaking of wire. 6. Handling of a Substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting Chip Common Mode SMD Choke Type Coil Chip Common!Caution/Notice Mode Choke Coil Lead Type 115

118 PLp!Caution/Notice o ating 1. Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. 2. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure our product. o Soldering and Mounting 1. Self-heating Please provide special attention when mounting chip common mode choke coils in close proximity to other products that radiate heat. The heat generated by other products may deteriorate the insulation resistance and cause excessive heat in this component.!caution 2. Mounting Direction Mount s in right direction. Wrong direction, which is 9 degrees rotated from right direction, causes not only open or short circuit but also flames or other serious trouble. right direction wrong direction Chip Common!Caution/Notice Mode Choke Coil Chip Common Mode SMD Choke Type Coil Lead Type o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling equirements> 1. Storage Period PLT1H series, PLT5BP series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to +4 C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Notice o Notice (Soldering and Mounting) 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. o Handling 1. Handling of a Substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 116

119 DLp Soldering and Mounting 1. Standard Land Pattern Dimensions DLM11S DLW21S DLW31S DLW43S DLW5A DLW5B DLW5AT_MQ2.85 oeflow Soldering DLM11S.3 DLW5A/5B (Except for DLW5AT_MQ2) DLW21S/31S/43S 4.7 a 3 b oeflow Soldering Chip Mounting Side DLW5AT_MQ c 2 d 1 Series DLW21S/H DLW31S DLW43SH11/22/51 DLW43SH11 a Land Pattern + Solder esist Land Pattern Solder esist b c (in mm) d : If the pattern is made with wider than 1.2mm (DLW21) / 1.6mm (DLW31S) it may result in components turning around, because melting speed is different. In the worst case, short circuit between lines may occur. 2: If the pattern is made with less than specified dimensions, in the worst case, short circuit between lines may occur due to spread of soldering paste or mount placing accuracy. 3: If the pattern is made with wider than.8mm (DLW21) / 1.6mm (DLW31SN), the bending strength will be reduced. Moreover, if the pattern is made with less than "a" dimension, in the worst case short circuit may be occurred. (DLW43S) Do not use gild pattern; excess soldering heat may dissolve metal of a copper wire. oflow Soldering Chip Mounting Side DLW5AT_MQ Chip Common Mode SMD Choke Type Coil Chip Soldering Common Mode and Mounting Choke Coil o PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Products should be located in the sideways direction (Length: a<b) to the mechanical stress. Poor example b a Good example Lead Type 117

120 DLp Soldering and Mounting 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip common mode choke coils, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns. When flow soldering the chip common mode choke coils, apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process. (in mm) Series Solder Paste Printing Adhesive Application DLW DLM oguideline of solder paste thickness: 1-15μm: DLW21S/31S, DLM11S 15μm: DLW43S 15-2μm: DLW5A/5B *Solderability is subject to reflow conditions and thermal conductivity. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. DLW5AT_MQ2 Apply.3mg of bonding agent at each chip. DLW5AT_MQ2 Chip Soldering Common Mode and Mounting Choke Coil Chip Common Mode SMD Choke Type Coil.3 DLM11S DLW21S/31S.55 Coating Position of Bonding Agent c d Series a b c d a b DLW43S c d DLW21S DLW31S Series a.5.4 b c d Lead Type a b DLW5A/5B DLW43S 3. (11/22/51) 3.2 (11)

121 DLp Soldering and Mounting 3. Standard Soldering Conditions (1) Soldering Methods Use flow and reflow soldering methods only. Use standard soldering conditions when soldering chip common mode choke coils. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Solder: Use Sn-3.Ag-.5Cu solder. Use of Sn-n based solder will deteriorate performance of products. If using DLM series with Sn-n based solder, please contact Murata in advance. (2) Soldering Profile oflow Soldering Profile (Sn-3.Ag-.5Cu Solder) Flux: o Use osin-based flux. In case of DLW21/31/43 series, use osin-based flux with converting chlorine content of.6 to.1wt%. In case of using A type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. For additional mounting methods, please contact Murata. DLW5AT_MQ2 Series oeflow Soldering Profile (Sn-3.Ag-.5Cu Solder) Temperature ( C) T1 Temp. (T1) Pre-heating Time. (t1) T3 T2 Pre-heating t1 t2 Heating Temp. (T2) Time (s) Standard Profile Heating Time. (t2) 15 C 6s min. 25 C 4 to 6s Limit Profile Standard Profile 2 times max. 265±3 C Limit Profile Cycle Heating of Flow Temp. (T3) Time. (t2) 5s max. Cycle of Flow 2 times max. Chip Common Mode SMD Choke Type Coil Chip Soldering Common Mode and Mounting Choke Coil DLM/ DLW21S/31S DLW43S Series Standard Profile Limit Profile Heating Peak Cycle Heating Peak Temperature Temperature Temp. (T1) Time. (t1) (T2) of eflow Temp. (T3) Time. (t2) (T4) 2 times 22 C min. 3 to 6s 245±3 C 23 C min. 6s max. 26 C/1s max. 22 C min. 3 to 6s 245±3 C DLW5A/5B 22 C min. 3 to 6s 25±3 C Temperature ( C) T2 T1 Pre-heating 9s±3s t1 t2 T4 T3 time (s) 2 times max. 2 times max. Limit Profile Standard Profile 24 C min. 3s max. 26 C/1s 23 C min. 6s max. 26 C/1s Cycle of eflow 2 times max. 2 times max. 2 times max. Lead Type 119

122 DLp Soldering and Mounting (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 15 C 6s min. Soldering iron power output / Tip diameter: 3W max. / ø3mm max. Temperature of soldering iron tip / Soldering time / Times: 35 C max. / 3-4s / 2 times* 1 * 1 DLW31S/DLW43S: 35 C max. / 3s / 2 times Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. 4. Cleaning Chip Soldering Common Mode and Mounting Choke Coil Chip Common Mode SMD Choke Type Coil Following conditions should be observed when cleaning chip EMI filter. Do not clean DLW series. (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol type cleaner) (2) Ultrasonic Output: 2W/liter max. Duration: 5 minutes max. Frequency: 28 to 4kHz (3) Cleaning agent The following list of cleaning agents have been tested on the individual components. Evaluation of final assembly should be completed prior to production. Before cleaning, please contact Murata engineering. (a) Alcohol cleaning agent Isopropyl alcohol (IPA) (b) Aqueous cleaning agent Pine Alpha ST-1S (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agent has been removed with deionized water. Lead Type 12

123 PL p Soldering and Mounting 1. Standard Land Pattern Dimensions PLT1H PLT5BP oeflow Soldering PLT1H PLT5BP Copper Foil Pattern Copper Foil Pattern + esist esist (in mm) o PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip common mode choke coils, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns Products should be located in the sideways direction (Length: a<b) to the mechanical stress. Poor example Good example When flow soldering the chip common mode choke coils, apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process. b a Chip Common Mode SMD Choke Type Coil Chip Soldering Common Mode and Mounting Choke Coil Series Solder Paste Printing PLT1H PLT5BP oguideline of solder paste thickness: 15-2μm: PLT1H 15μm: PLT5BP For the solder paste printing pattern, use standard land dimensions. *Solderability is subject to reflow conditions and thermal conductivity. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. Lead Type 121

124 PLp Soldering and Mounting 3. Standard Soldering Conditions (1) Soldering Methods Use reflow soldering methods only. Use standard soldering conditions when soldering chip common mode choke coils. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Solder: Use Sn-3.Ag-.5Cu solder. Use of Sn-n based solder will deteriorate performance of products. Flux: o Use osin-based flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. (2) Soldering Profile oeflow Soldering Profile (Sn-3.Ag-.5Cu Solder) For additional mounting methods, please contact Murata. Chip Soldering Common Mode and Mounting Choke Coil Chip Common Mode SMD Choke Type Coil PLT1H Series Temperature ( C) T2 T1 Pre-heating 9s±3s Standard Profile Limit Profile Heating Peak Cycle Heating Peak Temperature Temperature Temp. (T1) Time. (t1) (T2) of eflow Temp. (T3) Time. (t2) (T4) 22 C min. 3 to 6s 25±3 C t1 t2 T4 T3 time (s) 2 times max. Limit Profile Standard Profile 23 C min. 6s max. 26 C/1s Cycle of eflow 2 times max. Lead Type PLT5BP 22 C min. 3 to 6s 245±3 C (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 15 C 6s min. Soldering iron power output / Tip diameter: 8W max. / ø3mm max.: PLT1HH 3W max. / ø3mm max.: PLT5BP Temperature of soldering iron tip / Soldering time / Times: 4 C max. / 5s / 2 times: PLT1HH 35 C max. / 3 to 4s / 2 times: PLT5BP 4. Cleaning Do not clean after soldering. 2 times max. 24 C min. 3s max. 26 C/1s 2 times max. Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. 122

125 DLp Packaging Minimum Quantity and Dimensions of 8mm Width Embossed Tape 2.±.5 4.±.1 4.±.1 a +.1 ø ±.1 3.5±.5 8. <Embossed> c d DLM11S DLW21S DLW31S 8.±.1 2.±.5 4.±.1 b a Dimensions 1 DLW43/DLW5AT:.3 c: Depth of Cavity Dimension of the cavity is measured at the bottom side. b Direction of Feed Dimension of the cavity of embossed tape is measured at the bottom side. ø a ±.1 5.5±.5 Direction of feed 12. b c c d Minimum Quantity and Dimensions of 12mm Width Embossed Tape DLW43SH_K DLW43SH_P DLW5AT DLW5BS DLW5BT c: Depth of Cavity (Embossed Tape) Minimum Qty. (pcs.) ø18mm eel ø33mm eel Paper Tape Embossed Tape Paper Tape Embossed Tape Bulk Dimensions a b c Minimum Qty. (pcs.) ø18mm eel ø33mm eel (in mm) Bulk (in mm) Chip Common Mode SMD Choke Type Coil Chip Common Mode Packaging Choke Coil "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity." Lead Type 123

126 PL p Packaging Minimum Quantity and Dimensions of 12mm Width Embossed Tape 2.±.5 8.±.1 4.±.1 ø a 1.75±.1 5.5± d c b Direction of Feed Dimension of the cavity is measured at the bottom side. c: Depth of Cavity PLT5BP Dimensions Minimum Qty. (pcs.) a b c d ø18mm eel ø33mm eel Bulk (in mm) Chip Common Mode Packaging Choke Coil Chip Common Mode SMD Choke Type Coil Minimum Quantity and Dimensions of 24mm Width Embossed Tape 4.±.1 2.±.1 ø ±.1 d a b 12.± ±.1 24.±.2 c Direction of Feed Dimension of the cavity is measured at the bottom side. Lead Type PLT1H Dimensions Minimum Qty. (pcs.) a b c d ø18mm eel ø33mm eel Bulk (in mm) 124

127 Power Lines Type BN2pSeries Wide noise suppression frequency range from 1kHz to several GHz is available. (SMD type) c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment c Insertion Loss Characteristics (Main Items) BN24H1 Insertion Loss (db) ± ±.2 (3) BN2p* (4) * BN24H1 BN25H1 BN26H1 BN27H1 Appearance BN24 BN25 BN26 BN27 (1) (3) (4) (2) (4) 7.± ±.2 (1) 4.2±.3 (2.45) 3.5±.2.3±.1 1.±.3 For Powertrain/Safety (1) (2).3±.1 1.5±.2 1.3±.2 (3) (4) 2.5± ±.2 (4) ated Voltage (2) 1.6±.3 Withstand Voltage : Electrode (in mm) ated Current c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 4 K ø33mm Embossed Taping 15 B Packing in Bulk 1 c Equivalent Circuit L1 L3 C2 (1) B CB (2) L2 C1 (3) PSG CG (4) BN25H1/BN26H1 Insertion Loss (db) Insulation esistance (min.) (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B efer to pages from p.128 to p.129 for mounting information. BN25H1 BN26H1 Insertion Loss BN24H1p 5Vdc 125Vdc 15A 1M 1kHz to 1GHz:35dB min. (Line impedance=5 ) BN25H1p 25Vdc 62.5Vdc 15A 5M 5kHz to 1GHz:35dB min. (Line impedance=5 ) BN26H1p 5Vdc 125Vdc 15A 1M 5kHz to 1GHz:35dB min. (Line impedance=5 ) BN27H1p 16Vdc 4Vdc 15A 1M 4kHz to 1GHz:35dB min. (Line impedance=5 ) Operating Temperature ange: In operating temperatures exceeding +85, derating of current is necessary BN27H1 Insertion Loss (db) Continued on the following page. Lead Type 125

128 BN2p c Derating of ated current In operating temperature exceeding +85 C, derating of current is necessary for BN24H/25H/26H/27H series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (A) Operating Temperature ( C) Lead Type 126

129 BN!Caution/Notice o ating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance.!caution Notice o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling equirements> 1. Storage Period BN series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to +4 C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. o Notice (Soldering and Mounting) 1. Cleaning Do not clean BN series (). 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. o Handling 1. esin Coating Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. 2. Handling of a Substrate (for BN2p) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting Block Type SMD EMIFILr Type Block!Caution/Notice Type EMIFILr Lead Type 127

130 BN Soldering and Mounting 1. Standard Land Pattern Dimensions BN2p o PCB Warping (for BN2p) PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. B PSG CG CG CB CG 17.5 Land Pattern + Solder esist Land Pattern Solder esist Through Hole (1) A double-sided print board (or multilayer board) as shown in the left figure is designed, and please apply a soldering Cu electrode with a product electrode to a "Land Pattern", apply resist to a "Land Pattern + Solder esist" at Cu electrode. (2) This product is designed to meet large current. Please design PCB pattern which is connected to this product not to become too hot by applied large current. (3) Please drop CG on a ground electrode on the back layer (the same also in a multilayer case) by the through hole. And a surface to ground electrode layer may also take a large area as much as possible. (4) It is recommended to use a double-sided printed circuit board with BN mounting on one side and the ground pattern on the other in order to maximize filtering performance, multiple feed through holes are required to maximize the BN's connection to ground. (5) The ground pattern should be designed to be as large as possible to achieve maximum filtering performance. Products should be located in the sideways direction (Length: a<b) to the mechanical stress. b a (in mm) Soldering Block Type and Mounting EMIFILr Block Type SMD EMIFILr Type Lead Type 2. Solder Paste Printing and Adhesive Application When reflow soldering the block type EMIFILr, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. BN2p oguideline of solder paste thickness: 15-2μm Standard land dimensions should be used for resist and copper foil patterns. Series Solder Paste Printing Adhesive Application B PSG CG 1.3 CG 13.7 CB CG 17.5 Poor example Good example 128

131 BN Soldering and Mounting 3. Standard Soldering Conditions (1) Soldering Methods Use reflow soldering methods only. Use standard soldering conditions when soldering block type EMIFILr SMD type. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Flux: o Use osin-based flux. In case of using A type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. Solder: Use Sn-3.Ag-.5Cu solder. Use of Sn-n based solder will deteriorate performance of products. (2) Soldering Profile oeflow Soldering Profile (Sn-3.Ag-.5Cu solder) Series Standard Profile Limit Profile Heating Peak Cycle Heating Peak Temperature Temperature Temp. (T1) Time. (t1) (T2) of eflow Temp. (T3) Time. (t2) (T4) BN2p 22 C min. 3 to 6s 25±3 C Temperature ( C) T2 T1 Pre-heating 9s±3s t1 t2 For additional mounting methods, please contact Murata. T4 T3 Time (s) 2 times max. Limit Profile Standard Profile 23 C min. 6s max. 26 C/1s Cycle of eflow 2 times max. (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 15 C 6s min. Soldering iron power output: 1W max. Temperature of soldering iron tip / Soldering time / Times: 45 C max. / 5s max. / 2 time Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. Block Type SMD EMIFILr Type Soldering Block Type and Mounting EMIFILr 4. Cleaning Do not clean BN2p series, or inner humidity protect material will be damaged, results product s insulation resistance getting worse. Lead Type 129

132 BN Packaging Minimum Quantity and Dimensions of 24mm Width Embossed Tape 4.x1pitch=4.±.2 4.±.1 2.±.1 12.±.1 ø ±.1 c: 3.6±.1 3.6±.1 b: 9.4±.1 BN24/25/26/27 Dimensions a b c Minimum Qty. (pcs.) ø18mm reel ø33mm reel 4 15 Bulk 1 (in mm) Block Type Packaging EMIFILr Block Type SMD EMIFILr Type 11.5±.1 a: 12.4±.1 24.±.2 ø ±.1 Dimension of the cavity is measured at the bottom side. Lead Type "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity." 13

133 DSp Disc Type EMIFILr ing () DS q S w 1 e r B3 t 2A y 22 u Q55 i B o qproduct ID Product ID DS Three-terminal Capacitor ttemperature Characteristics Capacitance Change B3 ±1% (Temperature ange: -25 C to +85 C) wstructure estyle S 1 rcategory ilead Type/oPackaging Q55B Q91J Q91A Structure Built-in Ferrite Beads Type Style Expressed by a letter. Category For Automotive Infotainment Lead Type Straight Lead Length* (mm) 25. min. 2.±1. *Lead Distance between eference and Bottom Planes Except for Bulk. yated Voltage Packaging Bulk Paper eel (ø32mm) Ammo Pack 1H 2A DSS1 ated Voltage 5V 1V ucapacitance Expressed by three alphanumerics. The unit is in pico-farad (pf). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. Series Lead Type Microchip Transformer (Balun) EMI Suppression Filters 131

134 VFp EMIGUADr (EMIFILr with Varistor Function) ing () VF q C w 2 e H r 7 t 1D y 15 u K i 2 o K1! B!1 qproduct ID yated Voltage Product ID ated Voltage VF EMIGUADr Lead Type 1D 22V wstructure C Structure Built-in Capacitor ucapacitance Expressed by three alphanumerics. The unit is in pico-farad (pf). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. estyle icapacitance Style 2 Size is expressed by a digit Capacitance K ±1% rfeatures ovaristor Voltage Features Varistor Voltage H For Automotive Powertrain, Safety 2 27V ttemperature Characteristics Capacitance Change 7 ±15% (Temperature ange: -55 C to +125 C)!Lead Type/!1Packaging Lead Type Lead Length* Packaging Series K1B 26.±1.mm Bulk M1A Inside Crimp Ammo Pack VFC2 18.±1.mm M1J Paper eel (ø32mm) *From bottom of the crimp. Microchip Transformer (Balun) EMI Suppression Filters Lead Type 132

135 EMIFILr Lead Type Power lines Signal lines Universal Type DSS1Series 3 terminal structure enables excellent high frequency characteristics. c Appearance/ Dimensions 8.5 max. 3.5 max. 7.5 max. c Packaging Packaging Minimum Quantity B Packing in Bulk 25 A Ammo Pack 15 ø32mm eel ± min. ø.56 (in mm) c Equivalent Circuit GND No polarity. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Capacitance ated Current ated Voltage efer to p.14 for mounting information. Operating Temperature ange DSS1B32A22Q55Bp 22pF 1% 6A 1Vdc DSS1B32A22Q91Ap 22pF 1% 6A 1Vdc DSS1B32A22Q91Jp 22pF 1% 6A 1Vdc DSS1B32A33Q55Bp 33pF 1% 6A 1Vdc DSS1B32A33Q91Ap 33pF 1% 6A 1Vdc DSS1B32A33Q91Jp 33pF 1% 6A 1Vdc DSS1B32A47Q55Bp 47pF 1% 6A 1Vdc DSS1B32A47Q91Ap 47pF 1% 6A 1Vdc DSS1B32A47Q91Jp 47pF 1% 6A 1Vdc DSS1B32A68Q55Bp 68pF 1% 6A 1Vdc DSS1B32A68Q91Ap 68pF 1% 6A 1Vdc DSS1B32A68Q91Jp 68pF 1% 6A 1Vdc DSS1B32A11Q55Bp 1pF 1% 6A 1Vdc DSS1B32A11Q91Ap 1pF 1% 6A 1Vdc DSS1B32A11Q91Jp 1pF 1% 6A 1Vdc DSS1B32A121Q55Bp 12pF 1% 6A 1Vdc DSS1B32A121Q91Ap 12pF 1% 6A 1Vdc DSS1B32A121Q91Jp 12pF 1% 6A 1Vdc DSS1B32A151Q55Bp 15pF 1% 6A 1Vdc DSS1B32A151Q91Ap 15pF 1% 6A 1Vdc DSS1B32A151Q91Jp 15pF 1% 6A 1Vdc DSS1B32A221Q55Bp 22pF 1% 6A 1Vdc DSS1B32A221Q91Ap 22pF 1% 6A 1Vdc DSS1B32A221Q91Jp 22pF 1% 6A 1Vdc DSS1B32A271Q55Bp 27pF 1% 6A 1Vdc DSS1B32A271Q91Ap 27pF 1% 6A 1Vdc DSS1B32A271Q91Jp 27pF 1% 6A 1Vdc DSS1B32A331Q55Bp 33pF 1% 6A 1Vdc DSS1B32A331Q91Ap 33pF 1% 6A 1Vdc DSS1B32A331Q91Jp 33pF 1% 6A 1Vdc DSS1B32A471Q55Bp 47pF 1% 6A 1Vdc DSS1B32A471Q91Ap 47pF 1% 6A 1Vdc DSS1B32A471Q91Jp 47pF 1% 6A 1Vdc Number of Circuit: 1 Continued on the following page. Lead Type Microchip Transformer (Balun) EMI Suppression EMIFILr Filters 133

136 EMIFILr Lead Type DSS1 Microchip Transformer (Balun) EMI Suppression EMIFILr Filters Lead Type For Infotainment c Insertion Loss Characteristics (Main Items) Insertion Loss (db) pF 27pF 33pF 47pF 68pF 1pF 15pF 22pF 33pF 47pF 68pF 1pF 15pF 22pF 33pF 47pF 1pF For Powertrain/Safety 15pF 12pF 68pF 1pF 47pF 33pF 22pF Capacitance ated Current ated Voltage Operating Temperature ange DSS1B32A681Q55Bp 68pF 1% 6A 1Vdc DSS1B32A681Q91Ap 68pF 1% 6A 1Vdc DSS1B32A681Q91Jp 68pF 1% 6A 1Vdc DSS1B32A12Q55Bp 1pF 1% 6A 1Vdc DSS1B32A12Q91Ap 1pF 1% 6A 1Vdc DSS1B32A12Q91Jp 1pF 1% 6A 1Vdc DSS1B32A152Q55Bp 15pF 1% 6A 1Vdc DSS1B32A152Q91Ap 15pF 1% 6A 1Vdc DSS1B32A152Q91Jp 15pF 1% 6A 1Vdc DSS1B32A222Q55Bp 22pF 1% 6A 1Vdc DSS1B32A222Q91Ap 22pF 1% 6A 1Vdc DSS1B32A222Q91Jp 22pF 1% 6A 1Vdc DSS1B32A332Q55Bp 33pF 1% 6A 1Vdc DSS1B32A332Q91Ap 33pF 1% 6A 1Vdc DSS1B32A332Q91Jp 33pF 1% 6A 1Vdc DSS1B32A472Q55Bp 47pF 1% 6A 1Vdc DSS1B32A472Q91Ap 47pF 1% 6A 1Vdc DSS1B32A472Q91Jp 47pF 1% 6A 1Vdc DSS1B32A682Q55Bp 68pF 1% 6A 1Vdc DSS1B32A682Q91Ap 68pF 1% 6A 1Vdc DSS1B32A682Q91Jp 68pF 1% 6A 1Vdc DSS1B32A13Q55Bp 1pF 1% 6A 1Vdc DSS1B32A13Q91Ap 1pF 1% 6A 1Vdc DSS1B32A13Q91Jp 1pF 1% 6A 1Vdc DSS1B32A153Q55Bp 15pF 1% 6A 1Vdc DSS1B32A153Q91Ap 15pF 1% 6A 1Vdc DSS1B32A153Q91Jp 15pF 1% 6A 1Vdc DSS1B32A223Q55Bp 22pF 1% 6A 1Vdc DSS1B32A223Q91Ap 22pF 1% 6A 1Vdc DSS1B32A223Q91Jp 22pF 1% 6A 1Vdc DSS1B31H333Q55Bp 33pF 1% 6A 5Vdc DSS1B31H333Q91Ap 33pF 1% 6A 5Vdc DSS1B31H333Q91Jp 33pF 1% 6A 5Vdc DSS1B31H473Q55Bp 47pF 1% 6A 5Vdc DSS1B31H473Q91Ap 47pF 1% 6A 5Vdc DSS1B31H473Q91Jp 47pF 1% 6A 5Vdc DSS1B31H14Q55Bp 1pF 1% 6A 5Vdc DSS1B31H14Q91Ap 1pF 1% 6A 5Vdc DSS1B31H14Q91Jp 1pF 1% 6A 5Vdc Number of Circuit: 1 134

137 EMIGUADr (EMIFILr with Varistor Function) Lead Type Power Lines Type VFC2Series Large capacitance and high surge current of 2A. c Appearance/ Dimensions 4. max. 5. max. 6. max. 3. max. c Packaging Packaging Minimum Quantity B Packing in Bulk 5 A Ammo Pack 2 J ø32mm Paper eel 2 5.2±.5 1 (2) 2 (1) Lead Length* K1B M1A M1J Lead Length* 26.±1.mm 18.±1.mm (in mm) c Equivalent Circuit c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Varistor Voltage efer to p.14 for mounting information. Lead Type Microchip Transformer (Balun) EMIGUADr Suppression (EMIFILr with Varistor Filters Function) Capacitance Temperature Characteistics ated Voltage Insulation esistance (min.) VFC2H71D15K2M1p 27Vdc +5/-3V 1.µF 1% 7 ( 15%) 22Vdc 1M Operating Temperature ange:

138 Lead Type Power Lines Type BN12Series Wide noise suppression frequency range from 1kHz to several GHz is available. (Lead type) c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment c Insertion Loss Characteristics (Main Items) 1 2 (3) (4) 3.2±.5 (4) ø.8 12.±.2 BN12H 2D 7.5±.2 For Powertrain/Safety 11.±.2.8 ±.1 8.±.5 4.±.5 2.5±.2 ated Voltage 12.±.5 (2) (5Ω - 5Ω) (1) ø.8 ø.8.6 ±.1 (4) 2.5±.2 Withstand Voltage (in mm) ated Current c Packaging Packaging Minimum Quantity - Box 15 c Equivalent Circuit L1 L3 C2 (1) B CB (2) L2 C1 (3) PSG CG (4) Insulation esistance (min.) (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B efer to pages from p.141 to p.142 for mounting information. Insertion Loss BN12H 5Vdc 125Vdc 15A 5M 1MHz to 1GHz:4dB min. (Line impedance=5 ) Operating Temperature ange: In operating temperatures exceeding +85, derating of current is necessary. Insertion Loss (db) Microchip Transformer (Balun) EMI Block Suppression Type EMIFILr Filters Lead Type Continued on the following page. 136

139 Lead Type BN12 c Derating of ated current " ating In operating temperatures exceeding +85 C, derating of current is necessary for BN12H series. Please apply the derating curve shown in chart according to the operating temperature. Derating Operating Temperature ( C) " Connecting ± Power Line In case of using ± power line, please connect to each terminal as shown. Power Supply (BN Input) Power Supply W Bias Power Supply Ground Power Supply Y Bias Power Supply Ground B PSG B PSG BN CB CG CB CG Circuit (BN Output) Load Circuit W Bias Load Circuit Ground Load Circuit Y Bias Load Circuit Ground Lead Type Microchip Transformer (Balun) EMI Block Suppression Type EMIFILr Filters Derated Current (A) 137

140 DSp/VFp EMIFILr Lead Type!Caution/Notice o ating 1. Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. 2. Products should not be applied for the absorption of surge which have large energy (ex. Included lighting surge, switching surges) because it is designed for the absorption of electrostatic surges, or it results cracks in ceramics which may lead to smoking / firing. o Storage and Operating Conditions <Operating Environment> 1. Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 2. Do not use products near water, oil or organic solvents. Avoid environments where dust or dirt may adhere to the product. 3. Do not adhere any resin to products, coat nor mold products with any resin (including adhesive) to prevent mechanical and chemical stress on products. <Storage and Handling equirements> 1. Storage Period Use the products within 12 months after delivery. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to 4 degrees C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. <Using EMIGUADr effectively> 1. Products should be used at rated voltage or less and rated current or less.!caution Notice o Soldering and Mounting 1. Mounting holes should be designed as specified in these specifications. Other designs than those shown in these specifications may cause cracks in ceramics that may lead to smoking or firing. 2. Take care not to apply any mechanical stress to product body at the lead terminal bending process for product angle adjustment after insertion. o Soldering and Mounting 1. Washing Failure and degradation of a product are causedby the washing method. When you wash in conditions that are not in the mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in the mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, lead wire length, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. Microchip Transformer (Balun) EMI Suppression!Caution/Notice Filters Lead Type 138

141 BN Lead Type!Caution/Notice o ating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance.!caution Notice o Storage and Operating Conditions <Operating Environment> 1. Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 2. Do not use products near water, oil or organic solvents. <Storage and Handling equirements> 1. Storage Period BN Series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to +4 C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. o Notice (Soldering and Mounting) 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering eliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters "EMIFIL" may vary, depending on the circuits and ICs used, type of noise, mounting pattern, lead wire length, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. o Notice (Appearance) Although some part of the product surface seems to be white in some cases, do not care because it is the result of waxing process for humidity resistance improvement. This wax does not make bad affection to mechanical or electrical performance, reliability of the product. Lead Type Microchip Transformer (Balun) EMI Suppression!Caution/Notice Filters 139

142 DS p/vfpemifilr Lead Type Soldering and Mounting 1. Mounting Hole Mounting holes should be designed as specified below. Bulk Type (in mm) Taping Type (in mm) DSS1 ø.8-3 ø ±.2 2.5±.2 2.5±.2 2.5±.2 VFC2H ø ±.4 5.2±.4 ø Soldering (1) Use Sn-3.Ag-.5Cu solder. (2) Use osin-based flux. Do not use strong acidic flux with halide content exceeding.2wt% (chlorine conversion value). (3) Products and the leads should not be subjected to any mechanical stress during the soldering process, or while subjected to the equivalent high temperatures. (4) Standard flow soldering profile. Temperature ( C) Pre-heating 15 C 6s min. Gradual cooling Soldering (in air) Soldering temperature Soldering time Microchip Transformer (Balun) EMI Soldering Suppression and Mounting Filters Lead Type 3. Cleaning Conditions Clean other parts in the following conditions. (1) Cleaning temperature should be limited to 6 C max. (4 C max for alcohol type cleaner). (2) Ultrasonic cleaning should comply with the following conditions, avoiding the resonance phenomenon at the mounted products and PCB. Power: 2 W /max. Frequency: 28 to 4kHz Time: 5 min. max. (3) Cleaner (a) Alcohol type cleaner Isopropyl alcohol (IPA) (b) Aqueous agent (PLT series cannot be cleaned) PINE ALPHA ST-1S Solder Soldering Temperature Soldering Time Sn-3.Ag-.5Cu solder 25 to 26 C 4 to 6s (4) There should be no residual flux or residual cleaner left after cleaning. In the case of using aqueous agent, products should be dried completely after rinsing with de-ionized water in order to remove the cleaner. (5) The surface of products may become dirty after cleaning, but there is no deterioration on mechanical, electrical characteristics and reliability. (6) Other cleaning: Please contact us. 14

143 BN Lead Type Soldering and Mounting 1. Mounting Hole Mounting holes should be designed as specified below. BN1p Component Side ø1.2 (PSG) (B) (CG) (CG) (CG) (CB) 2.5±.1 5.±.1 7.5±.1 2.5±.1 2.5±.1 Terminal Layout (Bottom figure) CG PSG B CB CG PSG: Power supply ground CG: Load circuit ground CB: Load circuit + Bias 2. Using the (Lead Type) Effectively (1) How to use effectively This product effectively prevents undesired radiation and external noise from going out / entering the circuit by grounding the high frequency components which cause noise problems. Therefore, grounding conditions may affect the performance of the filter and attention should be paid to the following for effective use. (a) Design maximized grounding area in the P.C. board, and grounding pattern for all the grounding terminals of the product to be connected. (Please follow the specified recommendations.) (b) Minimize the distance between ground of the P.C. board and the ground plate of the product. (ecommend using the through hole connection between grounding area both of component side and bottom side.) (c) Insert the terminals into the holes on P.C. board completely. (d) Don't connect PSG terminal with CG terminal directly. (See the item 1. Terminal Layout) P. C. Board Patterns Use a bilateral P.C. board. Insert the BN into the P.C.board until the root of the terminal is secured, then solder. (1) Component Side View (2) Bottom View PSG PSG B B B PSG PSG CG CG CG CG CG CB CB CG B Shield plate Copper foil pattern (2) Self-heating Though this product has a large rated current, localized selfheating may be caused depending on soldering conditions. To avoid this, attention should be paid to the following: (a) Use P.C. board with our recommendation on hole diameter / land pattern dimensions, mentioned in the right hand drawing, especially for 4 terminals which pass current. (b) Solder the terminals to the P.C. board with soldercover area at least 9%. Otherwise, excess self-heating at connection between terminals and P.C. board may lead to smoke and / or fire of the product even when operating at rated current. (c) After installing this product in your product, please make sure the self-heating is within the rated current recommended. ecommended Land Pattern B PSG CG CG CB CG Through holes ø (in mm) Copper foil pattern Lead Type Microchip Transformer (Balun) EMI Soldering Suppression and Mounting Filters 141

144 BN Lead Type Soldering and Mounting Microchip Transformer (Balun) EMI Soldering Suppression and Mounting Filters Lead Type 3. Soldering (1) Use Sn-3.Ag-.5Cu solder. (2) Use osin-based flux. Do not use strong acidic flux with halide content exceeding.2wt% (chlorine conversion value). (3) Products and the leads should not be subjected to any mechanical stress during the soldering process, or while subjected to the equivalent high temperatures. (4) Standard flow soldering profile Temperature ( C) Solder Soldering Temperature Soldering Time Sn-3.Ag-.5Cu solder 25 to 26 C 4 to 6s 4. Cleaning Pre-heating 15 C 6s min. Gradual Cooling Soldering (in air) Soldering Temperature Soldering Time Clean the block Type EMIFILr(Lead Type) in the following conditions. (1) Cleaning temperature should be limited to 6 C max. (4 C max for alcohol type cleaner). (2) Ultrasonic cleaning should comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 2W/liter max. Frequency: 28 to 4kHz Time: 5 min. max. (3) Cleaner (a) Alcohol type cleaner Isopropyl alcohol (IPA) (b) Aqueous agent Pine Alpha ST-1S (4) There should be no residual flux or residual cleaner left after cleaning. In the case of using aqueous agent, products should be dried completely after rinsing with de-ionized water in order to remove the cleaner. (5) The surface of products may become dirty after cleaning, but there is no deterioration on mechanical, electrical characteristics and reliability. (6) Other cleaning: Please contact us. 142

145 DS p/vfpdisc Type EMIFILr/EMIGUADr Lead Type Packaging c Minimum Quantity VFC2H Series DSS1 Series Minimum Order Quantity (order in sets only) (pcs.) Ammo Pack ø32mm Paper eel Bulk (Bag) c Lead Type Lead Type Straight Type Q55B Q91A Q91J Lead Length (H) 25.mm min. 2.±1.mm Lead Type Inside Crimp Lead Length (from bottom of the crimp) K1B 26.±1.mm c Taping Dimensions DSS1_Q91 18.±.5 9.+/ / ±1.3 *1 3.85± ± / / max. ±1. ø4.± max..7± max. 1. max. 1.5± ±.5 *1 The bottom of the dielectric may be exposed. *2 If a hole is on the top of the ferrite bead, the bead should not be exposed. 7.5 max. 2.± to -1. ø.6 1. max. *2 VFC2H_M1 M1A M1J 18.±1.mm (in mm) Lead Type Microchip Transformer (Balun) EMI Suppression Packaging Filters 18.±.5 9.+/ / max. 6.35± ± ± max. 1 2 (2) (1) 5.+.8/-.2 ±1. ø4.±.1 1.5± ±1..6± to max. 1. max. 1. max. 12.±.5 ø

146 D p Micro Chip Transformer (Balun) ing () D q W w 21 e B r t 75 y 11 u T i L o qproduct ID yport Impedance Product ID Port Impedance D Micro Chip Transformer 75 75Ω wstructure W Structure Winding Type ucharacteristics Impedance atio 11 one to one edimensions (LgW) Dimensions (LgW) EIA iough Frequency ange 21 2.g1.2mm 85 T S rtype of Transformer Type of Transformer opackaging B Balun K tcategory L Category B For Automotive Infotainment ough Frequency ange 5MHz to 87MHz 95MHz to 215MHz Packaging Embossed Taping (ø33mm eel) Embossed Taping (ø18mm eel) Bulk Lead Type 144

147 Microchip Transformer (Balun) For TV Tuner DW21BSeries 85/212 (inch/mm) 85 size, wire-wound type. (Balun) c Appearance/ Dimensions 2.±.2 1.2±.2 1.2±.2 (.17) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 1 B Packing in Bulk 5 (1) (2) (4) (3) (.45) (.45) (.4) (.4) (1) : Unbalance port (2) (3) : Balance port (4) : GND : Electrode (in mm) c Equivalent Circuit Unbalanced Balanced 1 (1) (2) (4) (3) Balanced 2 No polarity. c ated Value (p: packaging code) For Infotainment c Insertion Loss Characteristics DW21B7511S For Powertrain/Safety Frequency ange Port Impedance c CM Characteristics DW21B7511S 45 Insertion Loss at Freq. ange (max.) efer to pages from p.147 to p.148 for mounting information. CM at Freq. ange (min.) ated Power DW21B7511Sp 1 to 1.5GHz dB 2dB 27dBm DW21B7511Tp 5 to 87MHz dB 2dB 27dBm Operating Temperature ange: Only for reflow soldering. Insertion Loss (db) CM (db) c Insertion Loss Characteristics DW21B7511T Insertion Loss (db) c CM Characteristics DW21B7511T CM (db) Lead Type 145

148 Dp Microchip Transformer (Balun)!Caution/Notice o ating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. o Soldering and Mounting 1. Self-heating Please provide special attention when mounting chip Micro Chip Transformer (DW) series in close proximity to other products that radiate heat. The heat generated by other products may deteriorate the insulation resistance and cause excessive heat in this component.!caution 2. Mounting Direction Mount Micro Chip Transformer in right direction. Wrong direction, which is 9 degree rotated from right direction, the characteristics does not come out as Micro Chip Transformer or causes not only open or short circuit but also flames or other serious trouble. right direction wrong direction Microchip Transformer!Caution/Notice (Balun) EMI Suppression Filters Microchip Transformer SMD (Balun) Type Lead Type o Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. <Storage and Handling equirements> 1. Storage Period DW series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -1 to +4 degree C elative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Notice o Handling 1. esin Coating The impedance value may change due to high curestress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention in selecting resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 2. Handling of a Substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 146

149 D p Microchip Transformer (Balun) Soldering and Mounting 1. Standard Land Pattern Dimensions Series Standard Land Pattern Dimensions Land Pattern + Solder esist Land Pattern Solder esist (in mm) DW21 oeflow Soldering DW21 * *2 1.2 *1 * 1 : If the pattern is made with wider than 1.2mm (DW21) it may result in components turning around, because melting speed is different. In the worst case, short circuit between lines may occur. * 2 : If the pattern is made with less than.4mm, in the worst case, short circuit between lines may occur due to spread of soldering paste or mount placing accuracy. * 3 : If the pattern is made with wider than.8mm (DW21), the bending strength will be reduced. Do not use gild pattern; excess soldering heat may dissolve metal of a copper wire. 2. Solder Paste Printing and Adhesive Application When reflow soldering the Micro Chip Transformer, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB Series and may crack. In contrast, if too little solder is applied, there is the potential that the termination strength will be insufficient, creating the potential for detachment. Standard land dimensions should be used for resist and copper foil patterns. (in mm) Solder Paste Printing DW21 ocoat the solder paste a thickness: 1-15μm Standard Soldering Conditions (1) Soldering Methods Use reflow soldering methods only. Use standard soldering conditions when soldering Micro Chip Transformer. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Solder: Use Sn-3.Ag-.5Cu solder. Flux: o Use osin-based flux, (with converting chlorine content.6 to.1(wt)%.), but not highly acidic flux (with Halogen content exceeding.2(wt)% conversion to chlorine). o Do not use water-soluble flux. Continued on the following page. Microchip Transformer SMD (Balun) Type Lead Type Microchip Soldering Transformer and Mounting (Balun) EMI Suppression Filters 147

150 Dp Microchip Transformer (Balun) Soldering and Mounting (2) Soldering profile oeflow Soldering profile (Sn-3.Ag-.5Cu) Temperature ( C) T2 T1 Pre-heating t1 t2 T4 T3 Limit Profile Standard Profile DW Series 9s±3s time (s) Standard Profile Limit Profile Heating Peak temperature Heating Peak temperature Cycle of reflow Cycle of reflow Temp. (T1) Time. (t1) (T2) Temp. (T3) Time. (t2) (T4) 22 C min. 3 to 6s 245±3 C 2 times max. 23 C min. 6s max. 26 C/1s 2 times max. (3) eworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating : 15 C 6s min. Soldering iron power output : 3W max. Temperature of soldering iron tip / Soldering time : 28 C max./1s max. or 35 C max./3s max. For additional methods of reworking with a soldering iron, please contact Murata engineering. 4. Cleaning Microchip Soldering Transformer and Mounting (Balun) EMI Suppression Filters Microchip Transformer SMD (Balun) Type Lead Type Do not clean. 148

151 D p Microchip Transformer (Balun) Packaging c Minimum Quantity and Dimensions of 8mm Width Embossed Tape 2.±.5 4.±.1 4.±.1 a +.1 ø ±.1 3.5±.5 8. <Embossed> c d b Direction of feed DW21B a Dimension of the cavity is measured at the bottom side. Dimensions b c d ø18mm reel Minimum Qty. (pcs.) Microchip Transformer SMD (Balun) Type Lead Type Microchip Transformer Packaging (Balun) EMI Suppression Filters Embossed Tape ø33mm reel Embossed Tape Bulk (in mm) 149

152 Memo 15

153 Chip Inductors Contents Classification and Structure of Chip Inductors 152 Product Guide 154 ainductors for Power Lines ing 156 Product Detail 158!Caution/Notice 189 Soldering and Mounting 191 Packaging 195 ainductors for General Circuits ing 197 Product Detail 198!Caution/Notice 22 Soldering and Mounting 23 Packaging 26 af Inductors ing 27 Product Detail 28!Caution/Notice 228 Soldering and Mounting 23 Packaging 233 Inductors for Power Lines Inductors for General Circuits F Inductors

154 Classification and Structure of Chip Inductors oline Up and Applications for Chip Inductors Line Up Applications For Power Lines / For Low Frequency Circuits (Under 1MHz) Wire Wound Type Ferrite Core Multilayer Type Ferrite Core LQH Series (With some exceptions.) LQM Series For Voltage Conversion For Choke For esonance Circuits For Low Frequency Filter Circuits Wire Wound Type Non-magnetic Core LQW_A Series F Inductors (Greater than 1MHz) Multilayer Type Non-magnetic Material LQG Series For Impedance Matching For High Frequency Filter Circuits For F Choke Film Type Non-magnetic Material LQP Series 152

155 oconstruction and Features of Chip Inductors Construction Features Wire Wound Type Ferrite core For Power Lines / For General Circuits (Under 1MHz) Wire Some products are coated with magnetic resin. Electrode Multilayer Type Coil pattern Wide inductance range Good DC bias current characteristics Electrode Small and lightweight Low DC resistance Ferrite Wire Wound Type For adio Frequency Wire esin coating on the top Non-magnetic ceramic core High Q Large inductance Electrode F Inductors (Greater than 1MHz) Multilayer Type Coil pattern Outer electrode Non-magnetic ceramic Industrial standard design Film Type Inner electrode, which is produced using photolithography process Small size, but high Q Outer electrode 153

156 Chip Inductors Product Guide Murata's LQp series of chip inductors (chip coils) consists of compact, high-performance inductors. Their innovative coil and case structures mean low DC resistance and outstanding high-frequency characteristics. The series is designed for a variety of applications, facilitating component selection for individual circuit requirements. Inductors for Power Lines Inductors for General Circuits F Inductors LQH2HP_J LQH3NP_J LQH32P_N LQH32P_NC LQH43P_26 LQH44P_G LQH5BP_T LQH32D_23 LQH32D_53 LQH32CH_23 LQH32CH_33 LQH32CH_53 LQM21P_C LQM21P_G LQM21P_GC LQM21P_G LQM2MP_G LQM2HP_G LQM2HP_GS LQM2HP_GC LQM2HP_J LQM2HP_JC LQM2HP_E LQH31H_3 LQH43N_3 LQG15H_2 LQG18HH_ LQP3TN_2 LQW15AN_ LQW15AN_1 LQW18AN_ LQW18AN_1 p183 p171 p173 p175 p177 p179 p181 p185 p186 p187 p187 p188 p158 p159 p16 p161 p162 p166 p168 p169 p164 p165 p17 p198 p199 p28 p21 p212 p216 p222 p224 p227 Structure Wire Wound Type (Ferrite Core) Multilayer Type (Ferrite Core) Wire Wound Type (Ferrite Core) Multilayer Type (Non-Magnetic Core) Film Type (Non-Magnetic Core) Wire Wound Type (Non-Magnetic Core) Size in inch (in mm) 18 (252) 1212 (33) 121 (3225) 121 (3225) 1812 (4532) 1515 (44) 22 (55) 121 (3225) 121 (3225) 121 (3225) 121 (3225) 121 (3225) 85 (212) 85 (212) 85 (212) 85 (212) 86 (216) 18 (252) 18 (252) 18 (252) 18 (252) 18 (252) 18 (252) 126 (3216) 1812 (4532) 42 (15) 63 (168) 21 (63) 42 (15) 42 (15) 63 (168) 63 (168) 1.nH.6nH 1n 1.2nH 1.5nH 1.3nH 2.2nH 2.2nH 8.4nH Inductance ange (H) 1n 1μ 1μ 1μ.47μH 22μH CAUTION: Use rosin-based flux, but not strong acidic flux (with chlorine content exceeding.2wt%) when soldering chip inductors (chip coils). Do not use water-soluble flux. 1n.15μH 54nH 33nH.68μH.47μH.47μH.47μH 1.μH.68μH.47μH.47μH.47μH.47μH 12nH 12nH 1.μH 1.μH 1.μH 1.μH 1.μH 1.μH 1.μH 1.μH 1.μH 1.μH 2.2μH 27nH 27nH.56μH 88nH 47nH 2.2μH 3.3μH 2.2μH 4.7μH 4.7μH 4.7μH 4.7μH 4.7μH 3.3μH 2.2μH 1μH 22μH 22μH 22μH 22μH 47μH 47μH 12μH 1μH 22μH 1m 33μH 1m 22μH Inductance Lineup : E-24 or Higher : E-12 :.1nH Step : Other *There are some items that do not match to E step. 154

157 Inductors for Power Lines Inductors for General Circuits F Inductors LQH2HP_J LQH3NP_J LQH32P_N LQH32P_NC LQH43P_26 LQH44P_G LQH5BP_T LQH32D_23 LQH32D_53 LQH32CH_23 LQH32CH_33 LQH32CH_53 LQM21P_C LQM21P_G LQM21P_GC LQM21P_G LQM2MP_G LQM2HP_G LQM2HP_GS LQM2HP_GC LQM2HP_J LQM2HP_JC LQM2HP_E LQH31H_3 LQH43N_3 LQG15H_2 LQG18HH_ LQP3TN_2 LQW15AN_ LQW15AN_1 LQW18AN_ LQW18AN_1 p183 p171 p173 p175 p177 p179 p181 p185 p186 p187 p187 p188 p158 p159 p16 p161 p162 p166 p168 p169 p164 p165 p17 p198 p199 p28 p21 p212 p216 p222 p224 p227 ated Current (A) 1m 1m mA 2.75A 3mA 6mA 1mA 11mA 8mA 11mA 75mA 57mA 2.86A 2mA 2.55A 55mA 2.9A 24mA 3.3A 25mA 25mA 18mA 41mA 2.5A 1.5A 4A 8mA 1A 8mA 45mA 1.45A 1A 6mA 1.1A 8mA 1.3A 8mA 9mA 8mA 1.3A 1.1A 1.6A 1.1A 1.8A 1A 1.1A 8mA 1.5A 3mA 1A 1.5A 1A 1.5A 5mA 1.5A 92mA 2mA 1.1A 85mA 1A 64mA 1.2A 85mA 55mA 1.4A 155

158 Inductors for Power Lines ing F Inductors Inductors for General Circuits Inductors for Power Lines () LQ q M w qproduct ID Product ID LQ wstructure H M edimensions (LgW) 21 2M 2H 3N B Chip Inductors (Chip Coils) Structure Wire Wound Type (Ferrite Core) Multilayer Type (Ferrite Core) Dimensions (LgW) 2.g1.25mm 2.g1.6mm 2.5g2.mm 3.g3.mm 3.2g2.5mm 4.5g3.2mm 4.g4.mm 5.g5.mm rapplications and Characteristics D C P tcategory H 21 e P r Series LQH LQH LQM/LQH t Automotive 54 Size (in inch) Applications and Characteristics for Choke for Choke (Coating Type) for Power Line yinductance Expressed by three-digit alphanumerics. The unit is micro-henry (μh). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. If there is a decimal point, it is expressed by the capital letter "." In this case, all figures are significant digits. If inductance is less than.1μh, the inductance code is expressed by a combination of two figures and the capital letter "N," and the unit of inductance is nano-henry (nh). The capital letter "N" indicates the unit of "nh," and also expresses a decimal point. In this case, all figures are significant digits. y M u G i o Category Infotainment Powertrain/Safety D! uinductance Tolerance Inductance Tolerance K ±1% M ±2% N ±3% ifeatures (Except for LQHppP/LQMppP) Features Series 2 Standard Type 3 Low DC esistance LQH32C/32D 5 Low Profile Type ithickness (LQHppP/LQMppP LQH43P) Dimensions (T) C.5mm E.7mm G.9mm J 1.1mm N 1.55mm T 2.mm oelectrode (Except for LQHppP/LQMppP) Electrode Series Sn LQM/LQW 3 LF Solder LQH ospecification (LQHppP/LQMppP LQH43P) Specification /S Standard Type C Good Bias Current Characteristics Type Low DC esistance Type Continued on the following page. 156

159 Inductors for Power Lines ing iothickness (LQH43P Only) Dimensions (T) mm!Packaging Packaging Series K L B D Embossed Taping (ø33mm eel) Embossed Taping (ø18mm eel) Bulk Paper Taping (ø18mm eel) LQH*1 LQH/LQM2HP/LQM2MP LQM LQM21P *1 Except for LQH2HP_J/LQH3NP_J F Inductors Inductors for General Circuits Inductors for Power Lines 157

160 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM21P_CSeries 85/212 (inch/mm) Size 85 (212) in inch (in mm),.55mm max. Thickness c Appearance/ Dimensions.5±.2 2.±.2 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Class of Magnetic Shield: Magnetic shield of ferrite Ferrite.5±.5 Inductance 1.25±.2 (in mm) Operating Temperature ange: c Packaging Inductance Test Frequency Packaging Minimum Quantity D ø18mm Paper Taping 4 B Packing in Bulk 1 ated Current efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQM21P47MCp.47µH 2% 1MHz 11mA.12 25% 1MHz LQM21P1MCp 1.µH 2% 1MHz 8mA.19 25% 9MHz LQM21P15MCp 1.5µH 2% 1MHz 7mA.26 25% 7MHz LQM21P22MCp 2.2µH 2% 1MHz 6mA.34 25% 5MHz FlowOK Thickness.55 mm eflow max. OK c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 2.2μH 2.2μH L (μh) 1 1.5μH 1.μH.47μH Inductance (μh) 1 1.5μH 1.μH.47μH Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 1.5μH 1.μH.47μH Current (ma) 158

161 Inductors for Power Lines Multilayer Type (Ferrite Core) LQM21P_GSeries 85/212 (inch/mm) Size 85 (212) in inch (in mm), 1.mm max. Thickness c Appearance/ Dimensions.5±.2 c ated Value (p: packaging code) 2.± ±.15.9±.1 (in mm) c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 B Packing in Bulk 1 FlowOK Thickness 1. mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. ated Current *1 DC Self-esonance Inductance For Infotainment For Powertrain/Safety Ambient Temperature 85 C Ambient Temperature 125 C esistance Frequency (min.) LQM21P47MGp.47µH 2% 1.3A.95A.94 (max.) /.75 (typ.) 1MHz LQM21P54MGp.54µH 2% 1.3A.95A.94 (max.) /.75 (typ.) 1MHz LQM21P33MGp 3.3µH 2%.8A.55A.27 (max.) /.165 (typ.) 3MHz LQM21P33NGp 3.3µH 3%.8A.55A.27 (max.) /.165 (typ.) 3MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: *1 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 3.3μH 3.3μH L (μh) 1.54μH Inductance (μh) 1.54μH.47μH.47μH Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH.54μH.47μH Current (ma) c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for LQM21P_G series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (A) ated Current at 85 C ated Current at 125 C 85 Operating Temperature ( C)

162 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM21P_GCSeries 85/212 (inch/mm) Bias Current Characteristics Improved c Appearance/ Dimensions.5±.2 c ated Value (p: packaging code) For Infotainment 2.± ±.15 For Powertrain/Safety Inductance.9±.1 (in mm) c Packaging Inductance Test Frequency Packaging Minimum Quantity D ø18mm Paper Taping 2 B Packing in Bulk 1 ated Current eflow OK Thickness 1. mm max. FlowOK Bias efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQM21P1NGCp 1.µH 3% 1MHz 9mA.1 25% 5MHz LQM21PH22MGCp 2.2µH 2% 1MHz 8mA.23 25% 4MHz LQM21P22NGCp 2.2µH 3% 1MHz 8mA.23 25% 4MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 2.2μH 2.2μH L (μh) 1 1.μH Inductance (μh) 1 1.μH Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 1.μH Current (ma) 16

163 Inductors for Power Lines Multilayer Type (Ferrite Core) LQM21P_GSeries 85/212 (inch/mm) Low DC esistance Type c Appearance/ Dimensions.5±.2 c ated Value (p: packaging code) For Infotainment 2.± ±.15 For Powertrain/Safety Inductance.9±.1 (in mm) c Packaging Inductance Test Frequency Packaging Minimum Quantity D ø18mm Paper Taping 4 B Packing in Bulk 1 ated Current eflow OK Thickness Low dc 1. mm max. FlowOK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQM21P1NGp 1.µH 3% 1MHz 13mA.66 25% 5MHz LQM21P33MGp 3.3µH 2% 1MHz 1mA.15 25% 3MHz LQM21P33NGp 3.3µH 3% 1MHz 1mA.15 25% 3MHz LQM21P47MGp 4.7µH 2% 1MHz 8mA.23 25% 3MHz LQM21P47NGp 4.7µH 3% 1MHz 8mA.23 25% 3MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 4.7μH 3.3μH 4.7μH 3.3μH L (μh) 1 1.μH Inductance (μh) 1 1.μH Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 3.3μH 1.μH Current (ma) 161

164 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2MP_GSeries 86/216 (inch/mm) Size 86 (216) in inch (in mm), 1.mm max. Thickness c Appearance/ Dimensions.5±.2 2.±.15 c ated Value (p: packaging code).9±.1 1.6±.15 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 ated Current *1 Inductance For Infotainment For Powertrain/Safety Ambient Temperature 85 C Ambient Temperature 125 C FlowOK Thickness 1. mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQM2MP47MGp.47µH 2% 1.6A 1.2A.75 (max.) /.6 (typ.) 1MHz LQM2MP47NGp.47µH 3% 1.6A 1.2A.75 (max.) /.6 (typ.) 1MHz LQM2MP1NGp 1.µH 3% 1.4A 1.A.17 (max.) /.85 (typ.) 6MHz LQM2MP15MGp 1.5µH 2% 1.2A.9A.138 (max.) /.11 (typ.) 5MHz LQM2MP15NGp 1.5µH 3% 1.2A.9A.138 (max.) /.11 (typ.) 5MHz LQM2MP22MGp 2.2µH 2% 1.2A.9A.138 (max.) /.11 (typ.) 4MHz LQM2MP22NGp 2.2µH 3% 1.2A.9A.138 (max.) /.11 (typ.) 4MHz LQM2MP33NGp 3.3µH 3% 1.2A.9A.15 (max.) /.12 (typ.) 3MHz LQM2MP47MGp 4.7µH 2% 1.1A.8A.175 (max.) /.14 (typ.) 2MHz LQM2MP47NGp 4.7µH 3% 1.1A.8A.175 (max.) /.14 (typ.) 2MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: *1 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 4.7μH 4.7μH 3.3μH 3.3μH L (μh) 1 2.2μH 1.5μH 1.μH.47μH Inductance (μh) 1 1.5μH 1.μH.47μH 2.2μH Current (ma) Continued on the following page. 162

165 LQM2MP_G c Temperature ise Characteristics (Typ.) Temperature ( C) μH 3.3μH 4.7μH.47μH 1.μH 1.5μH Current (ma) c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for LQM2MP_G series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (A) ated Current at 85 C ated Current at 125 C 85 Operating Temperature ( C) 125 Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines 163

166 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_JSeries 18/252 (inch/mm) Size 18 (252) in inch (in mm), 1.2mm max. Thickness c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code) For Infotainment 1.1±.1 For Powertrain/Safety 2.±.2 Inductance (in mm) c Packaging Inductance Test Frequency Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 ated Current FlowOK Thickness 1.2 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQM2HP1MJp 1.µH 2% 1MHz 15mA.9 25% 7MHz LQM2HP22MJp 2.2µH 2% 1MHz 1mA.12 25% 4MHz LQM2HP33MJp 3.3µH 2% 1MHz 1mA.12 25% 3MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 3.3μH 2.2μH 3.3μH 2.2μH L (μh) 1 1.μH Inductance (μh) 1 1.μH Current (ma) c Temperature ise Characteristics (Typ.) μH Temperature ( C) μH 3.3μH Current (ma) 164

167 Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_JCSeries 18/252 (inch/mm) Bias Current Characteristics Improved c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code) 1.1±.1 2.±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 efer to pages from p.191 to p.194 for mounting information. Inductance ated DC Self-esonance Inductance For Infotainment For Powertrain/Safety Test Frequency Current esistance Frequency (min.) LQM2HP1MJCp 1.µH 2% 1MHz 15mA.86 25% 5MHz LQM2HP22NJCp 2.2µH 3% 1MHz 1mA % 3MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: eflow OK Thickness 1.2 mm max. FlowOK Bias Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 2.2μH L (μh) 2.2μH Inductance (μh) 1 1.μH 1.μH Current (ma) c Temperature ise Characteristics (Typ.) μH 1.μH Temperature ( C) Current (ma) 165

168 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_GSeries 18/252 (inch/mm) Size 18 (252) in inch (in mm), 1.mm max. Thickness c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code).9±.1 2.±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 Thickness 1. mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC ated Current *1 Self-esonance Inductance For Infotainment For Powertrain/Safety esistance Ambient Temperature 85 C Ambient Temperature 125 C Frequency (min.) LQM2HP47MGp.47µH 2%.5 (max.)/.4 (typ.) 1.8A 1.3A 1MHz LQM2HP1MGp 1.µH 2%.69 (max.)/.55 (typ.) 1.6A 1.2A 6MHz LQM2HP15MGp 1.5µH 2%.88 (max.)/.7 (typ.) 1.5A 1.1A 5MHz LQM2HP22MGp 2.2µH 2%.1 (max.)/.8 (typ.) 1.3A.97A 4MHz LQM2HP33MGp 3.3µH 2%.125 (max.)/.1 (typ.) 1.2A.9A 3MHz LQM2HP47MGp 4.7µH 2%.138 (max.)/.11 (typ.) 1.1A.82A 25MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: *1 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. FlowOK c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 4.7μH L (μh) μH 3.3μH 2.2μH Inductance (μh) 1 3.3μH 2.2μH 1.5μH 1.μH.47μH 1.5μH 1.μH.47μH Current (ma) Continued on the following page. 166

169 LQM2HP_G c Temperature ise Characteristics (Typ.) Temperature ( C) μH 3.3μH 4.7μH 1.μH 1.5μH.47μH Current (ma) c Derating of ated Current In operating temperature exceeding +85 C, derating of current is necessary for LQM2HP_G series. Please apply the derating curve shown in chart according to the operating temperature. Derating of ated Current ated Current (A) ated Current at 85 C ated Current at 125 C 85 Operating Temperature ( C) 125 Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines 167

170 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_GSSeries 18/252 (inch/mm) Size 18 (252) in inch (in mm), 1.mm max. Thickness c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code).9±.1 2.±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 Thickness 1. mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. Inductance ated DC Self-esonance Inductance For Infotainment For Powertrain/Safety Test Frequency Current esistance Frequency (min.) LQM2HP22MGSp 2.2µH 2% 1MHz 11mA.18 25% 4MHz LQM2HP33MGSp 3.3µH 2% 1MHz 15mA.21 25% 2MHz LQM2HP47MGSp 4.7µH 2% 1MHz 1mA.25 25% 2MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: FlowOK c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 4.7μH 3.3μH L (μh) 1 2.2μH Inductance (μh) 4.7μH 3.3μH 2.2μH Current (ma) c Temperature ise Characteristics (Typ.) 5 45 Temperature ( C) μH 2.2μH 3.3μH Current (ma) 168

171 Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_GCSeries 18/252 (inch/mm) Bias Current Characteristics Improved c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code).9±.1 2.±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 eflow OK Thickness 1. mm max. FlowOK Bias efer to pages from p.191 to p.194 for mounting information. Inductance ated DC Self-esonance Operating Inductance For Infotainment For Powertrain/Safety Test Frequency Current esistance Frequency (min.) Temperature ange LQM2HP1MGCp 1.µH 2% 1MHz 15mA.8 25% 5MHz LQM2HP33MGCp 3.3µH 2% 1MHz 1mA.16 25% 3MHz LQM2HP47MGCp 4.7µH 2% 1MHz 8mA.18 25% 25MHz Class of Magnetic Shield: Magnetic shield of ferrite Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 4.7μH 3.3μH 4.7μH 3.3μH L (μh) 1 1.μH Inductance (μh) 1 1.μH Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 3.3μH 1.μH Current (ma) 169

172 Inductors for Power Lines Multilayer Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Multilayer Type (Ferrite Core) LQM2HP_ESeries 18/252 (inch/mm) Size 18 (252) in inch (in mm),.8mm max. Thickness c Appearance/ Dimensions.6±.2 2.5±.2 c ated Value (p: packaging code).7±.1 2.±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 3 B Packing in Bulk 1 FlowOK Thickness.8 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. Inductance ated DC Self-esonance Inductance For Infotainment For Powertrain/Safety Test Frequency Current esistance Frequency (min.) LQM2HP56MEp.56µH 2% 1MHz 15mA.6 25% 7MHz Class of Magnetic Shield: Magnetic shield of ferrite Operating Temperature ange: c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1.56μH L (μh) Inductance (μh).56μh Current (ma) c Temperature ise Characteristics (Typ.) Temperature ( C) μH Current (ma) 17

173 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH3NP_JSeries 1212/33 (inch/mm) Low DC esistance Type, 1.2mm max. Thickness c Appearance/ Dimensions 3.±.2.9±.2.9±.2 c ated Value (p: packaging code) 3.± ±.2 1.1±.1 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 ated Current *1 ated Current (Based on Temperature ise) *2 Inductance (Based on Inductance For Infotainment For Powertrain/Safety *3 Change) Ambient Temperature 85 C Ambient Temperature 15 C*4 eflow OK Thickness Low dc 1.2 mm max. efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH3NP68NJp.68µH 3% 27mA 286mA 128mA.32 2% 13MHz LQH3NP1MJp 1.µH 2% 225mA 278mA 123mA.4 2% 1MHz LQH3NP15MJp 1.5µH 2% 195mA 251mA 11mA.49 2% 6MHz LQH3NP22MJp 2.2µH 2% 18mA 22mA 98mA.68 2% 45MHz LQH3NP33MJp 3.3µH 2% 135mA 17mA 75mA.95 2% 45MHz LQH3NP47MJp 4.7µH 2% 118mA 158mA 71mA.12 2% 4MHz LQH3NP68MJp 6.8µH 2% 97mA 136mA 61mA.18 2% 35MHz LQH3NP1MJp 1µH 2% 81mA 12mA 53mA.24 2% 3MHz LQH3NP15MJp 15µH 2% 65mA 87mA 37mA.38 2% 25MHz LQH3NP22MJp 22µH 2% 52mA 8mA 35mA.5 2% 2MHz LQH3NP33MJp 33µH 2% 42mA 63mA 28mA.79 2% 15MHz LQH3NP47MJp 47µH 2% 36mA 57mA 24mA 1. 2% 1MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of initial inductance value range. *2 Keep the temperature (ambient temperature plus self-generation of heat) under 125. *3 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. (Ambient temperature 85 ). *4 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 2 max. (Ambient temperature 85 to 15 ) Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) μH L (μh) μH 33μH 22μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.5μH 1.μH.68μH Inductance (μh) μH 22μH.68μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.5μH 1.μH Current (ma) Continued on the following page. 171

174 LQH3NP_J F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 33μH 15μH 22μH 1μH 6.8μH 4.7μH 3.3μH 1.5μH 2.2μH 1.μH.68μH Current (ma) 172

175 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32P_NSeries 121/3225 (inch/mm) 1.7mm max. Thickness c Appearance/ Dimensions.9±.3 c ated Value (p: packaging code) A 2.7±.2 3.2±.3 1.3±.2 A: 2.8 max. 2.5±.2 2.5±.2 Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1*3 ated Current (Based on Temperature ise) *2*3 Inductance (Based on Inductance For Infotainment For Powertrain/Safety Change) Ambient Temperature 85 C Ambient Temperature 15 C (in mm) c Packaging DC esistance Thickness 1.7mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. Self-esonance Frequency (min.) LQH32P47NNp.47µH 3% 34mA 255mA 16mA.3 2% 1MHz LQH32P1NNp 1.µH 3% 23mA 25mA 132mA.45 2% 1MHz LQH32P15NNp 1.5µH 3% 175mA 175mA 11mA.57 2% 7MHz LQH32P22NNp 2.2µH 3% 155mA 16mA 97mA.76 2% 7MHz LQH32P33NNp 3.3µH 3% 125mA 12mA 67mA.12 2% 5MHz LQH32P47NNp 4.7µH 3% 1mA 1mA 53mA.18 2% 4MHz LQH32P68NNp 6.8µH 3% 85mA 85mA 51mA.24 2% 4MHz LQH32P1MNp 1µH 2% 75mA 7mA 38mA.38 2% 3MHz LQH32P15MNp 15µH 2% 6mA 52mA 32mA.57 2% 2MHz LQH32P22MNp 22µH 2% 5mA 45mA 24mA.81 2% 2MHz LQH32P33MNp 33µH 2% 38mA 39mA 19mA % 13MHz LQH32P47MNp 47µH 2% 33mA 31mA 14mA % 11MHz LQH32P68MNp 68µH 2% 28mA 275mA 12mA % 11MHz LQH32P11MNp 1µH 2% 18mA 25mA 11mA 2.7 2% 8MHz LQH32P121MNp 12µH 2% 17mA 2mA 8mA % 8MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of nomonal inductance value. *2 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. *3 Keep the temperature (ambient temperature plus self-generation of heat) under ±.15.9±.3 A Continued on the following page. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines 173

176 LQH32P_N F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Inductance-Frequency Characteristics (Typ.) L (μh) μH 1μH 68μH 47μH 33μH 22μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.5μH 1.μH.47μH c Temperature ise Characteristics (Typ.) Temperature ise ( C) 5 1μH 47μH μH 1μH 4.7μH 2.2μH 1.μH c Inductance-Current Characteristics (Typ.) Inductance (μh) μH 1μH 4.7μH 2.2μH 1.μH Current (ma) Current (ma) 174

177 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32P_NCSeries 121/3225 (inch/mm) 1.7mm max. Thickness, Bias Current Characteristics Improved c Appearance/ Dimensions.9±.3 2.7±.2 3.2±.3 1.3±.2 c ated Value (p: packaging code) 1.55±.15.9±.3 2.5±.2 2.5±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1*3 ated Current (Based on Temperature ise) *2*3 Inductance (Based on Inductance For Infotainment For Powertrain/Safety Change) Ambient Temperature 85 C Ambient Temperature 15 C eflow OK efer to pages from p.191 to p.194 for mounting information. DC esistance Thickness 1.7mm max. Bias Self-esonance Frequency (min.) LQH32P47NNCp.47µH 3% 44mA 29mA 149mA.24 2% 1MHz LQH32P1NNCp 1.µH 3% 3mA 25mA 138mA.36 2% 1MHz LQH32P15NNCp 1.5µH 3% 26mA 21mA 111mA.53 2% 7MHz LQH32P22NNCp 2.2µH 3% 2mA 185mA 91mA.64 2% 7MHz LQH32P33NNCp 3.3µH 3% 19mA 155mA 8mA.1 2% 5MHz LQH32P47NNCp 4.7µH 3% 16mA 12mA 61mA.155 2% 4MHz LQH32P68NNCp 6.8µH 3% 13mA 11mA 55mA.22 2% 4MHz LQH32P1MNCp 1µH 2% 1mA 9mA 45mA.295 2% 3MHz LQH32P15MNCp 15µH 2% 8mA 7mA 33mA.475 2% 2MHz LQH32P22MNCp 22µH 2% 65mA 55mA 27mA.685 2% 2MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of nomonal inductance value. *2 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. *3 Keep the temperature (ambient temperature plus self-generation of heat) under 125. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) 1 L (μh) μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH Inductance (μh) μH 1μH 4.7μH 2.2μH 1 1.5μH 1.μH.47μH 1.μH Current (ma) Continued on the following page. 175

178 LQH32P_NC F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ise ( C) μH 1μH 4.7μH 2.2μH 1.μH Current (ma) 176

179 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH43P_26Series 1812/4532 (inch/mm) Size 1812 (4532) in inch (in mm) c Appearance/ Dimensions 1.min. 3.6±.2 4.5±.3 1.min. c ated Value (p: packaging code) 2.6±.2 3.2±.2 3.2±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 5 K ø33mm Embossed Taping 25 ated Current *1*3 ated Current (Based on Temperature ise) *2*3 Inductance (Based on Inductance For Infotainment For Powertrain/Safety Change) Ambient Temperature 85 C Ambient Temperature 15 C Thickness 2.8 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH43P1N26p 1.µH 3% 34mA 33mA 141mA.26 2% 1MHz LQH43P22M26p 2.2µH 2% 23mA 25mA 112mA.42 2% 45MHz LQH43P33M26p 3.3µH 2% 18mA 21mA 1mA.52 2% 4MHz LQH43P47M26p 4.7µH 2% 14mA 16mA 78mA.75 2% 35MHz LQH43P68M26p 6.8µH 2% 12mA 14mA 76mA.98 2% 3MHz LQH43P82M26p 8.2µH 2% 11mA 13mA 67mA.128 2% 25MHz LQH43P1M26p 1µH 2% 15mA 117mA 62mA.147 2% 2MHz LQH43P22M26p 22µH 2% 7mA 78mA 4mA.327 2% 15MHz LQH43P47M26p 47µH 2% 47mA 52mA 28mA.718 2% 8MHz LQH43P11M26p 1µH 2% 32mA 32mA 18mA % 4MHz LQH43P151M26p 15µH 2% 28mA 26mA 14mA % 3MHz LQH43P221M26p 22µH 2% 22mA 24mA 13mA 2.9 2% 2MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of nomonal inductance value. *2 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. *3 Keep the temperature (ambient temperature plus self-generation of heat) under 125. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) L (μh) μH 15μH 1μH 47μH 1μH 22μH 8.2μH 6.8μH 4.7μH 3.3μH Inductance (μh) μH 15μH 1μH 47μH 22μH 1μH 8.2μH 6.8μH 4.7μH 3.3μH 1 2.2μH 1.μH 1 2.2μH 1.μH Current (ma) Continued on the following page. 177

180 LQH43P_26 F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 22μH 47μH 6.8μH 35 15μH 8.2μH 3 1μH 22μH 25 1μH μH 2.2μH 1.μH Current (ma) 178

181 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH44P_GSeries 1515/44 (inch/mm) Size 44 (1515) in mm (in inch), 1.mm max. Thickness. Low DC esistance c Appearance/ Dimensions 4.±.1 c ated Value (p: packaging code).9±.1 4.±.1 1.1±.2 1.1±.2 (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 1 K ø33mm Embossed Taping 45 ated Current *1 ated Current (Based on Temperature ise) *2 Inductance (Based on Inductance For Infotainment For Powertrain/Safety *3 Change) Ambient Temperature 85 C Ambient Temperature 15 C*4 eflow OK efer to pages from p.191 to p.194 for mounting information. DC esistance Thickness Low dc 1. mm max. Self-esonance Frequency (min.) LQH44P68NGp.68µH 3% 2.4A 2.5A 1.5A.43 2% 54MHz LQH44P1NGp 1.µH 3% 2.A 2.4A 1.4A.43 2% 5MHz LQH44P22NGp 2.2µH 3% 1.6A 2.A 1.2A.74 2% 45MHz LQH44P33NGp 3.3µH 3% 1.5A 1.7A 1.A.11 2% 25MHz LQH44P47MGp 4.7µH 2% 1.2A 1.6A.96A.13 2% 17MHz LQH44P68MGp 6.8µH 2%.85A 1.4A.84A.17 2% 15MHz LQH44P1MGp 1µH 2%.8A 1.1A.66A.27 2% 13MHz LQH44P15MGp 15µH 2%.64A.9A.54A.42 2% 1MHz LQH44P22MGp 22µH 2%.5A.75A.45A.57 2% 8MHz LQH44P33MGp 33µH 2%.4A.48A.28A 1.4 2% 6MHz LQH44P47MGp 47µH 2%.36A.41A.24A 1.7 2% 6MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of initial inductance value range. *2 Keep the temperature (ambient temperature plus self-generation of heat) under 125. *3 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. (Ambient temperature 85 ). *4 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 2 max. (Ambient temperature 85 to 15 ). Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) L (μh) μH 22μH 15μH 1.μH 1μH 6.8μH 4.7μH 3.3μH Inductance (μh) μH 33μH 2.2μH 22μH 15μH 1μH 6.8μH 4.7μH 3.3μH 1.μH.68μH.68μH Current (ma) Continued on the following page. 179

182 LQH44P_G F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 33μH 22μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.μH.68μH Current (ma) 18

183 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH5BP_TSeries 22/55 (inch/mm) Size 22 (55) in inch (in mm) c Appearance/ Dimensions 5.±.2 5.±.2 1.5±.2 1.5±.2 c ated Value (p: packaging code) 5.±.2 2.±.2 (.2) (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 5 K ø33mm Embossed Taping 3 ated Current *1*3 ated Current (Based on Temperature ise) *2*3 Inductance (Based on Inductance For Infotainment For Powertrain/Safety Change) Ambient Temperature 85 C Ambient Temperature 15 C Thickness 2.2 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH5BP47NTp.47µH 3% 7.7A 4.A 2.5A.12 2% 22MHz LQH5BP1NTp 1.µH 3% 5.8A 3.1A 1.68A.19 2% 9MHz LQH5BP12NTp 1.2µH 3% 5.4A 3.1A 1.68A.19 2% 9MHz LQH5BP15NTp 1.5µH 3% 5.A 3.A 1.63A.24 2% 7MHz LQH5BP22NTp 2.2µH 3% 4.A 2.6A 1.37A.3 2% 55MHz LQH5BP27NTp 2.7µH 3% 3.8A 2.5A 1.23A.35 2% 5MHz LQH5BP33NTp 3.3µH 3% 3.5A 2.3A 1.21A.44 2% 4MHz LQH5BP47NTp 4.7µH 3% 3.A 2.A 1.9A.58 2% 4MHz LQH5BP68NTp 6.8µH 3% 2.5A 1.65A.96A.83 2% 3MHz LQH5BP1MTp 1µH 2% 2.A 1.6A.87A.16 2% 25MHz LQH5BP15MTp 15µH 2% 1.6A 1.2A.62A.187 2% 18MHz LQH5BP22MTp 22µH 2% 1.4A 1.5A.55A.259 2% 15MHz Inductance Test Frequency: 1kHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of nomonal inductance value. *2 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. *3 Keep the temperature (ambient temperature plus self-generation of heat) under 125. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Inductance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) L (μh) μH 1.μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.7μH 2.2μH 1.5μH 1.2μH Inductance (μh) μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.7μH 2.2μH.47μH μH.47μH 1.2μH 1.5μH Current (ma) Continued on the following page. 181

184 LQH5BP_T F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 2.7μH 6.8μH 15μH 3.3μH 1μH 22μH 4.7μH 1.μH 1.5μH.47μH Current (ma) Continued on the following page. 182

185 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH2HP_JSeries 18/252 (inch/mm) Size 18 (252) in inch (in mm), 1.2mm max. Thickness. Low DC esistance c Appearance/ Dimensions.65±.2 c ated Value (p: packaging code) A 2.5±.2 1.1±.1.65±.2 2.±.2 B A: 2.75 max. B: 2.25 max. (in mm) c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 eflow OK Thickness Low dc 1.2 mm max. efer to pages from p.191 to p.194 for mounting information. ated Current *1 ated Current (Based on Temperature ise) *2 DC Self-esonance Inductance (Based on Inductance Frequency For Infotainment For Powertrain/Safety Change) Ambient Temperature 85 C *3 Ambient Temperature 15 C*4 esistance (min.) LQH2HP47NJp.47µH 3% 3.5A 2.75A 1.65A.31 2% 19MHz LQH2HP1NJp 1.µH 3% 2.6A 2.4A 1.44A.48 2% 12MHz LQH2HP12NJp 1.2µH 3% 2.45A 2.7A 1.24A.55 2% 1MHz LQH2HP15NJp 1.5µH 3% 2.2A 1.81A 1.8A.75 2% 95MHz LQH2HP22MJp 2.2µH 2% 1.7A 1.65A.99A.92 2% 5MHz LQH2HP33MJp 3.3µH 2% 1.45A 1.42A.85A.13 2% 45MHz LQH2HP47MJp 4.7µH 2% 1.23A 1.29A.77A.17 2% 4MHz LQH2HP68MJp 6.8µH 2% 1.5A 1.A.6A.26 2% 35MHz LQH2HP1MJp 1µH 2%.83A.83A.49A.38 2% 3MHz LQH2HP15MJp 15µH 2%.69A.71A.42A.55 2% 2MHz LQH2HP22MJp 22µH 2%.53A.54A.32A.84 2% 2MHz Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Inductance Test Frequency: 1MHz Class of Magnetic Shield: Magnetic shield of magnetic powder in resin Operating Temperature ange (Self-temperature rise is included): Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. *1 When applied rated current to the products, inductance will be within 3% of intial inductance value range. *2 Keep the temperature (ambient temperature plus self-generation of heat) under 125. *3 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 4 max. (Ambient temperature 85 ). *4 When applied rated current to the products, temperature rise caused by self-generated heat shall be limited to 2 max. (Ambient temperature 85 to 15 ). c Inductance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) 1 22μH 15μH 1μH 6.8μH 4.7μH 1 22μH 15μH 1μH 6.8μH 4.7μH L (μh) 1 1 Inductance (μh) μH 2.2μH 1.5μH 1.2μH.47μH 1.μH μH 2.2μH 3.3μH 1.μH 1.2μH.47μH Current (ma) Continued on the following page. 183

186 LQH2HP_J F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) c Temperature ise Characteristics (Typ.) Temperature ( C) μH 15μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.5μH 1.2μH 1.μH.47μH Current (ma) 184

187 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32D_23Series 121/3225 (inch/mm) Size 121 (3225) in inch (in mm) c Appearance/ Dimensions 2.5±.2 3.2±.3.9±.3.9±.3 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety 2.±.2 Inductance 2.5±.2 2.5±.2 (in mm) c Packaging ated Current *1 (Based on Inductance Change) Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1 (Based on Temperature ise) Thickness 2.2 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH32D1M23p 1.µH 2% 8mA 8mA.9 3% 96MHz LQH32D22M23p 2.2µH 2% 6mA 6mA.13 3% 64MHz LQH32D33M23p 3.3µH 2% 53mA 53mA.2 3% 5MHz LQH32D47M23p 4.7µH 2% 45mA 45mA.2 3% 43MHz LQH32D1K23p 1µH 1% 3mA 3mA.44 3% 26MHz LQH32D22K23p 22µH 1% 25mA 25mA.71 3% 19MHz LQH32D39K23p 39µH 1% 2mA 2mA 1.2 3% 16MHz LQH32D47K23p 47µH 1% 17mA 17mA 1.3 3% 15MHz LQH32D68K23p 68µH 1% 13mA 13mA 2.2 3% 12MHz LQH32D11K23p 1µH 1% 1mA 1mA 3.5 3% 1MHz LQH32D151K23p 15µH 1% 8mA 8mA 5.1 3% 8.MHz LQH32D221K23p 22µH 1% 7mA 7mA 8.4 3% 6.8MHz LQH32D331K23p 33µH 1% 6mA 6mA 1. 3% 5.6MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange: For refl ow soldering only. *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Impedance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) (Ω) μH 1μH 47μH 22μH 1μH 4.7μH 2.2μH 1.μH Inductance (μh) μH 1μH 47μH 22μH 1μH 4.7μH 2.2μH 1.μH Current (ma) 185

188 Inductors for Power Lines Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32D_53Series 121/3225 (inch/mm) Size 121 (3225) in inch (in mm), 1.7mm max. Thickness. c Appearance/ Dimensions 2.5±.2 3.2±.3.9±.3.9±.3 c ated Value (p: packaging code) For Infotainment A For Powertrain/Safety 1.55±.15 A Inductance A : 2.8 max. 2.5±.2 2.5±.2 (in mm) c Packaging ated Current *1 (Based on Inductance Change) Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1 (Based on Temperature ise) Thickness 1.7mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH32D1M53p 1.µH 2% 1mA 1mA.6 3% 1MHz LQH32D22M53p 2.2µH 2% 79mA 79mA.97 3% 64MHz LQH32D33M53p 3.3µH 2% 71mA 71mA.12 3% 5MHz LQH32D47M53p 4.7µH 2% 65mA 65mA.15 3% 43MHz LQH32D68M53p 6.8µH 2% 54mA 54mA.25 3% 32MHz LQH32D1K53p 1µH 1% 45mA 45mA.3 3% 26MHz LQH32D15K53p 15µH 1% 3mA 3mA.58 3% 26MHz LQH32D22K53p 22µH 1% 25mA 25mA.71 3% 19MHz LQH32D33K53p 33µH 1% 2mA 2mA 1.1 3% 17MHz LQH32D47K53p 47µH 1% 17mA 17mA 1.3 3% 15MHz LQH32D68K53p 68µH 1% 13mA 13mA 2.2 3% 12MHz LQH32D11K53p 1µH 1% 1mA 1mA 3.5 3% 1MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange: For refl ow soldering only. *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. c Impedance-Frequency Characteristics (Typ.) c Inductance-Current Characteristics (Typ.) μH 33μH 68μH 47μH 1μH 1 1 1μH 68μH 47μH 33μH 22μH (Ω) μH 3.3μH 4.7μH 6.8μH 1μH 15μH Inductance (μh) μH 1μH 6.8μH 4.7μH 3.3μH 2.2μH 1.μH μH Current (ma) 186

189 Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32CH_23/LQH32CH_33Series 121/3225 (inch/mm) Size 121 (3225) in inch (in mm) c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment 2.5±.2 3.2±.3.9±.3 2.±.2 1.3±.2 For Powertrain/Safety.9±.3 Fig ±.2 2.5±.2 2.5±.2 A A: 2.8 max. * Please refer to dimension A for LQH32CN_33 (22M, 47M, 1K) types. (See Fig. 1) Inductance 2.5±.2 (in mm) c Packaging ated Current *1 (Based on Inductance Change) Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1 (Based on Temperature ise) FlowOK Thickness 2.2 mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH32CH1M23p 1.µH 2% 8mA 8mA.9 3% 96MHz LQH32CH22M23p 2.2µH 2% 6mA 6mA.13 3% 64MHz LQH32CH47M23p 4.7µH 2% 45mA 45mA.2 3% 43MHz LQH32CH1K23p 1µH 1% 3mA 3mA.44 3% 26MHz LQH32CH22K23p 22µH 1% 25mA 25mA.71 3% 19MHz LQH32CH15M33p.15µH 2% 145mA 145mA.28 3% 4MHz LQH32CH27M33p.27µH 2% 125mA 125mA.34 3% 25MHz LQH32CH47M33p.47µH 2% 11mA 11mA.42 3% 15MHz LQH32CH1M33p 1.µH 2% 1mA 1mA.6 3% 1MHz LQH32CH22M33p 2.2µH 2% 79mA 79mA.97 3% 64MHz LQH32CH47M33p 4.7µH 2% 65mA 65mA.15 3% 43MHz LQH32CH1K33p 1µH 1% 45mA 45mA.3 3% 26MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange (Self-temperature rise is not included): *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines c Impedance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) Impedance (kω) μH 4.7μH 1.μH Inductance (μh) 1 22μH 4.7μH μH DC Current (ma) 187

190 Inductors for Power Lines Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Inductors for Power Lines Wire Wound Type (Ferrite Core) LQH32CH_53Series 121/3225 (inch/mm) Size 121 (3225) in inch (in mm), 1.7mm max. Thickness c Appearance/ Dimensions c ated Value (p: packaging code) For Infotainment A 2.5±.2 2.5±.2 3.2±.3.9±.3 1.3±.2.9±.3 For Powertrain/Safety 1.55±.15 A Inductance A : 2.8 max. 2.5±.2 (in mm) c Packaging ated Current *1 (Based on Inductance Change) Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 ated Current *1 (Based on Temperature ise) FlowOK Thickness 1.7mm eflow max. OK efer to pages from p.191 to p.194 for mounting information. DC esistance Self-esonance Frequency (min.) LQH32CH1M53p 1.µH 2% 1mA 1mA.6 3% 1MHz LQH32CH22M53p 2.2µH 2% 79mA 79mA.97 3% 64MHz LQH32CH33M53p 3.3µH 2% 71mA 71mA.12 3% 5MHz LQH32CH47M53p 4.7µH 2% 65mA 65mA.15 3% 43MHz LQH32CH68M53p 6.8µH 2% 54mA 54mA.25 3% 32MHz LQH32CH1K53p 1µH 1% 45mA 45mA.3 3% 26MHz LQH32CH15K53p 15µH 1% 3mA 3mA.58 3% 26MHz LQH32CH22K53p 22µH 1% 25mA 25mA.71 3% 19MHz Inductance Test Frequency: 1MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange (Self-temperature rise is not included): *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. c Impedance-Frequency Characteristics (Typ.) 1 c Inductance-Current Characteristics (Typ.) Impedance (kω) μh 4.7 μh 1. μh Inductance (μh) 1 22 μh 4.7 μh μh DC Current (ma) 188

191 Inductors for Power Lines!Caution/Notice o ating 1. About the ated Current Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. o Storage and Operating Condition <Operating Environment> Do not use products in chemical atmosphere such as chlorine gas, acid or sulfide gas. <Storage equirements> 1. Storage Period LQM series should be used within 6 months; the other products should be used within 12 months. Check solderability if this period is exceeded. 2. Storage Conditions (1) Store products in a warehouse in compliance with the following conditions: Temperature: -1 to +4 C. Humidity: 15 to 85% (relative humidity) Do not subject products to rapid changes in temperature and humidity. Do not store them in chemical atmosphere such as one containing sulfurous acid gas or alkaline gas. This will prevent electrode oxidation, which causes poor solderability and possible corrosion of inductors. (2) Do not store products in bulk packaging to prevent collision among inductors, which causes core chipping and wire breakage. (3) Store products on pallets to protect from humidity, dust, etc. (4) Avoid heat shock, vibration, direct sunlight, etc. o Handling This item is designed to have sufficient strength, but handle with care to avoid chipping or breaking its ceramic structure. LQH_C/D/P series sharp material, such as tweezers or the bristles of a cleaning brush, to the wire wound portion of this product. excessive mechanical shock to products mounted on the board. applying the rated current to Inductors for Power Lines. Be careful of the temperature rating of the circuit board and components around the chip Inductors.!Caution Notice 2. About Excessive Surge Current Surge current (pulse current or rush current) greater than the specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. LQM series the inductance value. Do not use a magnet or tweezers with magnetism when handling chip inductors. (The tip of the tweezers should be molded with resin or pottery.) applied, it may cause the inductance value to change due to magnetism. <Handling> 1. Avoid applying excessive stress to products to prevent damage. 2. Do not touch wire wound with sharp objects such as tweezers to prevent wire breakage. 3. Do not apply excessive force to products mounted on boards to prevent core breakage. <Transportation> Do not apply excessive vibration or mechanical shock to products. <esin Coating> resin curing stress may change inductance values. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Prior to use, please evaluate reliability with the product mounted in your application set. (LQH series) An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating conditions, etc. Some resins containing impurities or chloride may possibly generate chlorine by hydrolysis under some operating conditions, causing corrosion of the inductor wire and leading to an open circuit. <ated Current> (LQH2HP_J Series LQH44P_G Series) Inductance will be more than the value, which is 3% down from minimum rated Inductance value. (Other LQH_P Series) Inductance will be within ±3% of nominal Inductance value. For LQH_P series, rated current is set to keep temperature rise caused by self heating 4 C or less. For other Inductors for Power Lines, please refer to individual specifications. Inductors for Power Lines F Inductors Inductors for General Circuits Inductors!Caution/Notice for Power Lines Continued on the following page. 189

192 Inductors for Power Lines!Caution/Notice F Inductors Inductors for General Circuits Inductors!Caution/Notice for Power Lines Inductors for Power Lines <Handling of a Substrate> After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting the substrate when cropping the substrate, inserting and removing a connector from the substrate, or tightening a screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 19

193 Inductors for Power Lines Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip Inductors (chip coils) electrode. Land Pattern + Solder esist Land Pattern Solder esist (in mm) Series Standard Land Dimensions LQM21P LQM2MP LQM2HP LQH32P LQH44P_G LQH5BP LQH2HP LQH32C LQH32D LQH3NP_J 2. c 1. a b a b c LQM21P LQM2MP LQM2HP LQH32P LQH44P_G LQH5BP Inductors for Power Lines F Inductors Inductors for General Circuits Inductors Soldering for and Power Mounting Lines LQH43P Attention should be paid to potential magnetic coupling effects when using the Inductors (coils) as a resonator. 2. Standard Soldering Conditions (1) Soldering method Chip Inductors (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. As for LQH2HP/3NP/32P/44P/5BP series, please use reflow soldering. Solder: Use Sn-3.Ag-.5Cu solder. Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine content exceeding.2wt%). Do not use water-soluble flux. For additional mounting methods, please contact Murata. Continued on the following page. 191

194 Inductors for Power Lines Soldering and Mounting (2) Soldering profile F Inductors Inductors for General Circuits Inductors Soldering for and Power Mounting Lines Inductors for Power Lines "Flow Soldering profile (Sn-3.Ag-.5Cu solder) Series LQM21P/2MP/2HP LQH32C LQH43P "eflow Soldering profile (Sn-3.Ag-.5Cu solder) Temperature ( C) T1 Temp. (T1) Pre-heating Time. (t1) T3 T2 Pre-heating t1 t2 Heating Temp. (T2) time (s) Standard Profile Heating Time. (t2) 15 C 6s min. 25 C 4 to 6s 15 C 6s min. 25 C 4 to 6s Temperature ( C) T2 T1 Pre-heating t1 t2 T4 T3 Limit Profile Standard Profile Limit Profile Standard Profile 2 times max. 265±3 C Limit Profile Cycle Heating of flow Temp. (T3) Time. (t2) 2 times max. 265±3 C 5s max. 5s max. Cycle of flow 2 times max. 1 time 9±3s time (s) Series LQM21P/2MP/2HP LQH2HP LQH32D LQH3NP/32P/43P/44P/5BP Standard Profile Limit Profile Heating Peak Cycle Heating Peak temperature temperature Temp. (T1) Time. (t1) (T2) of reflow Temp. (T3) Time. (t2) (T4) 22 C 3 to 6s 245±3 C LQH32C 22 C 3 to 6s 245±3 C 2 times max. 2 times max. 23 C 6s max. 26 C/1s Cycle of reflow 2 times max. 23 C 6s max. 26 C/1s 1 time (3) eworking with Soldering Iron Preheating at 15 C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows: Soldering iron power output: 8W max. Temperature of soldering iron tip: 35 C Diameter of soldering iron end: 3.mm max. Soldering time: within 3 s Continued on the following page. 192

195 Inductors for Power Lines Soldering and Mounting 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and electrode leaching. (2) Land Pattern Designing (LQH series) Please follow the recommended patterns. Otherwise, their performance, which includes electrical performance or solderability, may be affected, or result in position shift in the soldering process. (3) Magnetic Coupling Since some chip inductors (chip coils) are constructed like an open magnetic circuit, narrow spacing between inductors (coils) may cause magnetic coupling. LQM and LQH_P series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip inductors (chip coils). (4) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Land d Solder esist c Magnetic Coupling Products should be located in a sideways direction (Length: a<b) to the mechanical stress. a Inductors for Power Lines F Inductors Inductors for General Circuits Inductors Soldering for and Power Mounting Lines b Poor example Good example except LQH3NP/44P/5BP The electrode part of the product should be located as in the figure to avoid mechanical stress. electrode Poor example LQH3NP/44P/5BP electrode Good example (5) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. " Guideline of solder paste thickness LQM, LQH2HP/3NP/32P/44P/5BP: 1 to 15μm LQH32C/32D, LQH43P: 2 to 3μm LQH LQM Continued on the following page. 193

196 Inductors for Power Lines Soldering and Mounting F Inductors Inductors for General Circuits Inductors Soldering for and Power Mounting Lines Inductors for Power Lines (6) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the adhesive in accordance with the conditions shown in the chart. 4. Cleaning The following conditions should be observed when cleaning chip inductors (chip coils): (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol cleaning agents) (2) Ultrasonic Output: 2W/l max. Duration: 5 minutes max. Frequency: 28 to 4kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. (a) Alcohol cleaning agents Isopropyl alcohol (IPA) (b) Aqueous cleaning agents Pine Alpha ST-1S LQH_C LQM21P/2MP LQM2HP LQH32C LQM Typical Application Amount (in:mg) I (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agents have been removed with deionized water. For additional cleaning methods, please contact Murata. 194

197 Inductors for Power Lines Packaging c Minimum Quantity and 8mm Width Taping Dimensions Paper Tape a ø ±.1 4.±.1 2.±.5 b Direction of feed 1.2 Dimension of the cavity of embossed tape is measured at the bottom side. a Dimensions 3.5± ±.1 (8.) <Embossed> c <Paper> c 1:.25 LQM2HP/2MP/31P_, LQH2 Packaging (Minimum Qty. [pcs.]) b c ø18mm reel ø33mm reel LQM21P_C max. D [4] - B [1] LQM21P_G max. D [4] - B [1] Embossed Tape Total Thickness of Tape Dimensions Depth of Cavity Packaging (Minimum Qty. [pcs.]) a b c ø18mm reel ø33mm reel Bulk LQM2HP_J/JC L [3] - B [1] LQM2HP_G L [3] - B [1] LQM2MP_G L [3] - B [1] LQH32C_33/23, LQH32D_23/ L [2] K [75] - LQH32C_ L [2] K [75] - LQH32P L [2] K [75] - Bulk Inductors for Power Lines F Inductors Inductors for General Circuits Inductors for Power Packaging Lines <Embossed> Polarity Marking ø ± ±.1 b (8.).25 a 4.±.1 4.±.1 2.±.5 Direction of feed c Dimension of the cavity of embossed tape is measured at the bottom side. Embossed Tape Dimensions Depth of Cavity Packaging (Minimum Qty. [pcs.]) a b c ø18mm reel ø33mm reel Bulk LQH2HP_J L [2] - - (in mm) Continued on the following page. 195

198 Inductors for Power Lines Packaging c Minimum Quantity and 8mm Width Taping Dimensions F Inductors Inductors for General Circuits Inductors for Power Packaging Lines Inductors for Power Lines Embossed Tape Polarity Marking a a Lead-in/out wire ø ±.1 4.±.1 2.±.5 Dimensions Depth of Cavity Packaging (Minimum Qty. [pcs.]) b c ø18mm reel ø33mm reel LQH3NP_J L [2] - - b Direction of feed <Embossed>.2 Dimension of the cavity of embossed tape is measured at the bottom side. c Minimum Quantity and 12mm Width Embossed Taping Dimensions 2.±.5 8.±.1 4.±.1 3.5±.5 ø ±.1 5.5± ±.1 (8.) b d c (12.) Bulk (in mm) a Lead-in/out wire c Direction of feed Dimension of the cavity of embossed tape is measured at the bottom side. Embossed Tape Dimensions (c: Depth of Cavity) Packaging (Minimum Qty. [pcs.]) a b c d ø18mm reel ø33mm reel Bulk LQH43P L [5] K [25] - LQH44P_G L [1] K [45] - LQH5BP L [5] K [3] - (in mm) 196

199 Inductors for General Circuits ing () LQ H 43 q w e N 47 M r t y u 3 L i o! qproduct ID Product ID LQ Chip Inductors (Chip Coils) wstructure Structure H Wire Wound Type (Ferrite Core) edimensions (LgW) Dimensions (LgW) Size (in inch) g1.6mm 4.5g3.2mm rapplications and Characteristics Applications and Characteristics N for esonant Circuit H for High-frequency esonant Circuit tcategory Category Automotive Infotainment uinductance Tolerance Inductance Tolerance J ±5% K ±1% M ±2% ifeatures Features Standard Type oelectrode Electrode 3 LF Solder!Packaging Packaging K Embossed Taping (ø33mm eel) L Embossed Taping (ø18mm eel) Inductors for Power Lines Inductors for General Circuits F Inductors Inductors for General Circuits yinductance Expressed by three-digit alphanumerics. The unit is micro-henry (μh). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. If there is a decimal point, it is expressed by the capital letter "". In this case, all figures are significant digits. If inductance is less than.1μh, the inductance code is expressed by a combination of two figures and the capital letter "N", and the unit of inductance is nano-henry (nh). The capital letter "N" indicates the unit of "nh", and also expresses a decimal point. In this case, all figures are significant digits. 197

200 Inductors for General Circuits Wire Wound Type (Ferrite Core) Inductors for Power Lines LQH31H_3Series 126/3216 (inch/mm) Size 126 (3216) in inch (in mm), Ferrite Core High Frequency Wound Type c Appearance/ Dimensions 2.3±.2 3.2±.3 1.8±.2 1.6±.2 1.6±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 2 K ø33mm Embossed Taping 75 FlowOK Thickness 2. mm eflow max. OK F Inductors Inductors for General Circuits Wire Wound Type (Ferrite Core).7 min..7 min..7 min. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance (in mm) Inductance Test Frequency ated Current DC esistance efer to pages from p.23 to p.25 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQH31H54NK3p 54nH 1% 1MHz 92mA.35 3% 5 1MHz 8MHz LQH31H95NK3p 95nH 1% 1MHz 79mA.47 3% 6 1MHz 65MHz LQH31H14J3p 145nH 5% 1MHz 7mA.61 3% 6 1MHz 5MHz LQH31H14K3p 145nH 1% 1MHz 7mA.61 3% 6 1MHz 5MHz LQH31H21J3p 215nH 5% 1MHz 52mA.11 3% 6 1MHz 43MHz LQH31H21K3p 215nH 1% 1MHz 52mA.11 3% 6 1MHz 43MHz LQH31H29J3p 29nH 5% 1MHz 42mA.17 3% 6 1MHz 36MHz LQH31H29K3p 29nH 1% 1MHz 42mA.17 3% 6 1MHz 36MHz LQH31H39J3p 39nH 5% 1MHz 33mA.26 3% 6 1MHz 3MHz LQH31H39K3p 39nH 1% 1MHz 33mA.26 3% 6 1MHz 3MHz LQH31H5J3p 5nH 5% 1MHz 26mA.44 3% 6 1MHz 27MHz LQH31H5K3p 5nH 1% 1MHz 26mA.44 3% 6 1MHz 27MHz LQH31H61J3p 61nH 5% 1MHz 25mA.48 3% 6 1MHz 24MHz LQH31H61K3p 61nH 1% 1MHz 25mA.48 3% 6 1MHz 24MHz LQH31H75J3p 75nH 5% 1MHz 19mA.79 3% 6 1MHz 22MHz LQH31H75K3p 75nH 1% 1MHz 19mA.79 3% 6 1MHz 22MHz LQH31H88J3p 88nH 5% 1MHz 18mA.86 3% 6 1MHz 2MHz LQH31H88K3p 88nH 1% 1MHz 18mA.86 3% 6 1MHz 2MHz Operating Temperature ange (Self-temperature rise is not included): c Q-Frequency Characteristics (Typ.) nH 88nH 54nH 6 Q

201 Inductors for General Circuits Wire Wound Type (Ferrite Core) LQH43N_3Series 1812/4532 (inch/mm) Size 1812 (4532) in inch (in mm) c Appearance/ Dimensions 3.6±.2 4.5±.3 2.6±.2 3.2±.2 3.2±.2 c Packaging Packaging Minimum Quantity L ø18mm Embossed Taping 5 K ø33mm Embossed Taping 25 eflow OK Thickness 2.8 mm max. E-12 Step Inductors for Power Lines 1.min. 1.min. 1.min. c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance (in mm) Inductance Test Frequency ated *1 Current Max. of DC esistance efer to pages from p.23 to p.25 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQH43N1M3p 1.µH 2% 1MHz 5mA.2 2 1MHz 12MHz LQH43N12M3p 1.2µH 2% 1MHz 5mA.2 2 1MHz 1MHz LQH43N15M3p 1.5µH 2% 1MHz 5mA.3 2 1MHz 85MHz LQH43N18M3p 1.8µH 2% 1MHz 5mA.3 2 1MHz 75MHz LQH43N22M3p 2.2µH 2% 1MHz 5mA.3 2 1MHz 62MHz LQH43N27M3p 2.7µH 2% 1MHz 5mA MHz 53MHz LQH43N33M3p 3.3µH 2% 1MHz 5mA MHz 47MHz LQH43N39M3p 3.9µH 2% 1MHz 5mA MHz 41MHz LQH43N47K3p 4.7µH 1% 1MHz 5mA.4 3 1MHz 38MHz LQH43N47M3p 4.7µH 2% 1MHz 5mA.4 3 1MHz 38MHz LQH43N56K3p 5.6µH 1% 1MHz 5mA MHz 33MHz LQH43N56M3p 5.6µH 2% 1MHz 5mA MHz 33MHz LQH43N68K3p 6.8µH 1% 1MHz 45mA.5 3 1MHz 31MHz LQH43N68M3p 6.8µH 2% 1MHz 45mA.5 3 1MHz 31MHz LQH43N82K3p 8.2µH 1% 1MHz 45mA MHz 27MHz LQH43N82M3p 8.2µH 2% 1MHz 45mA MHz 27MHz LQH43N1J3p 1µH 5% 1MHz 4mA MHz 23MHz LQH43N1K3p 1µH 1% 1MHz 4mA MHz 23MHz LQH43N12J3p 12µH 5% 1MHz 38mA MHz 21MHz LQH43N12K3p 12µH 1% 1MHz 38mA MHz 21MHz LQH43N15J3p 15µH 5% 1MHz 36mA MHz 19MHz LQH43N15K3p 15µH 1% 1MHz 36mA MHz 19MHz LQH43N18J3p 18µH 5% 1MHz 34mA MHz 17MHz LQH43N18K3p 18µH 1% 1MHz 34mA MHz 17MHz LQH43N22J3p 22µH 5% 1MHz 32mA MHz 15MHz LQH43N22K3p 22µH 1% 1MHz 32mA MHz 15MHz LQH43N27J3p 27µH 5% 1MHz 3mA MHz 14MHz LQH43N27K3p 27µH 1% 1MHz 3mA MHz 14MHz LQH43N33J3p 33µH 5% 1MHz 27mA MHz 12MHz LQH43N33K3p 33µH 1% 1MHz 27mA MHz 12MHz LQH43N39J3p 39µH 5% 1MHz 24mA MHz 11MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange: For refl ow soldering only. *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits Continued on the following page. 199

202 LQH43N_3 Inductors for Power Lines F Inductors Inductors for General Circuits Wire Wound Type (Ferrite Core) For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated *1 Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQH43N39K3p 39µH 1% 1MHz 24mA MHz 11MHz LQH43N47J3p 47µH 5% 1MHz 22mA MHz 1MHz LQH43N47K3p 47µH 1% 1MHz 22mA MHz 1MHz LQH43N56J3p 56µH 5% 1MHz 2mA MHz 9.3MHz LQH43N56K3p 56µH 1% 1MHz 2mA MHz 9.3MHz LQH43N68J3p 68µH 5% 1MHz 18mA MHz 8.4MHz LQH43N68K3p 68µH 1% 1MHz 18mA MHz 8.4MHz LQH43N82J3p 82µH 5% 1MHz 17mA MHz 7.5MHz LQH43N82K3p 82µH 1% 1MHz 17mA MHz 7.5MHz LQH43N11J3p 1µH 5% 1MHz 16mA kHz 6.8MHz LQH43N11K3p 1µH 1% 1MHz 16mA kHz 6.8MHz LQH43N121J3p 12µH 5% 1MHz 15mA kHz 6.2MHz LQH43N121K3p 12µH 1% 1MHz 15mA kHz 6.2MHz LQH43N151J3p 15µH 5% 1MHz 13mA kHz 5.5MHz LQH43N151K3p 15µH 1% 1MHz 13mA kHz 5.5MHz LQH43N181J3p 18µH 5% 1MHz 12mA kHz 5.MHz LQH43N181K3p 18µH 1% 1MHz 12mA kHz 5.MHz LQH43N221J3p 22µH 5% 1MHz 11mA kHz 4.5MHz LQH43N221K3p 22µH 1% 1MHz 11mA kHz 4.5MHz LQH43N271J3p 27µH 5% 1MHz 1mA kHz 4.MHz LQH43N271K3p 27µH 1% 1MHz 1mA kHz 4.MHz LQH43N331J3p 33µH 5% 1MHz 95mA kHz 3.6MHz LQH43N331K3p 33µH 1% 1MHz 95mA kHz 3.6MHz LQH43N391J3p 39µH 5% 1MHz 9mA kHz 3.3MHz LQH43N391K3p 39µH 1% 1MHz 9mA kHz 3.3MHz LQH43N471J3p 47µH 5% 1kHz 8mA kHz 3.MHz LQH43N471K3p 47µH 1% 1kHz 8mA kHz 3.MHz LQH43N561J3p 56µH 5% 1kHz 7mA kHz 2.7MHz LQH43N561K3p 56µH 1% 1kHz 7mA kHz 2.7MHz LQH43N681J3p 68µH 5% 1kHz 65mA kHz 2.5MHz LQH43N681K3p 68µH 1% 1kHz 65mA kHz 2.5MHz LQH43N821J3p 82µH 5% 1kHz 6mA kHz 2.2MHz LQH43N821K3p 82µH 1% 1kHz 6mA kHz 2.2MHz LQH43N12J3p 1µH 5% 1kHz 5mA kHz 2.MHz LQH43N12K3p 1µH 1% 1kHz 5mA kHz 2.MHz LQH43N122J3p 12µH 5% 1kHz 45mA kHz 1.8MHz LQH43N122K3p 12µH 1% 1kHz 45mA kHz 1.8MHz LQH43N152J3p 15µH 5% 1kHz 4mA kHz 1.6MHz LQH43N152K3p 15µH 1% 1kHz 4mA kHz 1.6MHz LQH43N182J3p 18µH 5% 1kHz 35mA kHz 1.5MHz LQH43N182K3p 18µH 1% 1kHz 35mA kHz 1.5MHz LQH43N222J3p 22µH 5% 1kHz 3mA kHz 1.3MHz LQH43N222K3p 22µH 1% 1kHz 3mA kHz 1.3MHz Class of Magnetic Shield: No magnetic shield Operating Temperature ange: For refl ow soldering only. *1 When applied rated current to the products, self temperature rise shall be limited to 2 max. and inductance will be within 1% of initial inductance value. Continued on the following page. 2

203 LQH43N_3 c Q-Frequency Characteristics (Typ.) Q μH 2.2μH 1.μH 22μH 1μH 47μH 22μH 1μH 47μH 22μH 1μH c Inductance-Current Characteristics (Typ.) Inductance (μh) Current (ma) 22μH 1μH 47μH 1 22μH 1μH 47μH 22μH 1μH 4.7μH 2.2μH 1.μH 1 Inductors for Power Lines Wire Wound Type (Ferrite Core) F Inductors Inductors for General Circuits 21

204 Inductors for General Circuits!Caution/Notice Inductors for Power Lines F Inductors Inductors for!caution/notice General Circuits Inductors for General Circuits o ating 1. About the ated Current Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. o Storage and Operating Condition <Operating Environment> Do not use products in chemical atmosphere such as chlorine gas, acid or sulfide gas. <Storage equirements> 1. Storage Period LQH series should be used within 12 months. Check solderability if this period is exceeded. 2. Storage Conditions (1) Store products in a warehouse in compliance with the following conditions: Temperature: -1 to +4 degrees C. Humidity: 15 to 85% (relative humidity) Do not subject products to rapid changes in temperature and humidity. Do not store them in chemical atmosphere such as one containing sulfurous acid gas or alkaline gas. This will prevent electrode oxidation, which causes poor solderability and possible corrosion of inductors. (2) Do not store products in bulk packaging to prevent collision among inductors, which causes core chipping and wire breakage. (3) Store products on pallets to protect from humidity, dust, etc. (4) Avoid heat shock, vibration, direct sunlight, etc. o Handling This item is designed to have sufficient strength, but handle with care to avoid chipping or breaking its ceramic structure. LQH series sharp material, such as tweezers or the bristles of a cleaning brush, to the wire wound portion of this product. excessive mechanical shock to products mounted on the board.!caution Notice 2. About Excessive Surge Current Surge current (pulse current or rush current) greater than the specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. <Handling> 1. Avoid applying excessive stress to products to prevent damage. 2. Do not touch wire wound with sharp objects such as tweezers to prevent wire breakage. 3. Do not apply excessive force to products mounted on boards to prevent core breakage. <Transportation> Do not apply excessive vibration or mechanical shock to products. <esin Coating> When coating products with resin, the relatively high resin curing stress may change inductance values. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Prior to use, please evaluate reliability with the product mounted in your application set. (LQH series) An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating conditions, etc. Some resins containing impurities or chloride may possibly generate chlorine by hydrolysis under some operating conditions, causing corrosion of the inductor wire and leading to an open circuit. <Handling of a Substrate> After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting the substrate when cropping the substrate, inserting and removing a connector from the substrate, or tightening a screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting 22

205 Inductors for General Circuits Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip Inductors (chip coils) electrode. Land Pattern + Solder esist Land Pattern Solder esist (in mm) Series Standard Land Dimensions LQH31H LQH43N Attention should be paid to potential magnetic coupling effects when using the Inductors (coils) as a resonator Inductors for Power Lines Inductors for General Circuits F Inductors Inductors Soldering for General and Mounting Circuits 2. Standard Soldering Conditions (1) Soldering method Chip Inductors (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. Solder: Use Sn-3.Ag-.5Cu solder. Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine content exceeding.2wt%). Do not use water-soluble flux. For additional mounting methods, please contact Murata. (2) Soldering profile "Flow Soldering profile (Sn-3.Ag-.5Cu solder) Temperature ( C) T1 T3 T2 t2 Heating Limit Profile Standard Profile Pre-heating t1 time (s) Series Temp. (T1) Pre-heating Time. (t1) Standard Profile Heating Temp. (T2) Time. (t2) Limit Profile Cycle Heating of flow Temp. (T3) Time. (t2) Cycle of flow LQH31H 15 C 6s min. 25 C 4 to 6s 2 times max. 265±3 C 5s max. 2 times max. Continued on the following page. 23

206 Inductors for General Circuits Soldering and Mounting Inductors for Power Lines "eflow Soldering profile (Sn-3.Ag-.5Cu solder) Temperature ( C) T4 T2 T1 T3 Limit Profile Pre-heating t1 Standard Profile t2 9±3s time (s) F Inductors Inductors Soldering for General and Mounting Circuits Inductors for General Circuits LQH31H/43N Series (3) eworking with Soldering Iron Preheating at 15 C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows: Soldering iron power output: 8W max. Temperature of soldering iron tip: 35 C Diameter of soldering iron end: 3.mm max. Soldering time: within 3 s Standard Profile Limit Profile Heating Peak Cycle Heating Peak temperature temperature Temp. (T1) Time. (t1) (T2) of reflow Temp. (T3) Time. (t2) (T4) 22 C 3 to 6s 245±3 C 2 times max. 23 C 6s max. 26 C/1s Cycle of reflow 2 times max. 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and electrode leaching. Land Solder esist c (2) Land Pattern Designing (LQH series) Please follow the recommended patterns. Otherwise, their performance, which includes electrical performance or solderability, may be affected, or result in position shift in the soldering process. d (3) Magnetic Coupling Since some chip inductors (chip coils) are constructed like an open magnetic circuit, narrow spacing between inductors (coils) may cause magnetic coupling. Magnetic Coupling Continued on the following page. 24

207 Inductors for General Circuits Soldering and Mounting (4) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Products should be located in a sideways direction (Length: a<b) to the mechanical stress. Poor example b a Good example Inductors for Power Lines (5) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. o Guideline of solder paste thickness LQH : 2 to 3μm The electrode part of the product should be located as in the figure to avoid mechanical stress. electrode Poor example electrode LQH Good example Inductors for General Circuits F Inductors Inductors Soldering for General and Mounting Circuits 4. Cleaning The following conditions should be observed when cleaning chip inductors (chip coils): (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol cleaning agents) (2) Ultrasonic Output: 2W/l max. Duration: 5 minutes max. Frequency: 28 to 4kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. (a) Alcohol cleaning agents Isopropyl alcohol (IPA) (b) Aqueous cleaning agents Pine Alpha ST-1S (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agents have been removed with deionized water. For additional cleaning methods, please contact Murata. 25

208 Inductors for General Circuits Packaging c Minimum Quantity and 12mm Width Embossed Taping Dimensions Inductors for Power Lines 2.±.5 8.±.1 4.±.1 ø ± ±.1 b d (12.) a c F Inductors Inductors for General Packaging Circuits Inductors for General Circuits Direction of feed Dimension of the cavity of embossed tape is measured at the bottom side. Embossed Tape a LQH43N 3.6 Dimensions (c: Depth of Cavity) b c c Minimum Quantity and 8mm Width Taping Dimensions <Embossed> ø ± ±.1 b (8.) Packaging (Minimum Qty. [pcs.]) d ø18mm reel ø33mm reel.3 L [5] K [25] <Paper> Bulk - (in mm) a 4.±.1 4.±.1 c 2.±.5 Direction of feed Dimension of the cavity of embossed tape is measured at the bottom side. c 1:.3 LQW2BH.25 LQW21H Embossed Tape Dimensions Depth of Cavity Packaging (Minimum Qty. [pcs.]) a b c ø18mm reel ø33mm reel Bulk LQH31H L [2] K [75] - (in mm) 26

209 F Inductors ing () LQ G 15 q w e H H 1N S r t y u 2 D i o! qproduct ID Product ID LQ Chip Inductors (Chip Coils) wstructure Structure G Multilayer Type (Air-core Inductors (Coils)) P Film Type W Wire Wound Type (Air-core Inductors (Coils)) edimensions (LgW) Dimensions (LgW) Size (in inch) g.3mm 1.g.5mm 1.6g.8mm rapplications and Characteristics Series Applications and Characteristics H LQG Multilayer Air-core Inductors (Coils) T LQP Film Type (Low DC esistance Type) A LQW High Q Type (UHF-SHF) tcategory Series Category N LQP/LQW Standard Type Infotainment LQG Automotive H Powertrain/Safety yinductance Expressed by three-digit alphanumerics. The unit is micro-henry (μh). The first and second figures are significant digits, and the third figure expresses the number of zeros that follow the two figures. If there is a decimal point, it is expressed by the capital letter "." In this case, all figures are significant digits. If inductance is less than.1μh, the inductance code is expressed by a combination of two figures and the capital letter "N," and the unit of inductance is nano-henry (nh). The capital letter "N" indicates the unit of "nh," and also expresses a decimal point. In this case, all figures are significant digits. uinductance Tolerance B C D G H J S W ifeatures oelectrode 2 Electrode Sn for Infotainment Inductance Tolerance ±.1nH ±.2nH ±.5nH ±2% ±3% ±5% ±.3nH ±.5nH Features Series 1 Standard Type High-Q, Low DC esistance for Infotainment LQG/LQP/LQW LQW15A/18A LQP3T Series LQG18H LQG15H/LQP3T LQW15A/LQW18W Inductors for Power Lines Inductors for General Circuits F Inductors!Packaging Packaging Series B J D Bulk Paper Taping (ø33mm eel) Paper Taping (ø18mm eel) LQW/LQG/LQP LQW18A/LQG/LQP LQW/LQG/LQP 27

210 F Inductors Multilayer Type (Non-Magnetic Core) Inductors for Power Lines LQG15H_2Series 42/15 (inch/mm) Size 42 (15) in inch (in mm), Multilayer Type c Appearance/ Dimensions.25±.1 Polarity Marking.5±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 J ø33mm Paper Taping 5 B Packing in Bulk 1 E-24 Step Thickness.55 mm max. eflow OK E-12 Step Inductors for General Circuits F Inductors Multilayer Type (Non-Magnetic Core) 1.±.5 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance.5±.5 (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQG15H1NS2p LQG15HH1NSp 1.nH.3nH 1MHz 3mA.7 8 1MHz 1MHz LQG15H1N1S2p LQG15HH1N1Sp 1.1nH.3nH 1MHz 3mA.9 8 1MHz 6MHz LQG15H1N2S2p LQG15HH1N2Sp 1.2nH.3nH 1MHz 3mA.9 8 1MHz 6MHz LQG15H1N3S2p LQG15HH1N3Sp 1.3nH.3nH 1MHz 3mA.9 8 1MHz 6MHz LQG15H1N5S2p LQG15HH1N5Sp 1.5nH.3nH 1MHz 3mA.1 8 1MHz 6MHz LQG15H1N6S2p LQG15HH1N6Sp 1.6nH.3nH 1MHz 3mA.1 8 1MHz 6MHz LQG15H1N8S2p LQG15HH1N8Sp 1.8nH.3nH 1MHz 3mA.1 8 1MHz 6MHz LQG15H2NS2p LQG15HH2NSp 2.nH.3nH 1MHz 3mA.1 8 1MHz 6MHz LQG15H2N2S2p LQG15HH2N2Sp 2.2nH.3nH 1MHz 3mA MHz 6MHz LQG15H2N4S2p LQG15HH2N4Sp 2.4nH.3nH 1MHz 3mA MHz 6MHz LQG15H2N7S2p LQG15HH2N7Sp 2.7nH.3nH 1MHz 3mA MHz 6MHz LQG15H3NS2p LQG15HH3NSp 3.nH.3nH 1MHz 3mA MHz 6MHz LQG15H3N3S2p LQG15HH3N3Sp 3.3nH.3nH 1MHz 3mA MHz 6MHz LQG15H3N6S2p LQG15HH3N6Sp 3.6nH.3nH 1MHz 3mA MHz 6MHz LQG15H3N9S2p LQG15HH3N9Sp 3.9nH.3nH 1MHz 3mA MHz 6MHz LQG15H4N3S2p LQG15HH4N3Sp 4.3nH.3nH 1MHz 3mA MHz 6MHz LQG15H4N7S2p LQG15HH4N7Sp 4.7nH.3nH 1MHz 3mA MHz 6MHz LQG15H5N1S2p LQG15HH5N1Sp 5.1nH.3nH 1MHz 3mA.2 8 1MHz 53MHz LQG15H5N6S2p LQG15HH5N6Sp 5.6nH.3nH 1MHz 3mA.2 8 1MHz 45MHz LQG15H6N2S2p LQG15HH6N2Sp 6.2nH.3nH 1MHz 3mA MHz 45MHz LQG15H6N8J2p LQG15HH6N8Jp 6.8nH 5% 1MHz 3mA MHz 45MHz LQG15H7N5J2p LQG15HH7N5Jp 7.5nH 5% 1MHz 3mA MHz 42MHz LQG15H8N2J2p LQG15HH8N2Jp 8.2nH 5% 1MHz 3mA MHz 37MHz LQG15H9N1J2p LQG15HH9N1Jp 9.1nH 5% 1MHz 3mA MHz 34MHz LQG15H1NJ2p LQG15HH1NJp 1nH 5% 1MHz 3mA MHz 34MHz LQG15H12NJ2p LQG15HH12NJp 12nH 5% 1MHz 3mA MHz 3MHz LQG15H15NJ2p LQG15HH15NJp 15nH 5% 1MHz 3mA MHz 25MHz LQG15H18NJ2p LQG15HH18NJp 18nH 5% 1MHz 3mA MHz 22MHz LQG15H22NJ2p LQG15HH22NJp 22nH 5% 1MHz 3mA MHz 19MHz LQG15H27NJ2p LQG15HH27NJp 27nH 5% 1MHz 3mA MHz 17MHz LQG15H33NJ2p LQG15HH33NJp 33nH 5% 1MHz 2mA MHz 16MHz LQG15H39NJ2p LQG15HH39NJp 39nH 5% 1MHz 2mA MHz 12MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 28

211 LQG15H_2 For Infotainment For Powertrain/Safety c Q-Frequency Characteristics (Typ.) Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQG15H47NJ2p LQG15HH47NJp 47nH 5% 1MHz 2mA MHz 1MHz LQG15H56NJ2p LQG15HH56NJp 56nH 5% 1MHz 2mA MHz 8MHz LQG15H68NJ2p LQG15HH68NJp 68nH 5% 1MHz 18mA MHz 8MHz LQG15H82NJ2p LQG15HH82NJp 82nH 5% 1MHz 15mA MHz 7MHz LQG15H1J2p LQG15HH1Jp 1nH 5% 1MHz 15mA MHz 6MHz LQG15H12J2p LQG15HH12Jp 12nH 5% 1MHz 15mA MHz 6MHz LQG15H15J2p LQG15HH15Jp 15nH 5% 1MHz 14mA MHz 55MHz LQG15H18J2p LQG15HH18Jp 18nH 5% 1MHz 13mA MHz 5MHz LQG15H22J2p LQG15HH22Jp 22nH 5% 1MHz 12mA MHz 45MHz LQG15H27J2p LQG15HH27Jp 27nH 5% 1MHz 11mA MHz 4MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. c Inductance-Frequency Characteristics (Typ.) Inductors for Power Lines Inductors for General Circuits Q nH 3.3nH 1nH L (nh) nH 56nH 1nH 3.3nH 1.nH Multilayer Type (Non-Magnetic Core) F Inductors 1 27nH 56nH

212 F Inductors Multilayer Type (Non-Magnetic Core) Inductors for Power Lines LQG18HH_Series 63/168 (inch/mm) Size 63 (168) in inch (in mm), Multilayer Type c Appearance/ Dimensions.3±.2 Polarity Marking.8±.15 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 1 eflow OK Thickness.95 mm max. E-12 Step 1.6±.15.8±.15 Inductors for General Circuits F Inductors Multilayer Type (Non-Magnetic Core) c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQG18HH1N2Sp 1.2nH.3nH 1MHz 11mA MHz 6MHz LQG18HH1N5Sp 1.5nH.3nH 1MHz 11mA MHz 6MHz LQG18HH1N8Sp 1.8nH.3nH 1MHz 11mA MHz 5MHz LQG18HH2N2Sp 2.2nH.3nH 1MHz 11mA MHz 5MHz LQG18HH2N7Sp 2.7nH.3nH 1MHz 1mA MHz 4MHz LQG18HH3N3Sp 3.3nH.3nH 1MHz 9mA MHz 4MHz LQG18HH3N9Sp 3.9nH.3nH 1MHz 9mA MHz 3MHz LQG18HH4N7Sp 4.7nH.3nH 1MHz 8mA MHz 3MHz LQG18HH5N6Sp 5.6nH.3nH 1MHz 8mA MHz 3MHz LQG18HH6N2Sp 6.2nH.3nH 1MHz 8mA MHz 28MHz LQG18HH6N8Jp 6.8nH 5% 1MHz 8mA MHz 28MHz LQG18HH8N2Jp 8.2nH 5% 1MHz 8mA MHz 26MHz LQG18HH1NJp 1nH 5% 1MHz 7mA MHz 24MHz LQG18HH12NJp 12nH 5% 1MHz 6mA MHz 22MHz LQG18HH15NJp 15nH 5% 1MHz 6mA MHz 18MHz LQG18HH18NJp 18nH 5% 1MHz 6mA MHz 18MHz LQG18HH22NJp 22nH 5% 1MHz 5mA MHz 16MHz LQG18HH27NJp 27nH 5% 1MHz 5mA MHz 14MHz LQG18HH33NJp 33nH 5% 1MHz 5mA MHz 12MHz LQG18HH39NJp 39nH 5% 1MHz 4mA MHz 1MHz LQG18HH47NJp 47nH 5% 1MHz 4mA MHz 9MHz LQG18HH56NJp 56nH 5% 1MHz 4mA MHz 8MHz LQG18HH68NJp 68nH 5% 1MHz 4mA MHz 8MHz LQG18HH82NJp 82nH 5% 1MHz 3mA MHz 7MHz LQG18HH1Jp 1nH 5% 1MHz 3mA MHz 6MHz LQG18HH12Jp 12nH 5% 1MHz 3mA MHz 55MHz LQG18HH15Jp 15nH 5% 1MHz 3mA MHz 55MHz LQG18HH18Jp 18nH 5% 1MHz 3mA MHz 5MHz LQG18HH22Jp 22nH 5% 1MHz 3mA MHz 45MHz LQG18HH27Jp 27nH 5% 1MHz 2mA MHz 4MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 21

213 LQG18HH_ c Q-Frequency Characteristics (Typ.) Q nH 82nH 22nH nH 1 5.6nH c Inductance-Frequency Characteristics (Typ.) L (nh) nH Inductors for Power Lines Inductors for General Circuits Multilayer Type (Non-Magnetic Core) F Inductors 82nH 22nH 5.6nH 1.2nH

214 .3±.3.3±.3.3±.3.3±.3 F Inductors Film Type (Non-Magnetic Core) Inductors for Power Lines LQP3TN_2Series 21/63 (inch/mm) Size 21 (63) in inch (in mm), High Q, Wide Variation c Appearance/ Dimensions.6±.3.6 to 62nH 68 to 12nH Polarity Marking Colored Side Polarity Marking Colored Side.6±.3 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 15 J ø33mm Paper Taping 5 B Packing in Bulk 5 E-24 Step Thickness.33 mm max. E-12 Step Tight Tolerance eflow OK Inductors for General Circuits F Inductors Film Type (Non-Magnetic Core).15±.5 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance.15±.5 (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQP3TNN6B2p.6nH.1nH 5MHz 85mA MHz 2MHz LQP3TNN6C2p.6nH.2nH 5MHz 85mA MHz 2MHz LQP3TNN7B2p.7nH.1nH 5MHz 8mA MHz 2MHz LQP3TNN7C2p.7nH.2nH 5MHz 8mA MHz 2MHz LQP3TNN8B2p.8nH.1nH 5MHz 8mA MHz 18MHz LQP3TNN8C2p.8nH.2nH 5MHz 8mA MHz 18MHz LQP3TNN9B2p.9nH.1nH 5MHz 75mA MHz 18MHz LQP3TNN9C2p.9nH.2nH 5MHz 75mA MHz 18MHz LQP3TN1NB2p 1.nH.1nH 5MHz 75mA MHz 17MHz LQP3TN1NC2p 1.nH.2nH 5MHz 75mA MHz 17MHz LQP3TN1N1B2p 1.1nH.1nH 5MHz 75mA MHz 17MHz LQP3TN1N1C2p 1.1nH.2nH 5MHz 75mA MHz 17MHz LQP3TN1N2B2p 1.2nH.1nH 5MHz 75mA MHz 17MHz LQP3TN1N2C2p 1.2nH.2nH 5MHz 75mA MHz 17MHz LQP3TN1N3B2p 1.3nH.1nH 5MHz 6mA MHz 17MHz LQP3TN1N3C2p 1.3nH.2nH 5MHz 6mA MHz 17MHz LQP3TN1N4B2p 1.4nH.1nH 5MHz 6mA MHz 16MHz LQP3TN1N4C2p 1.4nH.2nH 5MHz 6mA MHz 16MHz LQP3TN1N5B2p 1.5nH.1nH 5MHz 6mA MHz 15MHz LQP3TN1N5C2p 1.5nH.2nH 5MHz 6mA MHz 15MHz LQP3TN1N6B2p 1.6nH.1nH 5MHz 6mA MHz 15MHz LQP3TN1N6C2p 1.6nH.2nH 5MHz 6mA MHz 15MHz LQP3TN1N7B2p 1.7nH.1nH 5MHz 6mA MHz 15MHz LQP3TN1N7C2p 1.7nH.2nH 5MHz 6mA MHz 15MHz LQP3TN1N8B2p 1.8nH.1nH 5MHz 6mA MHz 15MHz LQP3TN1N8C2p 1.8nH.2nH 5MHz 6mA MHz 15MHz LQP3TN1N9B2p 1.9nH.1nH 5MHz 6mA MHz 125MHz LQP3TN1N9C2p 1.9nH.2nH 5MHz 6mA MHz 125MHz LQP3TN2NB2p 2.nH.1nH 5MHz 6mA MHz 125MHz LQP3TN2NC2p 2.nH.2nH 5MHz 6mA MHz 125MHz LQP3TN2N1B2p 2.1nH.1nH 5MHz 6mA MHz 11MHz LQP3TN2N1C2p 2.1nH.2nH 5MHz 6mA MHz 11MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 212

215 LQP3TN_2 For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQP3TN2N2B2p 2.2nH.1nH 5MHz 6mA MHz 11MHz LQP3TN2N2C2p 2.2nH.2nH 5MHz 6mA MHz 11MHz LQP3TN2N3B2p 2.3nH.1nH 5MHz 5mA MHz 1MHz LQP3TN2N3C2p 2.3nH.2nH 5MHz 5mA MHz 1MHz LQP3TN2N4B2p 2.4nH.1nH 5MHz 5mA MHz 1MHz LQP3TN2N4C2p 2.4nH.2nH 5MHz 5mA MHz 1MHz LQP3TN2N5B2p 2.5nH.1nH 5MHz 5mA MHz 1MHz LQP3TN2N5C2p 2.5nH.2nH 5MHz 5mA MHz 1MHz LQP3TN2N6B2p 2.6nH.1nH 5MHz 5mA MHz 1MHz LQP3TN2N6C2p 2.6nH.2nH 5MHz 5mA MHz 1MHz LQP3TN2N7B2p 2.7nH.1nH 5MHz 5mA MHz 1MHz LQP3TN2N7C2p 2.7nH.2nH 5MHz 5mA MHz 1MHz LQP3TN2N8B2p 2.8nH.1nH 5MHz 5mA MHz 95MHz LQP3TN2N8C2p 2.8nH.2nH 5MHz 5mA MHz 95MHz LQP3TN2N9B2p 2.9nH.1nH 5MHz 5mA MHz 95MHz LQP3TN2N9C2p 2.9nH.2nH 5MHz 5mA MHz 95MHz LQP3TN3NB2p 3.nH.1nH 5MHz 45mA MHz 95MHz LQP3TN3NC2p 3.nH.2nH 5MHz 45mA MHz 95MHz LQP3TN3N1B2p 3.1nH.1nH 5MHz 45mA MHz 8MHz LQP3TN3N1C2p 3.1nH.2nH 5MHz 45mA MHz 8MHz LQP3TN3N2B2p 3.2nH.1nH 5MHz 45mA MHz 8MHz LQP3TN3N2C2p 3.2nH.2nH 5MHz 45mA MHz 8MHz LQP3TN3N3B2p 3.3nH.1nH 5MHz 45mA MHz 8MHz LQP3TN3N3C2p 3.3nH.2nH 5MHz 45mA MHz 8MHz LQP3TN3N4B2p 3.4nH.1nH 5MHz 45mA MHz 7MHz LQP3TN3N4C2p 3.4nH.2nH 5MHz 45mA MHz 7MHz LQP3TN3N5B2p 3.5nH.1nH 5MHz 45mA MHz 7MHz LQP3TN3N5C2p 3.5nH.2nH 5MHz 45mA MHz 7MHz LQP3TN3N6B2p 3.6nH.1nH 5MHz 4mA MHz 6MHz LQP3TN3N6C2p 3.6nH.2nH 5MHz 4mA MHz 6MHz LQP3TN3N7B2p 3.7nH.1nH 5MHz 4mA MHz 6MHz LQP3TN3N7C2p 3.7nH.2nH 5MHz 4mA MHz 6MHz LQP3TN3N8B2p 3.8nH.1nH 5MHz 4mA MHz 6MHz LQP3TN3N8C2p 3.8nH.2nH 5MHz 4mA MHz 6MHz LQP3TN3N9B2p 3.9nH.1nH 5MHz 4mA MHz 57MHz LQP3TN3N9C2p 3.9nH.2nH 5MHz 4mA MHz 57MHz LQP3TN4NB2p 4.nH.1nH 5MHz 35mA MHz 53MHz LQP3TN4NC2p 4.nH.2nH 5MHz 35mA MHz 53MHz LQP3TN4N1B2p 4.1nH.1nH 5MHz 35mA MHz 53MHz LQP3TN4N1C2p 4.1nH.2nH 5MHz 35mA MHz 53MHz LQP3TN4N2B2p 4.2nH.1nH 5MHz 35mA MHz 53MHz LQP3TN4N2C2p 4.2nH.2nH 5MHz 35mA MHz 53MHz LQP3TN4N3H2p 4.3nH 3% 5MHz 35mA MHz 53MHz LQP3TN4N3J2p 4.3nH 5% 5MHz 35mA MHz 53MHz LQP3TN4N7H2p 4.7nH 3% 5MHz 35mA MHz 44MHz LQP3TN4N7J2p 4.7nH 5% 5MHz 35mA MHz 44MHz LQP3TN5N1H2p 5.1nH 3% 5MHz 35mA MHz 42MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Film Type (Non-Magnetic Core) F Inductors Continued on the following page. 213

216 LQP3TN_2 Inductors for Power Lines Inductors for General Circuits F Inductors Film Type (Non-Magnetic Core) For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQP3TN5N1J2p 5.1nH 5% 5MHz 35mA MHz 42MHz LQP3TN5N6H2p 5.6nH 3% 5MHz 35mA MHz 4MHz LQP3TN5N6J2p 5.6nH 5% 5MHz 35mA MHz 4MHz LQP3TN6N2H2p 6.2nH 3% 5MHz 3mA MHz 4MHz LQP3TN6N2J2p 6.2nH 5% 5MHz 3mA MHz 4MHz LQP3TN6N8H2p 6.8nH 3% 5MHz 3mA MHz 39MHz LQP3TN6N8J2p 6.8nH 5% 5MHz 3mA MHz 39MHz LQP3TN7N5H2p 7.5nH 3% 5MHz 3mA MHz 37MHz LQP3TN7N5J2p 7.5nH 5% 5MHz 3mA MHz 37MHz LQP3TN8N2H2p 8.2nH 3% 5MHz 25mA MHz 36MHz LQP3TN8N2J2p 8.2nH 5% 5MHz 25mA MHz 36MHz LQP3TN9N1H2p 9.1nH 3% 5MHz 25mA MHz 33MHz LQP3TN9N1J2p 9.1nH 5% 5MHz 25mA MHz 33MHz LQP3TN1NH2p 1nH 3% 5MHz 25mA MHz 32MHz LQP3TN1NJ2p 1nH 5% 5MHz 25mA MHz 32MHz LQP3TN11NH2p 11nH 3% 5MHz 25mA MHz 29MHz LQP3TN11NJ2p 11nH 5% 5MHz 25mA MHz 29MHz LQP3TN12NH2p 12nH 3% 5MHz 25mA MHz 29MHz LQP3TN12NJ2p 12nH 5% 5MHz 25mA MHz 29MHz LQP3TN13NH2p 13nH 3% 5MHz 25mA MHz 26MHz LQP3TN13NJ2p 13nH 5% 5MHz 25mA MHz 26MHz LQP3TN15NH2p 15nH 3% 5MHz 25mA MHz 26MHz LQP3TN15NJ2p 15nH 5% 5MHz 25mA MHz 26MHz LQP3TN16NH2p 16nH 3% 5MHz 2mA MHz 22MHz LQP3TN16NJ2p 16nH 5% 5MHz 2mA MHz 22MHz LQP3TN18NH2p 18nH 3% 5MHz 2mA MHz 22MHz LQP3TN18NJ2p 18nH 5% 5MHz 2mA MHz 22MHz LQP3TN2NH2p 2nH 3% 5MHz 15mA MHz 22MHz LQP3TN2NJ2p 2nH 5% 5MHz 15mA MHz 22MHz LQP3TN22NH2p 22nH 3% 5MHz 15mA MHz 22MHz LQP3TN22NJ2p 22nH 5% 5MHz 15mA MHz 22MHz LQP3TN24NH2p 24nH 3% 5MHz 14mA MHz 2MHz LQP3TN24NJ2p 24nH 5% 5MHz 14mA MHz 2MHz LQP3TN27NH2p 27nH 3% 5MHz 14mA MHz 2MHz LQP3TN27NJ2p 27nH 5% 5MHz 14mA MHz 2MHz LQP3TN3NH2p 3nH 3% 5MHz 12mA MHz 17MHz LQP3TN3NJ2p 3nH 5% 5MHz 12mA MHz 17MHz LQP3TN33NH2p 33nH 3% 3MHz 12mA MHz 17MHz LQP3TN33NJ2p 33nH 5% 3MHz 12mA MHz 17MHz LQP3TN36NH2p 36nH 3% 3MHz 12mA MHz 15MHz LQP3TN36NJ2p 36nH 5% 3MHz 12mA MHz 15MHz LQP3TN39NH2p 39nH 3% 3MHz 12mA MHz 15MHz LQP3TN39NJ2p 39nH 5% 3MHz 12mA MHz 15MHz LQP3TN43NH2p 43nH 3% 3MHz 1mA MHz 13MHz LQP3TN43NJ2p 43nH 5% 3MHz 1mA MHz 13MHz LQP3TN47NH2p 47nH 3% 3MHz 1mA MHz 13MHz LQP3TN47NJ2p 47nH 5% 3MHz 1mA MHz 13MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 214

217 LQP3TN_2 For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQP3TN51NH2p 51nH 3% 3MHz 1mA MHz 12MHz LQP3TN51NJ2p 51nH 5% 3MHz 1mA MHz 12MHz LQP3TN56NH2p 56nH 3% 3MHz 1mA MHz 12MHz LQP3TN56NJ2p 56nH 5% 3MHz 1mA MHz 12MHz LQP3TN62NH2p 62nH 3% 3MHz 1mA 8 8 3MHz 11MHz LQP3TN62NJ2p 62nH 5% 3MHz 1mA 8 8 3MHz 11MHz LQP3TN68NH2p 68nH 3% 3MHz 1mA 8 8 3MHz 11MHz LQP3TN68NJ2p 68nH 5% 3MHz 1mA 8 8 3MHz 11MHz LQP3TN75NH2p 75nH 3% 3MHz 1mA 1 8 3MHz 1MHz LQP3TN75NJ2p 75nH 5% 3MHz 1mA 1 8 3MHz 1MHz LQP3TN82NH2p 82nH 3% 3MHz 1mA 1 8 3MHz 1MHz LQP3TN82NJ2p 82nH 5% 3MHz 1mA 1 8 3MHz 1MHz LQP3TN91NH2p 91nH 3% 3MHz 8mA 1 8 3MHz 9MHz LQP3TN91NJ2p 91nH 5% 3MHz 8mA 1 8 3MHz 9MHz LQP3TN1H2p 1nH 3% 3MHz 8mA 1 8 3MHz 9MHz LQP3TN1J2p 1nH 5% 3MHz 8mA 1 8 3MHz 9MHz LQP3TN11H2p 11nH 3% 3MHz 8mA MHz 8MHz LQP3TN11J2p 11nH 5% 3MHz 8mA MHz 8MHz LQP3TN12H2p 12nH 3% 3MHz 8mA MHz 8MHz LQP3TN12J2p 12nH 5% 3MHz 8mA MHz 8MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Film Type (Non-Magnetic Core) F Inductors c Q-Frequency Characteristics (Typ.) 1 c Inductance-Frequency Characteristics (Typ.) nH 56nH 22nH Q nH 3.3nH 5.6nH 1nH 22nH 56nH 12nH L (nh) 1 1 1nH 5.6nH 3.3nH 2.2nH

218 F Inductors Wire Wound Type (Non-Magnetic Core) Inductors for Power Lines LQW15AN_Series 42/15 (inch/mm) Size 42 (15) in inch (in mm), Wound Type c Appearance/ Dimensions 1.±.1.5±.1.5±.1 W.1±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 B Packing in Bulk 5 Tight Tolerance eflow OK Thickness E-24.6 mm max. Step Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core).2±.1.2±.1 c ated Value (p: packaging code) W Inductance (nh).6± ± (in mm) efer to pages from p.23 to p.232 for mounting information. Inductance ated Max. of DC Q Q Test Self-esonance Inductance For Infotainment For Powertrain/Safety Test Frequency Current esistance (min.) Frequency Frequency (min.) LQW15AN1N5Bp 1.5nH.1nH 1MHz 1mA MHz 18.GHz LQW15AN1N5Cp 1.5nH.2nH 1MHz 1mA MHz 18.GHz LQW15AN1N5Dp 1.5nH.5nH 1MHz 1mA MHz 18.GHz LQW15AN1N6Cp 1.6nH.2nH 1MHz 75mA MHz 17.GHz LQW15AN1N6Dp 1.6nH.5nH 1MHz 75mA MHz 17.GHz LQW15AN1N7Cp 1.7nH.2nH 1MHz 64mA MHz 17.GHz LQW15AN1N7Dp 1.7nH.5nH 1MHz 64mA MHz 17.GHz LQW15AN1N8Cp 1.8nH.2nH 1MHz 46mA MHz 16.GHz LQW15AN1N8Dp 1.8nH.5nH 1MHz 46mA MHz 16.GHz LQW15AN2N4Bp 2.4nH.1nH 1MHz 85mA MHz 15.GHz LQW15AN2N4Cp 2.4nH.2nH 1MHz 85mA MHz 15.GHz LQW15AN2N4Dp 2.4nH.5nH 1MHz 85mA MHz 15.GHz LQW15AN2N5Bp 2.5nH.1nH 1MHz 85mA MHz 15.GHz LQW15AN2N5Cp 2.5nH.2nH 1MHz 85mA MHz 15.GHz LQW15AN2N5Dp 2.5nH.5nH 1MHz 85mA MHz 15.GHz LQW15AN2N6Bp 2.6nH.1nH 1MHz 85mA MHz 15.GHz LQW15AN2N6Cp 2.6nH.2nH 1MHz 85mA MHz 15.GHz LQW15AN2N6Dp 2.6nH.5nH 1MHz 85mA MHz 15.GHz LQW15AN2N7Bp 2.7nH.1nH 1MHz 85mA MHz 15.GHz LQW15AN2N7Cp 2.7nH.2nH 1MHz 85mA MHz 15.GHz LQW15AN2N7Dp 2.7nH.5nH 1MHz 85mA MHz 15.GHz LQW15AN2N8Bp 2.8nH.1nH 1MHz 85mA MHz 15.GHz LQW15AN2N8Cp 2.8nH.2nH 1MHz 85mA MHz 15.GHz LQW15AN2N8Dp 2.8nH.5nH 1MHz 85mA MHz 15.GHz LQW15AN2N9Bp 2.9nH.1nH 1MHz 75mA MHz 15.GHz LQW15AN2N9Cp 2.9nH.2nH 1MHz 75mA MHz 15.GHz LQW15AN2N9Dp 2.9nH.5nH 1MHz 75mA MHz 15.GHz LQW15AN3NBp 3.nH.1nH 1MHz 75mA MHz 15.GHz LQW15AN3NCp 3.nH.2nH 1MHz 75mA MHz 15.GHz LQW15AN3NDp 3.nH.5nH 1MHz 75mA MHz 15.GHz LQW15AN3N1Bp 3.1nH.1nH 1MHz 57mA MHz 14.GHz LQW15AN3N1Cp 3.1nH.2nH 1MHz 57mA MHz 14.GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 216

219 LQW15AN_ For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN3N1Dp 3.1nH.5nH 1MHz 57mA MHz 14.GHz LQW15AN3N2Bp 3.2nH.1nH 1MHz 5mA MHz 14.GHz LQW15AN3N2Cp 3.2nH.2nH 1MHz 5mA MHz 14.GHz LQW15AN3N2Dp 3.2nH.5nH 1MHz 5mA MHz 14.GHz LQW15AN3N9Bp 3.9nH.1nH 1MHz 75mA MHz 1.GHz LQW15AN3N9Cp 3.9nH.2nH 1MHz 75mA MHz 1.GHz LQW15AN3N9Dp 3.9nH.5nH 1MHz 75mA MHz 1.GHz LQW15AN4N1Bp 4.1nH.1nH 1MHz 75mA MHz 1.GHz LQW15AN4N1Cp 4.1nH.2nH 1MHz 75mA MHz 1.GHz LQW15AN4N1Dp 4.1nH.5nH 1MHz 75mA MHz 1.GHz LQW15AN4N3Bp 4.3nH.1nH 1MHz 75mA MHz 1.GHz LQW15AN4N3Cp 4.3nH.2nH 1MHz 75mA MHz 1.GHz LQW15AN4N3Dp 4.3nH.5nH 1MHz 75mA MHz 1.GHz LQW15AN4N4Bp 4.4nH.1nH 1MHz 75mA MHz 8.GHz LQW15AN4N4Cp 4.4nH.2nH 1MHz 75mA MHz 8.GHz LQW15AN4N4Dp 4.4nH.5nH 1MHz 75mA MHz 8.GHz LQW15AN4N5Bp 4.5nH.1nH 1MHz 75mA MHz 8.GHz LQW15AN4N5Cp 4.5nH.2nH 1MHz 75mA MHz 8.GHz LQW15AN4N5Dp 4.5nH.5nH 1MHz 75mA MHz 8.GHz LQW15AN4N6Bp 4.6nH.1nH 1MHz 75mA MHz 8.GHz LQW15AN4N6Cp 4.6nH.2nH 1MHz 75mA MHz 8.GHz LQW15AN4N6Dp 4.6nH.5nH 1MHz 75mA MHz 8.GHz LQW15AN4N7Bp 4.7nH.1nH 1MHz 75mA MHz 8.GHz LQW15AN4N7Cp 4.7nH.2nH 1MHz 75mA MHz 8.GHz LQW15AN4N7Dp 4.7nH.5nH 1MHz 75mA MHz 8.GHz LQW15AN4N8Bp 4.8nH.1nH 1MHz 75mA MHz 8.GHz LQW15AN4N8Cp 4.8nH.2nH 1MHz 75mA MHz 8.GHz LQW15AN4N8Dp 4.8nH.5nH 1MHz 75mA MHz 8.GHz LQW15AN4N9Bp 4.9nH.1nH 1MHz 6mA MHz 8.GHz LQW15AN4N9Cp 4.9nH.2nH 1MHz 6mA MHz 8.GHz LQW15AN4N9Dp 4.9nH.5nH 1MHz 6mA MHz 8.GHz LQW15AN5NBp 5.nH.1nH 1MHz 6mA MHz 8.GHz LQW15AN5NCp 5.nH.2nH 1MHz 6mA MHz 8.GHz LQW15AN5NDp 5.nH.5nH 1MHz 6mA MHz 8.GHz LQW15AN5N1Bp 5.1nH.1nH 1MHz 6mA MHz 8.GHz LQW15AN5N1Cp 5.1nH.2nH 1MHz 6mA MHz 8.GHz LQW15AN5N1Dp 5.1nH.5nH 1MHz 6mA MHz 8.GHz LQW15AN5N8Bp 5.8nH.1nH 1MHz 7mA MHz 8.GHz LQW15AN5N8Cp 5.8nH.2nH 1MHz 7mA MHz 8.GHz LQW15AN5N8Dp 5.8nH.5nH 1MHz 7mA MHz 8.GHz LQW15AN6N2Bp 6.2nH.1nH 1MHz 7mA MHz 8.GHz LQW15AN6N2Cp 6.2nH.2nH 1MHz 7mA MHz 8.GHz LQW15AN6N2Dp 6.2nH.5nH 1MHz 7mA MHz 8.GHz LQW15AN6N3Bp 6.3nH.1nH 1MHz 7mA MHz 6.GHz LQW15AN6N3Cp 6.3nH.2nH 1MHz 7mA MHz 6.GHz LQW15AN6N3Dp 6.3nH.5nH 1MHz 7mA MHz 6.GHz LQW15AN6N4Bp 6.4nH.1nH 1MHz 7mA MHz 6.GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors Continued on the following page. 217

220 LQW15AN_ Inductors for Power Lines Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core) For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN6N4Cp 6.4nH.2nH 1MHz 7mA MHz 6.GHz LQW15AN6N4Dp 6.4nH.5nH 1MHz 7mA MHz 6.GHz LQW15AN6N5Bp 6.5nH.1nH 1MHz 7mA MHz 6.GHz LQW15AN6N5Cp 6.5nH.2nH 1MHz 7mA MHz 6.GHz LQW15AN6N5Dp 6.5nH.5nH 1MHz 7mA MHz 6.GHz LQW15AN6N6Bp 6.6nH.1nH 1MHz 7mA MHz 6.GHz LQW15AN6N6Cp 6.6nH.2nH 1MHz 7mA MHz 6.GHz LQW15AN6N6Dp 6.6nH.5nH 1MHz 7mA MHz 6.GHz LQW15AN6N7Bp 6.7nH.1nH 1MHz 7mA MHz 6.GHz LQW15AN6N7Cp 6.7nH.2nH 1MHz 7mA MHz 6.GHz LQW15AN6N7Dp 6.7nH.5nH 1MHz 7mA MHz 6.GHz LQW15AN6N8Gp 6.8nH 2% 1MHz 7mA MHz 6.GHz LQW15AN6N8Hp 6.8nH 3% 1MHz 7mA MHz 6.GHz LQW15AN6N8Jp 6.8nH 5% 1MHz 7mA MHz 6.GHz LQW15AN6N9Gp 6.9nH 2% 1MHz 57mA MHz 6.GHz LQW15AN6N9Hp 6.9nH 3% 1MHz 57mA MHz 6.GHz LQW15AN6N9Jp 6.9nH 5% 1MHz 57mA MHz 6.GHz LQW15AN7NGp 7.nH 2% 1MHz 57mA MHz 6.GHz LQW15AN7NHp 7.nH 3% 1MHz 57mA MHz 6.GHz LQW15AN7NJp 7.nH 5% 1MHz 57mA MHz 6.GHz LQW15AN7N1Gp 7.1nH 2% 1MHz 57mA MHz 6.GHz LQW15AN7N1Hp 7.1nH 3% 1MHz 57mA MHz 6.GHz LQW15AN7N1Jp 7.1nH 5% 1MHz 57mA MHz 6.GHz LQW15AN7N2Gp 7.2nH 2% 1MHz 57mA MHz 6.GHz LQW15AN7N2Hp 7.2nH 3% 1MHz 57mA MHz 6.GHz LQW15AN7N2Jp 7.2nH 5% 1MHz 57mA MHz 6.GHz LQW15AN7N3Gp 7.3nH 2% 1MHz 57mA MHz 6.GHz LQW15AN7N3Hp 7.3nH 3% 1MHz 57mA MHz 6.GHz LQW15AN7N3Jp 7.3nH 5% 1MHz 57mA MHz 6.GHz LQW15AN7N5Gp 7.5nH 2% 1MHz 57mA MHz 6.GHz LQW15AN7N5Hp 7.5nH 3% 1MHz 57mA MHz 6.GHz LQW15AN7N5Jp 7.5nH 5% 1MHz 57mA MHz 6.GHz LQW15AN8N2Gp 8.2nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN8N2Hp 8.2nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN8N2Jp 8.2nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN8N6Gp 8.6nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN8N6Hp 8.6nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN8N6Jp 8.6nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN8N7Gp 8.7nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN8N7Hp 8.7nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN8N7Jp 8.7nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN8N8Gp 8.8nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN8N8Hp 8.8nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN8N8Jp 8.8nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN8N9Gp 8.9nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN8N9Hp 8.9nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN8N9Jp 8.9nH 5% 1MHz 54mA MHz 5.5GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 218

221 LQW15AN_ For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN9NGp 9.nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9NHp 9.nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9NJp 9.nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N1Gp 9.1nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N1Hp 9.1nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N1Jp 9.1nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N2Gp 9.2nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N2Hp 9.2nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N2Jp 9.2nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N3Gp 9.3nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N3Hp 9.3nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N3Jp 9.3nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N4Gp 9.4nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N4Hp 9.4nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N4Jp 9.4nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N5Gp 9.5nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N5Hp 9.5nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N5Jp 9.5nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N6Gp 9.6nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N6Hp 9.6nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N6Jp 9.6nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N7Gp 9.7nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N7Hp 9.7nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N7Jp 9.7nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N8Gp 9.8nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N8Hp 9.8nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N8Jp 9.8nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN9N9Gp 9.9nH 2% 1MHz 54mA MHz 5.5GHz LQW15AN9N9Hp 9.9nH 3% 1MHz 54mA MHz 5.5GHz LQW15AN9N9Jp 9.9nH 5% 1MHz 54mA MHz 5.5GHz LQW15AN1NGp 1nH 2% 1MHz 5mA MHz 5.5GHz LQW15AN1NHp 1nH 3% 1MHz 5mA MHz 5.5GHz LQW15AN1NJp 1nH 5% 1MHz 5mA MHz 5.5GHz LQW15AN11NGp 11nH 2% 1MHz 5mA MHz 5.5GHz LQW15AN11NHp 11nH 3% 1MHz 5mA MHz 5.5GHz LQW15AN11NJp 11nH 5% 1MHz 5mA MHz 5.5GHz LQW15AN12NGp 12nH 2% 1MHz 5mA MHz 5.5GHz LQW15AN12NHp 12nH 3% 1MHz 5mA MHz 5.5GHz LQW15AN12NJp 12nH 5% 1MHz 5mA MHz 5.5GHz LQW15AN13NGp 13nH 2% 1MHz 43mA MHz 5.GHz LQW15AN13NHp 13nH 3% 1MHz 43mA MHz 5.GHz LQW15AN13NJp 13nH 5% 1MHz 43mA MHz 5.GHz LQW15AN15NGp 15nH 2% 1MHz 46mA MHz 5.GHz LQW15AN15NHp 15nH 3% 1MHz 46mA MHz 5.GHz LQW15AN15NJp 15nH 5% 1MHz 46mA MHz 5.GHz LQW15AN16NGp 16nH 2% 1MHz 37mA MHz 4.5GHz LQW15AN16NHp 16nH 3% 1MHz 37mA MHz 4.5GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors Continued on the following page. 219

222 LQW15AN_ Inductors for Power Lines Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core) For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN16NJp 16nH 5% 1MHz 37mA MHz 4.5GHz LQW15AN18NGp 18nH 2% 1MHz 37mA MHz 4.5GHz LQW15AN18NHp 18nH 3% 1MHz 37mA MHz 4.5GHz LQW15AN18NJp 18nH 5% 1MHz 37mA MHz 4.5GHz LQW15AN19NGp 19nH 2% 1MHz 37mA MHz 4.5GHz LQW15AN19NHp 19nH 3% 1MHz 37mA MHz 4.5GHz LQW15AN19NJp 19nH 5% 1MHz 37mA MHz 4.5GHz LQW15AN2NGp 2nH 2% 1MHz 37mA MHz 4.GHz LQW15AN2NHp 2nH 3% 1MHz 37mA MHz 4.GHz LQW15AN2NJp 2nH 5% 1MHz 37mA MHz 4.GHz LQW15AN22NGp 22nH 2% 1MHz 31mA MHz 4.GHz LQW15AN22NHp 22nH 3% 1MHz 31mA MHz 4.GHz LQW15AN22NJp 22nH 5% 1MHz 31mA MHz 4.GHz LQW15AN23NGp 23nH 2% 1MHz 31mA MHz 3.8GHz LQW15AN23NHp 23nH 3% 1MHz 31mA MHz 3.8GHz LQW15AN23NJp 23nH 5% 1MHz 31mA MHz 3.8GHz LQW15AN24NGp 24nH 2% 1MHz 28mA MHz 3.5GHz LQW15AN24NHp 24nH 3% 1MHz 28mA MHz 3.5GHz LQW15AN24NJp 24nH 5% 1MHz 28mA MHz 3.5GHz LQW15AN27NGp 27nH 2% 1MHz 28mA MHz 3.5GHz LQW15AN27NHp 27nH 3% 1MHz 28mA MHz 3.5GHz LQW15AN27NJp 27nH 5% 1MHz 28mA MHz 3.5GHz LQW15AN3NGp 3nH 2% 1MHz 27mA MHz 3.3GHz LQW15AN3NHp 3nH 3% 1MHz 27mA MHz 3.3GHz LQW15AN3NJp 3nH 5% 1MHz 27mA MHz 3.3GHz LQW15AN33NGp 33nH 2% 1MHz 26mA MHz 3.2GHz LQW15AN33NHp 33nH 3% 1MHz 26mA MHz 3.2GHz LQW15AN33NJp 33nH 5% 1MHz 26mA MHz 3.2GHz LQW15AN36NGp 36nH 2% 1MHz 26mA MHz 3.1GHz LQW15AN36NHp 36nH 3% 1MHz 26mA MHz 3.1GHz LQW15AN36NJp 36nH 5% 1MHz 26mA MHz 3.1GHz LQW15AN39NGp 39nH 2% 1MHz 25mA MHz 3.GHz LQW15AN39NHp 39nH 3% 1MHz 25mA MHz 3.GHz LQW15AN39NJp 39nH 5% 1MHz 25mA MHz 3.GHz LQW15AN4NGp 4nH 2% 1MHz 25mA MHz 3.GHz LQW15AN4NHp 4nH 3% 1MHz 25mA MHz 3.GHz LQW15AN4NJp 4nH 5% 1MHz 25mA MHz 3.GHz LQW15AN43NGp 43nH 2% 1MHz 25mA MHz 3.GHz LQW15AN43NHp 43nH 3% 1MHz 25mA MHz 3.GHz LQW15AN43NJp 43nH 5% 1MHz 25mA MHz 3.GHz LQW15AN47NGp 47nH 2% 1MHz 21mA MHz 2.9GHz LQW15AN47NHp 47nH 3% 1MHz 21mA MHz 2.9GHz LQW15AN47NJp 47nH 5% 1MHz 21mA MHz 2.9GHz LQW15AN51NGp 51nH 2% 1MHz 21mA MHz 2.85GHz LQW15AN51NHp 51nH 3% 1MHz 21mA MHz 2.85GHz LQW15AN51NJp 51nH 5% 1MHz 21mA MHz 2.85GHz LQW15AN56NGp 56nH 2% 1MHz 2mA MHz 2.8GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 22

223 LQW15AN_ For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN56NHp 56nH 3% 1MHz 2mA MHz 2.8GHz LQW15AN56NJp 56nH 5% 1MHz 2mA MHz 2.8GHz LQW15AN62NGp 62nH 2% 1MHz 145mA MHz 2.6GHz LQW15AN62NHp 62nH 3% 1MHz 145mA MHz 2.6GHz LQW15AN62NJp 62nH 5% 1MHz 145mA MHz 2.6GHz LQW15AN68NGp 68nH 2% 1MHz 14mA MHz 2.5GHz LQW15AN68NJp 68nH 5% 1MHz 14mA MHz 2.5GHz LQW15AN72NGp 72nH 2% 1MHz 135mA MHz 2.5GHz LQW15AN72NJp 72nH 5% 1MHz 135mA MHz 2.5GHz LQW15AN75NGp 75nH 2% 1MHz 135mA MHz 2.4GHz LQW15AN75NJp 75nH 5% 1MHz 135mA MHz 2.4GHz LQW15AN82NGp 82nH 2% 1MHz 13mA MHz 2.3GHz LQW15AN82NJp 82nH 5% 1MHz 13mA MHz 2.3GHz LQW15AN91NGp 91nH 2% 1MHz 125mA MHz 2.1GHz LQW15AN91NJp 91nH 5% 1MHz 125mA MHz 2.1GHz LQW15AN1Jp 1nH 5% 1MHz 12mA MHz 1.5GHz LQW15AN12Jp 12nH 5% 1MHz 11mA MHz 1.GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. c Q-Frequency Characteristics (Typ.) nH c Inductance-Frequency Characteristics (Typ.) 1 12nH 68nH Inductors for Power Lines Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors Q nH 5.8nH 22nH 47nH L (nh) nH 22nH 1nH 5.8nH 2 68nH 12nH nH Continued on the following page. 221

224 F Inductors Wire Wound Type (Non-Magnetic Core) Inductors for Power Lines LQW15AN_1Series 42/15 (inch/mm) Size 42 (15) in inch (in mm), High Q, Low DC esistance Type c Appearance/ Dimensions 1.±.1.5±.1.5±.1.6±.1.1±.5 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 1 B Packing in Bulk 5 E-12 Step eflow OK Thickness Low dc.6 mm max. HiQ Tight Tolerance Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core).2±.1.2±.1 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN1N3C1p 1.3nH.2nH 1MHz 12mA MHz 16GHz LQW15AN1N3D1p 1.3nH.5nH 1MHz 12mA MHz 16GHz LQW15AN1N4C1p 1.4nH.2nH 1MHz 11mA MHz 15GHz LQW15AN1N4D1p 1.4nH.5nH 1MHz 11mA MHz 15GHz LQW15AN2N2C1p 2.2nH.2nH 1MHz 1mA MHz 14GHz LQW15AN2N2D1p 2.2nH.5nH 1MHz 1mA MHz 14GHz LQW15AN2N3C1p 2.3nH.2nH 1MHz 1mA MHz 14GHz LQW15AN2N3D1p 2.3nH.5nH 1MHz 1mA MHz 14GHz LQW15AN2N4D1p 2.4nH.5nH 1MHz 1mA MHz 14GHz LQW15AN3N3D1p 3.3nH.5nH 1MHz 9mA MHz 12GHz LQW15AN3N4C1p 3.4nH.2nH 1MHz 9mA MHz 12GHz LQW15AN3N4D1p 3.4nH.5nH 1MHz 9mA MHz 12GHz LQW15AN3N5C1p 3.5nH.2nH 1MHz 9mA MHz 9.5GHz LQW15AN3N5D1p 3.5nH.5nH 1MHz 9mA MHz 9.5GHz LQW15AN3N6C1p 3.6nH.2nH 1MHz 9mA MHz 9.5GHz LQW15AN3N6D1p 3.6nH.5nH 1MHz 9mA MHz 9.5GHz LQW15AN3N8C1p 3.8nH.2nH 1MHz 9mA MHz 7GHz LQW15AN3N8D1p 3.8nH.5nH 1MHz 9mA MHz 7GHz LQW15AN3N9D1p 3.9nH.5nH 1MHz 9mA MHz 7GHz LQW15AN4NC1p 4.nH.2nH 1MHz 8mA MHz 6.5GHz LQW15AN4ND1p 4.nH.5nH 1MHz 8mA MHz 6.5GHz LQW15AN4N2C1p 4.2nH.2nH 1MHz 8mA MHz 6.5GHz LQW15AN4N2D1p 4.2nH.5nH 1MHz 8mA MHz 6.5GHz LQW15AN4N7D1p 4.7nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N1C1p 5.1nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N1D1p 5.1nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N2C1p 5.2nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N2D1p 5.2nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N3C1p 5.3nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N3D1p 5.3nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N4C1p 5.4nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N4D1p 5.4nH.5nH 1MHz 8mA MHz 8GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 222

225 LQW15AN_1 For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW15AN5N5C1p 5.5nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N5D1p 5.5nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N6C1p 5.6nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N6D1p 5.6nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N7C1p 5.7nH.2nH 1MHz 8mA MHz 8GHz LQW15AN5N7D1p 5.7nH.5nH 1MHz 8mA MHz 8GHz LQW15AN5N9C1p 5.9nH.2nH 1MHz 76mA MHz 7.7GHz LQW15AN5N9D1p 5.9nH.5nH 1MHz 76mA MHz 7.7GHz LQW15AN6NC1p 6.nH.2nH 1MHz 76mA MHz 7.7GHz LQW15AN6ND1p 6.nH.5nH 1MHz 76mA MHz 7.7GHz LQW15AN6N1C1p 6.1nH.2nH 1MHz 76mA MHz 7.7GHz LQW15AN6N1D1p 6.1nH.5nH 1MHz 76mA MHz 7.7GHz LQW15AN7N4C1p 7.4nH.2nH 1MHz 75mA MHz 6.8GHz LQW15AN7N4D1p 7.4nH.5nH 1MHz 75mA MHz 6.8GHz LQW15AN7N6C1p 7.6nH.2nH 1MHz 75mA MHz 6.8GHz LQW15AN7N6D1p 7.6nH.5nH 1MHz 75mA MHz 6.8GHz LQW15AN7N7C1p 7.7nH.2nH 1MHz 75mA MHz 6.8GHz LQW15AN7N7D1p 7.7nH.5nH 1MHz 75mA MHz 6.8GHz LQW15AN7N8C1p 7.8nH.2nH 1MHz 75mA MHz 6.8GHz LQW15AN7N8D1p 7.8nH.5nH 1MHz 75mA MHz 6.8GHz LQW15AN7N9C1p 7.9nH.2nH 1MHz 64mA MHz 7.5GHz LQW15AN7N9D1p 7.9nH.5nH 1MHz 64mA MHz 7.5GHz LQW15AN8NC1p 8.nH.2nH 1MHz 64mA MHz 7.5GHz LQW15AN8ND1p 8.nH.5nH 1MHz 64mA MHz 7.5GHz LQW15AN8N1C1p 8.1nH.2nH 1MHz 64mA MHz 7.5GHz LQW15AN8N1D1p 8.1nH.5nH 1MHz 64mA MHz 7.5GHz LQW15AN8N3C1p 8.3nH.2nH 1MHz 64mA MHz 7.5GHz LQW15AN8N3D1p 8.3nH.5nH 1MHz 64mA MHz 7.5GHz LQW15AN8N4C1p 8.4nH.2nH 1MHz 64mA MHz 7.5GHz LQW15AN8N4D1p 8.4nH.5nH 1MHz 64mA MHz 7.5GHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors c Q-Frequency Characteristics (Typ.) c Inductance-Frequency Characteristics (Typ.) nH nH 4.7nH 5.6nH 5.6nH 4.7nH Q 8 6 L (nh) 3.3nH nH

226 F Inductors Wire Wound Type (Non-Magnetic Core) Inductors for Power Lines LQW18AN_Series 63/168 (inch/mm) Size 63 (168) in inch (in mm), Wound Type c Appearance/ Dimensions 1.6±.2.8±.2.8±.15 * 1.8±.2.2±.1 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 5 E-24 Step Thickness 1. mm max. E-12 Step Tight Tolerance eflow OK Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core).3±.1.3±.1 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance * 1 LQW18AN_1p:.8±.3 (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW18AN2N2Dp 2.2nH.5nH 1MHz 7mA MHz 6MHz LQW18AN3N6Cp 3.6nH.2nH 1MHz 85mA MHz 6MHz LQW18AN3N6Dp 3.6nH.5nH 1MHz 85mA MHz 6MHz LQW18AN3N9Cp 3.9nH.2nH 1MHz 85mA MHz 6MHz LQW18AN3N9Dp 3.9nH.5nH 1MHz 85mA MHz 6MHz LQW18AN4N3Cp 4.3nH.2nH 1MHz 85mA MHz 6MHz LQW18AN4N3Dp 4.3nH.5nH 1MHz 85mA MHz 6MHz LQW18AN4N7Dp 4.7nH.5nH 1MHz 85mA MHz 6MHz LQW18AN5N6Cp 5.6nH.2nH 1MHz 75mA MHz 6MHz LQW18AN5N6Dp 5.6nH.5nH 1MHz 75mA MHz 6MHz LQW18AN6N2Cp 6.2nH.2nH 1MHz 75mA MHz 6MHz LQW18AN6N2Dp 6.2nH.5nH 1MHz 75mA MHz 6MHz LQW18AN6N8Cp 6.8nH.2nH 1MHz 75mA MHz 6MHz LQW18AN6N8Dp 6.8nH.5nH 1MHz 75mA MHz 6MHz LQW18AN7N5Cp 7.5nH.2nH 1MHz 75mA MHz 6MHz LQW18AN7N5Dp 7.5nH.5nH 1MHz 75mA MHz 6MHz LQW18AN8N2Cp 8.2nH.2nH 1MHz 65mA MHz 6MHz LQW18AN8N2Dp 8.2nH.5nH 1MHz 65mA MHz 6MHz LQW18AN8N7Cp 8.7nH.2nH 1MHz 65mA MHz 6MHz LQW18AN8N7Dp 8.7nH.5nH 1MHz 65mA MHz 6MHz LQW18AN9N1Cp 9.1nH.2nH 1MHz 65mA MHz 6MHz LQW18AN9N1Dp 9.1nH.5nH 1MHz 65mA MHz 6MHz LQW18AN9N5Dp 9.5nH.5nH 1MHz 65mA MHz 6MHz LQW18AN1NGp 1nH 2% 1MHz 65mA MHz 6MHz LQW18AN1NJp 1nH 5% 1MHz 65mA MHz 6MHz LQW18AN11NGp 11nH 2% 1MHz 65mA MHz 6MHz LQW18AN11NJp 11nH 5% 1MHz 65mA MHz 6MHz LQW18AN12NGp 12nH 2% 1MHz 6mA MHz 6MHz LQW18AN12NJp 12nH 5% 1MHz 6mA MHz 6MHz LQW18AN13NGp 13nH 2% 1MHz 6mA MHz 6MHz LQW18AN13NJp 13nH 5% 1MHz 6mA MHz 6MHz LQW18AN15NGp 15nH 2% 1MHz 6mA MHz 6MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Continued on the following page. 224

227 LQW18AN_ For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW18AN15NJp 15nH 5% 1MHz 6mA MHz 6MHz LQW18AN16NGp 16nH 2% 1MHz 55mA MHz 55MHz LQW18AN16NJp 16nH 5% 1MHz 55mA MHz 55MHz LQW18AN18NGp 18nH 2% 1MHz 55mA MHz 55MHz LQW18AN18NJp 18nH 5% 1MHz 55mA MHz 55MHz LQW18AN2NGp 2nH 2% 1MHz 55mA MHz 49MHz LQW18AN2NJp 2nH 5% 1MHz 55mA MHz 49MHz LQW18AN22NGp 22nH 2% 1MHz 5mA MHz 46MHz LQW18AN22NJp 22nH 5% 1MHz 5mA MHz 46MHz LQW18AN24NGp 24nH 2% 1MHz 5mA MHz 38MHz LQW18AN24NJp 24nH 5% 1MHz 5mA MHz 38MHz LQW18AN27NGp 27nH 2% 1MHz 44mA MHz 37MHz LQW18AN27NJp 27nH 5% 1MHz 44mA MHz 37MHz LQW18AN3NGp 3nH 2% 1MHz 42mA MHz 33MHz LQW18AN3NJp 3nH 5% 1MHz 42mA MHz 33MHz LQW18AN33NGp 33nH 2% 1MHz 42mA MHz 32MHz LQW18AN33NJp 33nH 5% 1MHz 42mA MHz 32MHz LQW18AN36NGp 36nH 2% 1MHz 4mA MHz 29MHz LQW18AN36NJp 36nH 5% 1MHz 4mA MHz 29MHz LQW18AN39NGp 39nH 2% 1MHz 4mA MHz 28MHz LQW18AN39NJp 39nH 5% 1MHz 4mA MHz 28MHz LQW18AN43NGp 43nH 2% 1MHz 38mA MHz 27MHz LQW18AN43NJp 43nH 5% 1MHz 38mA MHz 27MHz LQW18AN47NGp 47nH 2% 1MHz 38mA MHz 26MHz LQW18AN47NJp 47nH 5% 1MHz 38mA MHz 26MHz LQW18AN51NGp 51nH 2% 1MHz 37mA MHz 25MHz LQW18AN51NJp 51nH 5% 1MHz 37mA MHz 25MHz LQW18AN56NGp 56nH 2% 1MHz 36mA MHz 24MHz LQW18AN56NJp 56nH 5% 1MHz 36mA MHz 24MHz LQW18AN62NGp 62nH 2% 1MHz 28mA MHz 23MHz LQW18AN62NJp 62nH 5% 1MHz 28mA MHz 23MHz LQW18AN68NGp 68nH 2% 1MHz 34mA MHz 22MHz LQW18AN68NJp 68nH 5% 1MHz 34mA MHz 22MHz LQW18AN72NGp 72nH 2% 1MHz 27mA MHz 21MHz LQW18AN72NJp 72nH 5% 1MHz 27mA MHz 21MHz LQW18AN75NGp 75nH 2% 1MHz 27mA MHz 25MHz LQW18AN75NJp 75nH 5% 1MHz 27mA MHz 25MHz LQW18AN82NGp 82nH 2% 1MHz 25mA MHz 2MHz LQW18AN82NJp 82nH 5% 1MHz 25mA MHz 2MHz LQW18AN91NGp 91nH 2% 1MHz 23mA MHz 19MHz LQW18AN91NJp 91nH 5% 1MHz 23mA MHz 19MHz LQW18AN1Gp 1nH 2% 1MHz 22mA MHz 18MHz LQW18AN1Jp 1nH 5% 1MHz 22mA MHz 18MHz LQW18AN11Gp 11nH 2% 1MHz 2mA MHz 17MHz LQW18AN11Jp 11nH 5% 1MHz 2mA MHz 17MHz LQW18AN12Gp 12nH 2% 1MHz 18mA MHz 16MHz LQW18AN12Jp 12nH 5% 1MHz 18mA MHz 16MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for Power Lines Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors Continued on the following page. 225

228 LQW18AN_ Inductors for Power Lines Inductors for General Circuits F Inductors Wire Wound Type (Non-Magnetic Core) For Infotainment For Powertrain/Safety Inductance Inductance Test Frequency ated Current Max. of DC esistance Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW18AN13Gp 13nH 2% 1MHz 17mA MHz 145MHz LQW18AN13Jp 13nH 5% 1MHz 17mA MHz 145MHz LQW18AN15Gp 15nH 2% 1MHz 16mA MHz 14MHz LQW18AN15Jp 15nH 5% 1MHz 16mA MHz 14MHz LQW18AN16Gp 16nH 2% 1MHz 15mA MHz 135MHz LQW18AN16Jp 16nH 5% 1MHz 15mA MHz 135MHz LQW18AN18Gp 18nH 2% 1MHz 14mA MHz 13MHz LQW18AN18Jp 18nH 5% 1MHz 14mA MHz 13MHz LQW18AN2Gp 2nH 2% 1MHz 12mA MHz 125MHz LQW18AN2Jp 2nH 5% 1MHz 12mA MHz 125MHz LQW18AN22Gp 22nH 2% 1MHz 12mA MHz 12MHz LQW18AN22Jp 22nH 5% 1MHz 12mA MHz 12MHz LQW18AN27Gp 27nH 2% 1MHz 11mA MHz 96MHz LQW18AN27Jp 27nH 5% 1MHz 11mA MHz 96MHz LQW18AN33Gp 33nH 2% 1MHz 85mA MHz 8MHz LQW18AN33Jp 33nH 5% 1MHz 85mA MHz 8MHz LQW18AN39Gp 39nH 2% 1MHz 8mA MHz 8MHz LQW18AN39Jp 39nH 5% 1MHz 8mA MHz 8MHz LQW18AN47Gp 47nH 2% 1MHz 75mA MHz 7MHz LQW18AN47Jp 47nH 5% 1MHz 75mA MHz 7MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. c Q-Frequency Characteristics (Typ.) 14 c Inductance-Frequency Characteristics (Typ.) 1 Q nH 2.2nH 1nH L (nh) nH 18nH 1nH 68nH 33nH 33nH 4 68nH 1nH 2 18nH 47nH nH 5.6nH 2.2nH

229 F Inductors Wire Wound Type (Non-Magnetic Core) LQW18AN_1Series 63/168 (inch/mm) Size 63 (168) in inch (in mm), High Q, Low DC esistance Type c Appearance/ Dimensions 1.6±.2.8±.2.8±.15 * 1.8±.2.2±.1 c Packaging Packaging Minimum Quantity D ø18mm Paper Taping 4 J ø33mm Paper Taping 1 B Packing in Bulk 5 E-12 Step eflow OK Thickness Low dc 1. mm max. HiQ Tight Tolerance Inductors for Power Lines.3±.1.3±.1 c ated Value (p: packaging code) For Infotainment For Powertrain/Safety Inductance * 1 LQW18AN_1p:.8±.3 (in mm) Inductance Test Frequency ated Current Max. of DC esistance efer to pages from p.23 to p.232 for mounting information. Q (min.) Q Test Frequency Self-esonance Frequency (min.) LQW18AN2N2D1p 2.2nH.5nH 1MHz 14mA MHz 18MHz LQW18AN3N9C1p 3.9nH.2nH 1MHz 1mA MHz 11MHz LQW18AN3N9D1p 3.9nH.5nH 1MHz 1mA MHz 11MHz LQW18AN5N6D1p 5.6nH.5nH 1MHz 9mA MHz 1MHz LQW18AN6N8C1p 6.8nH.2nH 1MHz 9mA MHz 7MHz LQW18AN6N8D1p 6.8nH.5nH 1MHz 9mA MHz 7MHz LQW18AN8N2D1p 8.2nH.5nH 1MHz 8mA MHz 7MHz LQW18AN1NG1p 1nH 2% 1MHz 8mA MHz 5MHz LQW18AN1NJ1p 1nH 5% 1MHz 8mA MHz 5MHz LQW18AN12NG1p 12nH 2% 1MHz 75mA MHz 5MHz LQW18AN12NJ1p 12nH 5% 1MHz 75mA MHz 5MHz LQW18AN15NJ1p 15nH 5% 1MHz 7mA MHz 45MHz LQW18AN18NG1p 18nH 2% 1MHz 7mA MHz 35MHz LQW18AN18NJ1p 18nH 5% 1MHz 7mA MHz 35MHz LQW18AN22NG1p 22nH 2% 1MHz 64mA MHz 32MHz LQW18AN22NJ1p 22nH 5% 1MHz 64mA MHz 32MHz LQW18AN27NG1p 27nH 2% 1MHz 59mA MHz 28MHz LQW18AN27NJ1p 27nH 5% 1MHz 59mA MHz 28MHz LQW18AN33NJ1p 33nH 5% 1MHz 55mA MHz 25MHz Operating Temperature ange (Self-temperature rise is not included): For refl ow soldering only. Inductors for General Circuits Wire Wound Type (Non-Magnetic Core) F Inductors c Q-Frequency Characteristics (Typ.) 2 c Inductance-Frequency Characteristics (Typ.) nH 33nH 16 22nH Q nH 1nH L (nh) 1 1nH 6.8nH 6 22nH 4 33nH 2.2nH

230 F Inductors!Caution/Notice Inductors for General Circuits Inductors for Power Lines!Caution/Notice F Inductors F Inductors o ating 1. About the ated Current Do not use products beyond the rated current as this may create excessive heat and deteriorate the insulation resistance. o Storage and Operating Condition <Operating Environment> Do not use products in chemical atmosphere such as chlorine gas, acid or sulfide gas. <Storage equirements> 1. Storage Period LQG series should be used within 6 months; the other products should be used within 12 months. Check solderability if this period is exceeded. 2. Storage Conditions (1) Store products in a warehouse in compliance with the following conditions: Temperature: -1 to +4 degrees C. Humidity: 15 to 85% (relative humidity) Do not subject products to rapid changes in temperature and humidity. Do not store them in chemical atmosphere such as one containing sulfurous acid gas or alkaline gas. This will prevent electrode oxidation, which causes poor solderability and possible corrosion of inductors. (2) Do not store products in bulk packaging to prevent collision among inductors, which causes core chipping and wire breakage. (3) Store products on pallets to protect from humidity, dust, etc. (4) Avoid heat shock, vibration, direct sunlight, etc. o Handling This item is designed to have sufficient strength, but handle with care to avoid chipping or breaking its ceramic structure. LQW_A series sharp material, such as tweezers or the bristles of a cleaning brush, to the wire wound portion. excessive mechanical shock to products mounted on the board.!caution Notice 2. About Excessive Surge Current Surge current (pulse current or rush current) greater than the specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. components, a support pin pushes the components please remove the support pin. The support pin may damage the components and break the wire. recognize this component. Please contact us when you use laser recognizion. (There is no problem with the permeation and reflection type.) LQP series protective film. Take care to avoid damaging the nozzles, sharp instruments, etc. <Handling> 1. Avoid applying excessive stress to products to prevent damage. 2. Do not touch wire wound with sharp objects such as tweezers to prevent wire breakage. 3. Do not apply excessive force to products mounted on boards to prevent core breakage. <Transportation> Do not apply excessive vibration or mechanical shock to products. <esin Coating> When coating products with resin, the relatively high resin curing stress may change inductance values. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Prior to use, please evaluate reliability with the product mounted in your application set. (LQW series) An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating conditions, etc. Some resins containing impurities or chloride may possibly generate chlorine by hydrolysis under some operating conditions, causing corrosion of the inductor wire and leading to an open circuit. (LQP3 series) When products are coated with resin, please contact us in advance. Continued on the following page. 228

231 F Inductors!Caution/Notice <Handling of a Substrate> After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting the substrate when cropping the substrate, inserting and removing a connector from the substrate, or tightening a screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Twisting o Measuring Method Measuring Method of Inductance/Q 1. esidual elements and stray elements of test fixtures can be described by F-parameter as shown in the following: m Test Head I1 V1 A C Test fixture B D V1 = A B I1 C D 2. The impedance of chip Inductors (chip coils) x and measured value m can be described by input/output current/voltage. 3. Thus, the relation between x and m is shown in the following: m - β x = α 1 - mγ esidual Impedance I2 V2 Product V1 m = x = I1, V2 I2 where, α = D / A = 1 β = B / D = sm - (1 - Yom sm) ss Γ = C / A = Yom sm: measured impedance of short chip ss: residual impedance of short chip* Yom: measured admittance when opening the fixture *esidual impedance of short chip x Series V2 I2 Inductors for General Circuits Inductors for Power Lines F Inductors!Caution/Notice F Inductors nh.48nh.556nh.771nh LQG15H, LQG18HH LQP3TN LQW15A LQW18A 4. Lx and Qx should be calculated with the following equation. Im (x) Im (x) Lx = Qx = 2πf, e (x) Lx: Inductance of chip Inductors (chip coils) Qx: Q of chip Inductors (chip coils) f: Measuring frequency 229

232 F Inductors Soldering and Mounting 1. Standard Land Pattern Dimensions Inductors for Power Lines Inductors for General Circuits Soldering and F Inductors Mounting F Inductors A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip Inductors (chip coils) electrode. Land Pattern + Solder esist Land Pattern Solder esist (in mm) Series Standard Land Dimensions LQG15H LQG18H LQP3 LQW15A LQW18A Attention should be paid to potential magnetic coupling effects when using the Inductors (coils) as a resonator. 2. Standard Soldering Conditions (1) Soldering method Chip Inductors (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. As for LQG, LQP, LQW series, please use reflow soldering. Solder: Use Sn-3.Ag-.5Cu solder. c a b a b c LQG15H LQG18H LQP LQW15A LQW18A Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine content exceeding.2wt%). Do not use water-soluble flux. The flux used for LQW series should use the rosin-based flux that includes middle activator equivalent to.6wt% to.1wt% chlorine. For additional mounting methods, please contact Murata. (2) Soldering profile "eflow Soldering profile (Sn-3.Ag-.5Cu solder) Temperature ( C) T2 T1 Pre-heating t1 t2 T4 T3 Limit Profile Standard Profile 9±3s time (s) LQG15H/18H LQP3 LQW15A/18A Series Standard Profile Limit Profile Heating Peak Cycle Heating Peak temperature temperature Temp. (T1) Time. (t1) (T2) of reflow Temp. (T3) Time. (t2) (T4) 22 C 3 to 6s 245±3 C 2 times max. 23 C 6s max. 26 C/1s Cycle of reflow 2 times max. (3) eworking with Soldering Iron Preheating at 15 C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows: Soldering iron power output: 8W max. Temperature of soldering iron tip: 35 C Diameter of soldering iron end: 3.mm max. Soldering time: within 3 s Continued on the following page. 23

233 F Inductors Soldering and Mounting 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and electrode leaching. (2) Land Pattern Designing (LQW series) Please follow the recommended patterns. Otherwise, their performance, which includes electrical performance or solderability, may be affected, or result in position shift in the soldering process. (3) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Land Products should be located in a sideways direction (Length: a<b) to the mechanical stress. Poor example b a Good example The electrode part of the product should be located as in the figure to avoid mechanical stress. electrode d Solder esist c Inductors for Power Lines Inductors for General Circuits F Inductors Soldering and F Inductors Mounting Poor example electrode Good example (4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. " Guideline of solder paste thickness LQG, LQW15A/LQW18A: 1 to 15μm LQP3TN: 1μm LQP/LQG LQW_A LQW15A Series: Too much solder may cause slant or rotation of the chip at the time of solder melting. Please reduce the amount of solder by using a smaller solder area than the land pattern, as shown in the figure at right. b c b d a Stencil Pattern b c b d Stencil Pattern Land Pattern 1.2 Solder esist Land Pattern b 1.2 c b a a.65 b.35 c.5 d (in mm) Continued on the following page. 231

234 F Inductors Soldering and Mounting 4. Cleaning Inductors for Power Lines Inductors for General Circuits Soldering and F Inductors Mounting F Inductors The following conditions should be observed when cleaning chip inductors (chip coils): (1) Cleaning Temperature: 6 C max. (4 C max. for alcohol cleaning agents) (2) Ultrasonic Output: 2W/l max. Duration: 5 minutes max. Frequency: 28 to 4kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. (a) Alcohol cleaning agents Isopropyl alcohol (IPA) (b) Aqueous cleaning agents Pine Alpha ST-1S (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agents have been removed with deionized water. For additional cleaning methods, please contact Murata. 232

235 F Inductors Packaging c Minimum Quantity and 8mm Width Taping Dimensions Paper Tape b 2.±.5 2.±.5 4.±.1 a Direction of feed ø ± ±.1 (8.) LQG15H, LQP15M/18M c LQP2T/3T/15T, LQW3A/4A/15A Dimensions Total Thickness of Tape Packaging (Minimum Qty. [pcs.]) a b c ø18mm reel ø33mm reel Bulk LQG15H LQP3T /.67.8 max..55 max. D [1] D [15] J [5] J [5] B [1] B [5] LQW15A_ 2 LQW15A_1 3.64/.66/.69.66/ max..8 max. D [1] D [1] - - B [5] B [5] 1.67 (LQP3TN_2;.6-62nH).65 (LQP3TN_2; 68-12nH) 2.69 (1.5nH, nH, nH, nH, nH, 11nH, 12nH, 15nH).66 ( nH, 2.9nH, 3.nH, 3.1nH, 3.2nH, nH, nH, 1nH, 13nH, 16-23nH, 1nH, 12nH).64 (24-91nH) 3.69 (1.3nH, 1.4nH).66 ( nH) c (in mm) Inductors for Power Lines Inductors for General Circuits F Inductors F Packaging Inductors c Minimum Quantity and 8mm Width Taping Dimensions <Embossed> ø ± ±.1 b (8.) <Paper> a 4.±.1 4.±.1 c 2.±.5 Direction of feed Dimension of the cavity of embossed tape is measured at the bottom side. c 1:.3 LQW2BH.25 LQW21H Paper Tape Dimensions a b Total Thickness of Tape c Packaging (Minimum Qty. [pcs.]) ø18mm reel ø33mm reel Bulk LQG18H max. D [4] J [1] B [1] LQW18A_ max. D [4] J [1] B [5] LQW18A_ max. D [4] J [1] B [5] (in mm) 233

236 Quick eference EMI Suppression Filters (for DC) BLE32PN BLM3AG BLM3A BLM3B BLM3E BLM3H BLM3PG BLM3P BLM15AG BLM15A BLM15B BLM15B BLM15EG BLM15G BLM15H BLM15PD BLM15PG BLM15P BLM18AG_S BLM18AG_W BLM18B BLM18EG BLM18GG BLM18H BLM18KG BLM18PG BLM18SG BLM21AG BLM21B BLM21PG BLM31PG BLM41PG a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.61 p.17 p.15 p.19 p.64 p.62 p.12 p.13 p.27 p.25 p.31 p.29 p.67 p.68 p.65 p.23 p.23 p.21 p.41 p.43 p.44 p.72 p.75 p.69 p.37 p.35 p.39 p.51 p.53 p.49 p.57 p.59 NFE31T NFE61HT NFL18T NFM21HC NFM31HK NF32BW_1 NF32BW_11 DLM11S DLW21S DLW31S DLW43S DLW5AT DLW5BS DLW5BT PLT1H PLT5BP a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.85 p.86 p.89 p.87 p.88 p.9 p.92 a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.17 p.18 p.11 p.111 p.15 p.14 p.15 p.112 p.113 a a a a a a a a a a a a a a a a a BN2p p.125 BN12 DSS1 VFC2 Lead Type a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.136 p.133 p.135 Microchip Transformer (Balun) a a a a a a a a a a a a a a a a a DW21B p.145 Chip Inductors Inductors for Power Lines LQH2HP_J LQH32CH_23 LQH32CH_33 LQH32CH_53 LQH32D_23 LQH32D_53 LQH32P_N LQH32P_NC LQH3NP_J LQH43P_26 LQH44P_G LQH5BP_T LQM21P_GC LQM21P_C LQM21P_G LQM21P_G LQM2HP_E LQM2HP_G LQM2HP_GC LQM2HP_GS LQM2HP_J LQM2HP_JC LQM2MP_G a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.183 p.187 p.187 p.188 p.185 p.186 p.173 p.175 p.171 p.177 p.179 p.181 p.16 p.158 p.159 p.161 p.17 p.166 p.169 p.168 p.164 p.165 p.162 Inductors for General Circuits LQH31H_3 LQH43N_3 a a a a a a a a a a a a a a a a a a a a a a a a a a p.198 p.199 LQG15H_2 LQG18HH_ LQP3TN_2 LQW15AN_ LQW15AN_1 LQW18AN_ LQW18AN_1 F Inductors a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a a p.28 p.21 p.212 p.216 p.222 p.224 p

237 Introduction of Chip Inductors Web Site SimSurfing

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