Two-Wire Shielded Cable Modeling for the Analysis of Conducted Transient Immunity
|
|
- Norma Singleton
- 6 years ago
- Views:
Transcription
1 Two-Wire Shielded Cable Modeling for the Analysis of Conducted Transient Immunity Spartaco Caniggia EMC Consultant, Viale Moranti 7, 21 Bareggio (MI), Italy Francesca Maradei DIAEE, Sapienza Univ. of Rome, Via Eudossiana 18, 184 Rome, Italy Abstract A SPICE model is proposed to simulate a typical boxto-box structure when the interconnect is a two-wire shielded cable. The goal is to carry out a very simple circuit that can be easily implemented by any user interested in investigating conducted transient immunity of a parallel-pair (twinax) or twisted-pair shielded cable. The model is based on the classic cable representation as a cascade of lumped element circuit cells obtained considering the cable as a three-conductor transmission line (TL) above a reference plane. Particular attention is here addressed to properly define the mutual inductive coupling between the wires and the shield in order to take into account the penetration through apertures proper of real braided shields. The model is suitable for direct transient analysis and allows modeling any kind of cable terminations. Keywords-Electrostatic discharge; immunity; shielded cable; SPICE I. INTRODUCTION There are many solutions to protect a box-to-box or systemto-system structure when subjected to interfering disturbances such as SURGE, EFT, and ESD. When using shielded cables, it is a common practice to connect the cable shield to the box in order to limit the noise introduced into the internal circuits of the cable. Suitable fixes for EMI reduction depend on how grounding is realized, and specifically on the impedance of the connection for grounding the cable shield: the lowest is the grounding connection impedance the better is the grounding. Box-to-box structure is widely used as setup configuration to test the conducted immunity of shielded cables. Several SPICE models have been presented over the years for coaxial cable connections [1]-[7]. In case of two-wire shielded cables, two compact models are available in literature [4]-[5], both derived by the multiconductor transmission line (MTL) theory, and both based on the separation of the internal and external parts of the shield. Due to this separation, suitable networks are needed to allow modeling of whatever termination. The circuit model proposed in [4] takes into account frequency dependent losses, runs in frequency domain, and time domain results are obtained by Inverse Fourier Transform (IFT). The need of IFT is the main limitation of this model since non linear loads cannot be included in the simulation. The model proposed in [5] is valid under the assumption of negligible losses and is suitable for direct time domain analysis. The equivalent circuit involves several controlled sources to take into account the coupling between the external and internal parts of the cable. The main drawback is that the equivalent circuits for modeling the analytical expressions of the controlled sources are quite complex and only expert users can deal with them. Grounding conductor Box 1 Box 2 Shielded cable V o PCB 1 PCB V i Figure 1 Box-to box structure with a two-wire shielded cable connecting PCB 1 and PCB 2. Grounding conductor The goal of this paper is to provide a simple SPICE model to simulate the box-to-box structure when the interconnect is a two-wire shielded cable (i.e., twinax or twisted-pair cable). The configuration of interest is schematically shown in Fig. 1, where the noise produced by an EMI current flowing through the grounding conductor of box 1 is modeled by the voltage source V i. The SPICE circuit that is here proposed is extremely simple and can be easily implemented by any user interested in investigating conducted transient immunity of two-wire shielded cables. The model is based on the classic subdivision of the cable in a cascade of lumped element circuit cells. However, contrary to the usual shielded cable representation based on the separation in internal and external transmission lines coupled through the shield transfer impedance, the cable is here seen as a three-conductor TL above a ground reference. Particular attention is addressed to properly define the mutual inductive coupling between the wires and the shield in order to take into account the penetration through apertures proper of real braided shields. The main limitation of the proposed model is the number of electrically short cells required to simulate interferences up to the maximum frequency of interest. However, in practical immunity test cases, cables are not very long (i.e., some meters) and interfering disturbances of interest (i.e., SURGE, EFT and ESD) are characterized by a maximum frequency less than 1GHz. Therefore, the number of cells required for good accuracy is quite low. The main advantages of the proposed SPICE model are the simplicity, the suitability for direct time domain analysis and the ability to account for arbitrary cable terminations (even non-linear) without any adaptation network as described in [4].
2 Wire #1 Wire #2 Shield R w1 R w2 R s L w1 L w2 L s C 1s C 12 C 2s C s Inductive Mutual Coupling M 12 L w1 L w2 M 1s M 2s L w1 L s L w2 L s where L t1 and L t2 are the shield transfer inductances for wires 1 and 2 respectively. The derivation of (1) in case of a coaxial cable can be found in [9]. For an ideal cable shield, L t1 = L t2 =, and (1) reduce to the formulas provided in [1]. In practice, the transfer inductances L t1 and L t2 are unknown and no analytical formulas are available. However, they can be derived as described in the next section from the shield transfer impedance measurement. Figure 2 Equivalent lumped circuit of a two-wire shielded cable above a reference ground seen as a MTL with three conductors above ground. R and L per-unit-line parameters R w1, L w1 R w2, L w2 C 12 M 1s M 12 M 2s R s,l s Infinite ground plane Figure 3 Electrical parameters of the lumped circuit model of a two-wire shielded cable above a reference ground. II. SPICE CIRCUIT OF TWO-WIRE SHIELDED CABLES The goal of this section is to present a SPICE model of a two-wire shielded cable above a reference ground easy to implement by anyone interested in investigating the conducted immunity to SURGE, ESD and EFT through a fast prediction tool. The two-wire shielded cable above a reference ground can be seen as a three-conductor transmission line above a metallic ground plane. In case of an electrically short cable (i.e., L cable λ/1=3/f MHz, where λ is the wavelength in meters and f MHz is the maximum frequency of interest in MHz), the three-conductor TL can be modelled by the lumped equivalent circuit shown in Fig. 2. The electrical parameters of the lumped equivalent circuit are visualized in Fig. 3. Since the shield operates an electrostatic separation between the internal and external parts, the wires-to-ground capacitances are not present. The cable capacitances as well as the inductances L w1, L w2, L s and M 12 can be easily calculated as described in [8] for a general MTL. Particular attention needs to be addressed to the mutual inductive couplings M 1s and M 2s between the inner wires and the shield. In fact, in order to take into account the penetration through apertures of realistic cable shields, these mutual inductances are given by: M = L L (1a) 1s s t1 M = L L (1b) 2s s t2 C per-unit-line parameters ε r =1.77 C 1s C 2s C s Infinite ground plane III. MEASUREMENTS OF REAL SHIELD COMMON AND DIFFERENTIAL MODE IMPEDANCES In case of real shields, L t1 and L t2 can be derived from the common and differential mode transfer impedances Z t_cm and Z t_dm that can be measured according to the procedure described in [11]. The measurement setup is schematically shown in Fig. 4a, and the corresponding equivalent SPICE circuit in Fig. 4b, where the left end of the inner wires is connected to ground while the right end is left open. These termination conditions are used for deriving both transfer impedances Z t_cm and Z t_dm. The common mode (CM) transfer impedance Z t_cm can be simply measured with the same method used for coaxial cable by joining the two wires at both cable ends, injecting a current I sh on the cable shield according to a setup reproducing a triaxial structure, and measuring the common mode voltage V cm between one end of the two wires and the shield so that: Faraday cage μv Controlled sources: VFT1=Z t1 I sh VFT2=Z t2 I sh R sg1 V ( f) L +L Zt_cm ( f ) = =R +j ω (2) I R sout I d (,f) R w R w L sout cm t2 t1 t sh( f) 2 G Current probe x L w1 L w2 M 12 I sh Vsource I sh (x,f) Z d=2r w+jω (L w1+l w2-2m 12) VFT1 VFT2 Figure 4 Setup for indirect measurement of differential mode transfer impedance Z t_dm with a current probe, and its equivalent circuit for SPICE. Note that: Z t1=r t+jωl t1 and Z t2=r t+ jωl t1 I d R sg2 R c Vc Open circuit V cm
3 The differential mode (DM) transfer impedance Z t_dm can be obtained by joining the two wires at each end of the cable and performing the two following measurements: - Measurement of the ratio I d (f)/i sh (f) versus frequency, where I d (f) is the internal loop current of the two wires (see Fig. 4a); - Measurement of the loop impedance of the two wires Z d (f) versus frequency. The differential mode transfer impedance is then derived as: r shield =3 mm d wire =1 mm ε r =1.77 Z( f) I ( f) Z ( ) - ( ) d d t_dm f = = jω Lt2 Lt1 cable Ish ( f) (3) h line =1 cm r wire =.5 mm Cable lenght=1 m Infinite ground plane Indirect measurement of Z t_dm needs two measurements but provides excellent common-mode rejection by using a current probe to measure I d (f). For both measurements, the cable must be electrically short. Therefore we can use I d (f)=i d (,f) and I sh (f)=i sh (,f). R 1ss V 1ss R 1sl R 12s V12s R 12l IV. SPICE MODEL VALIDATION To validate the proposed SPICE model, the cable configuration shown in Fig. 5 was considered assuming the following parameters: Resistance between wires and shield R 1ss =R 2ss =R 1sl = R 2sl =5Ω for both source and load ends; Resistance between the two inner wires R 12s = R 12l =1Ω for both source and load ends; Resistance between shield and infinite ground plane R gnds = R gndl =Ω for both source and load ends; Per unit length (p.u.l.) resistance of internal wires R w1 = R w2 =Ω/m; P.u.l. shield transfer resistance R t =Ω/m; P.u.l. shield transfer inductances L t1 =.8nH/m, L t2 =1.2nH/m. The shield transfer inductances L t1 and L t2 were derived by measurements as described in Section III. The common and differential mode transfer impedances obtained with the above mentioned values of R t, L t1 and L t2 are shown in Fig. 6. It can be noted that the obtained plot is very similar to the measurements shown in Fig of reference [11]. The first validation was performed comparing the results of the proposed low frequency (LF) SPICE model with those obtained through the high frequency (HF) compact model presented in [4] for a cable of length l cable =. The LF SPICE circuit was obtained by cascading 3 cells. Frequency domain simulations were carried out adopting a unit voltage source exciting the cable shield at one end as shown in Fig. 5b. The voltages across the termination resistances at the source end and the current induced on the cable shield are shown in Figs It can be noted a very good agreement for frequencies below 9MHz. Above 9MHz (i.e., high frequency range) the lumped model fails since the section length chosen to discretize the cable is not any longer electrically short. V source u 1u 1u 1n 1n R 2ss R gnds I gnds 1 cell Shielded Cable Cable Figure 5 Two-wire cable cross section, and terminations used for the model validation. Transfer impedance (Ohm/m) Common mode transfer impedance Z t_cm Differential mode transfer impedance Z t_dm R 2sl R gndl 1n k 1k 1k 1M 1M 1M 1G Figure 6 Simulated common- and differential-mode transfer impedance of a two-wire shielded cable with transfer inductances L t1=.8nh/m, L t2=1.2nh/m derived from measurements.
4 u.1.1 1u 1u 1n 1n Voltage V 1ss across the load resistance R 1ss (V) HF SPICE model [4] LF SPICE model 9 MHz LF HF k 1k 1k 1M 1M 1M 1G Voltage V 12s across the load resistance R 12s (V) HF SPICE model [4] LF SPICE model LF HF 9 MHz k 1k 1k 1M 1M 1M 1G 9 MHz Figure 7 Comparison between results obtained with the proposed LF SPICE model and with the HF model [4]: voltages at the source end across resistances R 1ss and R 12s. Current I gnds on the cable shield (A) 1k LF 9 MHz HF contains the receiver. The experimental test setup is shown in Fig. 9. The ESD generator MiniZap loaded at 5-kV voltage was used to reproduce typical ESD events. The EMI occurring in the shielded foil twisted pair (SFTP) cable was measured by the current probe Tektronix CT-1 connected to a digital oscilloscope characterized by 1-GHz bandwidth and placed inside a shielded enclosure in order to avoid coupling with the ESD radiated field. Common-mode (CM) interference was measured introducing the two wires of the SFTP cable through the small hole of the current probe, while differential-mode (DM) interference was measured in the same manner but using one wire only. In the following, the interference is represented in terms of induced voltage on the receiver, obtained multiplying the measured current for the CM and DM resistances (i.e., 5 Ω and Ω, respectively). The reference ESD current waveform as provided in the IEC standard [14] has an 85-MHz bandwidth. For the considered 1-m long cable, 3 unit cells provide a suitable approximation up to 1 GHz. The ESD gun used in real testing has been modeled using the ESD generator equivalent circuit provided in []. The induced CM and DM voltages at the receiver end are shown in Figs It is worth noting that the overall behaviour of the calculated and measured CM and DM induced currents is pretty much the same (note that the oscillations depend on the length and position of the green wires simulated as TL with 25-Ω characteristic impedance and 3.3-ns time delay). In addition, not significant differences can be observed in the peak-to-peak values nevertheless the complexity of the setup to be simulated. CM effect due to short pigtails was modelled by a 5-nH inductance at both ends of the cable shield. DM effect due to unbalancing causes was modelled by a 1-μH inductance on one wire at source end. Note also that the height of the line (45cm) from the reference plane is not electrically short for frequencies near 1GHz. Grounding and dissymmetry effects are further investigated in the following.. HF SPICE model [4] LF SPICE model.2m k 1k 1k 1M 1M 1M 1G Figure 8 Current on the cable shield I gnds calculated by the proposed LF SPICE model and the HF model [4]. Discharge point MiniZap ESD generator The SPICE model was also validated experimentally by performing a transient analysis in case of an electrostatic discharge (ESD) interference. The configuration used as test is the same that was used in [13], and consists of a two-wire shielded cable of length, placed at 45cm from the ground plane, and connecting differential driver/receiver RS422, both placed inside OPMC shielded enclosures of size 5cm 86cm 3cm. Both the enclosures are positioned on isolating stands of 1-cm thickness, and grounded by green wires. RJ45 shielded connectors are used to link the cable with PCBs. The ESD event in contact mode is assumed to occur on box 1 which Driver enclosure Grounding OPM Flat cable used as ESD strap connected to the metallic floor Figure 9 Experimental setup of ESD testing on a two-wire shielded cable connecting two shielded boxes.
5 V esd_cm = 47 V Measurements L probe Box 1 Box 2 Shielded cable PCB 1 PCB 2 pigtails L shin L shout 2 ns/div ESD L gnds C gnds C gndl L gndl Common mode voltage (V) V esd_cm = 46 V (s) Figure 1 Common mode voltage at the cable source end induced by an ESD event occuring on box1: measurements, and simulations V esd_dm =7 V 2 ns/div Differential mode voltage (V) V esd_dm =5.3 V SPICE Measurements SPICE (s) Figure 11 Differential mode voltage at the cable source end induced by an ESD event occuring on box1: measuremenets, and simulations. Metal reference ground: ideal plane Figure 12 Grounding configurations investigated by SPICE simulations in case of an ESD event as EMI source. The SPICE model shown in Fig. 5 was also used to quantify the influence of different grounding practices and undesired dissymmetry effects on wires. A cable of length l cable = was considered and 3 unit cells were cascaded for deriving the equivalent circuit. Assuming an ESD event occurring on Box 1 (see Fig. 12), the following configurations were investigated: 1. Boxes perfectly connected to ground (L gnds = L gndl = and C gnds =C gndl =); 2. Boxes connected to ground by cord (L gnds =L gnds =1μH and C gnds =C gndl =1pF); 3. Boxes grounded by cord and cable shield connected to boxes with pigtails (L sin =L sout =5nH); 4. Boxes grounded by cord, with pigtails and a probe inductance for current measurement on wire 1 (L probe =1nH). The comparison among the different configurations was carried out pointing the attention to the ESD current at discharge point, and to the CM and DM voltages induces across the load at the source end. The ESD currents at discharge point are shown in Fig. 13. In case 1, the ESD current has the same rise time of the reference IEC current for 5kV discharge according to the expectations being L gnd =. This result confirms also that 3 cells are an appropriate approximation for the transient simulation. In cases 2, 3, 4, we can note the same ESD current waveform and a lower first peak. Long oscillations for all cases are due to the 1μH strap inductance of the ESD gun []. The CM and DM voltages induced across the load at the source end are shown in Fig. 14. Note that case 1 gives too low voltages to be distinguishable. The peak-to-peak common and differential mode voltages obtained for the four grounding conditions are summarized in Tab. I, and the following comments can be drawn: When the structure is perfectly connected to the reference ground and cable shield connected to box by a 36-degree contact, the CM and DM noise is very low in the order of μvolt. With boxes isolated (1pF) and connected to ground by a cord of 1-μH inductance, the CM and DM noise rise to some volt.
6 ESD current at discharge point (A) 2 Cases 2,3,4 IEC 1 Common mode voltage at source end (V) 7.5 Cases 3,4 24 V V s_cm 5 Case ESD current at discharge point (A) 2 1 Cases 2,3,4 5 Case Figure 13 ESD current at discharge point: full scale, zoom of the peak currents. Table I - Peak-to- peak common and differential mode voltages obtained for the different grounding conditions V esd_cm V esd_dm Case 1: good shielding 35μV 12.5μV Case 2: boxes isolated 2.1V.67V Case 3: boxes isolated + pigtail 24V.59V Case 3: boxes isolated + pigtail + L probe 21V 2.25V With cable shield connected to box by pigtail of 5nH, and boxes connected to ground with cords of about 1μH, the CM noise becomes 1 times higher and the DM noise does not change. With cable shield connected to box by pigtail, boxes connected to the ground by cords, and a dissymmetry due to a probe inductance of 1nH on wire 1, the DM noise becomes 4 times higher and the CM noise does not change. V. CONCLUSIONS The proposed SPICE model of a two-wire shielded cable is suitable for both frequency and direct time domain simulations and for any kind of load conditions at both ends (including nonlinear). The common- and differential- mode transfer impedance concept have been used to derive an RLC network that simulates an electrically short segment of the cable (unit cell). A cascade of cells can appropriately simulate ground loop coupling produced by conducted disturbances such as ESD, EFT and SURGE. The bandwidth of these noises (about 1GHz for ESD, 2MHz for EFT, 2MHz for SURGE) determines the number of unit cell to be used. This number may be much less than 1 in many cases of practical interest where cable lengths are some meters. Problems caused by various grounding IEC -7.5 Case Differential mode voltage at source end (V) 1.5 Case V.75 V s_dm -.75 Cases 2, Figure 14 Simulated ESD induced effects in a two-wires cable: common mode voltage V S_cm and differential mode voltage V S_dm. topologies such as non-appropriate cable connection to box (i.e., use of pigtails), or dissymmetry in the differential circuit, can be quickly and effectively simulated. REFERENCES [1] S. Caniggia, L. Vitucci, M. Acquaroli, A. Giordano, Measurements and SPICE model for data signal lines under electrical fast transient test, EMC EUROPE 2, Brugge, Belgium, Sept. 2. [2] S. Caniggia, F. Maradei, Equivalent circuit models for the analysis of coaxial cables immunity, IEEE Int. Symp. on Electromag. Compat., Boston, USA, Aug. 23. [3] A. Orlandi, Circuit model for bulk current injection test on shielded coaxial cable, IEEE Trans. on Electromag. Compat., vol. 45, no. 4, Nov. 23, pp [4] S. Caniggia, F. Maradei, SPICE-Like Models for the Analysis of the Conducted and Radiated Immunity of Shielded Cables, IEEE Trans. on Electromag. Compat., Vol. 46, no.. 4, Nov. 24 [5] G. Antonini, A. Orlandi, SPICE Equivalent circuit of a Two-Parallel- Wires Shielded Cable for Evaluation of the RF Induced Voltages at the Terminations, IEEE Trans. Electromag. Compat., vol. 46, no. 2, pp , May 24. [6] H. Xie, J. Wang, R. Fan, and Y. Liu, SPICE Models for Prediction of Disturbances Induced by Nonuniform Fields on Shielded Cables, IEEE Trans. Electromag. Compat., vol. 53, no. 1, pp , Feb [7] H. Xie, J. Wang, R. Fan, and Y. Liu, SPICE Models to analyze Radiated and Conducted Susceptibilities of Shielded Coaxial Cables, IEEE Trans. Electromag. Compat., vol. 52, no. 1, pp , Feb. 21. [8] Clayton Paul, Introduction to Electromagnetic Compatibility, second edition, John Wiley and Sons, 26 [9] S. Caniggia, F. Maradei, Signal Integrity and Radiated Emission, John Wiley and Sons, 28 [1] Henry Ott, Electromagnetic Compatibility Engineering, John Wiley & Sons, 29 [11] P. Degauque, Joel Hamelin, Electromagnetic Compatibility, Oxford University Press, 1993 [12] SPICE, Spectrum Software, [13] S. Caniggia, F. Maradei, Interference in shielded foil twisted pair (SFTP) cables due to ESD, IEEE 27 International Symposium on Electromagnetic Compatibility, Honolulu (USA), July 9-13, 27, pp [14] IEC 61 Part 4-2 Ed.2: Testing and Measurement Techniques Section 2: Electrostatic Discharge (ESD) Immunity Test, [] S. Caniggia, F. Maradei, Circuit and numerical modeling of electrostatic discharge generators, IEEE Trans. Industry Applications, vol.42, no.6, Nov./Dic. 26, pp
Circuital and Numerical Modeling of Electrostatic Discharge Generators
Circuital and Numerical Modeling of Electrostatic Discharge Generators Spartaco Caniggia ITLTEL S.p.. Settimo Milanese 219, Milan, Italy Francescaromana Maradei Department of Electrical Engineering University
More informationMEASUREMENTS OF COUPLING THROUGH BRAIDED SHIELD VIA NEW CONDUCTED IMMUNITY TECH- NIQUE
Progress In Electromagnetics Research C, Vol. 11, 61 68, 2009 MEASUREMENTS OF COUPLING THROUGH BRAIDED SHIELD VIA NEW CONDUCTED IMMUNITY TECH- NIQUE M. Ghassempouri College of Electrical Engineering Iran
More informationOPEN SOURCE CABLE MODELS FOR EMI SIMULATIONS
OPEN SOURCE CABLE MODELS FOR EMI SIMULATIONS S. Greedy 1, C. Smartt 1, D. W. P. Thomas 1. 1 : George Green Institute for Electromagnetics Research, Department of Electrical and Electronic Engineering,
More informationOverview of the ATLAS Electromagnetic Compatibility Policy
Overview of the ATLAS Electromagnetic Compatibility Policy G. Blanchot CERN, CH-1211 Geneva 23, Switzerland Georges.Blanchot@cern.ch Abstract The electromagnetic compatibility of ATLAS electronic equipments
More informationIntroduction to Electromagnetic Compatibility
Introduction to Electromagnetic Compatibility Second Edition CLAYTON R. PAUL Department of Electrical and Computer Engineering, School of Engineering, Mercer University, Macon, Georgia and Emeritus Professor
More informationModeling and Practical Suggestions to Improve ESD Immunity Test Repeatability
17 th Symposium IMEKO TC, 3 rd Symposium IMEKO TC 19 and 15 th IWDC Workshop Sept. -1, 1, Kosice, Slovakia Modeling and Practical Suggestions to Improve ESD Immunity Test Repeatability. Morando 1, M. Borsero,.
More informationA Combined Impedance Measurement Method for ESD Generator Modeling
A Combined Impedance Measurement Method for ESD Generator Modeling Friedrich zur Nieden, Stephan Frei Technische Universität Dortmund AG Bordsysteme Dortmund, Germany David Pommerenke Missouri University
More informationInternal Model of X2Y Chip Technology
Internal Model of X2Y Chip Technology Summary At high frequencies, traditional discrete components are significantly limited in performance by their parasitics, which are inherent in the design. For example,
More informationTodd H. Hubing Michelin Professor of Vehicular Electronics Clemson University
Essential New Tools for EMC Diagnostics and Testing Todd H. Hubing Michelin Professor of Vehicular Electronics Clemson University Where is Clemson University? Clemson, South Carolina, USA Santa Clara Valley
More informationProgress In Electromagnetics Research, Vol. 119, , 2011
Progress In Electromagnetics Research, Vol. 119, 253 263, 2011 A VALIDATION OF CONVENTIONAL PROTECTION DEVICES IN PROTECTING EMP THREATS S. M. Han 1, *, C. S. Huh 1, and J. S. Choi 2 1 INHA University,
More informationAN IMPROVED MODEL FOR ESTIMATING RADIATED EMISSIONS FROM A PCB WITH ATTACHED CABLE
Progress In Electromagnetics Research M, Vol. 33, 17 29, 2013 AN IMPROVED MODEL FOR ESTIMATING RADIATED EMISSIONS FROM A PCB WITH ATTACHED CABLE Jia-Haw Goh, Boon-Kuan Chung *, Eng-Hock Lim, and Sheng-Chyan
More informationModelling electromagnetic field coupling from an ESD gun to an IC
Modelling electromagnetic field coupling from an ESD gun to an IC Ji Zhang #1, Daryl G Beetner #2, Richard Moseley *3, Scott Herrin *4 and David Pommerenke #5 # EMC Laboratory, Missouri University of Science
More informationEMC Immunity studies for front-end electronics in high-energy physics experiments
EMC Immunity studies for front-end electronics in high-energy physics experiments F. Arteche*, C. Rivetta**, *CERN,1211 Geneve 23 Switzerland, **FERMILAB, P.O Box 0 MS341, Batavia IL 510 USA. e-mail: fernando.arteche@cern.ch,
More informationDesign for Guaranteed EMC Compliance
Clemson Vehicular Electronics Laboratory Reliable Automotive Electronics Automotive EMC Workshop April 29, 2013 Design for Guaranteed EMC Compliance Todd Hubing Clemson University EMC Requirements and
More informationCHAPTER 4 MEASUREMENT OF NOISE SOURCE IMPEDANCE
69 CHAPTER 4 MEASUREMENT OF NOISE SOURCE IMPEDANCE 4.1 INTRODUCTION EMI filter performance depends on the noise source impedance of the circuit and the noise load impedance at the test site. The noise
More information3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB
3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB Tae Hong Kim, Hyungsoo Kim, Jun So Pak, and Joungho Kim Terahertz
More informationElectromagnetic Compatibility
Electromagnetic Compatibility Introduction to EMC International Standards Measurement Setups Emissions Applications for Switch-Mode Power Supplies Filters 1 What is EMC? A system is electromagnetic compatible
More informationAlternative Coupling Method for Immunity Testing of Power Grid Protection Equipment
Alternative Coupling Method for Immunity Testing of Power Grid Protection Equipment Christian Suttner*, Stefan Tenbohlen Institute of Power Transmission and High Voltage Technology (IEH), University of
More informationUnderstanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies
Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies 1 Definitions EMI = Electro Magnetic Interference EMC = Electro Magnetic Compatibility (No EMI) Three Components
More informationPhysical Test Setup for Impulse Noise Testing
Physical Test Setup for Impulse Noise Testing Larry Cohen Overview Purpose: Use measurement results for the EM coupling (Campbell) clamp to determine a stable physical test setup for impulse noise testing.
More information150Hz to 1MHz magnetic field coupling to a typical shielded cable above a ground plane configuration
150Hz to 1MHz magnetic field coupling to a typical shielded cable above a ground plane configuration D. A. Weston Lowfreqcablecoupling.doc 7-9-2005 The data and information contained within this report
More informationELECTROMAGNETIC COMPATIBILITY HANDBOOK 1. Chapter 8: Cable Modeling
ELECTROMAGNETIC COMPATIBILITY HANDBOOK 1 Chapter 8: Cable Modeling Related to the topic in section 8.14, sometimes when an RF transmitter is connected to an unbalanced antenna fed against earth ground
More informationDesign of EMI Filters for DC-DC converter
Design of EMI Filters for DC-DC converter J. L. Kotny*, T. Duquesne**, N. Idir** Univ. Lille Nord de France, F-59000 Lille, France * USTL, F-59650 Villeneuve d Ascq, France ** USTL, L2EP, F-59650 Villeneuve
More informationTime-Domain Coupling Analysis of Shielded Cable on the Ground Excited by Plane Wave
Progress In Electromagnetics Research M, Vol. 67, 45 53, 018 Time-Domain Coupling Analysis of Shielded Cable on the Ground Excited by Plane Wave Zhihong Ye 1, *, Cheng Liao, and Chuan Wen 1 Abstract This
More informationModeling and Simulation of Powertrains for Electric and Hybrid Vehicles
Modeling and Simulation of Powertrains for Electric and Hybrid Vehicles Dr. Marco KLINGLER PSA Peugeot Citroën Vélizy-Villacoublay, FRANCE marco.klingler@mpsa.com FR-AM-5 Background The automotive context
More informationA Comparison Between MIL-STD and Commercial EMC Requirements Part 2. By Vincent W. Greb President, EMC Integrity, Inc.
A Comparison Between MIL-STD and Commercial EMC Requirements Part 2 By Vincent W. Greb President, EMC Integrity, Inc. OVERVIEW Compare and contrast military (i.e., MIL-STD) and commercial EMC immunity
More informationTest and Measurement for EMC
Test and Measurement for EMC Bogdan Adamczyk, Ph.D., in.c.e. Professor of Engineering Director of the Electromagnetic Compatibility Center Grand Valley State University, Michigan, USA Ottawa, Canada July
More informationA review of shielding performance By Albert R. Martin
A review of shielding performance By Albert R. Martin INTRODUCTION What determines how effective a cable shield is going to be? And how does the decision to ground or not ground a shield impact its effectiveness?
More informationAP7301 ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY L T P C COURSE OBJECTIVES:
AP7301 ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY L T P C 3 0 0 3 COURSE OBJECTIVES: To understand the basics of EMI To study EMI Sources To understand EMI problems To understand Solution methods in
More informationSignal and Noise Measurement Techniques Using Magnetic Field Probes
Signal and Noise Measurement Techniques Using Magnetic Field Probes Abstract: Magnetic loops have long been used by EMC personnel to sniff out sources of emissions in circuits and equipment. Additional
More informationComparison of IC Conducted Emission Measurement Methods
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 52, NO. 3, JUNE 2003 839 Comparison of IC Conducted Emission Measurement Methods Franco Fiori, Member, IEEE, and Francesco Musolino, Member, IEEE
More informationAdvanced Topics in EMC Design. Issue 1: The ground plane to split or not to split?
NEEDS 2006 workshop Advanced Topics in EMC Design Tim Williams Elmac Services C o n s u l t a n c y a n d t r a i n i n g i n e l e c t r o m a g n e t i c c o m p a t i b i l i t y e-mail timw@elmac.co.uk
More informationEFFECT OF SHIELDING ON CABLE RF INGRESS MEASUREMENTS LARRY COHEN
EFFECT OF SHIELDING ON CABLE RF INGRESS MEASUREMENTS LARRY COHEN OVERVIEW Purpose: Examine the common-mode and differential RF ingress levels of 4-pair UTP, F/UTP, and F/FTP cables at an (RJ45) MDI port
More informationCHAPTER 2 EQUIVALENT CIRCUIT MODELING OF CONDUCTED EMI BASED ON NOISE SOURCES AND IMPEDANCES
29 CHAPTER 2 EQUIVALENT CIRCUIT MODELING OF CONDUCTED EMI BASED ON NOISE SOURCES AND IMPEDANCES A simple equivalent circuit modeling approach to describe Conducted EMI coupling system for the SPC is described
More informationAn Investigation of the Effect of Chassis Connections on Radiated EMI from PCBs
An Investigation of the Effect of Chassis Connections on Radiated EMI from PCBs N. Kobayashi and T. Harada Jisso and Production Technologies Research Laboratories NEC Corporation Sagamihara City, Japan
More informationPhysical RF Circuit Techniques and Their Implications on Future Power Module and Power Electronic Design
Physical RF Circuit Techniques and Their Implications on Future Power Module and Power Electronic Design Adam Morgan 5-5-2015 NE IMAPS Symposium 2015 Overall Motivation Wide Bandgap (WBG) semiconductor
More informationVerifying Simulation Results with Measurements. Scott Piper General Motors
Verifying Simulation Results with Measurements Scott Piper General Motors EM Simulation Software Can be easy to justify the purchase of software packages even costing tens of thousands of dollars Upper
More informationTesting for EMC Compliance: Approaches and Techniques October 12, 2006
: Approaches and Techniques October 12, 2006 Ed Nakauchi EMI/EMC/ESD/EMP Consultant Emulex Corporation 1 Outline Discuss EMC Basics & Physics Fault Isolation Techniques Tools & Techniques Correlation Analyzer
More informationEMC review for Belle II (Grounding & shielding plans) PXD DEPFET system
EMC review for Belle II (Grounding & shielding plans) PXD DEPFET system Outline 1. Introduction 2. Grounding strategy Implementation aspects 3. Noise emission issues Test plans 4. Noise immunity issues
More informationInvestigation of Cavity Resonances in an Automobile
Investigation of Cavity Resonances in an Automobile Haixiao Weng, Daryl G. Beetner, Todd H. Hubing, and Xiaopeng Dong Electromagnetic Compatibility Laboratory University of Missouri-Rolla Rolla, MO 65409,
More informationDesigning external cabling for low EMI radiation A similar article was published in the December, 2004 issue of Planet Analog.
HFTA-13.0 Rev.2; 05/08 Designing external cabling for low EMI radiation A similar article was published in the December, 2004 issue of Planet Analog. AVAILABLE Designing external cabling for low EMI radiation
More informationSuppression Techniques using X2Y as a Broadband EMI Filter IEEE International Symposium on EMC, Boston, MA
Suppression Techniques using X2Y as a Broadband EMI Filter Jim Muccioli Tony Anthony Dave Anthony Dale Sanders X2Y Attenuators, LLC Erie, PA 16506-2972 www.x2y.com Email: x2y@x2y.com Bart Bouma Yageo/Phycomp
More informationFlexRay Communications System. Physical Layer Common mode Choke EMC Evaluation Specification. Version 2.1
FlexRay Communications System Physical Layer Common mode Choke EMC Evaluation Specification Version 2.1 Disclaimer DISCLAIMER This specification as released by the FlexRay Consortium is intended for the
More informationTodd Hubing. Clemson University. Cabin Environment Communication System. Controls Airbag Entertainment Systems Deployment
Automotive Component Measurements for Determining Vehicle-Level Radiated Emissions Todd Hubing Michelin Professor of Vehicular Electronics Clemson University Automobiles are Complex Electronic Systems
More informationEMC analysis workflow
EMC analysis workflow Antonio Ciccomancini Scogna, CST of America antonio.ciccomancini@cst.com EMC/EMI Applications Emissions Susceptibility E3 Typical Emissions Issues 1 2 Image courtesy of Johnson Controls
More informationApplications of 3D Electromagnetic Modeling in Magnetic Recording: ESD and Signal Integrity
Applications of 3D Electromagnetic Modeling in Magnetic Recording: ESD and Signal Integrity CST NORTH AMERICAN USERS FORUM John Contreras 1 and Al Wallash 2 Hitachi Global Storage Technologies 1. San Jose
More informationAn Analysis of the Fields on the Horizontal Coupling Plane in ESD testing
An Analysis of the Fields on the Horizontal Coupling Plane in ESD testing Stephan Frei David Pommerenke Technical University Berlin, Einsteinufer 11, 10597 Berlin, Germany Hewlett Packard, 8000 Foothills
More informationChapter 12 Digital Circuit Radiation. Electromagnetic Compatibility Engineering. by Henry W. Ott
Chapter 12 Digital Circuit Radiation Electromagnetic Compatibility Engineering by Henry W. Ott Forward Emission control should be treated as a design problem from the start, it should receive the necessary
More informationEMI AND BEL MAGNETIC ICM
EMI AND BEL MAGNETIC ICM ABSTRACT Electromagnetic interference (EMI) in a local area network (LAN) system is a common problem that every LAN system designer faces, and it is a growing problem because the
More informationBASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises
BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises I. EXERCISE NO 1 - Spot the PCB design errors Spot the six design errors in
More informationChapter 5 Electromagnetic interference in flash lamp pumped laser systems
Chapter 5 Electromagnetic interference in flash lamp pumped laser systems This chapter presents the analysis and measurements of radiated near and far fields, and conducted emissions due to interconnects
More informationAnalogue circuit design for RF immunity
Analogue circuit design for RF immunity By EurIng Keith Armstrong, C.Eng, FIET, SMIEEE, www.cherryclough.com First published in The EMC Journal, Issue 84, September 2009, pp 28-32, www.theemcjournal.com
More informationT + T /13/$ IEEE 236. the inverter s input impedances on the attenuation of a firstorder
Emulation of Conducted Emissions of an Automotive Inverter for Filter Development in HV Networks M. Reuter *, T. Friedl, S. Tenbohlen, W. Köhler Institute of Power Transmission and High Voltage Technology
More informationEMC Simulation of Consumer Electronic Devices
of Consumer Electronic Devices By Andreas Barchanski Describing a workflow for the EMC simulation of a wireless router, using techniques that can be applied to a wide range of consumer electronic devices.
More informationUse and abuse of screened cables
December 2016 Use and abuse of screened cables Tim Williams Elmac Services 1 of 21 Outline How does a screened cable work? electric fields, magnetic fields, low versus high frequency Types of screen Transfer
More informationLarge E Field Generators in Semi-anechoic Chambers for Full Vehicle Immunity Testing
Large E Field Generators in Semi-anechoic Chambers for Full Vehicle Immunity Testing Vince Rodriguez ETS-Lindgren, Inc. Abstract Several standards recommend the use of transmission line systems (TLS) as
More informationThe effect of USB ground cable and product dynamic capacitance on IEC qualification
Tampere University of Technology The effect of USB ground cable and product dynamic capacitance on IEC61000-4-2 qualification Citation Tamminen, P., Ukkonen, L., & Sydänheimo, L. (2015). The effect of
More informationTECHNICAL REPORT: CVEL Investigation of the Imbalance Difference Model and its Application to Various Circuit Board and Cable Geometries
TECHNICAL REPORT: CVEL-0-07.0 Investigation of the Imbalance Difference Model and its Application to Various Circuit Board and Cable Geometries Hocheol Kwak and Dr. Todd Hubing Clemson University May.
More informationAnalysis of a PCB-Chassis System Including Different Sizes of Multiple Planes Based on SPICE
Analysis of a PCB-Chassis System Including Different Sizes of Multiple Planes Based on SPICE Naoki Kobayashi (1), Todd Hubing (2) and Takashi Harada (1) (1) NEC, System Jisso Research Laboratories, Kanagawa,
More informationENERGY CABLE MODELING UNDER POWER ELECTRONIC CONVERTER CONSTRAINTS
ENERGY CABLE MODELING UNDER POWER ELECTRONIC CONVERTER CONSTRAINTS Yannick WEENS, USTL - L2EP, (France), yannick.weens@ed-univ-lille1.fr Nadir IDIR, USTL - L2EP, (France), nadir.idir@univ-lille1.fr Jean
More informationTECHNICAL REPORT: CVEL Special Considerations for PCB Heatsink Radiation Estimation. Xinbo He and Dr. Todd Hubing Clemson University
TECHNICAL REPORT: CVEL-11-27 Special Considerations for PCB Heatsink Radiation Estimation Xinbo He and Dr. Todd Hubing Clemson University May 4, 211 Table of Contents Abstract... 3 1. Configuration for
More informationModeling of Power Planes for Improving EMC in High Speed Medical System
Modeling of Power Planes for Improving EMC in High Speed Medical System Surender Singh, Dr. Ravinder Agarwal* *Prof : Dept of Instrumentation Engineering Thapar University, Patiala, India Dr. V. R. Singh
More informationElectromagnetic Compatibility of Power Converters
Published by CERN in the Proceedings of the CAS-CERN Accelerator School: Power Converters, Baden, Switzerland, 7 14 May 2014, edited by R. Bailey, CERN-2015-003 (CERN, Geneva, 2015) Electromagnetic Compatibility
More information10 Safety earthing/grounding does not help EMC at RF
1of 6 series Webinar #3 of 3, August 28, 2013 Grounding, Immunity, Overviews of Emissions and Immunity, and Crosstalk Contents of Webinar #3 Topics 1 through 9 were covered by the previous two webinars
More informationTechniques to reduce electromagnetic noise produced by wired electronic devices
Rok / Year: Svazek / Volume: Číslo / Number: Jazyk / Language 2016 18 5 EN Techniques to reduce electromagnetic noise produced by wired electronic devices - Tomáš Chvátal xchvat02@stud.feec.vutbr.cz Faculty
More informationReconstruction of Current Distribution and Termination Impedances of PCB-Traces by Magnetic Near-Field Data and Transmission-Line Theory
Reconstruction of Current Distribution and Termination Impedances of PCB-Traces by Magnetic Near-Field Data and Transmission-Line Theory Robert Nowak, Stephan Frei TU Dortmund University Dortmund, Germany
More information2620 Modular Measurement and Control System
European Union (EU) Council Directive 89/336/EEC Electromagnetic Compatibility (EMC) Test Report 2620 Modular Measurement and Control System Sensoray March 31, 2006 April 4, 2006 Tests Conducted by: ElectroMagnetic
More informationTechniques for Investigating the Effects of ESD on Electronic Equipment Douglas C. Smith
Techniques for Investigating the Effects of ESD on Electronic Equipment Douglas C. Smith Worldwide training and design help in most areas of Electrical Engineering including EMC and ESD Copyright 2015
More informationEMC Overview. What is EMC? Why is it Important? Case Studies. Examples of calculations used in EMC. EMC Overview 1
EMC Overview What is EMC? Why is it Important? Case Studies. Examples of calculations used in EMC. EMC Overview 1 What Is EMC? Electromagnetic Compatibility (EMC): The process of determining the interaction
More informationFISCHER CUSTOM COMMUNICATIONS, INC.
FISCHER CUSTOM COMMUNICATIONS, INC. Current Probe Catalog FISCHER CUSTOM COMMUNICATIONS, INC. Fischer Custom Communications, Inc., is a manufacturer of custom electric and magnetic field sensors for military
More informationOverview of EMC Regulations and Testing. Prof. Tzong-Lin Wu Department of Electrical Engineering National Taiwan University
Overview of EMC Regulations and Testing Prof. Tzong-Lin Wu Department of Electrical Engineering National Taiwan University What is EMC Electro-Magnetic Compatibility ( 電磁相容 ) EMC EMI (Interference) Conducted
More informationLS200 TEST DATA IEC61000 SERIES
TEST DATA IEC61000 SERIES DWG. No. PA607-58-01 APPD CHK DWG TDK-Lambda INDEX LS200 PAGE 1. Electrostatic Discharge Immunity Test (IEC61000-4-2) R-1 2. Radiated Radio-Frequency Electromagnetic Field Immunity
More informationContents. 1 Introduction. 2 System-Level Electrostatic Discharge (ESD) and Electrical Fast Transient. 3 Electromagnetic Interference
Issue 3, October 2002 Electromagnetic Compatibility and Electrical Safety Contents Telcordia GR-1089 - Documentation Information Generic Requirements Notice Of Disclaimer................. iii Contents.......................................
More informationEMC Seminar Series All about EMC Testing and Measurement Seminar 1
EMC Seminar Series All about EMC Testing and Measurement Seminar 1 Introduction to EMC Conducted Immunity Jeffrey Tsang Organized by : Department of Electronic Engineering 1 Basic Immunity Standards: IEC
More informationAppropriate methods to analyse Power Conversion Harmonics
International Conference on Renewable Energies and Power Quality (ICREPQ 13) Bilbao (Spain), 20 th to 22 th March, 2013 Renewable Energy and Power Quality Journal (RE&PQJ) ISSN 2172-038 X, No.11, March
More informationKeywords Signal Integrity, micro-strip, crosstalk, NEXT, FEXT.
Volume 6, Issue 4, April 2016 ISSN: 2277 128X International Journal of Advanced Research in Computer Science and Software Engineering Research Paper Available online at: www.ijarcsse.com Effect of Vias
More informationAn Efficient Hybrid Method for Calculating the EMC Coupling to a. Device on a Printed Circuit Board inside a Cavity. by a Wire Penetrating an Aperture
An Efficient Hybrid Method for Calculating the EMC Coupling to a Device on a Printed Circuit Board inside a Cavity by a Wire Penetrating an Aperture Chatrpol Lertsirimit David R. Jackson Donald R. Wilton
More informationRelationship Between Signal Integrity and EMC
Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?
More informationCommon Impedance Shield Coupling
Common Impedance Shield Coupling When a coaxial cable is used at low frequencies and the shield is grounded at both ends, V R I IN S S The shield serves two functions: 1. the return conductor for the signal;
More informationSolutions for EMC Issues in Automotive System Transmission Lines
Solutions for EMC Issues in Automotive System Transmission Lines Todd H. Hubing Michelin Professor of Vehicle Electronics Clemson University A P R. 1 0. 2 0 1 4 TM External Use EMC Requirements and Key
More informationDebugging EMI Using a Digital Oscilloscope. Dave Rishavy Product Manager - Oscilloscopes
Debugging EMI Using a Digital Oscilloscope Dave Rishavy Product Manager - Oscilloscopes 06/2009 Nov 2010 Fundamentals Scope Seminar of DSOs Signal Fidelity 1 1 1 Debugging EMI Using a Digital Oscilloscope
More informationMaximum Power Transfer versus Efficiency in Mid-Range Wireless Power Transfer Systems
97 Maximum Power Transfer versus Efficiency in Mid-Range Wireless Power Transfer Systems Paulo J. Abatti, Sérgio F. Pichorim, and Caio M. de Miranda Graduate School of Electrical Engineering and Applied
More informationEMC TEST REPORT For MPP SOLAR INC Inverter/ Charger Model Number : PIP 4048HS
EMC-E20130903E EMC TEST REPORT For MPP SOLAR INC Inverter/ Charger Model Number : PIP 4048HS Prepared for : MPP SOLAR INC Address : 4F, NO. 50-1, SECTION 1, HSIN-SHENG S. RD. TAIPEI, TAIWAN Prepared by
More informationTransient calibration of electric field sensors
Transient calibration of electric field sensors M D Judd University of Strathclyde Glasgow, UK Abstract An electric field sensor calibration system that operates in the time-domain is described and its
More informationRadiated emission is one of the most important part of. Research on the Effectiveness of Absorbing Clamp Measurement Method.
or Research on the Effectiveness of Absorbing Clamp Measurement Method Hong GuoChun Fujian Inspection and Research Institute for Product Quality Abstract For the effectiveness of disturbance power measurement
More informationA VIEW OF ELECTROMAGNETIC LIFE ABOVE 100 MHz
A VIEW OF ELECTROMAGNETIC LIFE ABOVE 100 MHz An Experimentalist's Intuitive Approach Lothar O. (Bud) Hoeft, PhD Consultant, Electromagnetic Effects 5012 San Pedro Ct., NE Albuquerque, NM 87109-2515 (505)
More informationBulk Current Injection instead of Radiated immunity testing, in the range from 1 MHz upto 1 GHz: Measuring results
Immunity Testing: radiated immunity 41 Bulk Current Injection instead of Radiated immunity testing, in the range from 1 MHz upto 1 GHz: Measuring results Immunity Testing: radiated immunity 42 Bulk Current
More informationChapter 16 PCB Layout and Stackup
Chapter 16 PCB Layout and Stackup Electromagnetic Compatibility Engineering by Henry W. Ott Foreword The PCB represents the physical implementation of the schematic. The proper design and layout of a printed
More informationTop Ten EMC Problems
Top Ten EMC Problems presented by: Kenneth Wyatt Sr. EMC Consultant EMC & RF Design, Troubleshooting, Consulting & Training 10 Northern Boulevard, Suite 1 Amherst, New Hampshire 03031 +1 603 578 1842 www.silent-solutions.com
More informationPCB Crosstalk Simulation Toolkit Mark Sitkowski Design Simulation Systems Ltd Based on a paper by Ladd & Costache
PCB Crosstalk Simulation Toolkit Mark Sitkowski Design Simulation Systems Ltd www.designsim.com.au Based on a paper by Ladd & Costache Introduction Many of the techniques used for the modelling of PCB
More informationMethods for Testing Impulse Noise Tolerance
Methods for Testing Impulse Noise Tolerance May,6,2015 Larry Cohen Overview Purpose: Describe some potential test methods for impulse noise tolerance What we will cover in this presentation: Discuss need
More informationTECHNICAL REPORT: CVEL AN IMPROVED MODEL FOR REPRESENTING CURRENT WAVEFORMS IN CMOS CIRCUITS
TECHNICAL REPORT: CVEL-06-00 AN IMPROVED MODEL FOR REPRESENTING CURRENT WAVEFORMS IN CMOS CIRCUITS Yan Fu, Gian Lorenzo Burbui 2, and Todd Hubing 3 University of Missouri-Rolla 2 University of Bologna
More informationDesigning Your EMI Filter
The Engineer s Guide to Designing Your EMI Filter TABLE OF CONTENTS Introduction Filter Classifications Why Do We Need EMI Filters Filter Configurations 2 2 3 3 How to Determine Which Configuration to
More informationCharacterization and modelling of EMI susceptibility in integrated circuits at high frequency
Characterization and modelling of EMI susceptibility in integrated circuits at high frequency Ignacio Gil* and Raúl Fernández-García Department of Electronic Engineering UPC. Barcelona Tech Colom 1, 08222
More informationApplication Note # 5438
Application Note # 5438 Electrical Noise in Motion Control Circuits 1. Origins of Electrical Noise Electrical noise appears in an electrical circuit through one of four routes: a. Impedance (Ground Loop)
More informationStandardized Direct Charge Device ESD Test For Magnetoresistive Recording Heads II
Standardized Direct Charge Device ESD Test For Magnetoresistive Recording Heads II Lydia Baril (1), Tim Cheung (2), Albert Wallash (1) (1) Maxtor Corporation, 5 McCarthy Blvd, Milpitas, CA 9535 USA Tel.:
More informationCharacterization of Integrated Circuits Electromagnetic Emission with IEC
Characterization of Integrated Circuits Electromagnetic Emission with IEC 61967-4 Bernd Deutschmann austriamicrosystems AG A-8141 Unterpremstätten, Austria bernd.deutschmann@ieee.org Gunter Winkler University
More informationExperiment 5: Grounding and Shielding
Experiment 5: Grounding and Shielding Power System Hot (Red) Neutral (White) Hot (Black) 115V 115V 230V Ground (Green) Service Entrance Load Enclosure Figure 1 Typical residential or commercial AC power
More informationVLSI is scaling faster than number of interface pins
High Speed Digital Signals Why Study High Speed Digital Signals Speeds of processors and signaling Doubled with last few years Already at 1-3 GHz microprocessors Early stages of terahertz Higher speeds
More informationTop Ten EMC Problems & EMC Troubleshooting Techniques by Kenneth Wyatt, DVD, Colorado Springs Rev. 1, Feb 26, 2007
EMC Engineering Top Ten EMC Problems & EMC Troubleshooting Techniques by Kenneth Wyatt, DVD, Colorado Springs Rev. 1, Feb 26, 2007 1a. Ground Impedance The overwhelming majority of high-frequency problems,
More information