3d System Integration Simulation
|
|
|
- Jack Anderson
- 6 years ago
- Views:
Transcription
1 3d System Integration Simulation Dr. Thomas Fischer Siemens Audiology Solutions CST Usergroup Conference, May 2012 T. Fischer, CST User Conference 2012, Page 1 Copyright Siemens AG All rights reserved.
2 Content Introduction Magnetic link - antenna simulation Modeling of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 2 Copyright Siemens AG All rights reserved.
3 Content Introduction Magnetic link - antenna simulation Modeling of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 3 Copyright Siemens AG All rights reserved.
4 Introduction (I) Modern hearing aids in a world of communication (1) Ear to ear communication with magnetic 3 MHz (2) Ear to RCU communication with magnetic 3 MHz (3) RCU to mobile phone or audio transmitter communication with Bluetooth 2.4 GHz T. Fischer, CST User Conference 2012, Page 4 Copyright Siemens AG All rights reserved.
5 Introduction (II) Components of a hearing aid Microphones Battery External speaker connector PCB with ASICs Wireless antenna T. Fischer, CST User Conference 2012, Page 5 Copyright Siemens AG All rights reserved.
6 Motivation Sources of interferences and influences at 3 MHz Microphones (2) Battery (1, 2) External speaker connector (3) PCB with ASICs (1, 2, 3) (1) Changes in inductance L (2) Changes in ESR (3) Interference sources T. Fischer, CST User Conference 2012, Page 6 Copyright Siemens AG All rights reserved.
7 Content Introduction Magnetic link - antenna simulation Modeling of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 7 Copyright Siemens AG All rights reserved.
8 Antenna Simulation (I) Antenna data Operating frequency 3 MHz, λ = 100 m Coil with ferrite core 2 winding layers, 90 turns Wire diameter 34 um Flexible PCB connector 1.65 mm 6.4 mm PCB Inductance (L) Geometry and core Losses (ESR) Wire diameter Skin effect Proximity effect Core losses T. Fischer, CST User Conference 2012, Page 8 Copyright Siemens AG All rights reserved.
9 Antenna Simulation (II) Simulation in CST Microwave Studio (MWS) Frequency domain (electrically small, narrow band) Tetrahedral meshing (for round core, wires, complexity) Thin wire model for L calculation only due to PEC wire Name Measurement L [uh] 74,4 ESR Duration [Ω] [min] 18,6 - Model thin wire (PEC) 74,6 1,6 1,5 T. Fischer, CST User Conference 2012, Page 9 Copyright Siemens AG All rights reserved.
10 Antenna Simulation (III) Volume wire model for L and ESR calculation Wire as lossy material for skin depth δ< material thickness Wire as normal material with 3rd order tetrahedral mesh Proximity Effect Eddy currents with current density at 0 phase T. Fischer, CST User Conference 2012, Page 10 Name Measurement L [uh] ESR Duration [Ω] [min] 74,4 18,6 - Model volume wire (lossy metal) 74,5 13,3 3,0 Model volume wire (normal material), 1st order tet mesh Model volume wire (normal material), 3d order tet mesh 74,5 28,2 3,0 75,5 17,6 14,0 Copyright Siemens AG All rights reserved.
11 Antenna Simulation (IV) Influence of an adjacent thin metal plane as part of PCB Decreased inductance (L) and increased losses (ESR) Good agreement between measurement and simulation T. Fischer, CST User Conference 2012, Page 11 Copyright Siemens AG All rights reserved.
12 Content Introduction Magnetic link - antenna simulation Modeling of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 12 Copyright Siemens AG All rights reserved.
13 Bending Process (I) How could the PCB be imported into MWS? PCB from ECAD tool 2d layout All traces and VIAs Components as lumped elements PCB from MCAD tool 3d bended design Missing traces and VIAs Components as bricks T. Fischer, CST User Conference 2012, Page 13 Copyright Siemens AG All rights reserved.
14 Bending Process (II) Usage of additional tool Mecadtron Nextra + Combines ECAD/MCAD world + Back annotation for redesign + Components as lumped elements since CST Studio Suite Rework of materials - Meshing difficult for tetrahedral mesh - Handling of ECAD tools and Nextra requires workflow T. Fischer, CST User Conference 2012, Page 14 Copyright Siemens AG All rights reserved.
15 Bending Process (III) Import via CST EDA filter using bend sheet command Cut PCB 2 times Rotate upper part Define Cylinder for each multiple layer Bend faces of connectors + Usage of full EDA import functionality - Complex bend process - Handling of redesign T. Fischer, CST User Conference 2012, Page 15 Copyright Siemens AG All rights reserved.
16 Bending Process (IV) Import via CST EDA filter using analytical face and thicken sheet commands (VBA macro) Cut PCB 2 times Rotate upper part Pick point and face of connector Create analytical face Thicken sheet command + Usage of full EDA import functionality + Easy bend process - Handling of redesign T. Fischer, CST User Conference 2012, Page 16 Copyright Siemens AG All rights reserved.
17 Content Introduction Magnetic link - antenna simulation Modeling of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 17 Copyright Siemens AG All rights reserved.
18 PCB Simulation (I) Modeling of interference, PCB and antenna in MWS ASIC Load (discrete port) ASIC Noise source (discrete port) Antenna as sink Capacitors (discret ports) T. Fischer, CST User Conference 2012, Page 18 Copyright Siemens AG All rights reserved.
19 PCB Simulation (II) Source and load impedances in CST Design Studio (DS) Influence of different coupling capacitors Different signal shaping Observation of antenna voltage T. Fischer, CST User Conference 2012, Page 19 Copyright Siemens AG All rights reserved.
20 PCB Simulation (III) Magnetic field distribution with MWS and DS as combined result (qualitative observation) Analysis of induced coil voltage in DS (quantitative observation) T. Fischer, CST User Conference 2012, Page 20 Copyright Siemens AG All rights reserved.
21 Content Introduction Magnetic link - antenna simulation Simulation of bended multilayer PCBs Magnetic link system integration simulation Conclusion T. Fischer, CST User Conference 2012, Page 21 Copyright Siemens AG All rights reserved.
22 Conclusion Antenna simulation works pretty well Inductance and losses Influence of metal planes Import and handling of bended multilayer PCBs Additional tool Mecadtron Nextra combines MCAD/ECAD world Usage of MWS commands to bend multilayer PCBS System integration simulation Simulation of PCB, components, noise sources and antenna Prediction of induced interference voltage Magnetic field distribution to analyze interference problem T. Fischer, CST User Conference 2012, Page 22 Copyright Siemens AG All rights reserved.
Wireless Power Transfer
Wireless Power Transfer Dr. Tobias Glahn (CST AG) Nearfield Coupling: Inductive Coils Goals: maximum power transfer high energy efficiency range & freedom of movement Topics: Equivalent circuits Matching
EMC cases study. Antonio Ciccomancini Scogna, CST of America CST COMPUTER SIMULATION TECHNOLOGY
EMC cases study Antonio Ciccomancini Scogna, CST of America antonio.ciccomancini@cst.com Introduction Legal Compliance with EMC Standards without compliance products can not be released to the market Failure
Wireless Power Transfer. CST COMPUTER SIMULATION TECHNOLOGY
Wireless Power Transfer Some History 1899 - Tesla 1963 - Schuder 1964 - Brown from Garnica et al. (2013) from Schuder et al. (1963) from Brown (1964) Commercialization 1990s onward: mobile device charging
CST s commercial Beam-Physics Codes Ulrich Becker CST (Computer Simulation Technique)
CST s commercial Beam-Physics Codes Ulrich Becker CST (Computer Simulation Technique) 1 ICAP 2006 Chamonix-Mont Blanc Ulrich Becker www.cst.com Outline Overview CST STUDIO SUITE Accelerator related examples
EM Noise Mitigation in Electronic Circuit Boards and Enclosures
EM Noise Mitigation in Electronic Circuit Boards and Enclosures Omar M. Ramahi, Lin Li, Xin Wu, Vijaya Chebolu, Vinay Subramanian, Telesphor Kamgaing, Tom Antonsen, Ed Ott, and Steve Anlage A. James Clark
Reduction of Mutual Coupling in Closely Spaced Strip Dipole Antennas with Elliptical Metasurfaces. Hossein M. Bernety and Alexander B.
Reduction of Mutual Coupling in Closely Spaced Strip Dipole Antennas with Elliptical Metasurfaces Hossein M. Bernety and Alexander B. Yakovlev Department of Electrical Engineering Center for Applied Electromagnetic
INVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT
INVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT ABSTRACT: This paper describes the design of a high-efficiency energy harvesting
DC/DC Converter. Conducted Emission. CST COMPUTER SIMULATION TECHNOLOGY
DC/DC Converter Conducted Emission Introduction 3D Model EDA Layout Simulation Modifications N GOALS MET? Y In modern electronic applications a majority of devices utilizes switched AC/DC or DC/DC converters
West Coast Magnetics. Advancing Power Electronics FOIL WINDINGS FOR SMPS INDUCTORS AND TRANSFORMERS. Weyman Lundquist, CEO and Engineering Manager
1 West Coast Magnetics Advancing Power Electronics FOIL WINDINGS FOR SMPS INDUCTORS AND TRANSFORMERS Weyman Lundquist, CEO and Engineering Manager TYPES OF WINDINGS 2 Solid wire Lowest cost Low DC resistance
EMDS for ADS Momentum
EMDS for ADS Momentum ADS User Group Meeting 2009, Böblingen, Germany Prof. Dr.-Ing. Frank Gustrau Gustrau, Dortmund User Group Meeting 2009-1 Univ. of Applied Sciences and Arts (FH Dortmund) Presentation
Categorized by the type of core on which inductors are wound:
Inductors Categorized by the type of core on which inductors are wound: air core and magnetic core. The magnetic core inductors can be subdivided depending on whether the core is open or closed. Equivalent
Electromagnetic Interference Shielding Effects in Wireless Power Transfer using Magnetic Resonance Coupling for Board-to-Board Level Interconnection
Electromagnetic Interference Shielding Effects in Wireless Power Transfer using Magnetic Resonance Coupling for Board-to-Board Level Interconnection Sukjin Kim 1, Hongseok Kim, Jonghoon J. Kim, Bumhee
CITY UNIVERSITY OF HONG KONG
CITY UNIVERSITY OF HONG KONG Modeling and Analysis of the Planar Spiral Inductor Including the Effect of Magnetic-Conductive Electromagnetic Shields Submitted to Department of Electronic Engineering in
Applications of 3D Electromagnetic Modeling in Magnetic Recording: ESD and Signal Integrity
Applications of 3D Electromagnetic Modeling in Magnetic Recording: ESD and Signal Integrity CST NORTH AMERICAN USERS FORUM John Contreras 1 and Al Wallash 2 Hitachi Global Storage Technologies 1. San Jose
Numerical Simulation of PCB-Coil-Layouts for Inductive Energy Transfer
Numerical Simulation of PCB-Coil-Layouts for Inductive Energy Transfer Systems David Maier *, Normen Lucht, Alexander Enssle, Anna Lusiewicz, Julian Fischer, Urs Pecha, Prof. Dr.-Ing. Nejila Parspour University
Development of a noval Switched Beam Antenna for Communications
Master Thesis Presentation Development of a noval Switched Beam Antenna for Communications By Ashraf Abuelhaija Supervised by Prof. Dr.-Ing. Klaus Solbach Institute of Microwave and RF Technology Department
EMC Simulation of Consumer Electronic Devices
of Consumer Electronic Devices By Andreas Barchanski Describing a workflow for the EMC simulation of a wireless router, using techniques that can be applied to a wide range of consumer electronic devices.
Metamaterial Inspired CPW Fed Compact Low-Pass Filter
Progress In Electromagnetics Research C, Vol. 57, 173 180, 2015 Metamaterial Inspired CPW Fed Compact Low-Pass Filter BasilJ.Paul 1, *, Shanta Mridula 1,BinuPaul 1, and Pezholil Mohanan 2 Abstract A metamaterial
Antenna Simulation Overview
Antenna Simulation Overview Marc Rütschlin, Senior Application Engineer 2011 CST European UGM 18-19 May 2011 1 Antenna Choice Analysis Optimisation Environment Antenna Design Flow 2011 CST European UGM
Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas
CST North American Automotive Workshop Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas Patrick DeRoy, CST of America, Framingham, Massachusetts,
Design of Frequency Selective Surface Radome over a Frequency Range
Vol.2, Issue.3, May-June 2012 pp-1231-1236 ISSN: 2249-6645 Design of Frequency Selective Surface Radome over a Frequency Range K. Renu 1, K.V. V. Prasad 2, S. Saradha Rani 3, A. Gayatri 4 1, 3, 4 (Department
Study on Bluetooth Antenna Integration into Metal Environment Julnar Musmar, Dr. Ing Denis Sievers, Ralf Kakerow Continental, Paderborn University
Bitte decken Sie die schraffierte Fläche mit einem Bild ab. Please cover the shaded area with a picture. (24,4 x 7,6 cm) Study on Bluetooth Antenna Integration into Metal Environment Julnar Musmar, Dr.
High Power Antenna Design for Lower Hybrid Current Drive in MST
High Power Antenna Design for Lower Hybrid Current Drive in MST M.A. Thomas, J.A. Goetz, M.C. Kaufman, S.P. Oliva University of WisconsinMadison J.B.O. Caughman, P.M. Ryan Oak Ridge National Laboratory
Novel Modeling Strategy for a BCI set-up applied in an Automotive Application
Novel Modeling Strategy for a BCI set-up applied in an Automotive Application An industrial way to use EM simulation tools to help Hardware and ASIC designers to improve their designs for immunity tests.
Optimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
Schematic-Level Transmission Line Models for the Pyramid Probe
Schematic-Level Transmission Line Models for the Pyramid Probe Abstract Cascade Microtech s Pyramid Probe enables customers to perform production-grade, on-die, full-speed test of RF circuits for Known-Good
High-Performance Electronic Design: Predicting Electromagnetic Interference
White Paper High-Performance Electronic Design: In designing electronics in today s highly competitive markets, meeting requirements for electromagnetic compatibility (EMC) presents a major risk factor,
TECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors
TECHNICAL REPORT: CVEL-14-059 Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors Andrew J. McDowell and Dr. Todd H. Hubing Clemson University April 30, 2014
RF Board Design for Next Generation Wireless Systems
RF Board Design for Next Generation Wireless Systems Page 1 Introduction Purpose: Provide basic background on emerging WiMax standard Introduce a new tool for Genesys that will aide in the design and verification
Advanced Meshing Techniques
Advanced Meshing Techniques Ansoft High Frequency Structure Simulator v10 Training Seminar P-1 Overview Initial Mesh True Surface Approximation Surface Approximation Operations Lambda Refinement Seeding
Achieving High Power Density Designs in DC-DC Converters
Achieving High Power Density Designs in DC-DC Converters Agenda Marketing / Product Requirement Design Decision Making Translating Requirements to Specifications Passive Losses Active Losses Layout / Thermal
Cell size and box size in Sonnet RFIC inductor analysis
Cell size and box size in Sonnet RFIC inductor analysis Purpose of this document: This document describes the effect of some analysis settings in Sonnet: Influence of the cell size Influence of thick metal
ABB September Slide 1
Magdalena Puskarczyk, Radoslaw Jez, ABB Corporate Research Center, Krakow, Poland The Design of a Multilayer Planar Transformer for a DC/DC Converter with a Resonant Inverter Slide 1 The Design of a Multilayer
Using Sonnet EM Analysis with Cadence Virtuoso in RFIC Design. Sonnet Application Note: SAN-201B July 2011
Using Sonnet EM Analysis with Cadence Virtuoso in RFIC Design Sonnet Application Note: SAN-201B July 2011 Description of Sonnet Suites Professional Sonnet Suites Professional is an industry leading full-wave
High Rejection BPF for WiMAX Applications from Silicon Integrated Passive Device Technology
High Rejection BPF for WiMAX Applications from Silicon Integrated Passive Device Technology by Kai Liu, Robert C Frye* and Billy Ahn STATS ChipPAC, Inc, Tempe AZ, 85284, USA, *RF Design Consulting, LLC,
2/18/ Transmission Lines and Waveguides 1/3. and Waveguides. Transmission Line A two conductor structure that can support a TEM wave.
2/18/2009 3 Transmission Lines and Waveguides 1/3 Chapter 3 Transmission Lines and Waveguides First, some definitions: Transmission Line A two conductor structure that can support a TEM wave. Waveguide
1 of 7 12/20/ :04 PM
1 of 7 12/20/2007 11:04 PM Trusted Resource for the Working RF Engineer [ C o m p o n e n t s ] Build An E-pHEMT Low-Noise Amplifier Although often associated with power amplifiers, E-pHEMT devices are
Microwave Metrology -ECE 684 Spring Lab Exercise T: TRL Calibration and Probe-Based Measurement
ab Exercise T: TR Calibration and Probe-Based Measurement In this project, you will measure the full phase and magnitude S parameters of several surface mounted components. You will then develop circuit
AS Benson Liu 2016/12/28 Ryan Liu 2016/12/28 Welson Tan 2016/12/28. 1 of 5. Product Name
10W Rx COIL FOR LOW FREQUENCY WIRELESS POWER TRANSFER Product Name Wireless Charging Antenna Coil -10w low frequency receive Molex PN Part Description 1461790001 Wireless Charging Coil - 10w low frequency
Description RF Explorer RFEAH-25 1 is a 25mm diameter, high performance near field H-Loop antenna.
Description RF Explorer RFEAH-25 1 is a 25mm diameter, high performance near field H-Loop antenna. RFEAH-25 is a very sensitive, compact and easy to use H-loop near field antenna. The low-loss design exhibits
Single-turn and multi-turn coil domains in 3D COMSOL. All rights reserved.
Single-turn and multi-turn coil domains in 3D 2012 COMSOL. All rights reserved. Introduction This tutorial shows how to use the Single-Turn Coil Domain and Multi-Turn Coil Domain features in COMSOL s Magnetic
Etched ring absorbing waveguide filter based on a slotted waveguide antenna response
Etched ring absorbing waveguide filter based on a slotted waveguide antenna response Tinus Stander and Petrie Meyer Department of E&E Engineering University of Stellenbosch Private Bag X1 7602 Matieland
Lecture 4. Maximum Transfer of Power. The Purpose of Matching. Lecture 4 RF Amplifier Design. Johan Wernehag Electrical and Information Technology
Johan Wernehag, EIT Lecture 4 RF Amplifier Design Johan Wernehag Electrical and Information Technology Design of Matching Networks Various Purposes of Matching Voltage-, Current- and Power Matching Design
Including the proper parasitics in a nonlinear
Effects of Parasitics in Circuit Simulations Simulation accuracy can be improved by including parasitic inductances and capacitances By Robin Croston California Eastern Laboratories Including the proper
Transfer Functions in EMC Shielding Design
Transfer Functions in EMC Shielding Design Transfer Functions Definition Overview of Theory Shielding Effectiveness Definition & Test Anomalies George Kunkel CEO, Spira Manufacturing Corporation www.spira-emi.com
Analysis of Laddering Wave in Double Layer Serpentine Delay Line
International Journal of Applied Science and Engineering 2008. 6, 1: 47-52 Analysis of Laddering Wave in Double Layer Serpentine Delay Line Fang-Lin Chao * Chaoyang University of Technology Taichung, Taiwan
Relationship Between Signal Integrity and EMC
Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?
Modeling Physical PCB Effects 5&
Abstract Getting logical designs to meet specifications is the first step in creating a manufacturable design. Getting the physical design to work is the next step. The physical effects of PCB materials,
Accurate Models for Spiral Resonators
MITSUBISHI ELECTRIC RESEARCH LABORATORIES http://www.merl.com Accurate Models for Spiral Resonators Ellstein, D.; Wang, B.; Teo, K.H. TR1-89 October 1 Abstract Analytically-based circuit models for two
Design Fundamentals by A. Ciccomancini Scogna, PhD Suppression of Simultaneous Switching Noise in Power and Ground Plane Pairs
Design Fundamentals by A. Ciccomancini Scogna, PhD Suppression of Simultaneous Switching Noise in Power and Ground Plane Pairs Photographer: Janpietruszka Agency: Dreamstime.com 36 Conformity JUNE 2007
CST MWS simulation of the SARAF RFQ 1.5 MeV/nucleon proton/deuteron accelerator
CST MWS simulation of the SARAF RFQ 1.5 MeV/nucleon proton/deuteron accelerator Jacob Rodnizki SARAF Soreq NRC APril 19-21 th, 2010 Outline 1. SARAF accelerator 2. Presentation of the four rods RFQ 3.
VLSI is scaling faster than number of interface pins
High Speed Digital Signals Why Study High Speed Digital Signals Speeds of processors and signaling Doubled with last few years Already at 1-3 GHz microprocessors Early stages of terahertz Higher speeds
Performance Analysis of Different Ultra Wideband Planar Monopole Antennas as EMI sensors
International Journal of Electronics and Communication Engineering. ISSN 09742166 Volume 5, Number 4 (2012), pp. 435445 International Research Publication House http://www.irphouse.com Performance Analysis
The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates
The Performance Leader in Microwave Connectors The Design & Test of Broadband Launches up to 50 GHz on Thin & Thick Substrates Thin Substrate: 8 mil Rogers R04003 Substrate Thick Substrate: 30 mil Rogers
11 Myths of EMI/EMC ORBEL.COM. Exploring common misconceptions and clarifying them. MYTH #1: EMI/EMC is black magic.
11 Myths of EMI/EMC Exploring common misconceptions and clarifying them By Ed Nakauchi, Technical Consultant, Orbel Corporation What is a myth? A myth is defined as a popular belief or tradition that has
ELECTROMAGNETIC COMPATIBILITY HANDBOOK 1. Chapter 8: Cable Modeling
ELECTROMAGNETIC COMPATIBILITY HANDBOOK 1 Chapter 8: Cable Modeling Related to the topic in section 8.14, sometimes when an RF transmitter is connected to an unbalanced antenna fed against earth ground
But this is about practical experiments so lets find out what an inductor is all about.
Chapter 2 inductors Inductors are components we often use in radio design. We measure them with our LCR meter and build a circuit with them, only to find out the resonance is way off from the calculated
Antenna Performance In Your Headset THE RESULTS OF HUMAN HEAD INTERACTION TESTS
Antenna Performance In Your Headset THE RESULTS OF HUMAN HEAD INTERACTION TESTS Micro Reach Xtend TM (FR05-S1-N-0-110) Space Saving AN for Bluetooth and WiFi Headsets 2.4-2.5 GHz Fractus Antennas specializes
Synthesis of Optimal On-Chip Baluns
Synthesis of Optimal On-Chip Baluns Sharad Kapur, David E. Long and Robert C. Frye Integrand Software, Inc. Berkeley Heights, New Jersey Yu-Chia Chen, Ming-Hsiang Cho, Huai-Wen Chang, Jun-Hong Ou and Bigchoug
Experimental Analysis of Via-hole-ground Effects in Microwave Integrated Circuits at X-band
h y POSTER 215, PRAGUE MAY 14 1 Experimental Analysis of Via-hole-ground Effects in Microwave Integrated Circuits at X-band Ghulam Mustafa Khan Junejo Microwave Electronics Lab, University of Kassel, Kassel,
Cu 0.37 Brass Cu 0.37 Brass
To: From: EDGES MEMO #148 MASSACHUSETTS INSTITUTE OF TECHNOLOGY HAYSTACK OBSERVATORY WESTFORD, MASSACHUSETTS 01886 October 7, 2014 Telephone: 781-981-5400 Fax: 781-981-0590 EDGES Group Alan E.E. Rogers
Introduction: Planar Transmission Lines
Chapter-1 Introduction: Planar Transmission Lines 1.1 Overview Microwave integrated circuit (MIC) techniques represent an extension of integrated circuit technology to microwave frequencies. Since four
FINAL BACHELOR THESIS PRESENTATION
FINAL BACHELOR THESIS PRESENTATION TOPIC DESIGN AND OPTIMISE AN AIR-BRIDGE CROSSING FOR A BUTLER MATRIX IN MICROSTRIP TECHNOLOGY IN DIELECTRIC LAMINATE BY ANOM EBENEZER SUPERVISOR PROF. DR.-ING. K. SOLBACH
Transcutaneous Energy Transmission Based Wireless Energy Transfer to Implantable Biomedical Devices
Transcutaneous Energy Transmission Based Wireless Energy Transfer to Implantable Biomedical Devices Anand Garg, Lakshmi Sridevi B.Tech, Dept. of Electronics and Instrumentation Engineering, SRM University
150Hz to 1MHz magnetic field coupling to a typical shielded cable above a ground plane configuration
150Hz to 1MHz magnetic field coupling to a typical shielded cable above a ground plane configuration D. A. Weston Lowfreqcablecoupling.doc 7-9-2005 The data and information contained within this report
Course Introduction. Content 16 pages. Learning Time 30 minutes
Course Introduction Purpose This course discusses techniques for analyzing and eliminating noise in microcontroller (MCU) and microprocessor (MPU) based embedded systems. Objectives Learn what EMI is and
SMT Module RF Reference Design Guide. AN_ SMT Module RF Reference Design Guide _V1.01
SMT Module RF Reference Design Guide AN_ SMT Module RF Reference Design Guide _V1.01 Document Title: SMT Module RF Reference Design Guide Version: 1.01 Date: 2010-2-10 Status: Document Control ID: Release
An Equivalent Circuit Model for On-chip Inductors with Gradual Changed Structure
An Equivalent Circuit Model for On-chip Inductors with Gradual Changed Structure Xi Li 1, Zheng Ren 2, Yanling Shi 1 1 East China Normal University Shanghai 200241 People s Republic of China 2 Shanghai
Chapter 2. Inductor Design for RFIC Applications
Chapter 2 Inductor Design for RFIC Applications 2.1 Introduction A current carrying conductor generates magnetic field and a changing current generates changing magnetic field. According to Faraday s laws
Simulating Inductors and networks.
Simulating Inductors and networks. Using the Micro-cap7 software, CB introduces a hands on approach to Spice circuit simulation to devise new, improved, user models, able to accurately mimic inductor behaviour
Optimized shield design for reduction of EMF from wireless power transfer systems
This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented. IEICE Electronics Express, Vol.*, No.*, 1 9 Optimized shield design for reduction of EMF
Leading antenna solution provider
Challenging the world with advanced material products Leading antenna solution provider The Most Reliable Antenna Copyright c 2010 Amotech corp. All right reserved. GPS GPS Antenna Ceramic patch-pin type
Technical Manual For Chips Multilayer Antenna Matching Adjustment Method LDA31 series
Technical Manual For Chips Multilayer Antenna Matching Adjustment Method LDA31 series Application: 2.4GHz Wireless Bluetooth TM 1/17 Chip Antenna is a special component to change characteristics and this
ANTENNA DESIGN REPORT OF A MINIATURE CAMERA DEVICE
ANTENNA DESIGN REPORT OF A MINIATURE CAMERA DEVICE Krishna Rao (krisrao@amazon.com) I. INTRODUCTION Miniature camera devices have flooded the market for use cases ranging from security, closed-circuittelevision
Investigation of a Hybrid Winding Concept for Toroidal Inductors using 3D Finite Element Modeling
Downloaded from orbit.dtu.dk on: Dec 20, 2017 Investigation of a Hybrid Winding Concept for Toroidal Inductors using 3D Finite Element Modeling Schneider, Henrik; Andersen, Thomas; Mønster, Jakob Døllner;
Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies
Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies 1 Definitions EMI = Electro Magnetic Interference EMC = Electro Magnetic Compatibility (No EMI) Three Components
10 Safety earthing/grounding does not help EMC at RF
1of 6 series Webinar #3 of 3, August 28, 2013 Grounding, Immunity, Overviews of Emissions and Immunity, and Crosstalk Contents of Webinar #3 Topics 1 through 9 were covered by the previous two webinars
BE. Electronic and Computer Engineering Final Year Project Report
BE. Electronic and Computer Engineering Final Year Project Report Title: Development of electrical models for inductive coils used in wireless power systems Paul Burke 09453806 3 rd April 2013 Supervisor:
Introduction. Internet of things. Smart New World
1 Introduction Internet of things Smart New World Source : iamwire IoT has evolved multiple technologies including sensors, embedded systems, communication, real-time analytics or machine learning. For
BlueCore. Inverted-F and Meander Line Antennas. Application Note. January 2003
BlueCore Inverted-F and Meander Line Antennas Application Note January 2003 CSR Unit 400 Cambridge Science Park Milton Road Cambridge CB4 0WH United Kingdom Registered in England 3665875 Tel: +44 (0)1223
Multilayer chip antenna application guide
1. introduction Shenzhen Sunlord electronics Co. LTD Multilayer chip antenna application guide The chip antenna series is designed for the applications of ISM band 2.4GHz and CMMB, just like as Bluetooth
Radio Frequency Electronics
Radio Frequency Electronics Preliminaries IV Born 22 February 1857, died 1 January 1894 Physicist Proved conclusively EM waves (theorized by Maxwell ), exist. Hz names in his honor. Created the field of
Newsletter 3.1. Antenna Magus version 3.1 released! New antennas in the database. Square pin-fed septum horn. July 2011
Newsletter 3.1 July 2011 Antenna Magus version 3.1 released! Antenna Magus 3.0 was such a feature laden release that not all of the new features could be mentioned in the newsletter, so we decided to rather
Multi-Band Microstrip Antenna Design for Wireless Energy Harvesting
Shuvo MAK et al. American Journal of Energy and Environment 2018, 3:1-5 Page 1 of 5 Research Article American Journal of Energy and Environment http://www.ivyunion.org/index.php/energy Multi-Band Microstrip
CBC-EVAL-11. EnerChip CC Inductive Charging Evaluation Kit. Product Discontinued - Not for New Designs
Product Discontinued - Not for New Designs CBC-EVAL-11 EnerChip CC Inductive Charging Evaluation Kit Overview CBC-EVAL-11 is a demonstration kit combining an inductive transmitter board with a receiver
Design of Microstrip Coupled Line Bandpass Filter Using Synthesis Technique
Design of Microstrip Coupled Line Bandpass Filter Using Synthesis Technique 1 P.Priyanka, 2 Dr.S.Maheswari, 1 PG Student, 2 Professor, Department of Electronics and Communication Engineering Panimalar
FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATABILITY, VOL. 43, NO. 1, FEBRUARY 2001 1 FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations David M. Hockanson, Member, IEEE, Xiaoning
EE2003 Circuit Theory Chapter 13 Magnetically Coupled Circuits
EE003 Circuit Theory Chapter 3 Magnetically Coupled Circuits Copyright The McGraw-Hill Companies, Inc. Permission required for reproduction or display. Magnetically Coupled Circuit Chapter 3 3. What is
Electrical and Thermal Analysis of an OLED Module
Electrical and Thermal Analysis of an OLED Module Jurica Kundrata and Adrijan Barić University of Zagreb Faculty of Electrical Engineering and Computing COMSOL CONFERENCE 2012. 10.-12. October 2012. Excerpt
Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material
Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material April 28, 2010 Yu Xuequan, Yanhang, Zhang Gezi, Wang Haisan Huawei Technologies CO., LTD. Shanghai, China Tony_yu@huawei.com
Induction heating of internal
OPTIMAL DESIGN OF INTERNAL INDUCTION COILS The induction heating of internal surfaces is more complicated than heating external ones. The three main types of internal induction coils each has its advantages
Inductors & Resonance
Inductors & Resonance The Inductor This figure shows a conductor carrying a current. A magnetic field is set up around the conductor as concentric circles. If a coil of wire has a current flowing through
CHAPTER - 6 PIN DIODE CONTROL CIRCUITS FOR WIRELESS COMMUNICATIONS SYSTEMS
CHAPTER - 6 PIN DIODE CONTROL CIRCUITS FOR WIRELESS COMMUNICATIONS SYSTEMS 2 NOTES 3 INTRODUCTION PIN DIODE CONTROL CIRCUITS FOR WIRELESS COMMUNICATIONS SYSTEMS Chapter 6 discusses PIN Control Circuits
Design and Analysis of Novel Compact Inductor Resonator Filter
Design and Analysis of Novel Compact Inductor Resonator Filter Gye-An Lee 1, Mohamed Megahed 2, and Franco De Flaviis 1. 1 Department of Electrical and Computer Engineering University of California, Irvine
Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors
Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors Charles R Sullivan and Yuqin Sun Thayer School of Engineering Dartmouth College http://power.thayer.dartmouth.edu/ Introduction Why
Investigation of a Hybrid Winding Concept for Toroidal Inductors Using 3D Finite Element Modeling
Investigation of a Hybrid Winding Concept for Toroidal Inductors Using 3D Finite Element Modeling H. Schneider 1, T. Andersen 1, J. D. Mønster 1, M. P. Madsen 1, A. Knott 1, M. A. E. Andersen 1 1 Technical
BGA Solder Balls Formation by Induction Heating
International Journal of Scientific Research in Knowledge, 2(1), pp. 22-27, 2014 Available online at http://www.ijsrpub.com/ijsrk ISSN: 2322-4541; 2014 IJSRPUB http://dx.doi.org/10.12983/ijsrk-2014-p0022-0027
Design and Matching of a 60-GHz Printed Antenna
Application Example Design and Matching of a 60-GHz Printed Antenna Using NI AWR Software and AWR Connected for Optenni Figure 1: Patch antenna performance. Impedance matching of high-frequency components
Search. Login Register. Patrick Gormally -March 24, 2014
EDN MOMENT Space Shuttle Columbia is delivered, March 25, 1979 Search Login Register Patrick Gormally -March 24, 2014 Share Tweet 0 Like 0 Over the years medical devices have continually been made smaller;
Compact Wideband Quadrature Hybrid based on Microstrip Technique
Compact Wideband Quadrature Hybrid based on Microstrip Technique Ramy Mohammad Khattab and Abdel-Aziz Taha Shalaby Menoufia University, Faculty of Electronic Engineering, Menouf, 23952, Egypt Abstract