Features. Applications GND2 GND2. Tx-out VCC2. Tx-PD-out. Filter. Tx-LD-in GND2. Cext. Rx-in. 8 9 Rref

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1 HCPL - 8J PLC Powerline DAA IC Data Sheet Lead (Pb) Free RoHS fully compliant RoHS fully compliant options available; -xxxe denotes a lead-free product Description The HCPL-8J is a galvanically isolated Powerline Data Access Arrangement IC. It provides the key features of isolation, Tx line driver and Rx amplifier as required in a powerline modem application. Used together with a simple LC coupling circuit, the HCPL-8J offers a highly integrated, cost effective Analogue Front End (AFE) solution. Optical coupling technology provides very high isolation mode rejection, facilitating excellent EMI and EMC performance. Application robustness is enhanced by the inherent properties of opto-isolation devices, to effectively block the transfer of damaging surge transients. Excellent transmitter performance is achieved with the use of a high efficiency, low distortion line driver stage. Transmitter robustness is further enhanced with integrated load detection and over-temperature protection functions. The HCPL-8J is designed to work with various transceiver ICs and significantly simplify the implementation of a powerline modem. Connection Diagram Features - db Overall Tx Distortion nv/ Typical Input Referred Noise Load Detection Function Under-Voltage Detection Over-Temperature Shutdown Highly Efficient Tx Line Driver Built-in Rx Amplifier Temperature Range: - C to +8 C Regulatory Approvals (pending): UL, CSA, IEC/EN/DIN EN -- Suitable for FCC Part and EN- Compliant Design Applications Automatic Meter Reading (AMR) Powerline Modem Home Automation/Control Security and Surveillance General Purpose Isolated Transceiver Internet Appliances TX-EN Powerline Transceiver IC (ENDEC) TX RX STATUS VCC Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out VCC Tx-out VCC Tx-PD-out Tx-LD-in Cext Rx-in 8 9 Rref HCPL-8J VCC Filter Filter L N CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

2 Block Diagram Tx -PD -out Tx -LD -in Tx -en AGC Tx -in Tx LED Driver Tx TIA G T Tx -out 8 Control IC Detection Shield Tx -en Detection Over -Temp Detection UVD Load Detection Line Driver Control Logic 9 C ext Rx -out G R Rx TIA Shield Rx LED Driver Line IC Amp Rx -in Rx -Amp -in Rx -PD -out Package Pin Out Pin Descriptions Pin No. Symbol Description Tx -en Tx -in Rx -PD -out Tx -out Tx-en Transmit Enable Input Tx-in Transmit Input Signal Rx-PD-out Rx Photodetector Output Rx-Amp-in Receiver Output Amplifier Input Rx -Amp -in Tx -PD -out Tx -LD -in Signal indicating Line Condition Rx-out Receiving Signal Output V Power Supply Rx -out C ext Rx -in 8 VCC Power Supply Ground 9 Sets Line Driver biasing current, typically kω Rx-in Receiving Signal Input from Powerline 8 9 C ext External Capacitor Tx-LD-in Tx Line Driver Input Tx-PD-out Tx Photodetector Output V Power Supply Tx-out Transmit Signal Output to Powerline VCC Power Supply Ground

3 Ordering Information HCPL-8J are UL Recognized with Vrms for minute per UL. Option IEC/EN/DIN EN Part number RoHS Compliant Packaging Surface Mount Tape & Reel -- Quantity HCPL-8J -E SO- X X per tube -E SO- X X X 8 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example : ACPL-8J-E to order product of SO- package in Tape and Reel packaging packaging with IEC/EN/DIN EN -- Safety Approval in RoHS compliant.. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation #XXX is used for existing products, while (new) products launched since th July and RoHS compliant option will use -XXXE. Package Outline Drawings Land Pattern Recommendation -Lead Surface Mount.8 (.). (.).8 (.) 9 A 8J YYWW.9 ±. (.9 ±.) TYPE NUMBER DATE CODE.8 (.). (.) 9. ±. (. ±.) 8. ±. (8.98 ±.) ALL LEADS TO BE COPLANAR ±..8 (.).8 ±. (. ±.) 8. MIN..8 ±. (. ±.).8 ±. (. ±.) STANDOFF DIMENSIONS IN INCHES (MILLIMETERS). NOTES:. INITIAL AND CONTINUED VARIATION IN THE COLOR OF THE HCPL-8J s WHITE MOLD COMPOUND IS NORMAL AND DOES NOT AFFECT DEVICE PERFORMANCE OR RELIABILITY.. FLOATING LEAD PROTRUSION IS. (.) MAX.

4 Package Characteristics All specifications and figures are at the nominal (typical) operating conditions of = V, = V, = V, = V and T A = + C. Parameter Symbol Min. Typ. Max. Units Test Conditions Note Control IC - Line IC Momentary Withstand Voltage V ISO V rms RH< %, t = min., T A = C Resistance (Control IC - Line IC) R I-O >9 Ω V I-O = Vdc Capacitance (Control IC - Line IC) C I-O. pf f = MHz Control IC to Ambient Thermal Resistance Line IC to Ambient Thermal Resistance θ IA 8 C/W oz. trace, -layer PCB Still air, T A = C θ OA 8 Notes:. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage Vrms for second (leakage detection current limit, I I-O µa). This test is performed before the % production test for partial discharge (method b) shown in IEC/EN/ DIN EN -- Insulation Characteristics Table, if applicable.. The Control IC-Line IC Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as a Control IC-Line IC continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or IEC/EN/DIN EN -- Insulation Characteristics Table.. Device is considered as a two terminal device: pins - 8 shorted together and pins 9 - shorted together.. Maximum power dissipation in Control side and Line side IC s needs to be limited to ensure that their respective junction temperature is less than C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found in the Application Information section under Thermal Considerations.,, Recommended PB-free IR Profile C seconds C (Peak Temperature) Temperature ( C) C C C sec C ~ sec 9 sec sec Note: Non-halide flux should be used Time (sec)

5 Regulatory Information The HCPL-8J is pending for approval by the following organizations: IEC/EN/DIN EN -- Approved under: IEC --:99 + A: EN --: + A: DIN EN -- (VDE 88 Teil ):- with VIORM = 89 Vpeak. UL Recognized under UL, component recognition program, File E. CSA Approved under CSA Acceptance Notice #, File CA 88. IEC/EN/DIN EN -- Insulation Characteristics () Description Symbol Characteristic Unit Installation classification per DIN VDE /.89, Table For rated mains voltage Vrms For rated mains voltage Vrms For rated mains voltage Vrms I IV I III I II Climatic Classification // Pollution Degree (DIN VDE /.89) Maximum Working Insulation Voltage V IORM 89 V PEAK Input to Output Test Voltage, Method b () V IORM x.8 = V PR, % Production Test with t m = sec, Partial Discharge < pc Input to Output Test Voltage, Method a () V IORM x. = V PR, Type and Sample Test, t m = sec, Partial Discharge < pc V PR V PEAK V PR V PEAK Highest Allowable Over-voltage () (Transient Over-voltage tini = sec) V IOTM V PEAK Safety-limiting values - maximum values allowed in the event of a failure Case Temperature Control Side Power () Line Side Power () T S P S, INPUT P S, OUTPUT Insulation Resistance at T S, V IO = V R S > 9 Ω C mw mw Notes:. Isolation characteristics are guaranteed only within the safety maximum ratings that must be ensured by protective circuits in application. Surface mount classification is class A in accordance with CECCOO8.. Refer to the optocoupler section of the Isolation and Control Component Designer s Catalog, under Product Safety Regulations section, (IEC/EN/DIN EN --) for a detailed description of Method a and Method b partial discharge test profiles.. Refer to the following figure for dependence of PS, INPUT and PS, OUTPUT on case temperature. P S POWER mw 8 P S, OUTPUT P S, INPUT T S CASE TEMPERATURE C

6 Insulation and Safety Related Specifications Parameter Symbol Value Unit Condition Minimum External Air Gap (Clearance) Minimum External Tracking (Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) L() 8. mm Measured from input terminals to output terminals, shortest distance through air. L() 8. mm Measured from input terminals to output terminals, shortest distance path along body.. mm Through insulation distance of conductor to conductor, usually the straight-line distance between the emitter and detector. CTI > Volts DIN IEC /VDE Part Isolation Group IIIa Material Group (DIN VDE, /89, Table ) Absolute Maximum Ratings Parameter Symbol Minimum Maximum Unit Note Storage Temperature T S - C Ambient Operating Temperature T A - 8 C Junction Temperature T J C Supply Voltage -.. V Supply Voltage -.. V Transmit Output Voltage V Tx-out -. V Transmit Input Signal Voltage V Tx-in -. V Transmit Enable Voltage V Tx-en -. V Receiving Input Signal Voltage V Rx-in -. V Control-Side Power Dissipation P I mw Line-Side Power Dissipation P O mw Solder Reflow Temperature Profile (See Solder Reflow Temperature Profile Section) Notes:. Maximum power dissipation in Control side and Line side IC s needs to be limited to ensure that their respective junction temperature is less than C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found in the Application Information section under Thermal Considerations. Recommended Operating Conditions Parameter Symbol Minimum Typical Maximum Unit Note Ambient Operating Temperature T A - 8 C Input Supply Voltage.. V Output Supply Voltage.. V Tx-in Signal Current I Tx-in µa PP Notes:. The transmitter input impedance is very low, this is meant for signal current input. Transmitter performance is optimized at µapp input signal, an external series resistor with nominal value of kω would be required if the input signal is. V PP.

7 Electrical Specifications Unless otherwise noted, for sinusoidal waveform input and reference resistor = kω, all typical values are at T A = C, = V, = V; all Minimum/Maximum specifications are at Recommended Operating Conditions. General Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note Supply Current I CC ma V Tx-en = V 8 ma V Tx-en = V Supply Current I CC 8 ma V Tx-en = V ma V Tx-en = V,, Logic High Output V OH - V I OH = - ma Logic Low Output V OL V =. V, I OL = ma Under Voltage Detection Junction Over-Temperature Threshold V UVD.8. V T th C Load Detection Threshold. A PP V Tx-en = V, f = khz, 9 Isolation Mode Rejection Ratio IMRR 8 db V Tx-en = V, f = khz, Notes:. Threshold of falling with hysteresis of. V (typ.).. Threshold of rising junction temperature with hysteresis of C (typ.).. IMRR is defined as the ratio of the signal gain (measured at Rx-PD-out with signal applied to Rx-in) to the isolation mode gain (measured at Rx- PD-out with Rx-in connected to and the isolation mode voltage, V IM, applied between and ), expressed in db.

8 Electrical Specifications (Cont.) Unless otherwise noted, for sinusoidal waveform input and reference resistor = kω, all typical values are at T A = C, = V, = V; all Minimum/Maximum specifications are at Recommended Operating Conditions. Transmitter Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note Transmit Enable Threshold Voltage V th, T x-en.8. V Set-up Time (Tx-PD-out) t s, T x µs V Tx-en = V, I Tx-in = µa PP, f AGC Settling Time t AGC 8 µs = khz, Tx-PD-out no load Tx Photodetector Output Voltage (Tx-PD-out) nd Harmonic Distortion Tx-PD-out) rd Harmonic Distortion (Tx-PD-out).8.. V V Tx-en = V, I Tx-in = µa PP, f = khz, T A = C HD TxPD - db V Tx-en = V, I Tx-in = µa PP, f = khz, Tx-PD-out load HD TxPD - db kω Bandwidth (Tx-PD-out) BW TxPD MHz V Tx-en = V, I Tx-in = µa PP Tx Photodetector Output Impedance (Tx-PD-out) Line Driver (LD) Power Supply ( ) Rejection Ratio Z O, TxPD Ω V Tx-en = V, f = khz PSRR db Hz ripple, V ripple = mv PP Input Impedance Z I, LD kω V Tx-en = V, f = khz DC Biased Voltage V Bias, LD. V V Tx-en = V Gain G T.8. V/V V Tx-en = V, f = khz, Txout no load nd Harmonic Distortion (Tx-out) rd Harmonic Distortion (Tx-out) HD LD - - db V Tx-en = V, V Tx-out =. V PP, f = khz, Tx-out load HD LD - - db Ω, T A = C Output Impedance (Tx-out) Z O, LD. Ω V Tx-en = V, f = khz. kω V Tx-en = V, f = khz Short-Circuit Output Current I OS A PP V Tx-en = V, V Tx-LD-in =.8 V PP, f = khz, t P µs, 8, 9,,,,,, Notes:. Time from transmit is enabled (V Tx-en is set to logic high) until output (Tx-PD-out) is available. See Figure in the Application Information section.. Time from output (Tx-PD-out) is available until Tx-PD-out signal reaches % of its steady state level. See Figure in the Application Information section.. To keep the junction temperature as close to the ambient temperature as possible, pulse testing method is used. The device is transmitenabled within the pulse duration time, t P. Thermal effects must be considered separately.. Maximum power dissipation in Control side and Line side IC s needs to be limited to ensure that their respective junction temperature is less than C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be found in the Application Information section under Thermal Considerations., 8

9 Electrical Specifications (Cont.) Unless otherwise noted, for sinusoidal waveform input and reference resistor = kω, all typical values are at T A = C, = V, = V; all Minimum/Maximum specifications are at Recommended Operating Conditions. Receiver Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note Input Impedance Z I, Rx kω V Tx-en = V, f = khz Output Impedance (Rx-PD-out) Z O, RxPD W Hz V Tx-en = V, f = khz Input Referred Noise V nr nv/ V Tx-en = V, V Rx-in = VPP Bandwidth (Rx-PD-out) BW RxPD khz V Tx-en = V Gain G R db V Tx-en = V, V Rx-in =. V PP, f = khz Set-up Time (Rx-PD-out) t s, Rx ms V Tx-en = V, f = khz Total Harmonic Distortion (Rx-PD-out) THD RxPD -8 db V Tx-en = V, V Rx-in =. V PP, f = khz Receiver Output Amplifier (RxAMP) DC Biased Voltage V Bias, Rx. V Output Impedance Z O, RxA W V Tx-en = V, f = khz Total Harmonic Distortion (Rx-out) THD Rx - db V Tx-en = V, f = khz, V Rx-Amp-in =. V PP, Gain = -, feedback resistor kω Gain Bandwidth Product GBW RxA 8 MHz V Tx-en = V, f = khz, V Rx-in =. V PP, G R = -, feedback resistor kω 8 9

10 Typical Performance Plots Unless otherwise noted, all typical plots are at T A = C, = V, = V, sinusoidal waveform input, signal frequency f = khz, I Tx-in = µa PP, and = kω. I CC SUPPLY CURRENT ma Rx Tx - - T A AMBIENT TEMPERATURE C Figure. supply current vs. temperature I CC SUPPLY CURRENT ma Rx Tx - - T A AMBIENT TEMPERATURE C Figure. supply current vs. temperature I CC SUPPLY CURRENT ma 9 8 V Tx-en = V I CC SUPPLY CURRENT ma REFERENCE RESISTOR kù Figure. supply current vs. reference resistor I Tx-out Tx-out OUTPUT CURRENT A PP Figure. supply current vs. Tx output current NORMALIZED AT C T A AMBIENT TEMPERATURE C Figure. Normalized load detection threshold vs. temperature ISOLATION MODE REJECTION RATIO db f FREQUENCY MHz Figure. Isolation mode rejection ratio vs. frequency

11 Typical Performance Plots (Cont.) Unless otherwise noted, all typical plots are at T A = C, = V, = V, sinusoidal waveform input, signal frequency f = khz, I Tx-in = µa PP, and = kω. NORMALIZED AT C T A AMBIENT TEMPERATURE C Figure. Normalized Tx-PD-out output voltage vs. temperature V Tx-PD-out Tx-PD-out OUTPUT VOLTAGE V I Tx-in Tx INPUT CURRENT µa PP Figure 8. Tx-PD-out output voltage vs. Tx-in input current. - NORMALIZED AT khz.8... I Tx-in = µa PP HD HARMONIC DISTORTION dbc HD HD k k M M f FREQUENCY Hz Figure 9. Normalized Tx-PD-out output voltage vs. frequency T A AMBIENT TEMPERATURE C Figure. Tx-PD-out harmonic distortion vs. temperature. - NORMALIZED AT C..99 HD HARMONIC DISTORTION dbc HD HD V Tx-out =. V PP T A AMBIENT TEMPERATURE C Figure. Normalized line driver gain vs. temperature T A AMBIENT TEMPERATURE C Figure. Line driver harmonic distortion vs. temperature

12 Typical Performance Plots (Cont.) Unless otherwise noted, all typical plots are at T A = C, = V, = V, sinusoidal waveform input, signal frequency f = khz, I Tx-in = µa PP, and = kω. HD HARMONIC DISTORTION dbc HD HD = kù -9 f FREQUENCY Hz Figure. Line driver harmonic distortion vs. frequency for = kω HD HARMONIC DISTORTION dbc HD = 8 kù HD -9 f FREQUENCY Hz Figure. Line driver harmonic distortion vs. frequency for = 8 kω HD HARMONIC DISTORTION dbc HD HD -8-9 V Tx-out Tx-out OUTPUT VOLTAGE V PP Figure. Line driver harmonic distortion vs. Tx-out output voltage LD PEAK HARMONIC DISTORTION dbµv 8 V Tx-LD-in =.8 V PP Z Coupling =. Ù + nf + µh HD HD R L RESISTIVE LOAD Ù Figure. Line driver peak harmonic distortion vs. load NORMALIZED AT khz. V Rx-in = mv PP.8... k k M M f FREQUENCY Hz Figure. Normalized Rx-PD-out output voltage vs. frequency GAIN A OL RxAMP VOLTAGE GAIN db 9 8 PHASE 8 8 k k k M M f FREQUENCY Hz Figure 8. RxAMP gain and phase xs. frequency PHASE DEGREES

13 Test Circuit Diagrams Unless otherwise noted, all test circuits are at T A = C, = V, = V, sinusoidal waveform input, and signal frequency f = khz. SCOPE Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-out Tx-PD-out Tx-LD-in C ext Rx-in µf V IN =. V PP µf kù. Ù R L µf Figure 9. Load detection test circuit SCOPE kù V OUT Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-out Tx-PD-out Tx-LD-in C ext Rx-in µf V µf kù V IM = V PP Figure. Isolation mode rejection ratio test circuit V IN =. V PP PULSE GEN. V PULSE = V, f PULSE ¼ khz kù Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-out Tx-PD-out Tx-LD-in C ext Rx-in µf µf V OUT kù Figure. Tx-PD-out enable/ disable time test circuit

14 Test Circuit Diagrams (Cont.) Unless otherwise noted, all test circuits are at T A = C, = V, = V, sinusoidal waveform input, and signal frequency f = khz. V IN =. V PP kù Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-out Tx-PD-out Tx-LD-in C ext Rx-in µf Ù µf kù SPECTRUM ANALYZER µf kù Figure. Tx-PD-out harmonic distortion test circuit Tx-en VOUT =. VPP SPECTRUM Tx-in Tx-out Ù ANALYZER kù µf Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-PD-out Tx-LD-in C ext Rx-in V IN µf kù µf Figure. Line driver harmonic distortion test circuit kù Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out 8 9 HCPL-8J Tx-out Tx-PD-out Tx-LD-in C ext Rx-in µf V OUT kù Ù R L µf V IN = V PP f = k ~ MHz µf Figure. Line driver bandwidth test circuit

15 Applications Information Tx-en Tx-in Rx-out C R kù R kù R kù VCC Tx-en Tx-in Rx-PD-out Rx-Amp-in Rx-out VCC Tx-out VCC Tx-PD-out Tx-LD-in Cext Rx-in 8 9 Rref HCPL-8J µf Rref kù Filter Filter R Ù µf L D VCC µf C X L µh L N Figure. Schematic of HCPL - 8J application for FSK modulation scheme Typical application for FSK modulation scheme The HCPL-8J is designed to work with various transceivers and can be used with a variety of modulation methods including ASK, FSK and BPSK. Figure shows a typical application in a powerline modem using Frequency Shift Keying (FSK) modulation scheme. Transmitter The analogue Tx input pin is connected to the modulator via an external coupling capacitor C and a series resistor R (see Figure ). Optimal performance is obtained with an input signal of µa PP. E.g., for a modulator with an output signal of. V PP using a coupling capacitor of nf, the optimal series resistor R would be kω. TX AGC To ensure a stable and constant output voltage at Tx-PDout, the HCPL-8J includes an Automatic Gain Control (AGC) circuit in the isolated transmit signal path. This AGC circuit compensates for variations in the input signal level presented at Tx-in and variations in the optical channel over temperature and time. The Tx-PD-out output signal is effectively stabilized for input Tx-in signals of between µa PP and µa PP (see Figure 8). The AGC circuit starts to function µs after the Tx-en signal is set to logic high. After a period of 8 µs the Tx-PD-out signal typically reaches % of its steady state level (see Figure ). To ensure correct operation of the internal circuitry, an external µf capacitor needs to be connected from pin to. The optical signal coupling technology used in the HCPL-8J transmit path achieves very good harmonic distortion typically HD < - db and HD < - db, which is usually significantly better than the distortion performance of the modulated input signal. However to meet the requirements of some international EMC regulations it is often necessary to filter the modulated input signal. The optimal position for such a filter is between pins and as shown in Figure. A possible band-pass filter topology is shown in Figure, some typical values of the components in this filter are listed in Table. Tx-en V/Div Tx-PD-out V/Div ts, Tx tagc Figure. Tx-PD-out AGC response time µs/div

16 Filter input R L Figure. An example of a band-pass filter for transmit Tx Rx µf L Figure 8. LC coupling network L C C X L N Filter output Table. Typical component values for band-pass filter and LC coupling network. Carrier Frequency (khz) Band-Pass Filter LC Coupling L (µh) C (nf) L (µh) C (nf) To compensate for the attenuation in the filter, the line driver stage has db gain. To prevent the line driver output from saturating, it is therefore important to achieve db of attenuation between Tx-PD-out (pin ) and Tx-LD-in (pin ) either by the inherent filter attenuation or by other means. Transmitter Line Driver The line driver is capable of driving powerline load impedances with output signals up to V PP. The internal biasing of the line driver is controlled externally via a resistor connected from pin 9 to. The optimum biasing point value for modulation frequencies up to khz is kω. For higher frequency operation with certain modulation schemes, it may be necessary to reduce the resistor value to enable compliance with international regulations. The output of the line driver is coupled onto the powerline using a simple LC coupling circuit as shown in Figure 8. Refer to Table for some typical component values. Capacitor C and inductor L attenuate the / Hz powerline transmission frequency. A suitable value for L can range in value from µh to mh. To reduce the series coupling impedance at the modulation frequency, L is included to compensate the reactive impedance of C. This inductor should be a low resistive type capable of meeting the peak current requirements. To meet many regulatory requirements, capacitor C needs to be an X type. Since these types of capacitors typically have a very wide tolerance range of %, it is recommended to use as low Q factor as possible for the L/C combination. Using a high Q coupling circuit will result in a wide tolerance on the overall coupling impedance, causing potential communication difficulties with low powerline impedances. Occasionally with other circuit configurations, a high Q coupling arrangement is recommend, e.g., C less than. In this case it is normally used as a compromise to filter out of band harmonics originating from the line driver. This is not required with the HCPL-8J. Although the series coupling impedance is minimized to reduce insertion loss, it has to be sufficiently large to limit the peak current to the desired level in the worst expected powerline load condition. The peak output current is effectively limited by the total series coupling resistance, which is made up of the series resistance of L, the series resistance of the fuse and any other resistive element connected in the coupling network. To reduce power dissipation when not operating in transmit mode the line driver stage is shut down to a low power high impedance state by pulling the Tx-en input (pin ) to logic low state. The high impedance condition helps minimize attenuation on received signals.

17 Receiver The received signal from the powerline is often heavily attenuated and also includes high level out of band noise. Receiver performance can be improved by positioning a suitable filter prior to the Rx-in input (pin ). To counter the inevitable attenuation on the powerline, the HCPL-8J receiver circuit includes a fixed db front-end gain stage. If desired, this fixed gain can be reduced to unity gain by inserting an impedance of kω in the receiver signal path. It is however recommended to maintain the fixed gain of db at this position and reduce the overall signal gain elsewhere if required. This configuration will result in the best SNR and IMRR. The optical isolated Rx signal appears at Rx-PD-out (pin ). This signal is subsequently AC coupled to the final gain stage via a capacitor. The final gain stage consists of an op-amp configured in an inverting configuration and DC biased at. V. The actual gain of this gain stage is user programmable with external resistors R and R as shown in Figure. The signal output at Rx-out (pin ) is buffered and may be directly connected to the demodulator or ADC, using AC coupling if required. different connection points but is also time variant. The HCPL-8J includes a current sense feature, which may be utilized to feedback information on the instantaneous powerline load condition. Should the peak current reach a level greater than. A PP, the output of pin is pulled to a logic low state for the entire period the peak current exceeds -. A, as shown in Figure 9. Using the period of the pulse together with the known coupling impedance, the actual powerline load can be calculated. Table shows the logic output of the pin. External Transient Voltage Protection To protect the HCPL-8J from high voltage transients caused by power surges and disconnecting/connecting the modem, it is necessary to add an external.8 V bidirectional transient voltage protector (as component D shown in Figure ). Additional protection from powerline voltage surges can be achieved by adding an appropriate Metal Oxide Varistor (MOV) across the powerline terminals after the fuse. Internal Protection and Sensing The HCPL-8J includes several sensing and protection functions to ensure robust operation under wide ranging environmental conditions. The first feature is the Under Voltage Detection (UVD). In the event of dropping to a voltage less than V, the output status pin is switched to a logic low state. The next feature is the over-temperature shutdown. This particular feature protects the line driver stage from over-temperature stress. Should the IC junction temperature reach a level above C, the line driver circuit is shut down, simultaneously the output of (pin ) is pulled to the logic low state. Tx-out (pin ). A/Div I th (pin ) V/Div tth tth µs/div The final feature is load detection function. The powerline impedance is quite unpredictable and varies not just at Figure 9. Transmit output load detection Normal < V Over-Temperature I Tx-out < -. A Receiver Mode High Low - - Transmitter Mode High Low Low Low (pulsed)

18 V + 8L C* µh ma VOUT VIN GND X. µf/. µf ma L µf 9. V W - VARISTOR kù N *.µf X for V mains,.µf X for V mains Figure. A simple low cost non-isolated power supply VCC Power Supply Requirements The recommended voltage regulator to supply is a low cost 8L or equivalent. To minimize harmonic distortion, it is recommended to connect a tantalum decoupling capacitor of at least µf together with a ceramic capacitor in parallel. The capacitors should be positioned as close as possible to the supply input pin. The supply voltage for the regulator can be supplied from the system level power supply transformer (powerline side winding). Alternatively, the supply can be derived directly from the powerline via a simple low cost circuit as shown in Figure. Thermal Considerations The high efficiency line driver used in the HCPL-8J ensures minimum internal power dissipation, even for high peak output currents. Despite this, operating the line driver continuously with high output currents at elevated ambient temperatures can cause the peak junction temperature to exceed C and/or resulting in the triggering of the thermal protection. To prevent this from happening, when operating the line driver continuously with high output currents, an ambient temperature derating factor needs to be applied. A typical derating curve is shown in Figure. In this case the assumption is that the transmitter is operating continuously in still air with a typical -layer Printed-Circuit Board (PCB). However, it should be noted that operating the transmitter discontinuously for short periods of time will allow lower derating or even no derating at all. Conversely operating the line driver continuously with a poor PCB layout and/or with restricted air convection could result in the requirement for a larger derating factor. MAXIMUM POWER DISSAPATION W T A AMBIENT TEMPERATURE C Figure. Power derating vs. temperature For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright -9 Avago Technologies. All rights reserved. Obsoletes 989-EN AV-EN - August 8, 9