Features. Y High input impedance 400 kx. Y Low output impedance 6X. Y High power efficiency. Y Low harmonic distortion. Y DC to 30 MHz bandwidth

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James Brooks
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1 LH0002 Buffer General Description The LH0002 is a general purpose buffer Its features make it ideal to integrate with operational amplifiers inside a closed loop configuration to increase current output The symmetrical output portion of the circuit also provides a low output impedance for both the positive and negative slopes of output pulses The LH0002 is available in an 8-lead TO-99 can The LH0002C is available in an 8-lead TO-99 and a 10-pin molded dual-in-line package The LH0002 is specified for operation over the b55 C to a125 C military temperature range The LH0002C is specified for operation over the 0 C toa85 C temperature range Features February 1995 Y High input impedance 400 kx Y Low output impedance 6X Y High power efficiency Y Low harmonic distortion Y DC to 30 MHz bandwidth Y Output voltage swing that approaches supply voltage Y 400 ma pulsed output current Y Slew rate is typically 200 V ms Y Operation from g5v to g20v Applications Y Y Y Line driver 30 MHz buffer High speed D A conversion LH0002 Buffer Schematic and Connection Diagrams Dual-In-Line Package Order Number LH0002CN See NS Package Number N10A TL H Metal Can Package Pin numbers in parentheses denote pin connections for dual-in-line package TL H Order Number LH0002H LH0002H-MIL or LH0002CH LH0002H 883 See NS Package Number H08D TL H Available per SMD C1995 National Semiconductor Corporation TL H 5560 RRD-B30M115 Printed in U S A

2 Absolute Maximum Ratings (Note 3) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications (Note 2) Supply Voltage g22v Power Dissipation (Note 4) 600 mw Input Voltage (Equal to Power Supply Voltage) Storage Temperature Range b65 Ctoa150 C Junction Temperature N Package a150 C H Package a175 C Steady State Output Current g100 ma Pulsed Output Current (50 ms On 1 sec Off) g400 ma Lead Temperature Soldering (10 seconds) Metal Can 300 C Plastic 260 C ESD Rating (Note 6) 2 kv Operating Ratings (Note 3) Temperature Range LH0002 LH0002C Thermal Resistance (Note 5) i JA H Package i JC H Package i JA N Package b55 Ctoa125 C 0 Ctoa85 C a125 C W a75 C W a120 C W Electrical Characteristics (Note 1) Parameter Conditions Min Typ Max Units Voltage Gain R S e 10 kx R L e1 0 kx V IN e g10v Input Impedance R S e 200 kx V IN e g1 0V R L e 1 0 kx kx Output Impedance V IN e g1 0V R L e 50X R S e10 kx X Output Voltage Swing R L e 1 0 kx V IN e g12v g10 g11 V Output Voltage Swing V S e g15v V IN e g12v R S e 50X R L e100x T A e25 C g10 V DC Output Offset Voltage R S e 300X R L e1 0 kx g10 g30 mv DC Input Bias Current R S e 10 kx R L e1 0 kx g6 0 g10 ma Harmonic Distortion V IN e 5 0 Vrms f e 1 0 khz 0 1 % Rise Time R L e 50X DV IN e 100 mv ns Positive Supply Current R S e 10 kx R L e1 0 kx a6 0 a10 ma Negative Supply Current R S e 10 kx R L e1 0 kx b6 0 b10 ma Note 1 Specification applies for T A e 25 C with a12v on Pins 1 and 2 b12v on Pins 6 and 7 for the metal can package and a12v on Pins 1 and 2 b12v on Pins 4 and 5 for the dual-in-line package unless otherwise specified The parameter guarantees for LH0002C apply over the temperature range of 0 C toa85 C while parameters for the LH0002 are guaranteed over the temperature range b55 C toa125 C unless otherwise specified Note 2 Refer to RETS0002X for LH0002 military specifications Note 3 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur Operating Ratings indicate conditions for which the device is intended to be functional but do not guarantee specific performance limits For guaranteed specifications and test conditions see the Electrical Characteristics The guaranteed specifications apply only for the test conditions listed Note 4 The maximum power dissipation is a function of maximum junction temperature (T J Max) total thermal resistance (i JA ) and ambient temperature (T A ) The maximum allowable power dissipation at any ambient is P D e (T J Max b T A ) i JA Note 5 For operating at elevated temperatures the device must be derated based on the thermal resistance i JA and T J Max T J e T A a P D i JA Note 6 Human body model 1 5 kx in series with 100 pf 2

3 Typical Applications High Current Operational Amplifier TL H Line Driver Previously called NH0002 NH0002C TL H Typical Performance Characteristics Frequency Response Input Impedance (Magnitude Phase) Supply Current Positive Pulse Negative Pulse Input Bias Current TL H

4 4

5 Physical Dimensions inches (millimeters) Metal Can Package (H) Order Number LH0002H LH0002H-MIL LH0002H 883 or LH0002CH NS Package Number H08D 5

6 LH0002 Buffer Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number LH0002CN NS Package Number N10A LIFE SUPPORT POLICY NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a) are intended for surgical implant support device or system whose failure to perform can into the body or (b) support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectiveness be reasonably expected to result in a significant injury to the user National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd Japan Ltd 1111 West Bardin Road Fax (a49) th Floor Straight Block Tel Arlington TX cnjwge tevm2 nsc com Ocean Centre 5 Canton Rd Fax Tel 1(800) Deutsch Tel (a49) Tsimshatsui Kowloon Fax 1(800) English Tel (a49) Hong Kong Fran ais Tel (a49) Tel (852) Italiano Tel (a49) Fax (852) National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications

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