CPS131. Data Sheet. Water Resistant Pressure Sensor. Consensic. Preliminary 0.1 January 2013 DAT 0006

Transcription

1 Data Sheet Preliminary 0.1 January 2013 DAT 0006

2 Water Digital Resistant Barometer Pressure Sensor Overview The SiP (System in a Package) solution comprises of a resistive bridge type pressure sensor and an 18 bit calibration math DSP for high resolution and accurate pressure measurements. The fully calibrated pressure and temperature compensated digital output makes the solution simple to use. The ADC comprise of an internal calibration logic that provides accurate pressure and temperature measurements to the application via the SPI or I²C interface. There is no need to separately download internal calibration coefficients and have the host micro controller conduct complicated compensation calculations. Applications Sports Watches Altimeters Portable and Stationary Barometers Weather Stations GPS Applications Benefits Water Protection up to 100m Gel Filled Stainless Steel Ring for Sealing Low Power Consumption. Excellent for Battery and Other Low Power Applications External Clock not Required Features Factory Calibrated Pressure and Temperature Sensor Supply Voltage: 1.8V to 3.6V Current Consumption: 1mA (Active Mode) Sleep State Current: <250nA (25 C) Absolute Temperature Range: 40 C to +85 C Pressure Accuracy: <±0.2kPa 25 C Temperature Accuracy: ±1.0 C Altitude Resolution Better Than 1.0 meter (50cm) in Active Mode Interfaces I²C TM * Compatible ( 3.4MHz) SPI ( 20MHz) Physical Characteristics 6.4 x 6.2 x 2.88mm (w x l x h) SMD, 8 Lead PCB Substrate *I²C TM is a registered trademark of NXP 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 2 of 20

3 BLOCK DIAGRAM TABLE 1: ORDERING INFORMATION PART NUMBER OUTPUT MODE OPERATION PACKAGE MODE 8SMD 100 I 2 C Sleep 1 8 Lead SMD, PCB Substrate 8SMD 200 SPI Sleep 1 8 Lead SMD, PCB Substrate 1 Contact us for Part Numbers on Different Operation Modes and Packages SALES and CONTACT INFORMATION United States, Inc. 875 Mahler Road, Suite 216 Burlingame, CA Ph: Fax: China 北京亿优八方科技发展有限公司 Ph: Fax: Sales Rep. (United States) MicroElec Technical 2953 Bunker Hill lane, Suite 400 Santa Clara, CA Ph: Fax: sales@microelecs.com 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 3 of 20

4 CONTENTS 1 OPERATING CHARACTERISTICS ABSOLUTE RATINGS OPERATING CONDITIONS ELECTRICAL PARAMETERS OUTPUT MODES I 2 C AND SPI I 2 C FEATURES AND TIMING SPI FEATURES AND TIMING I 2 C AND SPI COMMANDS GET DATA (GD) OPERATION MODES OTP CALCULATING OUTPUT PRESSURE OUTPUT TEMPERATURE OUTPUT PACKAGE AND ASSEMBLY MECHANICAL DRAWING SOLDERING CONDITIONS DOCUMENT HISTORY DISCLAIMER , Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 4 of 20

5 LIST OF TABLES TABLE 1: ORDERING INFORMATION...3 TABLE 2: I 2 C PARAMETERS...10 TABLE 3: SPI PARAMETERS...11 TABLE 4: I 2 C AND SPI COMMANDS...12 TABLE 5: STATUS BITS...12 TABLE 6: PACKAGE REFLOW TEMPERATURE , Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 5 of 20

6 LIST OF FIGURES FIGURE 1: I 2 C TIMING DIAGRAM...1 FIGURE 2: SPI TIMING DIAGRAM...1 FIGURE 3: 7 BIT SLAVE ADDRESS FOLLOWED BY ONE STATUS BYTE, TWO PRESSURE AND TWO TEMPERATURE BYTES...1 FIGURE 4: 7 BIT SLAVE ADDRESS FOLLOWED BY ONE STATUS BYTE AND TWO PRESSURE BYTES...1 FIGURE 5: SPI DATA AFTER THE COMPLETION OF A FULL MEASUREMENT COMMAND (AC HEX )...1 FIGURE 6: I 2 C MEASUREMENT REQUEST COMMAND (AC HEX )...1 FIGURE 7: SPI MEASUREMENT REQUEST COMMAND (AC HEX ) , Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 6 of 20

7 1 OPERATING CHARACTERISTICS 1.1 ABSOLUTE RATINGS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Over Pressure 2X FS kpa (bar) Supply Voltage (with respect to GND) V DD V Voltages at Analog and Digital I/O Pins V A_IO V D_IO 0.5 V DD +0.5 V Storage Temperature T STOR C 1.2 OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS PRESSURE SENSOR Range 30 (300) 120 (1200) kpa (mbar) kpa (mbar) kpa (mbar) kpa (mbar) Resolution (0.01) 70 to 115kPa 0.2 ± C ( 2.0) (±1.0) (+2.0) 70 to 115kPa 0.3 ± (0 C to 50 C Verified) ( 3.0) (±1.0) (+3.0) TEMPERATURE SENSOR Range C Resolution C Accuracy 1 ± C OPERATION Supply Voltage to GND 1 V SUPPLY V Operating Temperature Range 0 60 C External Capacitance Between CL nf V DDB Pin and GND I 2 C Pull Up Resistors R PU kω 1 Factory calibrated for Pressure and Temperature at 3.0V±10%. Output accuracy will be affected if used outside this range. Other ranges available upon request. 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 7 of 20

8 1.3 ELECTRICAL PARAMETERS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SUPPLY CURRENT Active Mode Current I VDD Active State Average µa Sleep Mode Current I VDD At 25 C na ANALOG TO DIGITAL CONVERTER Resolution r ADC 16 Bit ADC Clock Frequency f ADC MHz 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 8 of 20

9 2 OUTPUT MODES 2.1 I 2 C AND SPI Two wire I 2 C and SPI are available for reading data from the. The interface is selectable by the voltage level on the SEL pin: SEL = 0 SPI Mode SEL = 1 I 2 C Mode When SEL=0, SPI mode is selected. When SEL = 1 or not connected (IC internal pull up at SEL pin), I 2 C mode is selected. In I 2 C mode, the SPI specific pins (SS, MISO) do not need to be connected at all I 2 C FEATURES AND TIMING The factory setting for the I 2 C slave address is 0x28 and the communication is restricted to this address only. See Figure 1 for the I 2 C timing and Table 2 for definitions of the parameters shown in the diagram. FIGURE 1: I 2 C TIMING DIAGRAM tsusta thdsta tlow thigh thddat tsudat tsusto tbus SDA SCL START B1 B2 Bn STOP 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 9 of 20

10 TABLE 2: I 2 C PARAMETERS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SCL Clock Frequency f SCL khz Start Condition Hold Time Relative to SCL Edge t HDSTA 0.1 µs Minimum SCL Clock Low Width 3 t LOW 0.6 µs Minimum SCL Clock High Width 3 t HIGH 0.6 µs Start Condition Setup Time Relative to SCL Edge t SUSTA 0.1 µs Data Hold Time on SDA Relative to SCL Edge t HDDAT µs Data Setup Time on SDA Relative to SCL Edge t SUDAT 0.1 µs Stop Condition Setup Time on SCL t SUSTO 0.1 µs Bus Free Time Between Stop Condition and Start Condition t BUS 1 µs 3 Combined low and high widths must equal or exceed minimum SCL period SPI FEATURES AND TIMING SPI allows a duplex, synchronous, serial communication with support for up to 800kHz. The SPI interface can be programmed to allow the master to sample MISO on the falling edge or rising edge. The factory default is to sample MISO on the falling edge. See Figure 2 for SPI timing diagram and Table 3 for definitions of the parameters shown in the timing diagram. 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 10 of 20

11 FIGURE 2: SPI TIMING DIAGRAM tclkd thigh tlow tclkd tsuss tbus SCLK MISO HiZ HiZ SS thdss START STOP TABLE 3: SPI PARAMETERS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SCLK Clock Frequency f SCL khz SS Drop to First Clock Edge t HDSS 2.5 µs Minimum SCLK Clock Low Width 4 t LOW 0.6 µs Minimum SCLK Clock High Width 4 t HIGH 0.6 µs Clock Edge to Data Transition t CLKD µs Rise of SS Relative to Last Clock Edge t SUSS 0.1 µs Bus Free Time Between Rise and Fall of SS t SUS 2 µs 4 Combined low and high widths must equal or exceed minimum SCLK period 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 11 of 20

12 2.1.3 I 2 C AND SPI COMMANDS Table 4 details the commands to interface with the device in the I 2 C and SPI modes. TABLE 4: I 2 C AND SPI COMMANDS Get Data (GD) TYPE DESCRIPTION SUPPORT REFERENCE Measurement Request (MR) Used to Get Data in Active Mode, and Automatically Turns into Sleep Mode Again Used to Enter Active Mode from Sleep Mode, and Take a Measurement I 2 C and SPI I 2 C and SPI GET DATA (GD) The Get Data (GD) command is used to get data in Active mode. With the start of communication (for I 2 C after reading the slave address; for SPI at the falling edge of SS) the entire output packet will be loaded in a serial output register. The register will be updated after the communication is finished. The output is always scaled to 16 bits independent of the programmed resolution. The ordering of the bits is big endian I 2 C GET DATA An I 2 C Get Data command starts with the 7 bit slave address and the 8 th bit = 1 (READ). The device as the slave sends and acknowledges (ACK) indicating success. The number of data bytes returned by the device is determined by when the master sends the NACK and stop condition. Figure 3 shows examples of receiving a total of 6 bytes. The first byte contains the I 2 C address followed by one status byte, two pressure bytes and two temperature bytes. The bit6 and bit5 of the first byte is the status Bits. See Table 5. TABLE 5: STATUS BITS Bit6 : Bit5 DESCRIPTION 00 Device Not Powered 01 Device Not Powered and Not Available for Read and Write 10 Device Powered or POR(Power on Reset) successfully, and Available for Data or Command 11 Device Busy, Not Available for Data Read or Command Processing 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 12 of 20

13 In Figure3, the last two bytes returns 2 bytes of pressure data followed by 2 bytes of temperature data (16 bit accuracy). After executing the MR command, use the GD command to retrieve the Pressure and Temperature raw output counts. FIGURE 3: 7 BIT SLAVE ADDRESS FOLLOWED BY ONE STATUS BYTE, TWO PRESSURE AND TWO TEMPERATURE BYTES S SlaveAddr 1 A Status A PressureDat <15:8> A PressureDat <7:0> A TempDat <15:8> A TempDat <7:0> NP read from master to slave from slave to master S START condition P STOP condition AAcknowledge NNot Acknowledge For Pressure data only, the data stream can be terminated after the third pressure byte. See Figure 4 below. FIGURE 4: 7 BIT SLAVE ADDRESS FOLLOWED BY ONE STATUS BYTE AND TWO PRESSURE BYTES S SlaveAddr 1 A Status A PressureDat <15:8> read A PressureDat <7:0> NP 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 13 of 20

14 SPI GET DATA By default, the SPI interface will have data after the falling edge of the SCLK. The master should sample MISO on the rising (opposite) edge of SCLK. The SPI protocol can handle high and low polarity of the clock line without configuration change. As seen in Figure 5, the entire output packet is 5 bytes (40 bits). The status byte comes first, followed by the high and low pressure data bytes. Then, 16 bits of corrected Temperature are sent. If the user only requires the corrected Pressure value, the read can be terminated after the 2 nd and 3 rd byte. FIGURE 5: SPI DATA AFTER THE COMPLETION OF A FULL MEASUREMENT COMMAND (AC HEX ) MOSI Command = NOP 00 HEX 00 HEX 00 HEX 00 HEX MISO Status PressDat <15:8> PressDat <7:0> TempDat <15:8> TempDat 7:0> 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 14 of 20

15 I 2 C MEASUREMENT REQUEST The I 2 C MR is used to wake up the device in Sleep Mode and start a complete cycle starting with the Pressure measurement, followed by the Temperature measurements; after the DSP calculations. The results are then written to the digital output register. As shown in Figure6, the communication contains only the slave address and the WRITE bit (0) sent by the master. After the IC responds with the slave ACK, the master creates a stop condition. FIGURE 6: I 2 C MEASUREMENT REQUEST COMMAND (AC HEX ) S SlaveAddr 0 A Command A P write from master to slave from slave to master S START condition P STOP condition AAcknowledge NNot Acknowledge 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 15 of 20

16 SPI MEASUREMENT REQUEST The SPI MR is used to wake up the device in Sleep mode and start a complete Pressure measurement and Temperature measurement cycle. The SPI command request always consists of 3 bytes. The SPI MR command (AC HEX ) consists of 2 bytes followed by 0s. FIGURE 7: SPI MEASUREMENT REQUEST COMMAND (AC HEX ) MOSI Command other than NOP CmdDat <15:8> CmdDat <7:0> MISO Status Data Data 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 16 of 20

17 3 OPERATION MODES The is factory programmed in Sleep Mode. In Sleep Mode, the waits for commands from the master before taking measurements. After receive MR command, it runs a full measurement, and then turns into sleep mode again. 4 OTP The OTP array contains the sensor calibration coefficients and the configuration bits for the analog front end, output modes, measurement modes, etc. The OTP ROM is locked to prevent changes. 5 CALCULATING OUTPUT After retrieving the data, the compensated output can be calculated by following the equations below. 5.1 PRESSURE OUTPUT An example of the 16 bit compensated pressure with a full scale range of 30 to 120kPa can be calculated as follows: Pressure [kpa] = (Pressure High Byte [7:0] x Pressure Low Byte [7:0]) / 2^16 x TEMPERATURE OUTPUT The 16 bit compensated temperature can be calculated as follows: Temperature [ C] = (Temperature High Byte [7:0] x 64 + Temperature Low Byte [7:0]) / 2^16 x , Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 17 of 20

18 6 PACKAGE AND ASSEMBLY The is available in a SMD package with a PCB substrate. 6.1 MECHANICAL DRAWING 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 18 of 20

19 6.2 SOLDERING CONDITIONS TABLE 6: PACKAGE REFLOW TEMPERATURE PARAMETER CONDITIONS MIN TYP MAX UNITS Soldering Peak Temperature Less than 30 seconds (JEDEC STD 020 Standard) 260 C 7 DOCUMENT HISTORY REVISION DATE DESCRIPTION JAN 2013 Preliminary 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 19 of 20

20 8 DISCLAIMER Information in this datasheet is provided solely to enable implementation and use of products. The specifications and characteristics are subject to change without notice. reserves the right to make changes without further notice to any products herein. Typical parameters provided in this datasheet can and do vary in different applications and actual performance may vary over time. Customers must validate all operating parameters for their application. is not responsible for direct, indirect, incidental or consequential damages resulting from any defect, error or failure to perform. In no event, regardless of cause, shall incur any liability for any damages of any kind, including, but not limited to, any direct, indirect, special, incidental, punitive or consequential damages arising out of, resulting from, or any way connected to the use of the product, whether arising under breach of contract, tort (including negligence), strict liability or otherwise, and whether based on this agreement or otherwise, even if advised of the possibility of such damages, and whether or not injury was sustained by persons or property or otherwise; and whether or not loss was sustained from, or arose out of, the results of, the product, or any services that may be provided by. The customer assumes all responsibility and liability for proper and safe handling of the goods. It is the customer s responsibility to take any and all appropriate precautions with regard to electrostatic discharge. Also be aware that the products herein may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). No License is granted under any patent right or other intellectual property whatsoever. assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or any other Intellectual property rights of any kind. 2013, Inc. All rights reserved. The information contained in this document is subject to changes without notice. Page 20 of 20