TLE Overview. Dual LIN 2.2 / SAE J2602 Transceiver. Quality Requirement Category: Automotive

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1 1 Overview Qualiy Requiremen Caegory: Auomoive Feaures Two independen single-wire LIN ransceivers in one device Transmission rae up o 20 kbps Complian o ISO , LIN Specificaion 2.2 A and SAE J2602 Very low curren consumpion in Sleep mode wih wake-up capabiliy Very low leakage curren on he BUSx pins Digial I/O levels compaible for 3.3V and 5V microconrollers TxD proeced wih dominan ime-ou funcion and sae check afer mode change o Normal Operaion mode bus_x shor o V BAT proecion bus_x shor o GND handling Overemperaure proecion Undervolage deecion Very high ESD robusness: +/- 10 kv (IEC ), +/-8 kv (HBM) Opimized for high elecromagneic compliance (EMC) Very low elecromagneic emission and high immuniy o inerference Available in PG-DSO-14 and PG-TSON-14 package Auomaed Opical Inspecion (AOI) suppor wih PG-TSON-14 package Pin and fooprin compaible wih single LIN ransceivers such as TLE7257, TLE7258, and TLE7259-3GE Green Produc (RoHS complian) AEC Qualified Applicaions Body Conrol Modules (BCM) Gaeway Descripion The is a dual ransceiver for he Local Inerconnec Nework (LIN) wih inegraed wake-up and proecion feaures. The is designed for in-vehicle neworks using daa ransmission raes up o Daa Shee 1 Rev

2 Overview 20 kbps. The includes wo independen ransceivers ha operae as bus drivers beween he proocol conroller and physical LIN neworks. The suppors differen modes of operaion of he wo ransceivers for minimizing ECU curren consumpion in low power modes. When boh ransceivers are in Sleep mode, he ypically draws a quiescen curren of less han 10 µa, while hey sill can wake up on deecing LIN bus raffic on eiher bus channel. A common INH oupu can be used for conrolling exernal circuiry, for example volage regulaors. Based on he Infineon BiCMOS echnology he provides excellen ESD robusness ogeher wih very high elecromagneic compliance (EMC). The reaches a very low level of elecromagneic emission (EME) wihin a broad frequency range and independen from he baery volage. The is AEC qualified and ailored o wihsand he harsh condiions of auomoive environmen. Type Package Marking SK PG-DSO LC PG-TSON Daa Shee 2 Rev. 1.0

3 Table of conens 1 Overview Table of conens Block diagram Pin configuraion Pin assignmen Pin definiions and Funcions Funcional descripion Operaing modes Normal Operaion mode Sandby mode Sleep mode Wake-up evens Bus wake-up via LIN bus Mode ransiion via EN pin Fail safe funcions Overemperaure proecion Undervolage deecion TxD ime-ou V and 5 V logic capabiliy Shor circui Unconneced logic pins General produc characerisics Absolue maximum raings Funcional range Thermal characerisics Elecrical characerisics Funcional device characerisics General iming parameers Power supply inerface Curren consumpion Undervolage deecion INH oupu LIN conroller inerface Bus ransmier and receiver Bus receiver Bus ransmier Dynamic ransceiver parameers Diagrams Applicaion informaion ESD robusness according o IEC Physical layer compaibiliy TxD fail safe inpu Applicaion example Daa Shee 3 Rev. 1.0

4 8.5 RxDx pull-up resisor Furher applicaion informaion Package oulines Revision hisory Daa Shee 4 Rev. 1.0

5 Block diagram 2 Block diagram 11 INH V S 10 Supply Monior 2 EN1 RSlave2 RSlave1 Over-emperaure and Over-curren Proecion Wake Receiver 1 Conrol R EN 5 EN2 R EN Wake Receiver 2 V REF BUS1 13 Transmier 1 Driver Time-ou 3 TxD1 Receiver 1 BUS1 V S /2 RF- Filer 1 RxD1 V REF BUS2 9 Transmier 2 Driver Time-ou 7 TxD2 GND 8 Receiver 2 BUS2 V S /2 RF- Filer 4 RxD2 Figure 1 Block diagram Daa Shee 5 Rev. 1.0

6 Pin configuraion 3 Pin configuraion 3.1 Pin assignmen RxD N.C. EN1 TxD BUS1 N.C. RxD1 EN1 TxD N.C. BUS1 N.C. RxD2 EN INH V S RxD2 EN2 N.C INH V S BUS2 N.C. 6 9 BUS2 TxD2 7 8 GND TxD2 7 8 GND PG-TSON-14 (Top side X-Ray view) PG-DSO-14 _PINNING Figure 2 Pin configuraion 3.2 Pin definiions and Funcions Table 1 Pin definiions and funcions Pin Symbol Funcion 1 RxD1 Receive daa oupu 1; requires an exernal pull-up resisor moniors he LIN bus_1 signal in Normal Operaion mode Indicaes a wake-up even on BUS1 in Sandby mode 2 EN1 Enable inpu 1; has an inegraed pull-down resisor se his pin o high o selec Normal Operaion mode for ransceiver_1 3 TxD1 Transmi daa inpu 1; has an inegraed pull-up curren source se his pin o low o drive a dominan signal on LIN bus_1 4 RxD2 Receive daa oupu 2; requires an exernal pull-up resisor moniors he LIN bus_2 signal in Normal Operaion mode Indicaes a wake-up even on BUS2 in Sandby mode Daa Shee 6 Rev. 1.0

7 Pin configuraion Table 1 Pin definiions and funcions Pin Symbol Funcion 5 EN2 Enable inpu 2; has an inegraed pull-down resisor se his pin o high o selec Normal Operaion mode for ransceiver_1 6 N.C. No conneced 7 TxD2 Transmi daa inpu 2; has an inegraed pull-up curren source se his pin o low o drive a dominan signal on LIN bus_2 8 GND Ground 9 BUS2 BUS Inpu / Oupu 2; has an inegraed LIN slave erminaion 10 V S Baery supply inpu; requires decoupling capacior of 100 nf 11 INH Inhibi oupu; Baery supply relaed oupu high when ransceiver_1 OR ransceiver_2 is in Normal Operaion mode OR in Sandby mode 12 N.C. No conneced 13 BUS1 BUS Inpu / Oupu 1; has an inegraed LIN slave erminaion 14 N.C. No conneced Daa Shee 7 Rev. 1.0

8 Funcional descripion 4 Funcional descripion The LIN inerface is a single wire, bidirecional bus, used for in-vehicle neworks. The Dual LIN ransceiver is he inerface beween he microconroller and physical LIN bus (see Figure 15). The drives daa from he microconroller o he LIN bus via he TxD1/TxD2 inpus. The convers he ransmi daa sreams on he TxD1/TxD2 inpus o LIN signals wih opimized slew raes in order o minimize he level of elecromagneic emission on he LIN neworks. The RxD1/RxD2 oupus read back he informaion from he LIN bus o he microconroller. The inegraed filer neworks of he receivers suppress noise from he LIN bus and increase he elecromagneic immuniy level of he ransceivers. The LIN specificaion defines wo valid bus saes (see Figure 3): dominan: LIN bus volage level close o GND level recessive: LIN bus volage level pulled up o he supply volage V S by bus erminaion By seing he TxD1/TxD2 inpu of he o a low signal, he ransceiver generaes a dominan level on he corresponding BUS1/BUS2 pin. The RxD1/RxD2 oupus read he signal on he corresponding LIN bus pin and indicae he dominan LIN bus signal wih a low signal o he microconroller. Seing he TxD1/TxD2 pins o high, he ses he corresponding LIN inerface pin BUS1/BUS2 o he recessive level. A he same ime a high signal on he RxD1/RxD2 oupus indicaes he recessive level on he LIN bus. Every LIN nework consiss of a maser node and one or more slave nodes. To configure a ransceiver for maser node applicaions, a erminaion resisor of 1 kω and a diode mus be conneced beween LIN bus and power supply V S (see Figure 15). V IO Recessive Dominan Recessive TxDx V S Recessive Dominan Recessive V h_rec BUSx V h_dom Recessive Dominan Recessive V IO RxDx Figure 3 LIN bus signals Daa Shee 8 Rev. 1.0

9 Funcional descripion 4.1 Operaing modes The ransceivers of he have he following major operaion modes (see Figure 4): Normal Operaion mode Sandby mode Sleep mode The ransceivers can operae independenly of each oher regarding operaional mode, for example one ransceiver can be in Normal Operaion mode while he oher is in Sleep mode or in Sandby mode. The only feaure ha inroduces a dependency beween he wo ransceivers is he volage regulaor conrol oupu, he INH pin. INH is floaing only when boh ransceivers are in Sleep mode. INH high immediaely indicaes a mode change of any ransceiver, which has been riggered by bus wake-up or by a high signal on eiher ENx inpu. Sandby mode LIN BUSx OFF INH high ENx low Power-up ENx BUSx wake-up BUSx wake-up Normal Operaion mode ENx Sleep mode LIN BUSx ON INH high ENx high ENx LIN BUSx OFF INH floaing 1 ) ENx low 1) Inhibi oupu: - INH is floaing only if boh ransceivers are in Sleep mode Figure 4 Operaion mode sae diagram Daa Shee 9 Rev. 1.0

10 Funcional descripion 4.2 Normal Operaion mode In Normal Operaion mode all funcions of he are available and he device is fully funcional. Daa can be received from he LIN Bus as well as ransmied o he LIN Bus. The following funcions are available in he Normal Operaion mode: The ransmier_x is urned on, daa on he TxDx inpu pin is driven on he LIN bus_x. The receiver_x is urned on, daa on he LIN bus_x is moniored on he RxDx oupu. The TxDx pin is pulled up o he inernal power supply by an inernal curren source of he. The INH oupu is swiched on. The LIN bus is no coninuously moniored afer a LIN Bus Wake Up (Chaper 4.5) The undervolage deecion is enabled (see Chaper 5.2). Condiions for enering he Normal Operaion mode: The Normal Operaion mode can be enered from all modes of Operaion by seing he ENx inpu pin o high. Afer a mode change for a ransceiver_x of he o Normal Operaion mode, a high signal for a leas o_rec on he TxDx inpu is required before releasing daa communicaion on he corresponding ransceiver (see Figure 5). Afer a mode change o Normal Operaion mode while he TxDx is low, he Transmier_x remains inacive unil here is a ransiion from low o high a he TxDx pin. This behavior excludes possible bus communicaion disurbance during a mode change. ENx MODE MODE RxDx 1) Daa ransmission 1) To_rec TxDx Daa ransmission TxDx pin is high-impedance INH Sandby mode Normal Operaion mode 2) INH is swiched off only if boh ransceivers are in Sleep mode Sleep mode 1) Exernal pull up resisor is required. 2) Exernal pull down is required. Figure 5 Transiion from Sandby mode o Normal Operaion mode Daa Shee 10 Rev. 1.0

11 Funcional descripion 4.3 Sandby mode In Sandby mode no communicaion wih he LIN Bus is possible. The following funcions are available: The ransmier_x is urned off, he TxD_x inpu is inacive and he BUSx oupu is permanen recessive. The receiver_x is urned off. The RxDx oupu indicaes a wake-up even (see Figure 4). The TxDx pin is pulled up o he inernal power supply by an inernal curren source of he. The INH oupu is swiched on. The LIN Bus x is coninuously moniored for a valid Bus Wake up (Chaper 4.5) and indicaes a wake-up even on he RxDx pin. The undervolage deecion is disabled if he second ransceiver is no in Normal Operaion mode (see Chaper 5.2). Condiions for enering he Sandby mode: A bus wake-up even on he BUSx pin, while he ENx inpu pin remains low. 4.4 Sleep mode Sleep mode is a low power mode wih quiescen curren consumpion reduced o a minimum while a ransceiver_x is sill able o wake-up by a message on he LIN bus_x. The following funcions are available: The ransmier_x is urned off. The receiver_x is urned off. RxDx oupu is high if a pull-up resisor is conneced o he exernal microconroller supply. The TxDx inpu is disabled and he inernal pull-up curren source is swiched off. The INH oupu is swiched off and is floaing if boh ransceivers of he are in Sleep mode. The LIN Bus x is coninuously moniored for a valid Bus Wake up (Chaper 4.5). The undervolage deecion is disabled if he second ransceiver is no in Normal Operaion mode (Chaper 5.2). Condiions for enering he Sleep mode: The Sleep mode will be enered, if he ransceiver_x is in Normal Operaion mode AND he ENx pin has been se o low (see Figure 6). The Sleep mode will be enered, if V S exceeds he V S_UV_PON hreshold, while he ENx inpu pin remains low (see Figure 7). Figure 6 shows he behavior of he RxDx, TxDx and INH pin when he ransceivers ener Sleep mode from Normal Operaion mode. Daa Shee 11 Rev. 1.0

12 Funcional descripion ENx RxDx High or low depending on he signals on he LIN bus_x 1) TxDx Daa ransmission TxDx pin is high-impedance Mode INH 2) INH is swiched off only if boh ransceivers are in Sleep mode Normal Operaion mode Sleep mode Figure 6 1) Exernal pull up resisor is required 2) Exernal pull down resisor is required Transiion from Normal Operaion mode o Sleep mode V S V S_UV_PON Exernal microconroller supply: Off Exernal microconroller supply: Off RxDx ENx INH 1) The ransceiver_x remains in Sleep mode as long as he ENx pin remains low and no Bus Wake up has occured. 2) INH Pin is swiched off, because boh ransceivers are in Sleep Mode Power-down Sleep mode 1) Exernal pull up resisor is required. 2) Exernal pull down resisor is required. Figure 7 Transiion from Power-down o Sleep mode Daa Shee 12 Rev. 1.0

13 Funcional descripion 4.5 Wake-up evens A wake-up even on he LIN Bus changes he operaion mode for ransceiver_x of he from Sleep mode o Sandby mode. There are wo differen ways o exi Sleep mode: Bus wake-up via a dominan signal on he pin BUSx for a leas he ime WK_bus. The changes ino Sandby mode. Mode change by seing he ENx inpu high. The changes ino Normal Operaion mode Bus wake-up via LIN bus The bus wake-up, also called remoe wake-up, changes he ransceivers operaion mode from Sleep mode o Sandby mode. A falling edge on he LIN Bus, followed by a dominan bus signal for > WK,bus resuls in a bus wake-up even. The mode change o Sandby mode is performed wih he subsequen rising edge on he LIN bus. The ransceiver_x of remains in Sleep mode unil i deecs a change from dominan o recessive on he LIN bus_x (see Figure 8). In Sandby mode a low signal on he RxDx oupu indicaes a bus wake-up even of ransceiver_x. LIN bus signal V BUSx V BUS,dom V BUS,wk WK,bus Sleep mode Sandby mode INH 2) INH is swiched off only if boh ransceivers are in he Sleep mode ENx TxDx TxDx is high-impedance RxDx Figure 8 1) 1) Exernal pull up resisor is required. 2)E l lld i i i d Bus wake-up behavior RxDx low indicaes wake-up even on Bus_x Daa Shee 13 Rev. 1.0

14 Funcional descripion Mode ransiion via EN pin I is possible o change a ransceiver_x s mode from Sleep mode o Normal Operaion mode by seing he corresponding ENx inpu high. This feaure is useful wih an exernal microconroller ha is coninuously powered (insead of being conrolled by he INH oupu). The EN1/EN2 pins have inegraed pull-down resisors o ensure he ransceivers remain in Sleep mode or in Sandby mode, even if he volage a each ENx pin is floaing. The EN1/EN2 inpus have inegraed hyseresis (see Figure 9). ENx V EN,ON V EN,OFF Hyseresis MODE MODE RxDx 3) Daa ransmission 3) o,rec TxDx 1)) Daa ransmission INH 2) 2) Sleep mode Normal Operaion mode Sleep mode 1) The TxDx signal is driven from he exernal microconroller 2) The INH is swiched off, if boh ransceivers are in he Sleep Mode. Exernal pull down is required. 3) Exernal pull up resisor is required. Figure 9 Transiion from Sleep mode o Normal Operaion mode A ransiion from high o low on he ENx pin changes he operaion mode of ransceiver_x from Normal Operaion mode o Sleep mode. If ransceiver_x is already in Sleep mode, changing he ENx from low o high resuls in a mode change from Sleep mode o Normal Operaion mode. If he ransceiver_x is in Sandby mode, hen a change from low o high on he ENx pin changes he mode o Normal Operaion mode (see Figure 5). The ransceivers of he change operaion modes regardless of he signal on he BUS1 and BUS2 pins. In case of a shor circui from LIN bus_x o GND, which resuls in a permanen dominan signal, he ransceiver_x can be pu o Sleep mode by seing he ENx inpu o low. Afer he mode change o Normal Operaion mode, a high signal for he ime o_rec on he TxDx inpu is required o release he daa communicaion of ransceiver_x. Daa Shee 14 Rev. 1.0

15 Fail safe funcions 5 Fail safe funcions 5.1 Overemperaure proecion The inegraed overemperaure sensors proec he from hermal oversress on he ransmiers. In case of an overemperaure even T J > T JSD, he emperaure sensors disable he ransmiers (see Figure 10). An overemperaure even does no cause any mode change. The does no indicae an overemperaure even o he microconroller. If he juncion emperaure drops below he hermal shudown level T J < T JSD, hen he ransmiers are swiched on again. A signal change from high o low on he TxDx inpu resars daa communicaion of ransceivers afer a high signal wih a duraion of a leas o,rec. T JSD (shudown emp.) ΔT (shudown hyseresis) T J Swich-on Overemperaure even Cool down BUSx TxDx RxDx Figure 10 Overemperaure shudown A emperaure hyseresis is implemened for avoiding oggling during emperaure shudown. Daa Shee 15 Rev. 1.0

16 Fail safe funcions 5.2 Undervolage deecion If V S < V S_UV, hen he deecs an undervolage even. During an undervolage even he ransmiers and he receivers are disabled and no mode change is performed. If V S > V S_UV he ransmier will be enabled afer blank_uv. Figure 11 shows his scenario. V S Supply volage V S Undervolage release level V S_UV Power-on rese level V S_PON Blanking ime blank_uv Normal Operaion Mode Communicaion blocked Normal Operaion Mode V S Supply volage V S Undervolage release level V S_UV Power-on rese level V S_PON Blanking ime blank_uv Normal Operaion Mode Device unpowered Sleep Mode (ENx = low ) Normal Operaion Mode (ENx = high ) Communicaion blocked Figure 11 Undervolage deecion Daa Shee 16 Rev. 1.0

17 Fail safe funcions 5.3 TxD ime-ou The TxD ime-ou feaure proecs he LIN BUSx from blocking permanenly in case he signal on he TxDx pin is coninuously low, for example due o a malfuncioning microconroller or a shor circui on he prined circui board. In Normal Operaion mode, a coninuous low signal a he TxDx inpu for ime > TxD enables he TxD ime-ou feaure and he disables he ransceivers's oupu driver sage (see Figure 12). The receiver_x remains acive and daa on he LIN BUSx is sill moniored on he RxDx oupu. The releases he oupu sage afer a TxD ime-ou even when i deecs a high signal on he corresponding TxDx inpu for he ime o,rec. TxDx ime-ou due o e.g. microconroller error Recovery of he microconroller error Release afer TxDx ime-ou Normal communicaion TxD o,rec Normal communicaion TxDx V BUSx _TXD_TIMEOUT_V01 Figure 12 TxD ime-ou V and 5 V logic capabiliy The can be used for 3.3 V and 5 V microconrollers. The inpus and he oupus can operae a boh volage levels. The RxD1/RxD2 oupus require exernal pull-up resisors o he microconroller supply o define he volage level (see Figure 15). 5.5 Shor circui The BUS1/BUS2 pins of can wihsand shor circui o GND and shor circui o he power supply V S. The inegraed overemperaure proecion may disable he ransmiers in case of a permanen shor circui on he bus pins causing overheaing. 5.6 Unconneced logic pins If he inpu pins are no conneced and floaing (see Table 2), hen he inegraed pull-up resisors and pulldown resisors a he digial inpu pins force he ino fail safe behavior. Table 2 Unconneced logical inpus Inpu signal Defaul sae Commen TxD1, TxD2 high pull-up curren source o V Ref disabled in Sleep mode EN1, EN2 low pull-down resisor R EN Daa Shee 17 Rev. 1.0

18 General produc characerisics 6 General produc characerisics 6.1 Absolue maximum raings Table 3 Absolue maximum raings 1) All volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Volages Baery supply volage V S V ISO Param. 11 P_5.1.1 inpu volage a BUS1, BUS2 V BUS V P_5.1.2 Difference volage beween BUS1 and BUS2 Logic volage a EN1, EN2, TxD1, TxD2, RxD1, RxD2 V BUS1-BUS2-40 V P_ V logic V P_5.1.3 INH volage V INH -0.3 V S V P_5.1.4 Currens Oupu curren a RxD1, RxD2 I RxD 0 15 ma P_5.1.5 Oupu curren a INH I INH -5 5 ma P_5.1.6 Temperaures Juncion emperaure T j C P_5.1.7 Sorage emperaure T s C P_5.1.8 ESD Resisiviy Elecrosaic discharge volage a V S, BUS1, BUS2 Elecrosaic discharge volage all oher pins Elecrosaic discharge volage corner pins V ESD_HBM_BUS -8 8 kv Human Body Model (100pF via 1.5 kω) 2) V ESD_HBM_ALL -2 2 kv Human Body Model (100pF via 1.5 kω) 2) V ESD_CDM_CP V Charged Device Model 3) P_5.1.9 P_ P_ Elecrosaic discharge volage all oher pins V ESDCDM_OP V Charged Device Model 3) P_ ) No subjec o producion es, specified by design 2) ESD suscepibiliy HBM according o ANSI / ESDA / JEDEC JS-001 3) ESD suscepibiliy, Charged Device Model CDM EIA / JESD 22-C101 or ESDA STM5.3.1 Noes 1. Sresses above he ones lised here may cause permanen damage o he device. Exposure o absolue maximum raing condiions for exended periods may affec device reliabiliy. 2. Inegraed proecion funcions are designed o preven IC desrucion under faul condiions described in he daa shee. Faul condiions are considered as ouside normal operaing range. Proecion funcions are no designed for coninuous repeiive operaion. Daa Shee 18 Rev. 1.0

19 General produc characerisics 6.2 Funcional range Table 4 Funcional range Parameer Symbol Values Uni Noe or Min. Typ. Max. Tes Condiion Supply volages Exended supply volage range for operaion V S(ex) V Parameer deviaions possible Number P_5.2.1 Supply volage range for normal operaion V S(nor) V ISO P_5.2.2 Param. 10 Thermal parameers Juncion emperaure T j C P_5.2.3 Noe: Wihin he funcional range he IC operaes as described in he circui descripion. The elecrical characerisics are specified wihin he condiions given in he relaed elecrical characerisics able. 6.3 Thermal characerisics Noe: This hermal daa was generaed in accordance wih JEDEC JESD51 sandards. For more informaion, go o Table 5 Thermal resisance 1) Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Thermal resisance Juncion o ambien PG-DSO-14 R hja K/W 2) P_5.3.1 Juncion o ambien PG-TSON-14 R hja K/W 3) P_5.3.1 Thermal shudown juncion emperaure Thermal shudown emperaure T JSD C P_5.3.2 Thermal shudown hyseresis ΔT 10 K P_ ) No subjec o producion es, specified by design 2) Specified R hja value is according o Jedec JESD51-2,-7 a naural convecion on FR4 2s2p board; The Produc () was simulaed on a 76.2 x x 1.5 mm board wih 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu). 3) Specified R hja value is according o Jedec JESD51-2,-7 a naural convecion on FR4 2s2p board; The Produc () was simulaed on a 76.2 x x 1.5 mm board wih 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu). Daa Shee 19 Rev. 1.0

20 Elecrical characerisics 7 Elecrical characerisics 7.1 Funcional device characerisics General iming parameers Table 6 General Timing Parameers 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Number Min. Typ. Max. Tes Condiion Delay ime for mode change MODE_x 50 µs 1) P_7.1.1 TxD ime-ou TxD_x ms P_7.1.2 TxD recessive ime o release ransmier o, 10 µs 1) P_ ) Delay ime specified for a load of 10 kω, 20 pf on he INH oupu Power supply inerface Curren consumpion Table 7 Curren consumpion 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Min. Typ. Max. Tes Condiion Curren consumpion a V S, Normal Operaion mode, recessive sae (boh ransceivers) Curren consumpion a V S, Normal Operaion mode, dominan sae (boh ransceivers) Curren consumpion a V S, Sandby mode (boh ransceivers) Curren consumpion a V S, Sleep mode (boh ransceivers) I S,rec ma INH open, wihou R L ; V TxD1 = V TxD2 = high I S,dom ma INH open, wihou R L ; V TxD1 = V TxD2 =0V I S,sandby µa Sandby mode, V S = V BUS1 = V BUS2 I S,sleep,yp µa Sleep mode, T j <40 C; V S = 13.5 V; V S = V BUS1 = V BUS2 Number P_7.1.4 P_7.1.5 P_7.1.6 P_7.1.7 Daa Shee 20 Rev. 1.0

21 Elecrical characerisics Table 7 Curren consumpion (con d) 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Min. Typ. Max. Tes Condiion Curren consumpion a V S, Sleep mode (boh ransceivers) Curren consumpion a V S, Sleep mode (boh ransceivers), BUS1 and BUS2 shored o GND I S,sleep µa Sleep mode, V S = V BUS1 = V BUS2 I S,SC_GND µa Sleep mode, V S = 13.5 V; V BUS1 = V BUS2 =0V Number P_7.1.8 P_ Undervolage deecion V 4.3 V Rese level for mode Table 8 Undervolage deecion 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Number Min. Typ. Max. Tes Condiion Power-on rese level P_ on V S S,PON change Undervolage V S,UV V P_ deecion hreshold Undervolage deecion hyseresis V S,UV,HYS 300 mv 1) P_ Undervolage blanking BLANK,UV 10 µs 1) P_ ime 1) No subjec o producion es, specified by design Daa Shee 21 Rev. 1.0

22 Elecrical characerisics INH oupu Table 9 INH oupu 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Inhibi oupu: INH Inhibi volage drop ΔV INH 1.0 V I INH =-2.0mA P_ Leakage curren I INH,lk -5.0 µa Sleep mode; V INH =0V P_ LIN conroller inerface Table 10 LIN conroller inerface 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Number Min. Typ. Max. Tes Condiion Receiver oupus: RxD1, RxD2 High level leakage curren I RD,H,leak_x 5 µa V RxD1 = V RxD2 =5V; P_ V BUS1 = V BUS2 = V S Low level oupu curren I RD,L_x 2 ma V RxD1 = V RxD2 =0.4V; P_ V BUS1 = V BUS2 =0V Transmier inpus: TxD1, TxD2 High level inpu volage range V TD,H_x V Recessive sae P_ Low level inpu volage range V TD,L_x V Dominan sae P_ Inpu hyseresis V TD,hys_x 200 mv 1) P_ Pull-up curren I TD_x µa V TxD1 = V TxD2 =0V; P_ Normal Operaion or Sandby mode Enable inpus: EN1, EN2 High level inpu volage range V EN,H_x V Normal Operaion P_ mode Low level inpu volage range V EN,L_x V Sleep or Sandby P_ mode Inpu hyseresis V EN,hys_x 200 mv 1) P_ Pull-down resisance R EN_x kω P_ ) No subjec o producion es, specified by design Daa Shee 22 Rev. 1.0

23 Elecrical characerisics Bus ransmier and receiver Bus receiver Table 11 Bus receiver 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Receiver hreshold volage, recessive o dominan edge Receiver dominan sae Receiver hreshold volage, dominan o recessive edge Receiver recessive sae V h_dom_x 0.4 V S 0.44 V S V P_ V BUSdom_x V S V ISO (Par. 17) P_ V h_rec_x 0.56 V S 0.6 V S V P_ V BUSrec_x 0.6 V S 40 V ISO (Par. 18) P_ Receiver cener volage V BUS_CNT_x V S 0.5 V S V S V ISO (Par. 19) 1) P_ Receiver hyseresis V HYS_x 0.07 V S 0.12 V S V S V ISO (Par. 20) 2) P_ Wake-up hreshold volage V BUS,wk_x 0.40 V S 0.5 V S 0.6 V S V P_ Dominan ime for bus wake-up 1) V BUS_CNT =(V h_dom +V h rec )/2; 2) V HYS =V h_rec -V h_dom WK,bus_x µs P_ Daa Shee 23 Rev. 1.0

24 Elecrical characerisics Bus ransmier Table 12 Bus ransmier 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Min. Typ. Max. Tes Condiion Bus recessive oupu volage V BUS,ro_x 0.8 V S V S V V TxDx1 = V TxDx2 = high ; Open load Bus shor circui curren I BUSx_SC_x ma V BUS1 = V BUS2 = 18 V; ISO (Par. 12); Leakage curren loss of ground Leakage curren loss of baery Leakage curren driver off and bus dominan Leakage curren driver off and bus recessive I BUS_NO_GND_x ma V S =0V; V BUS1 = V BUS2 =-12V; ISO (Par. 15) I BUS_NO_BAT_x 1 5 µa V S =0V; V BUS1 = V BUS2 =18V ISO (Par. 16) I BUS_PAS_dom_x ma V S =18V; V BUS1 = V BUS2 =0V ISO (Par. 13) I BUSx_PAS_rec_x 1 5 µa V S =8V, V BUS1 = V BUS2 =18V, ISO (Par. 14) Forward volage serial diode V SerDiode_x V I SerDiodex =75µA 1) ISO (Par.21) Bus pull-up resisance R slave_x kω Normal Operaion mode; ISO (Par. 26) Inpu capaciance C i,bus_x 30 pf 2) Number P_ P_ P_ P_ P_ P_ P_ P_ P_ ) ΔV BUSx = volage difference beween V S and BUSx. V SerDiodex = ΔV BUSx - I SerDiodex * R Slave x 2) No subjec o producion es, specified by design Daa Shee 24 Rev. 1.0

25 Elecrical characerisics Dynamic ransceiver parameers Table 13 Dynamic ransceiver parameers 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Propagaion delay BUSx o RxDx ( dominan o low ) Propagaion delay BUSx o RxDx ( recessive o high ) rx_pdf_x µs R RxD1 = R RxD2 =2.4kΩ; C RxD1 = C RxD2 =20pF; ISO (Par. 31) rx_pdr_x µs R RxD1 = R RxD2 =2.4kΩ; C RxD1 = C RxD2 =20pF; ISO (Par. 31) Receiver delay symmery rx_sym_x -2 2 µs rx_sym = rx_pdf - rx_pdr ; R RxD1 = R RxD2 =2.4kΩ; C RxD1 = C RxD2 =20pF; ISO (Par. 32) Duy cycle D1 (for wors case a 20 kbi/s) Duy cycle D1 for V S supply 5.5 V o 7.0 V (for wors case a 20 kbi/s) Duy cycle D2 (for wors case a 20 kbi/s) Duy cycle D2 for V S supply 6.1 V o 7.6 V (for wors case a 20 kbi/s) D Duy cycle 1 TH Rec(max) = V S ; TH Dom(max) = V S ; V S =7.0 18V; bi =50µs; D1 = bus_rec(min) /2 bi ; ISO (Par. 27) D Duy cycle 1 1) TH Rec(max) = V S ; TH Dom(max) = V S ; V S = V; bi =50µs; D1 = bus_rec(min) /2 bi ; D Duy cycle 2 1) TH Rec(min) = V S ; TH Dom(min) = V S ; V S =7.6 18V; bi =50µs; D2 = bus_rec(max) /2 bi ; ISO (Par. 28) D Duy cycle 2 1) TH Rec(min) = V S ; TH Dom(min) =.275 V S ; V S = V; bi =50µs; D2 = bus_rec(max) /2 bi ; P_ P_ P_ P_ P_ P_ P_ Daa Shee 25 Rev. 1.0

26 Elecrical characerisics Table 13 Dynamic ransceiver parameers (con d) 5.5 V < V S <18V; R L = 500 Ω; -40 C < T J < 150 C all volages wih respec o ground; posiive curren flowing ino pin; unless oherwise specified. Parameer Symbol Values Uni Noe or Tes Condiion Number Min. Typ. Max. Duy cycle D3 (for wors case a 10.4 kbi/s) Duy cycle D3 for V S supply 5.5 V o 7.0 V (for wors case a 10.4 kbi/s) Duy cycle D4 (for wors case a 10.4 kbi/s) Duy cycle D4 for V S supply 6.1 V o 7.6 V (for wors case a 10.4 kbi/s) 1) Bus load concerning LIN Spec 2.2: Load 1 = 1 nf / 1 kω = C BUS / R L Load 2 = 6.8 nf / 660 Ω = C BUS / R L Load 3 = 10 nf / 500 Ω = C BUS / R L D Duy cycle 3 TH Rec(max) = V S ; TH Dom(max) = V S ; V S = V; bi =96µs; D3 = bus_rec(min) /2 bi ; ISO (Par. 29) D Duy cycle 3 1) TH Rec(max) = V S ; TH Dom(max) = V S ; V S = V; bi =96µs; D3 = bus_rec(min) /2 bi ; D Duy cycle 4 1) TH Rec(min) = V S ; TH Dom(min) = V S ; V S =7.6 18V; bi =96µs; D4 = bus_rec(max) /2 bi ; ISO (Par. 30) D Duy cycle 4 1) TH Rec(min) = V S ; TH Dom(min) = V S ; V S = V; bi =96µs; D4 = bus_rec(max) /2 bi ; P_ P_ P_ P_ Daa Shee 26 Rev. 1.0

27 Elecrical characerisics 7.2 Diagrams V S INH 100nF R INH V IO = 5 V RL RL EN1 TxD1 RxD1 R RxD1 BUS1 C RxD1 V IO = 5 V BUS2 EN2 TxD2 R RxD2 C Bus C Bus GND RxD2 C RxD2 _TEST_CIRCUIT Figure 13 Simplified es circui Bi Bi Bi TxDx (inpu o ransmiing node) Bus_dom(max) Bus_rec(min) V SUP (Transceiver supply of ransmiing node) TH Rec(max) TH Dom(max) TH Rec(min) TH Dom(min) Thresholds of receiving node 1 Thresholds of receiving node 2 Bus_dom(min) Bus_rec(max) RxDx (oupu of receiving node 1) rx_pdf(1) rx_pdr(1) RxDx (oupu of receiving node 2) rx_pdr(2) rx_pdf(2) Figure 14 Duy Cycle D1, D3 = BUS_rec(min) / (2 x BIT ) Duy Cycle D2, D4 = BUS_rec(max) / (2 x BIT ) Timing diagram for dynamic characerisics _LIN_TIMING_DIAGRAM Daa Shee 27 Rev. 1.0

28 Applicaion informaion 8 Applicaion informaion Noe: The following informaion is given as a hin for he implemenaion of he device only and shall no be regarded as a descripion or warrany of a cerain funcionaliy, condiion or qualiy of he device. 8.1 ESD robusness according o IEC Tess for ESD robusness according o IEC Gun es (150 pf, 330 Ω) have been performed. The resuls and es condiions are available in a separae es repor. Table 14 ESD robusness according o IEC Performed es Resul Uni Remarks Elecrosaic discharge volage a pin V S, BUS versus GND +10 kv 1) Posiive pulse Elecrosaic discharge volage a pin V S, BUS versus GND -10 kv 1) Negaive pulse 1) No subjec o producion es. ESD suscepibiliy ESD GUN according IEC , Tesed by exernal es faciliy (IBEE Zwickau, EMC es repor Nr and Nr ). 8.2 Physical layer compaibiliy Since he LIN physical layer is independen from higher LIN layers (for example LIN proocol layer), all nodes wih a LIN physical layer according o his revision can be mixed wih LIN physical layer nodes according o older revisions (LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3, LIN 2.0, LIN 2.1 and LIN 2.2) wihou any resricions. 8.3 TxD fail safe inpu The TxD1/TxD2 inpus have inernal pull-up srucures for avoiding bus disurbance in case he TxDx inpu is open. In case of an unconneced TxDx inpu, he TxDx is pulled up o an inernal volage supply (see Figure 1) and he oupu o he LIN bus on he pin BUSx is always recessive. This ensures ha he ransceiver does no disurb communicaion on he LIN bus. In Sleep mode he pull-up srucure on each TxD1/TxD2 inpu is disabled in order o minimize quiescen curren of he. The logic a he TxDx inpu does no reac o any signal change on he TxDx inpu and he ransmier_x is urned off. In Sleep mode he ransceiver_x can no disurb or block he LIN BUSx. Table 15 TxDx erminaion (TxDx inpus open) Operaion mode Inernal pull-up srucure TxDx inpu signal Transmier_x BUSx oupu Normal Operaion mode acive high on recessive Sandby mode acive high off recessive Sleep mode inacive floaing off recessive Daa Shee 28 Rev. 1.0

29 Applicaion informaion 8.4 Applicaion example V Ba 5 V or 3.3V LIN BUS2 LIN BUS1 Maser Node 1kΩ 1nF 1kΩ 1nF V I 22μF 100nF 100nF 13 9 V S TLE42xx GND BUS1 BUS2 GND V Q INH RxD1 RxD2 TxD1 TxD2 EN1 EN2 10μF kΩ 2.4kΩ 100nF Pull-up o MCU Supply V CC Microconroller e.g XC22xx GND 8, 12 ECU_1 5 V or 3.3V 22μF 100nF V I TLE42xx V Q 10μF 100nF V CC GND Slave Node 100nF 7 8 V S TLE7258 INH 2.4kΩ Pull-up o MCU Supply Microconroller e.g XC22xx RxD 1 TxD 4 220pF 6 BUS GND EN 2 GND 5 ECU_X Figure 15 Simplified applicaion circui Daa Shee 29 Rev. 1.0

30 Applicaion informaion 8.5 RxDx pull-up resisor The receive daa oupus RxD1/RxD2 provide open drain behavior for allowing he oupu level o be adaped o he microconroller supply volage. Because of his, 3.3 V microconroller derivaives wihou 5 V oleran pors can be used. In case he microconroller por pin does no provide inegraed pull-up circuis, exernal pull-up resisors conneced o he microconroller logic supply volage V IO are required. Figure 16 shows ypical RxD1/RxD2 pin inpu curren and inpu volage characerisics across emperaure. The RxDx pull-up resisors can be dimensioned according o he minimum high -level inpu volage and he maximum low -level inpu volage of he applicaion s microconroller por pins (Rx). Typically pull-up resisors R RxD1 /R RxD2 of 2.4 kω are recommended T j = 150 C T j = 27 C T j = -40 C VRxD1, VRxD2 [mv] Figure i RxD1, i RxD2 [ma] _RXD_CURRENT_V00 RxDx pin inpu ypical curren and volage characerisics 8.6 Furher applicaion informaion Please conac Infineon for informaion regarding he FMEA pin For furher informaion you may conac Daa Shee 30 Rev. 1.0

31 Package oulines 9 Package oulines 0.33 x (1.47) 1.75 MAX ) A MAX C M B C 14x 6 8 ± x M A 1 7 Index Marking ) B 1) Does no include plasic or meal prorusion of 0.25 max. per side Figure 17 PG-DSO-14 Daa Shee 31 Rev. 1.0

32 Package oulines Figure 18 PG-TSON-14 Green Produc (RoHS complian) To mee he world-wide cusomer requiremens for environmenally friendly producs and o be complian wih governmen regulaions he device is available as a green produc. Green producs are RoHS-Complian (i.e Pb-free finish on leads and suiable for Pb-free soldering according o IPC/JEDEC J-STD-020). For furher informaion on alernaive packages, please visi our websie: hp:// Dimensions in mm Daa Shee 32 Rev. 1.0

33 Revision hisory 10 Revision hisory Table 16 Revision hisory Revision Dae Changes Daa Shee creaed Daa Shee 33 Rev. 1.0

34 Please read he Imporan Noice and Warnings a he end of his documen Trademarks of Infineon Technologies AG µhvic, µipm, µpfc, AU-ConverIR, AURIX, C166, CanPAK, CIPOS, CIPURSE, CoolDP, CoolGaN, COOLiR, CoolMOS, CoolSET, CoolSiC, DAVE, DI-POL, DirecFET, DrBlade, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPACK, EconoPIM, EiceDRIVER, eupec, FCOS, GaNpowIR, HEXFET, HITFET, HybridPACK, imotion, IRAM, ISOFACE, IsoPACK, LEDrivIR, LITIX, MIPAQ, ModSTACK, my-d, NovalihIC, OPTIGA, OpiMOS, ORIGA, PowIRaudio, PowIRSage, PrimePACK, PrimeSTACK, PROFET, PRO-SIL, RASIC, REAL3, SmarLEWIS, SOLID FLASH, SPOC, SrongIRFET, SupIRBuck, TEMPFET, TRENCHSTOP, TriCore, UHVIC, XHP, XMC. Trademarks updaed November 2015 Oher Trademarks All referenced produc or service names and rademarks are he propery of heir respecive owners. Ediion Published by Infineon Technologies AG Munich, Germany 2017 Infineon Technologies AG. All Righs Reserved. Do you have a quesion abou any aspec of his documen? erraum@infineon.com IMPORTANT NOTICE The informaion given in his documen shall in no even be regarded as a guaranee of condiions or characerisics ("Beschaffenheisgaranie"). Wih respec o any examples, hins or any ypical values saed herein and/or any informaion regarding he applicaion of he produc, Infineon Technologies hereby disclaims any and all warranies and liabiliies of any kind, including wihou limiaion warranies of non-infringemen of inellecual propery righs of any hird pary. In addiion, any informaion given in his documen is subjec o cusomer's compliance wih is obligaions saed in his documen and any applicable legal requiremens, norms and sandards concerning cusomer's producs and any use of he produc of Infineon Technologies in cusomer's applicaions. The daa conained in his documen is exclusively inended for echnically rained saff. I is he responsibiliy of cusomer's echnical deparmens o evaluae he suiabiliy of he produc for he inended applicaion and he compleeness of he produc informaion given in his documen wih respec o such applicaion. For furher informaion on echnology, delivery erms and condiions and prices, please conac he neares Infineon Technologies Office ( WARNINGS Due o echnical requiremens producs may conain dangerous subsances. For informaion on he ypes in quesion please conac your neares Infineon Technologies office. Excep as oherwise explicily approved by Infineon Technologies in a wrien documen signed by auhorized represenaives of Infineon Technologies, Infineon Technologies producs may no be used in any applicaions where a failure of he produc or any consequences of he use hereof can reasonably be expeced o resul in personal injury.