RT Channel Charge Pump White LED Driver with Low Dropout Current Source. Preliminary. Features. General Description. Ordering Information

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1 4-Channel Charge Pump White LED Driver with Low Dropout Current Source General Description The is a high efficiency and cost effective charge pump white LED driver. It supports up to 4 white LEDs with regulated constant current for uniform intensity. The maintains the highest efficiency by utilizing a x/ x.5/x2 charge pump and low dropout current regulators. User can easily configure each LED current from.25ma to 20mA by a PWM dimming control. The dimming of white LEDs current can be achieved by applying a PWM signal to the pin. is available in a WQFN 3x3-6L package. Features Very High Efficiency Over 80% of Battery Life Support up to 4 White LEDs Support up to 80mA Output Current % Typical LED Current Matching Soft Start Function Auto Charge Pump Mode Selection 250kHz Fixed Frequency Oscillator Output Over Voltage Protection PWM Dimming Control Low Input Noise and EMI RoHS Compliant and 00% Lead (Pb)-Free Ordering Information Package Type QW : WQFN-6L 3x3 (W-Type) Operating Temperature Range P : Pb Free with Commercial Standard Note : RichTek Pb-free products are : Applications Mobile Phone, DSC, MP3 White LED Backlighting LCD Display Supply Pin Configurations (TOP VIEW) RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. Suitable for use in SnPb or Pb-free soldering processes % matte tin (Sn) plating. NC Marking Information CP For marking information, contact our sales representative directly or through a RichTek distributor located in your CN area, otherwise visit our website for detail. WQFN-6L 3x3

2 Typical Application Circuit C C PUMP PUMP2 + GPIO C IN CP CN C OUT R SET Figure. 4-WLEDs Application Circuit with PWM Dimming Function C C PUMP PUMP2 + GPIO C IN CP CN C OUT R SET Figure 2. 3-WLEDs Application Circuit with PWM Dimming Function C C PUMP PUMP2 + GPIO C IN CP CN C OUT R SET Figure 3. 2-WLEDs Application Circuit with PWM Dimming Function C PUMP C PUMP2 Maximum output current (total) 0.22μF 0.22μF 60mA 0.47μF 0.47μF 00mA μf μf 60mA 2

3 Functional Pin Description Pin Number Pin Name Pin Function LED 4 Output Current for. (If not in use, this pin must be connected to ) 2, Exposed Pad NC No Internal Connection. 3, 0 Ground. 4 CP Positive Terminal of Bucket Capacitor. 5 Power Input Voltage. 6 Negative Terminal of Bucket Capacitor 2. 7 CN Negative Terminal of Bucket Capacitor. 8 Output Voltage Source. 9 Positive Terminal of Bucket Capacitor 2. LED current is set by the value of the resistor R SET connected from the pin to ground. Do not short the pin to directly. 2 Chip Enable (Active High). Note that this pin is high impedance. 3 Power Input Voltage. 4 LED Output Current for. (If not in use, this pin must be connected to ) 5 LED 2 Output Current for. (If not in use, this pin must be connected to ) 6 LED 3 Output Current for. (If not in use, this pin must be connected to ) Function Block Diagram CP CN x/x.5/x2 Charge Pump UVLO Shut Down Delay (2ms) Current Limitation Soft Start Circuit Low Dropout Current Source (PMOS) 3

4 Absolute Maximum Ratings (Note ) Supply Input Voltage V to 6V Other I/O Pin Voltage V to 6V Power Dissipation, T A = 25 C WQFN-6L 3x W Package Thermal Resistance (Note 4) WQFN-6L 3x3, θ JA C/W Junction Temperature C Lead Temperature (Soldering, 0 sec.) C Storage Temperature Range C to 50 C ESD Susceptibility (Note 2) HBM (Human Body Mode) kV MM (Machine Mode) V Recommended Operating Conditions (Note 3) Junction Temperature Range C to 25 C Ambient Temperature Range C to 85 C Electrical Characteristics (V IN = 3.6V, C IN = C OUT = C FLY = uf (ESR = 30mΩ), T A = 25 C, unless otherwise specification) Input Parameter Symbol Test Condition Min Typ Max Units Input Supply Voltage V IN V Under-voltage Lockout Threshold V IN Rising V Under-voltage Lockout Hysteresis mv Quiescent of x Mode Quiescent of x2 Mode Shutdown Current x mode to x.5 mode Transition Voltage (V IN falling) x.5 mode to x2 mode Transition Voltage (V IN falling) I Q_x I Q_x2 I SHDN x Mode, No Load, All LED pins connected to, V IN = 3.5V to 4.5V x2 Mode, No Load, All LED pins floating, V IN = 3.5V V = 0.4V, V IN = 2.8V to 5.5V (T A = 40 C to 85 C) ma ma μa V TS_x.5 V F = 3.5V, I OUT = 80mA, I LEDx = 20mA V V TS_x2 V F = 3.5V, I OUT = 80mA, I LEDx = 20mA V Hysteresis of Mode Transition mv Output Current Range of I LEDx 2.8 < V IN < 5.5@V F = 3.2, I OUT = 60mA 3.0 < V IN < 5.5@V F = 3.4, I OUT = 80mA 3.3 < V IN < 5.5@V F = 3.8, I OUT = 80mA ma 00% Setting % I LEDx Accuracy I LED-ERR 6.25% Setting % To be continued 4

5 Parameter Symbol Test Condition Min Typ Max Units Current Matching 6.25% to 00% Setting % Start-up Current of LEDx I STUP Continuous Leakage μa Enable Threshold Voltage Logic-High V IH V Logic-Low V IL V Current Logic-High I IH V IH = V IN μa Logic-Low I IL V IL = μa Low Time for Shut Down T SHDN PWM Dimming ms Frequency PWM Dimming Frequency f PWM Minimum Turn On > 30μs k Hz Oscillator Frequency f OSC khz Note. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution is highly recommended. Note 3. The device is not guaranteed to function outside its operating conditions. Note 4. θ JA is measured in the natural convection at T A = 25 C on a low effective thermal conductivity test board of JEDEC 5-3 thermal measurement standard. 5

6 Typical Operating Characteristics Input Current vs. Input Voltage Efficiency vs. Input Voltage x2 Mode Input Current (ma) x Mode Efficiency (%) x2 x.5 x Input Voltage (V) Input Voltage (V) 22 LED Current vs. Input Voltage 5.5 Output Voltage vs. Input Voltage 2 5 LED Current (ma) Output Voltage (V) Input Voltage (V) Input Voltage (V) Pin Shutdown Response x.5 Mode Inrush Current Response V IN ac (00mV/Div) = 3.6V V IN ac (200mV/Div) = 3.3V (2V/Div) (2V/Div) (V/Div) (V/Div) I LED (0mA/Div) I IN (200mA/Div) Time (5ms/Div) Time (50μs/Div) 6

7 x.5 Mode Ripple & Spike = 3.V, CIN = COUT = 2.2μF x2 Mode Ripple & Spike = 3.0V, CIN = COUT = 2.2μF (200mV/Div) V IN (200mV/Div) (200mV/Div) V OUT (200mV/Div) (2V/Div) (2V/Div) Time (μs/div) Time (μs/div) 7

8 Applications Information The is a high efficiency charge pump white LED driver. It provides 4 channels low dropout voltage current source to regulated 4 white LEDs current. For high efficiency, the implements x/x.5/x2 mode charge pump. An external R SET is used to set the current of white LED. has input current regulation to reduce the input ripple. Soft Start The includes a soft start circuit to limit the inrush current at power on and mode switching. Soft start circuit holds the input current level long enough for output capacitor C OUT reaching a desired voltage level. When the soft start off, the won t sink spike current from V IN. Mode Decision The uses a smart mode decision method to select the working mode for maximum efficiency. Mode decision circuit senses the output and LED voltage for up/down selection. Dimming Control When an external PWM signal is connected to the pin, brightness of white LED is adjusted by the duty cycle. LED Current Setting The current of white LED connected to can be set by R SET. Every current flows through the white LED is 250 times greater than the current of R SET. The white LED can be estimated by following equation : VSET ILED = ( ) 250 RSET Where V SET =.2V, and R SET is the resistor connected from to. If the LED is not used, the LEDs pin should be connected to. Figure 4 shows the connection for 3LEDs application, pin is connection to directly. Layout Consideration Figure 4. Application for 3 LEDs The is a low dropout current source for white LED driver. Careful PCB layout is necessary. For best performance, place all peripheral components as close to the IC as possible. A short connection is highly recommended. The following guidelines should be strictly followed when designing a PCB layout for the. All the traces of LED pins running from chip to LEDs should be wide and short to reduce the parasitic connection resistance. Input capacitor (C IN ) should be placed close to (Pin 5) and connected to ground plane. The trace of in the PCB should be placed far away the sensitive devices or shielded by the ground. The should be connected to a strong ground plane for heat sinking and noise protection. The connection of R SET should be isolated from other noisy traces. The short wire is recommended to prevent EMI and noise coupling. Output capacitor (C OUT ) should be placed close to V OUT and connected to ground plane to reduce noise coupling from charge pump to LEDs. 6. The traces running from pins to flying capacitor should be short and wide to reduce parasitic resistance and prevent noise radiation. 8

9 All the traces of LED pins running from chip to LEDs should be wide and short to reduce the parasitic connection resistance. C NC CP CN The connection of R SET should be isolated from other noisy traces. The short wire is recommended to prevent EMI and noise coupling. C2 R SET The should be connected to a strong ground plane for heat sinking and noise protection. The traces running from pins to flying capacitor should be short and wide to reduce parasitic resistance and prevent noise radiation. C IN Ground Plane Battery C OUT Input capacitor (C IN ) should be placed close to V IN (Pin 5) and connected to ground plane. The trace of V IN in the PCB should be placed far away the sensitive devices or shielded by the ground. Output capacitor (C OUT ) should be placed close to V OUT and connected to ground plane to reduce noise coupling from charge pump to LEDs. Figure 5 9

10 Outline Dimension D D2 SEE DETAIL A L E E2 e b 2 2 A A A3 DETAIL A Pin # ID and Tie Bar Mark Options Note : The configuration of the Pin # identifier is optional, but must be located within the zone indicated. Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A A A b D D E E e L W-Type 6L QFN 3x3 Package RICHTEK TECHNOLOGY CORP. Headquarter 5F, No. 20, Taiyuen Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863) Fax: (8863) RICHTEK TECHNOLOGY CORP. Taipei Office (Marketing) 8F-, No. 37, Lane 235, Paochiao Road, Hsintien City Taipei County, Taiwan, R.O.C. Tel: (8862) Fax: (8862) marketing@richtek.com

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