Applications and opportunities of AM in Diebond equipment

Size: px
Start display at page:

Download "Applications and opportunities of AM in Diebond equipment"

Transcription

1 2018, March 22 Applications and opportunities of AM in Diebond equipment Patrick Houben Ralph Huijbers

2 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 2 nexperia.com

3 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 3 nexperia.com

4 Introducing Nexperia is a dedicated global leader in Discretes, Logic and MOSFETs devices. We became independent at the beginning of nexperia.com

5 A new force in Discretes, Logic & MOSFETs With a long history, broad experience and a global customer base. Key Facts A dedicated company for Discretes, Logic and MOSFETs with leadership positions in all product areas Over 1.1 billion US$ revenues (2016) More than 12% market share High volume production of 85 billion units annually 11,000 Employees supporting customers globally 2 own frontend, 3 own backend manufacturing sites Over 60 years of expertise in semiconductors, the former Standard Products division of NXP Headquarters in Nijmegen, The Netherlands CEO: Frans Scheper, heading a successful and established leadership team 5 nexperia.com

6 1-stop-shop for Discretes, Logic and MOSFETs Broad portfolio for standard functions and state-of-the art applications More than 10,000 active types Diodes & transistors Logic devices ESD Protection MOSFETs General purpose diodes and transistors Resistor-equipped transistors (RETs) Low V CEsat, medium & high power transistors Zener, Schottky and switching diodes Low V F Schottky and PN rectifier Automotive logic Buffers, drivers, transceivers Counters / frequency dividers Flip-flops, latches, registers Gates Logic voltage translators Specialty Logic Switches, (de)multiplexers ESD protection devices with standard and low capacitance for high-speed interfaces Surge protection (TVS) devices Common Mode & EMI filters Application-specific ESD solutions Automotive MOSFETs Low R DSon Trench MOSFETs from 12 V to 200 V N/P-channel MOSFETs ESD protected types 6 nexperia.com

7 Our manufacturing footprint Vertically integrated Manchester Nijmegen* Hamburg Guangdong Cabuyao Serembam 5 owned front and back end factories Very high degree of automation in backend factories Own specialized equipment designer Highly efficient supply chain and secure capacity Headquarter Nijmegen The Netherlands Front End Hamburg, Germany Manchester, UK Back End Guangdong, China Cabuyao, Philippines Seremban Malaysia 12 nexperia.com

8 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 8 nexperia.com

9 Industrial Technology Engineering Center (ITEC) Deliver breakthroughs in Back-end Semiconductors OEM solution provider in Assembly and Test equipment ITEC Smart Shop Floor infrastructure connects tools Benchmark for High-Volume Low-Diversity markets Highest capacity for investment, top Quality & Yield. Value proposition Enable businesses by tailored solutions Gain markets, keep markets by fast volume ramp-up and Lowest Total Cost of Ownership Exploit synergy with Package and Test innovation

10 ITEC Brief ITEC established in employees with service and supply in Asia and development in Europe Installed base >2300 systems providing 60-70Bpc products/ year Hong Kong office Netherlands office

11 ITEC benchmark solutions For Best in Class semiconductor manufacturing Lowest Integral Cost ADAT3 Assembly Platform Parset Test platforms Inspection Platforms Smart Manufacturing Lowest Cost of Ownership Process Portability Thinner wafers Flip Chip iso wires Placement accuracy 360º optical inspections Predictive Maintenance Versatility/ flexibility Lowest Cost of Ownership Multi-site testing Higher pincount Integrated digital / analogue functions Test Platform consolidation/ wide Test coverage Lowest Cost of Ownership Higher Resolving power 3D imaging Infrared inspections Integration in IT infrastructure for traceability Full die level traceability Big Data analytics Data fusion Autonomous loops/ Machine learning Leading in high volume Small Die Pick & Place Benchmark in Analogue Testing of Small Signal to Power MOS devices Best-In-Class Mold Defect and In-Tape Inspections Leading in Industry 4.0 for mass production 11 nexperia.com

12 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 12 nexperia.com

13 Die Bonder (ADAT3) Pick and place machine One platform, diverse applications High speed High accuracy ADAT3 Pick from wafer Place in tape Place on leadframe And many more applications

14 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 14 nexperia.com

15 Bondhead assembly pick and place end-affector 14 parts Interface Z move Pick and place nozzle Parallel leafspring guiding 2

16 Cooporation with Fontys Centre of Expertise And Objexlab Assignment : Is it possible to manufacture a monolithic bondhead including thin flexures using additive manufacturing? (Maintaning existing specifications) Student: Marco Teeuwen

17 Additive manufacturing Adding layers of material Selective Laser Melting (SLM)

18 Test models Fontys Objexlab Stainless Steel Print jobs stopped Support structures Straight flexures before removing Support structures removing problematic

19 Test models Supplier X 2x Titanium and 1x Stainless Steel Broken leaf springs Bended leaf springs Problems occure at removing support structures

20 Test models 3D Systems 4x Titanium Leaf spring 1x Titanium Cross flexure Straight flexures Edges in the reinforced sections 45

21 Topology optimization with Altair HyperWorks

22 Costs (%) Costs Costs per model in Titanium Serie size (pieces)

23 Final design 14 parts -> 1 part

24 Final design Printed at supplier X

25 7 Final design Printed at 3D Systems

26 Leafspring thickness Printed at 3D Systems Bondhead 1 Average: Min: Max: Delta: Bondhead 2 Average: Min: Max: Delta: mm mm mm mm (= +/- 12 um) mm mm mm mm (= +/- 10 um) - Nominal thickness of 0.2 mm possible - Tolerance +/ um - At Objexlab we printed a nomical thickness of 0.25 mm

27 Costs comparison Conventional (serie 8) = 100% Printed (serie 2) = 80 % Excluding: - Vacuum pipet (exchange part) - Some conventional postprocessing still needed 27 nexperia.com

28 Conclusions Is it possible to manufacture a monolithic bond head including thin flexures using additive manufacturing? Yes! 0.20 mm printing should be possible in Titanium and Stainless Steel Print tolerance ± ± mm Printing of thin structures standing will give the best results Leafsprings at 45 (no support structure needed)

29 Next assignment Perform a life (fatigue) test Investigate the effects of a treatment after printing Implement into machine Check on dynamics performance

30 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 30 nexperia.com

31 ITEC roadmap in Additive Manufacturing Examples AM parts to validate accessibility of design AM support structures AM cyclone housing for removal rejected dies 31 nexperia.com

32 ITEC roadmap in Additive Manufacturing Examples AM ring light housing 32 nexperia.com

33 Impact on TCOO ITEC roadmap in Additive Manufacturing AM Bond head AM of high accuracy parts (tolerances < 0.05 mm) AM of Optics supports AM of vacuum suction parts AM of type parts AM of type parts by customer Use AM to validate designs AM support structures Gained basic knowledge Additive Manufacturing Participate in the SAMOII project = Running Cooporation with Fontys Centre of Expertise = To be investigated

34

The 3D silicon leader. March 2012

The 3D silicon leader. March 2012 The 3D silicon leader March 2012 IPDiA overview Company located in Caen, Normandy, France Dedicated to manufacturing of integrated passive devices Employing 100 people and operating own wafer fab Strong

More information

Technology & Manufacturing

Technology & Manufacturing Technology & Manufacturing Jean-Marc Chery Chief Operating Officer Front-End Manufacturing Unique capability 2 Technology portfolio aligned with application focus areas Flexible IDM model with foundry

More information

PRESS KIT. High Accuracy Device Bonder with Robotics.

PRESS KIT. High Accuracy Device Bonder with Robotics. PRESS KIT High Accuracy Device Bonder with Robotics Press Announcement SET Introduces FC300R High Accuracy Device Bonder with Robotics FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy

More information

1 FUNDAMENTAL CONCEPTS What is Noise Coupling 1

1 FUNDAMENTAL CONCEPTS What is Noise Coupling 1 Contents 1 FUNDAMENTAL CONCEPTS 1 1.1 What is Noise Coupling 1 1.2 Resistance 3 1.2.1 Resistivity and Resistance 3 1.2.2 Wire Resistance 4 1.2.3 Sheet Resistance 5 1.2.4 Skin Effect 6 1.2.5 Resistance

More information

Company Presentation. October 2017

Company Presentation. October 2017 Company Presentation October 2017 A global semiconductor leader 2016 revenues of $6.97B Listed: NYSE, Euronext Paris and Borsa Italiana, Milan Who We are 2 Research & Development Main Sales & Marketing

More information

CREE POWER PRODUCTS 2012 REVOLUTIONIZING POWER ELECTRONICS WITH SILICON CARBIDE

CREE POWER PRODUCTS 2012 REVOLUTIONIZING POWER ELECTRONICS WITH SILICON CARBIDE CREE POWER PRODUCTS 2012 REVOLUTIONIZING POWER ELECTRONICS WITH SILICON CARBIDE Cree, the silicon carbide expert, is leading the power semiconductor revolution. Cree, an innovator of semiconductors for

More information

Company Presentation. January 2018

Company Presentation. January 2018 Company Presentation January 2018 A global semiconductor leader 2017 revenues of $8.35B with yearon-year growth of 19.7% Listed: NYSE, Euronext Paris and Borsa Italiana, Milan Who We Are 2 Research & Development

More information

APPLICATION FOCUS. Exceptional Class D subwoofer amplifier solutions. Setting new benchmarks in performance, power and cost

APPLICATION FOCUS. Exceptional Class D subwoofer amplifier solutions. Setting new benchmarks in performance, power and cost APPLICATION FOCUS Exceptional Class D subwoofer amplifier solutions Setting new benchmarks in performance, power and cost Exceptional power and performance The ZXCDSUBEV series of reference designs offers

More information

» Facing the Smart Future «

» Facing the Smart Future « Industrie 4.0 Internet of Things» Facing the Smart Future «Smart Products, Production and Services Internet of Services Industrial Internet Digital Manufacturing Call for Partners: Consortium Study Our

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 07 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and

More information

MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs

MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs Application Note Recently, various devices using MEMS technology such as pressure sensors, accelerometers,

More information

Advanced Packaging Equipment Solder Jetting & Laser Bonding

Advanced Packaging Equipment Solder Jetting & Laser Bonding Advanced Packaging Equipment Solder Jetting & Laser Bonding www.pactech.comw.pactech.com PacTech Packaging Technologies Pioneering in laser solder jetting technologies since 1995 Our mission is to reshape

More information

SiP packaging technology of intelligent sensor module. Tony li

SiP packaging technology of intelligent sensor module. Tony li SiP packaging technology of intelligent sensor module Tony li 2016.9 Contents What we can do with sensors Sensor market trend Challenges of sensor packaging SiP technology to overcome challenges Overview

More information

Application Note AN-1011

Application Note AN-1011 AN-1011 Board Mounting Application Note for 0.800mm Pitch Devices For part numbers IRF6100, IRF6100PBF, IR130CSP, IR130CSPPBF, IR140CSP, IR140CSPPBF, IR1H40CSP, IR1H40CSPPBF By Hazel Schofield and Philip

More information

DTMOS IV Efficiency Advantages of Superjunction Transistors. By Michael Piela, Toshiba Electronics Europe

DTMOS IV Efficiency Advantages of Superjunction Transistors. By Michael Piela, Toshiba Electronics Europe DTMOS IV Efficiency Advantages of Superjunction Transistors By Michael Piela, Toshiba Electronics Europe Summary Superjunction MOSFETs are able to deliver a combination of high conduction and switching

More information

Rick Clemmer Media briefing in China. Rick Clemmer, President & CEO NXP Semiconductors March 19, 2012 Shanghai

Rick Clemmer Media briefing in China. Rick Clemmer, President & CEO NXP Semiconductors March 19, 2012 Shanghai Rick Clemmer Media briefing in China Rick Clemmer, President & CEO NXP Semiconductors March 19, 2012 Shanghai Today s agenda NXP update Share our vision Zoom in China 2 NXP Semiconductors NXP Semiconductors

More information

A European Perspective for Electronic Industry in Latin America

A European Perspective for Electronic Industry in Latin America A European Perspective for Electronic Industry in Latin America François Guibert Corporate Vice President, Emerging Markets Region General Manager Electronic, a Global World Security Networking Consumer

More information

Industry trends are boosting Jet Printing. Nico Coenen Global Sales Director Jet Printing

Industry trends are boosting Jet Printing. Nico Coenen Global Sales Director Jet Printing Industry trends are boosting Jet Printing Nico Coenen Global Sales Director Jet Printing Agenda What is Jet Printing Market Overview Industry Trends Typical Applications 2 What is Jet Printing What is

More information

LESJÖFORS FLAT SPRINGS. The Lesjöfors Group also includes.

LESJÖFORS FLAT SPRINGS. The Lesjöfors Group also includes. LESJÖFORS FLAT SPRINGS The Lesjöfors Group also includes 1 2 LESJÖFORS As an industry leader in the design and manufacture of custom engineered mechanical springs and spring assemblies, Lesjöfors has the

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Integrated Photonics using the POET Optical InterposerTM Platform

Integrated Photonics using the POET Optical InterposerTM Platform Integrated Photonics using the POET Optical InterposerTM Platform Dr. Suresh Venkatesan CIOE Conference Shenzhen, China Sept. 5, 2018 POET Technologies Inc. TSXV: PUBLIC POET PTK.V Technologies Inc. PUBLIC

More information

Keysight Technologies MEMS On-wafer Evaluation in Mass Production

Keysight Technologies MEMS On-wafer Evaluation in Mass Production Keysight Technologies MEMS On-wafer Evaluation in Mass Production Testing at the Earliest Stage is the Key to Lowering Costs Application Note Introduction Recently, various devices using MEMS technology

More information

Yole Developpement. Developpement-v2585/ Publisher Sample

Yole Developpement.  Developpement-v2585/ Publisher Sample Yole Developpement http://www.marketresearch.com/yole- Developpement-v2585/ Publisher Sample Phone: 800.298.5699 (US) or +1.240.747.3093 or +1.240.747.3093 (Int'l) Hours: Monday - Thursday: 5:30am - 6:30pm

More information

Taking a broader view

Taking a broader view Taking a broader view A brief introduction to DNV GL 1 SAFER, SMARTER, GREENER We are a global classification, certification, technical assurance and advisory company 2 In a challenging world we make businesses

More information

Victor Vega RFID Solutions Marketing Director NXP Semiconductors San Jose, CA

Victor Vega RFID Solutions Marketing Director NXP Semiconductors San Jose, CA Victor Vega RFID Solutions Marketing Director NXP Semiconductors San Jose, CA Involved in RFID for 17 years. Responsibilities have ranged from design engineer to marketing director. Prior employment engagements

More information

STEVAL-ISA005V1. 1.8W buck topology power supply evaluation board with VIPer12AS. Features. Description. ST Components

STEVAL-ISA005V1. 1.8W buck topology power supply evaluation board with VIPer12AS. Features. Description. ST Components Features Switch mode general purpose power supply Input: 85 to 264Vac @ 50/60Hz Output: 15V, 100mA @ 50/60Hz Output power (pick): 1.6W Second output through linear regulator: 5V / 60 or 20mA Description

More information

Serving Diversified Markets F1Q10

Serving Diversified Markets F1Q10 Corporate Overview Microsemi Today Global Supplier of Semiconductor & Electronic Systems Founded 1960. 50 years of success Nasdaq - MSCC Specializing in System-engineered analog mixed signal integrated

More information

Financial Highlights. Letter to Shareholders. Annual Report

Financial Highlights. Letter to Shareholders. Annual Report A N N U A L R E P O R T 2 0 0 4 The Company s common stock is traded on the SWX Swiss Stock Exchange under the symbol IFCN. T A B L E O F C O N T E N T S Financial Highlights Letter to Shareholders Annual

More information

About EOS. Step 01. Step 02. Step 03

About EOS. Step 01. Step 02. Step 03 EOS EOS in Brief About EOS Founded in 1989 and headquartered in Germany, EOS is the technology and market leader for design-driven integrated e-manufacturing solutions for Additive Manufacturing (AM).

More information

Dynamic Semiconductor Years

Dynamic Semiconductor Years Dynamic Semiconductor Years PSMC Meeting April 25-27 Director IHS Markit Technology 15 Inverness Way East Englewood, CO 80112 P: +1 303 988 2206 2 IHS Markit Addressing strategic challenges with interconnected

More information

New Power MOSFET. 1. Introduction. 2. Application of Power MOSFETs. Naoto Fujisawa Toshihiro Arai Tadanori Yamada

New Power MOSFET. 1. Introduction. 2. Application of Power MOSFETs. Naoto Fujisawa Toshihiro Arai Tadanori Yamada New Power MOSFET Naoto Fujisawa Toshihiro Arai Tadanori Yamada 1. Introduction Due to the finer patterns and higher integration of LSIs, functions that were used a few years ago in minicomputers have now

More information

Creating the world technology leader in surface solutions under one roof

Creating the world technology leader in surface solutions under one roof Creating the world technology leader in surface solutions under one roof We are the world technology leader in the growing surface solutions market. Combining the complementary strengths of Oerlikon Balzers

More information

21 st Annual Needham Growth Conference

21 st Annual Needham Growth Conference 21 st Annual Needham Growth Conference Investor Presentation January 15, 2019 Safe Harbor Statement The information contained in and discussed during this presentation may include forward-looking statements

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 07 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and

More information

Thinning of IC chips

Thinning of IC chips 1 Thinning of IC chips Annette Teng CORWIL TECHNOLOGY CORP. 1635 McCarthy Blvd. Milpitas, CA 95135 2 CONTENT Industry Demand for thinness Method to achieve ultrathin dies Mechanical testing of ultrathin

More information

CHAPTER 1 INTRODUCTION. Infineon consists of two main companies which are:

CHAPTER 1 INTRODUCTION. Infineon consists of two main companies which are: CHAPTER 1 INTRODUCTION 1.1 Organization Background Infineon consists of two main companies which are: IFMY (Infineon Technologies Malaysia Sdn.Bhd) IFLP (Infineon (Advanced Logic) Sdn.Bhd) Infineon Technologies

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Competitive in Mainstream Products

Competitive in Mainstream Products Competitive in Mainstream Products Bert Koek VP, Business Unit manager 300mm Fabs Analyst Day 20 September 2005 ASML Competitive in mainstream products Introduction Market share Device layers critical

More information

Brief Introduction of Sigurd IC package Assembly

Brief Introduction of Sigurd IC package Assembly Brief Introduction of Sigurd IC package Assembly Content Package Development Trend Product Brief Sawing type QFN Representative MEMS Product LGA Light Sensor Proximity Sensor High Yield Capability Low

More information

Sirectifier Company Presentation

Sirectifier Company Presentation Sirectifier Company Presentation POWER MANAGEMENT & ESD PROTECTION www.sirect.com About Sirectifier Sirectifier Global Corp. (SGC), located in Delaware, U.S.A., is a leading designer and ODM/OEM service

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Company Presentation. October 2018

Company Presentation. October 2018 Company Presentation October 2018 A global semiconductor leader 2017 revenues of $8.35B with yearon-year growth of 19.7% Listed: NYSE, Euronext Paris and Borsa Italiana, Milan Who We Are 2 Research & Development

More information

Rugged 1.2 KV SiC MOSFETs Fabricated in High-Volume 150mm CMOS Fab

Rugged 1.2 KV SiC MOSFETs Fabricated in High-Volume 150mm CMOS Fab Rugged 1.2 KV SiC MOSFETs Fabricated in High-Volume 150mm CMOS Fab Agenda Motivation for SiC Devices SiC MOSFET Market Status High-Volume 150mm Process Performance / Ruggedness Validation Static characteristics

More information

In the heart of Industrial electronics

In the heart of Industrial electronics In the heart of Industrial electronics DRIVES SAFETY, SECURITY BUILDING CONTROL MEDICAL ELEVATORS INSTRUMENTATION, MEASUREMENT INDUSTIAL AUTOMATION POWER & UTILITIES ESCALATORS RAILWAY, MARINE & OTHER

More information

Integration of Power, Control and Dynamic Braking in AC Motor Drives

Integration of Power, Control and Dynamic Braking in AC Motor Drives Thick Film & Hybrid Technology Integration of Power, Control and Dynamic Braking in AC Motor Drives Increased energy cost is undoubtedly one of the major problems facing industry today. Since almost every

More information

Unlocking the Power of GaN PSMA Semiconductor Committee Industry Session

Unlocking the Power of GaN PSMA Semiconductor Committee Industry Session Unlocking the Power of GaN PSMA Semiconductor Committee Industry Session March 24 th 2016 Dan Kinzer, COO/CTO dan.kinzer@navitassemi.com 1 Mobility (cm 2 /Vs) EBR Field (MV/cm) GaN vs. Si WBG GaN material

More information

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration

More information

Osram reveals the future of entertainment lighting at Prolight + Sound 2017 in Frankfurt

Osram reveals the future of entertainment lighting at Prolight + Sound 2017 in Frankfurt 1/5 Presse Press Osram reveals the future of entertainment lighting at Prolight + Sound 2017 in Frankfurt Munich, April 4, 2017 The lighting specialist is presenting innovative products everything from

More information

Company Presentation. July 2018

Company Presentation. July 2018 Company Presentation July 2018 A global semiconductor leader 2017 revenues of $8.35B with yearon-year growth of 19.7% Listed: NYSE, Euronext Paris and Borsa Italiana, Milan Who We Are 2 Research & Development

More information

Mr. Thachat Viswanath Narendran

Mr. Thachat Viswanath Narendran INTERVIEW with Tata Steel CEO Rising Elephant: Tata and the Indian Steel Industry Mr. Thachat Viswanath Narendran CEO & Managing Director, Tata Steel Limited Mr. T.V. Narendran joined Tata Steel after

More information

Innovations Push Package-on-Package Into New Markets. Flynn Carson. STATS ChipPAC Inc Kato Rd Fremont, CA 94538

Innovations Push Package-on-Package Into New Markets. Flynn Carson. STATS ChipPAC Inc Kato Rd Fremont, CA 94538 Innovations Push Package-on-Package Into New Markets by Flynn Carson STATS ChipPAC Inc. 47400 Kato Rd Fremont, CA 94538 Copyright 2010. Reprinted from Semiconductor International, April 2010. By choosing

More information

IFX Day Campeon 07 June Dr. Reinhard Ploss Member of the Management Board Operations, R&D, Labor Director

IFX Day Campeon 07 June Dr. Reinhard Ploss Member of the Management Board Operations, R&D, Labor Director IFX Day 2011 Campeon Dr. Reinhard Ploss Member of the Management Board Operations, R&D, Labor Director Table of Contents Manufacturing Strategy Investments and 300mm Power Semiconductor Technologies and

More information

Electroless Bumping for 300mm Wafers

Electroless Bumping for 300mm Wafers Electroless Bumping for 300mm Wafers T. Oppert Internepcon 2006 Tokyo Big Sight, Japan Outline Short Company Profile Electroless Ni/Au Under Bump Metallization UBM for Copper Devices Solder Bumping: Stencil

More information

The SEMATECH Model: Potential Applications to PV

The SEMATECH Model: Potential Applications to PV Continually cited as the model for a successful industry/government consortium Accelerating the next technology revolution The SEMATECH Model: Potential Applications to PV Dr. Michael R. Polcari President

More information

50 YEARS SUSS MASK ALIGNER

50 YEARS SUSS MASK ALIGNER 50 YEARS SUSS MASK ALIGNER Ralph Zoberbier SUSS MicroTec Lithography GmbH Germany Published in the SUSS report 01/2013 E-mail: info@suss.com www.suss.com 50 YEARS SUSS MASK ALIGNER Ralph Zoberbier SUSS

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

AN10361 Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board

AN10361 Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board Philips and the SOT666 BISS loadswitch demo board Rev. 01.00 20 June 2005 Application note Document information Info Keywords Abstract Content BISS, loadswitch, high side switch, supply line switch, SOT666,

More information

LM2240 Programmable Timer Counter

LM2240 Programmable Timer Counter LM2240 Programmable Timer Counter General Description The LM2240 Programmable Timer Counter is a monolithic controller capable of both monostable and astable operation Monostable operation allows accurate

More information

The Renishaw Additive Manufacturing formula

The Renishaw Additive Manufacturing formula Renishaw Investor Day 2018 The Renishaw Additive Manufacturing formula Clive Martell Head of Global Additive Manufacturing What is Renishaw additive manufacturing? Renishaw and additive manufacturing Additive

More information

Semiconductor Devices

Semiconductor Devices Semiconductor Devices - 2014 Lecture Course Part of SS Module PY4P03 Dr. P. Stamenov School of Physics and CRANN, Trinity College, Dublin 2, Ireland Hilary Term, TCD 3 th of Feb 14 MOSFET Unmodified Channel

More information

Accelerating Collective Innovation: Investing in the Innovation Landscape

Accelerating Collective Innovation: Investing in the Innovation Landscape PCB Executive Forum Accelerating Collective Innovation: Investing in the Innovation Landscape How a Major Player Uses Internal Venture Program to Accelerate Small Players with Big Ideas Dr. Joan K. Vrtis

More information

Release Nexperia Assembly and Test Malaysia Facility as 2nd Source for PowerMOS

Release Nexperia Assembly and Test Malaysia Facility as 2nd Source for PowerMOS epcn Print: Final Product Change Notification 201703004F01 https://extranet.nexperia.com/pcn/private/print?pcnid=37221434 Page 1 of 2 3/16/2017 Final Product Change Notification Issue Date: 17-Mar-2017

More information

Keysight HMMC-1002 DC 50 GHz Variable Attenuator

Keysight HMMC-1002 DC 50 GHz Variable Attenuator Keysight HMMC-1002 DC 50 GHz Variable Attenuator 1GG7-8001 Data Sheet Features Specified frequency range: DC to 26.5 GHz Return loss: 10 db Minimum attenuation: 2.0 db Maximum attenuation: 30.0 db 02 Keysight

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

INTEGRATED CIRCUITS. AN243 LVT (Low Voltage Technology) and ALVT (Advanced LVT)

INTEGRATED CIRCUITS. AN243 LVT (Low Voltage Technology) and ALVT (Advanced LVT) INTEGRATED CIRCUITS LVT (Low Voltage Technology) and ALVT (Advanced LVT) Author: Tinus van de Wouw January 1998 Author: Tinus van de Wouw, Philips Semiconductors, Nijmegen 1 INTRODUCTION Philips Semiconductors

More information

Agilent AEDA-3300 Series Ultra Miniature, High Resolution Incremental Kit Encoders Data Sheet

Agilent AEDA-3300 Series Ultra Miniature, High Resolution Incremental Kit Encoders Data Sheet Description The AEDA-3300 series are high performance, cost effective, three-channel optical incremental encoder modules with integrated bearing stage. By using transmissive encoder technology to sense

More information

AN2239 APPLICATION NOTE

AN2239 APPLICATION NOTE AN2239 APPLICATION NOTE Maximizing Synchronous Buck Converter Efficiency with Standard STripFETs with Integrated Schottky Diodes Introduction This document explains the history, improvements, and performance

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

FAN MHz TinyBoost Regulator with 33V Integrated FET Switch

FAN MHz TinyBoost Regulator with 33V Integrated FET Switch FAN5336 1.5MHz TinyBoost Regulator with 33V Integrated FET Switch Features 1.5MHz Switching Frequency Low Noise Adjustable Output Voltage Up to 1.5A Peak Switch Current Low Shutdown Current:

More information

QUALITY SEMICONDUCTOR, INC.

QUALITY SEMICONDUCTOR, INC. Q QUALITY SEMICONDUCTOR, INC. AN-20 Board Assembly Techniques for 0.4mm Pin Pitch Surface Mount Packages Application Note AN-20 The need for higher performance systems continues to push both silicon and

More information

Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November

Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November 2006 Forward Looking Statement The presentation today may

More information

MM5452 MM5453 Liquid Crystal Display Drivers

MM5452 MM5453 Liquid Crystal Display Drivers MM5452 MM5453 Liquid Crystal Display Drivers General Description The MM5452 is a monolithic integrated circuit utilizing CMOS metal gate low threshold enhancement mode devices It is available in a 40-pin

More information

DS DS Series Dual Peripheral Drivers

DS DS Series Dual Peripheral Drivers DS55451 2 3 4 DS75451 2 3 4 Series Dual Peripheral Drivers General Description Features Y The DS7545X series of dual peripheral drivers is a family of versatile devices designed for use in systems that

More information

A Soft And Efficient Switch For Industrial Applications

A Soft And Efficient Switch For Industrial Applications New Gen 3 650V IGBT A Soft And Efficient Switch For Industrial Applications Recent development of trench stop IGBTs has led to very performant devices. They present lower static and dynamic losses, thus

More information

Semiconductor and LED Markets. Jon Sabol Vice President and General Manager Semiconductor and LED Division

Semiconductor and LED Markets. Jon Sabol Vice President and General Manager Semiconductor and LED Division Semiconductor and LED Markets Jon Sabol Vice President and General Manager Semiconductor and LED Division Semiconductor & LED Investing in Semiconductor and LED $ Millions 300 200 27% CAGR 100 0 * FY06

More information

Volume 21 Issue IV News Review, News Analysis, Features, Research Review and much more.

Volume 21 Issue IV   News Review, News Analysis, Features, Research Review and much more. Volume 21 Issue IV 2015 @compoundsemi www.compoundsemiconductor.net Exposing a fl aw in p-type GaN Making MOSFETs for motoring Veeco A brighter future for LEDs Shares: The good, bad and ugly Instant imaging

More information

6-7 October Marina Bay Sands Expo & Convention Centre Peony Ballroom [Level 4]

6-7 October Marina Bay Sands Expo & Convention Centre Peony Ballroom [Level 4] camline http://www.camline.com Booth 22 camline s mission is to provide the highest quality software solutions for factory automation and logistics, helping global manufacturers maintain their competitive

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS

APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and

More information

LM390 1W Battery Operated Audio Power Amplifier

LM390 1W Battery Operated Audio Power Amplifier LM390 1W Battery Operated Audio Power Amplifier General Description The LM390 Power Audio Amplifier is optimized for 6V 7 5V 9V operation into low impedance loads The gain is internally set at 20 to keep

More information

LM W Audio Power Amplifier

LM W Audio Power Amplifier LM388 1 5W Audio Power Amplifier General Description The LM388 is an audio amplifier designed for use in medium power consumer applications The gain is internally set to 20 to keep external part count

More information

FULLY PROTECTED POWER MOSFET SWITCH

FULLY PROTECTED POWER MOSFET SWITCH Data Sheet No. PD 60068-I FULLY PROTECTED POWER MOSFET SWITCH Features Controlled slew rate reduces EMI Over temperature protection with auto-restart Linear current-limit protection Active drain-to-source

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Automotive and Discrete Group (ADG)

Automotive and Discrete Group (ADG) Automotive and Discrete Group (ADG) Marco Monti Executive Vice President General Manager, Automotive and Discrete Group Automotive & Discrete Group in FY 16 2 Group Revenues by Core Application Assisted

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic

More information

Application Alley. Automated Test Equipment - Reed Relays. Pulsed High Current Testing Applications use Reed Relays PARTNER SOLVE DELIVER

Application Alley. Automated Test Equipment - Reed Relays. Pulsed High Current Testing Applications use Reed Relays PARTNER SOLVE DELIVER PARTNER SOLVE DELIVER Automated Test Equipment - Reed Relays Introduction When Test Equipment and Automatic Test Equipment (ATE) systems are used to test discrete semiconductors they often require a switching

More information

COMMERCIAL PORTABLE CRIMP TOOLING

COMMERCIAL PORTABLE CRIMP TOOLING COMMERCIAL PORTABLE CRIMP TOOLING A FLEXIBLE APPROACH TO PORTABLE CRIMPING INTRODUCTION TO TOOLING SOLUTIONS TE Connectivity. A Leader in Crimp Quality. Anyone can make a tool to crimp terminals onto a

More information

LED Driving Technology for Long Term Flexibility Application Note

LED Driving Technology for Long Term Flexibility Application Note LED Driving Technology for Long Term Flexibility Application Note Abstract In order to guarantee constant brightness for LED illumination systems with long product cycle times, the availability of LEDs

More information

LM338T LM338T 5A POSITIVE VARIABLE REG (RC) LM338K LM338K 5A VARIABLE VOLTAGE REGULATOR RC

LM338T LM338T 5A POSITIVE VARIABLE REG (RC) LM338K LM338K 5A VARIABLE VOLTAGE REGULATOR RC DATA SHEET Variable voltage regulators Order code Manufacturer code Description 47-3322 LM338T LM338T 5A POSITIVE VARIABLE REG (RC) 47-3324 LM338K LM338K 5A VARIABLE VOLTAGE REGULATOR RC Variable voltage

More information

Keysight TC GHz Frequency Doubler

Keysight TC GHz Frequency Doubler Keysight TC221 50 GHz Frequency Doubler 1GC1-8038 Data Sheet Features Conversion Efficiency: 12 db Typical 1/2 and 3/2 spurs: 15 dbc Typical Broad Bandwidth, 20 50 GHz Output Frequency Introduction The

More information

» Facing the Smart Future «Big Data

» Facing the Smart Future «Big Data » Facing the Smart Future «Big Data Smart Products, Production Processes and Services Call for Partners: Consortium Project Our Expert Network: Smart Products, Production Processes and Services Motivation

More information

The Advantages of Integrated MEMS to Enable the Internet of Moving Things

The Advantages of Integrated MEMS to Enable the Internet of Moving Things The Advantages of Integrated MEMS to Enable the Internet of Moving Things January 2018 The availability of contextual information regarding motion is transforming several consumer device applications.

More information

Ricoh Industrial Ink Jet Technology

Ricoh Industrial Ink Jet Technology Ricoh Industrial Ink Jet Technology Ink Jet Business Division EMEA IMI Barcelona, November 2014 Presentation Outline HISTORY & ORGANIZATION SOLUTIONS TECHNOLOGY Who is Ricoh? Founded in 1936 108,000+ Employees

More information

AN1387 APPLICATION NOTE APPLICATION OF A NEW MONOLITHIC SMART IGBT IN DC MOTOR CONTROL FOR HOME APPLIANCES

AN1387 APPLICATION NOTE APPLICATION OF A NEW MONOLITHIC SMART IGBT IN DC MOTOR CONTROL FOR HOME APPLIANCES AN1387 APPLICATION NOTE APPLICATION OF A NEW MONOLITHIC SMART IGBT IN DC MOTOR CONTROL FOR HOME APPLIANCES A. Alessandria - L. Fragapane - S. Musumeci 1. ABSTRACT This application notes aims to outline

More information

Metal additive manufacturing for industrial applications. Global network of solutions centres. Applications expertise for a wide range of industries

Metal additive manufacturing for industrial applications. Global network of solutions centres. Applications expertise for a wide range of industries Brochure: Renishaw Solutions Centres for additive manufacturing Your partner for innovative manufacturing Metal additive manufacturing for industrial applications Global network of solutions centres Applications

More information

Triple i - The key to your success

Triple i - The key to your success Triple i - The key to your success The needs and challenges of today s world are becoming ever more demanding. Standards are constantly rising. Creativity, reliability and high performance are basic prerequisites

More information

The Future of Packaging ~ Advanced System Integration

The Future of Packaging ~ Advanced System Integration The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product

More information

Deep drawing in small series. Creating value through smart engineering

Deep drawing in small series. Creating value through smart engineering Deep drawing in small series Creating value through smart engineering Company profile Phoenix 3D Metaal specialises in 3D sheet metal forming in small series in Ferro and non-ferro metals. The company

More information