Applications and opportunities of AM in Diebond equipment
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1 2018, March 22 Applications and opportunities of AM in Diebond equipment Patrick Houben Ralph Huijbers
2 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 2 nexperia.com
3 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 3 nexperia.com
4 Introducing Nexperia is a dedicated global leader in Discretes, Logic and MOSFETs devices. We became independent at the beginning of nexperia.com
5 A new force in Discretes, Logic & MOSFETs With a long history, broad experience and a global customer base. Key Facts A dedicated company for Discretes, Logic and MOSFETs with leadership positions in all product areas Over 1.1 billion US$ revenues (2016) More than 12% market share High volume production of 85 billion units annually 11,000 Employees supporting customers globally 2 own frontend, 3 own backend manufacturing sites Over 60 years of expertise in semiconductors, the former Standard Products division of NXP Headquarters in Nijmegen, The Netherlands CEO: Frans Scheper, heading a successful and established leadership team 5 nexperia.com
6 1-stop-shop for Discretes, Logic and MOSFETs Broad portfolio for standard functions and state-of-the art applications More than 10,000 active types Diodes & transistors Logic devices ESD Protection MOSFETs General purpose diodes and transistors Resistor-equipped transistors (RETs) Low V CEsat, medium & high power transistors Zener, Schottky and switching diodes Low V F Schottky and PN rectifier Automotive logic Buffers, drivers, transceivers Counters / frequency dividers Flip-flops, latches, registers Gates Logic voltage translators Specialty Logic Switches, (de)multiplexers ESD protection devices with standard and low capacitance for high-speed interfaces Surge protection (TVS) devices Common Mode & EMI filters Application-specific ESD solutions Automotive MOSFETs Low R DSon Trench MOSFETs from 12 V to 200 V N/P-channel MOSFETs ESD protected types 6 nexperia.com
7 Our manufacturing footprint Vertically integrated Manchester Nijmegen* Hamburg Guangdong Cabuyao Serembam 5 owned front and back end factories Very high degree of automation in backend factories Own specialized equipment designer Highly efficient supply chain and secure capacity Headquarter Nijmegen The Netherlands Front End Hamburg, Germany Manchester, UK Back End Guangdong, China Cabuyao, Philippines Seremban Malaysia 12 nexperia.com
8 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 8 nexperia.com
9 Industrial Technology Engineering Center (ITEC) Deliver breakthroughs in Back-end Semiconductors OEM solution provider in Assembly and Test equipment ITEC Smart Shop Floor infrastructure connects tools Benchmark for High-Volume Low-Diversity markets Highest capacity for investment, top Quality & Yield. Value proposition Enable businesses by tailored solutions Gain markets, keep markets by fast volume ramp-up and Lowest Total Cost of Ownership Exploit synergy with Package and Test innovation
10 ITEC Brief ITEC established in employees with service and supply in Asia and development in Europe Installed base >2300 systems providing 60-70Bpc products/ year Hong Kong office Netherlands office
11 ITEC benchmark solutions For Best in Class semiconductor manufacturing Lowest Integral Cost ADAT3 Assembly Platform Parset Test platforms Inspection Platforms Smart Manufacturing Lowest Cost of Ownership Process Portability Thinner wafers Flip Chip iso wires Placement accuracy 360º optical inspections Predictive Maintenance Versatility/ flexibility Lowest Cost of Ownership Multi-site testing Higher pincount Integrated digital / analogue functions Test Platform consolidation/ wide Test coverage Lowest Cost of Ownership Higher Resolving power 3D imaging Infrared inspections Integration in IT infrastructure for traceability Full die level traceability Big Data analytics Data fusion Autonomous loops/ Machine learning Leading in high volume Small Die Pick & Place Benchmark in Analogue Testing of Small Signal to Power MOS devices Best-In-Class Mold Defect and In-Tape Inspections Leading in Industry 4.0 for mass production 11 nexperia.com
12 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 12 nexperia.com
13 Die Bonder (ADAT3) Pick and place machine One platform, diverse applications High speed High accuracy ADAT3 Pick from wafer Place in tape Place on leadframe And many more applications
14 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 14 nexperia.com
15 Bondhead assembly pick and place end-affector 14 parts Interface Z move Pick and place nozzle Parallel leafspring guiding 2
16 Cooporation with Fontys Centre of Expertise And Objexlab Assignment : Is it possible to manufacture a monolithic bondhead including thin flexures using additive manufacturing? (Maintaning existing specifications) Student: Marco Teeuwen
17 Additive manufacturing Adding layers of material Selective Laser Melting (SLM)
18 Test models Fontys Objexlab Stainless Steel Print jobs stopped Support structures Straight flexures before removing Support structures removing problematic
19 Test models Supplier X 2x Titanium and 1x Stainless Steel Broken leaf springs Bended leaf springs Problems occure at removing support structures
20 Test models 3D Systems 4x Titanium Leaf spring 1x Titanium Cross flexure Straight flexures Edges in the reinforced sections 45
21 Topology optimization with Altair HyperWorks
22 Costs (%) Costs Costs per model in Titanium Serie size (pieces)
23 Final design 14 parts -> 1 part
24 Final design Printed at supplier X
25 7 Final design Printed at 3D Systems
26 Leafspring thickness Printed at 3D Systems Bondhead 1 Average: Min: Max: Delta: Bondhead 2 Average: Min: Max: Delta: mm mm mm mm (= +/- 12 um) mm mm mm mm (= +/- 10 um) - Nominal thickness of 0.2 mm possible - Tolerance +/ um - At Objexlab we printed a nomical thickness of 0.25 mm
27 Costs comparison Conventional (serie 8) = 100% Printed (serie 2) = 80 % Excluding: - Vacuum pipet (exchange part) - Some conventional postprocessing still needed 27 nexperia.com
28 Conclusions Is it possible to manufacture a monolithic bond head including thin flexures using additive manufacturing? Yes! 0.20 mm printing should be possible in Titanium and Stainless Steel Print tolerance ± ± mm Printing of thin structures standing will give the best results Leafsprings at 45 (no support structure needed)
29 Next assignment Perform a life (fatigue) test Investigate the effects of a treatment after printing Implement into machine Check on dynamics performance
30 Content Nexperia introduction Department ITEC Pick and place machine (ADAT3) AM example 1 : Bondhead Conclusion and ITEC roadmap 30 nexperia.com
31 ITEC roadmap in Additive Manufacturing Examples AM parts to validate accessibility of design AM support structures AM cyclone housing for removal rejected dies 31 nexperia.com
32 ITEC roadmap in Additive Manufacturing Examples AM ring light housing 32 nexperia.com
33 Impact on TCOO ITEC roadmap in Additive Manufacturing AM Bond head AM of high accuracy parts (tolerances < 0.05 mm) AM of Optics supports AM of vacuum suction parts AM of type parts AM of type parts by customer Use AM to validate designs AM support structures Gained basic knowledge Additive Manufacturing Participate in the SAMOII project = Running Cooporation with Fontys Centre of Expertise = To be investigated
34
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