Hebei I.T. (Shanghai) Co., Ltd. Technical Data Sheet Lamp View LED

Transcription

1 Customer: PN: 3751XG2D-S For: IF=20mA Contents 1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6. Ranks Combination 7.Soldering conditions 8.Typical electro-optical characteristics curves 9.Reliability 10.Cautions 11.Notes Customer confirm Approved by Checked by Issued by Rev.:1 Page 1 of 8

2 Part No. 3751XG2D-S Emitted Color Green Face Color Green Diffused Chip Material InGaN/GaN Viewing Angle 105/55 Features: Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption This product doesn t contain restriction Substance, comply ROHS standard. Applications: Automotive and Telecommunication Flat backlight for LCD,switch and symbol in telephone and fax General use for indicators Package Dimensions: ± 0.5 ANODE CATHODE 1.50max Note: 1.All dimensions in mm tolerance is ±0.2mm unless otherwise noted. 2. An epoxy meniscus may extend about 1.5mm down the leads. 3.Burr around bottom of epoxy may be 0.5mm max. Rev.:1 Page 2 of 8

3 Absolute Maximum Rating (Ta=25 ) Parameter Symbol Max. Unit Power Dissipation P M 100 Mw Pulse Forward Current I FP 100 ma DC Forward Current I F 30 ma Reverse Voltage V R 5 V Operating Temperature Range Topr -30 ~85 Storage Temperature Range Tstg -40 ~100 * I FP condition: pulse width 0.1ms,duty cycle 1/10 Electrical Optical Characteristics(Ta=25 ) Parameter Symbol Min Typ. Max. Unit Test Condition Luminous Intensity I V mcd I F =20mA Dominant wavelength λd nm I F =20mA Forward Voltage VF V I F =20mA Reverse Current IR ua V R =5V Viewing Angle 2θ 1/ /55 -- Deg. I F =20mA Ranks Combination (IF = 20mA) Rank WD(nm) Rank IV Rank VF(v) Notes: 1.Tolerance of Luminous Intensity±15%. 2.Tolerance of Dominant wavelength ±1nm. 3.Tolerance of Forward Voltage±0.05V. 4.Optical characteristic is measured by HB s equipment. Rev.:1 Page 3 of 8

4 Soldering Conditions (Maximum allowable soldering conditions) lead-free solder mode Hand soldering DIP soldering fixed form 1. Soldering time : 3 sec MAX. 2. Distance : 3 mm MIN (from solder joint to case) 1. Preheat temp : 100 C MAX, 60 sec MAX. 2. Bath temp : 265 C MAX. 3. Bath time : 3 sec MAX. 4. Distance : 3 mm MIN (From solder joint to case) 5. decrease temperature externally and compulsorily after dip soldering) Rev.:1 Page 4 of 8

5 Typical Electro-Optical Characteristics Curves: 100 If (ma) 5.0 Iv Fig.1 Forward Current vs. Forward Voltage Vf (v) If (ma) Fig.2 Relative Luminous Intensity vs. Forward Current Half Wide= 35nm 1.0 Iv Domi WL=525nm 2.0 Iv Fig.3 Relative Luminous Intensity vs. Wavelength WL(nm) 0.1 Ta ( ) Fig.4 Relative Luminous Intensity vs.ambient Temperature Y-Y 50 If (ma) IV X-X Y-Y X-X % % 10 0 Ta ( ) 0% Fig.6 Relative Luminous Intensity vs. Radiation Angle Fig.5 Maximum Forward Current vs.ambient Temperature Rev.:1 Page 5 of 8

6 Reliability (1)Test Items and Conditions Test Item Standard Test Method Test Conditions Note Number of Damaged Reflow Soldering Tsld=260,3 sec (pre treatment 30,70%,168hrs) 2 time 0/100 High Temperature Storage Low Temperature Storage T A = Hrs 0/100 T A = Hrs 0/100 Temperature Humidity Storage JEITA ED T A =60, RH=90%RH 1000 Hrs 0/100 Thermal Shock Test ~ min 15 min 100 Cycles 0/100 Temperature Cycling Test ~25 ~100 ~25 30min 5min 30min 5min 100 Cycles 0/100 Operating Life Test T A =25 I F =20mA 1000 Hrs 0/100 (2)Criteria of judging the damage Item Symbol Test Conditions Criteria for Judgment Min. Max. Forward Voltage V F I F =20 ma --- Initial Data 1.1 Luminous Intensity I V I F =20 ma Initial Data Reverse Current I R V R = 5V --- 2μA Wave length λd/λp IF=Test Current / Initial Data±2nm Appearance / View check No mechanical damage Rev.:1 Page 6 of 8

7 Cautions 1 Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2 Storage Before opening the package a. Avoid the absorption of moisture, we recommended to store the LEDs in a dry box(or desiccator) with a desiccant. Otherwise, store them in the following environment: Temperature : 5 ~30,Humidity : 60%max. b. The products should be used in 3 months. It is recommended that the LEDs be used as soon as possible. After opening the package a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction -sealing -Temperature : 5 ~ 30,Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, Components should be dried for 10-12hr at 60±5 3 Lead Forming When the lead forming is required before soldering, care must be taken to avoid any bending and mechanical stress. The stress to the base may damage the LEDs. When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly aligned with the leads of the LEDs. It is recommended that tooling made to precisely form and cut the leads to length rather than rely on hand operating. 4 The LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. 5 Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. 6 Static Electricity 6.1 These products are sensitive to static electricity charge, and users are required to handle with care. Particularly, if an current and or voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in electrical destruction of, the Products. The customer is requested to take adequate countermeasures against static electricity charge and surge when handling Products. 6.2 Proper grounding of Products, use of conductive mat, conductive working uniform and shoes, and conductive containers are effective against static electricity and surge. Rev.:1 Page 7 of 8

8 6.3 Ground low-resistance areas where the product contacts, such as metal surfaces of the work platform, with a conductive mat (surface resistance Ω ). 6.4 A tip of soldering iron is requested to be grounded. An ionizer should also be installed where risk of static generation is high. 7 Circuit Protection Below the zener reference voltage V Z, all the current flows through LED and as the voltage rises to V Z, the zener diode breakdown. If the voltage tries to rise above V Z current flows through the zener branch to keep the voltage at exactly V Z. When the LED is connected using serial circuit, if either piece of LED is no light up but current can not flow through causing others to light down. In new design, the LED is parallel with zener diode, if either piece of LED is no light up but current can flow through causing others to light up. Notes: 1 Above specification may be changed without notice. We will reserve authority on material change for above specification. 2 When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets. Rev.:1 Page 8 of 8