CPC1333. Single-Pole Normally Closed OptoMOS Relay INTEGRATED CIRCUITS DIVISION

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1 Single-Pole Normally Closed OptoMOS Relay Parameters Ratings Units Peak Blocking Voltage 3 V P Load Current 3 ma rms / ma DC On-Resistance (max) 3 Isolation Voltage, Input to Output V rms Features V rms Input/Output Isolation 3V P Blocking Voltage Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Description The G is a single-pole, normally closed (-Form-B) Solid State Relay with an enhanced input to output isolation barrier of V rms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Approvals UL Recognized Component: File E7627 EN/IEC 69- Certified Component: TUV Certificate B Applications Telephony Switching Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Security Aerospace Industrial Controls Ordering Information Part Number Description G 4-Pin DIP (/Tube) GR 4-Pin Surface Mount (/Tube) GRTR 4-Pin Surface Mount (/Reel) Pin Configuration + Control 4 Load 2 Control 3 Load Switching Characteristics of Normally Closed Devices Form-B I LOAD % 9% t on t off DS--R3

2 Absolute Maximum 2ºC Parameter Ratings Units Peak Blocking Voltage 3 V P Reverse Input Voltage V Input Control Current ma Peak (ms) A Input Power Dissipation mw Total Package Dissipation 2 mw Isolation Voltage, Input to Output V rms ESD Rating, Human Body Model 8 kv Operational Temperature -4 to +8 ºC Storage Temperature -4 to +2 ºC Derate linearly.33mw / ºC 2 Derate linearly 3mW / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical 2ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous - I L ma rms / ma DC Peak t=ms I LPK - - ±3 ma P On-Resistance I L =3mA R ON Off-State Leakage Current =2mA, V L =3V I LEAK - - A Switching Speeds Turn-On t =ma, V L =V on Turn-Off t off ms Output Capacitance =2mA, V L =V, f=mhz C OUT pf Input Characteristics Input Control Current to Activate ma Input Control Current to Deactivate I L =3mA. - - ma Input Voltage Drop =ma V F V Reverse Input Current V R =V I R - - A Common Characteristics Capacitance, Input to Output V IO =V, f=mhz C I/O pf Measurement taken within one second of on-time. 2 For high temperature operation (> 6ºC), IXYS Integrated Circuits Division recommends a minimum LED drive current of ma. Timing Diagram G Isolation Test Circuit I L ma ma t on % t off 9% kV rms Test Conditions: Voltage Ramp: 2V/ s Test Time: 2 Seconds I LEAK Threshold: A Test Voltage: 6kV rms 2 R3

3 PERFORMANCE (Unless Otherwise Noted)* 2 Typical LED Forward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =ma, I L =6mA) 2 Typical Turn-Off Time (N=, =ma, I L =6mA) LED Forward Voltage (V) Turn-On Time (ms) Turn-Off Time (ms) 2 Typical for Switch Operation (N=, I L =3mA) 2 Typical On-Resistance Distribution (N=, =ma, I L =3mA) 2 Typical Blocking Voltage Distribution (N=, =2mA) On-Resistance ( ) Blocking Voltage (V P ) LED Forward Voltage (V).6..4 Typical LED Forward Voltage Drop.3.2 =ma =2mA =ma. =ma =2mA Turn-On Time ( s) Typical Turn-On Time vs. LED Forward Current =6mA) Turn-Off Time ( s) Typical Turn-Off Time vs. LED Forward Current =6mA) Typical for Switch Operation =6mA) 6 Typical Turn-On Time =6mA) 2 Typical Turn-Off Time =6mA)... Turn-On Time ( s) =ma =ma =2mA Turn-Off Time ( s) 2 =2mA =ma =ma * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R3 3

4 PERFORMANCE (Unless Otherwise Noted)* 4 Typical On-Resistance ( =ma, I L =6mA). Typical Load Current vs. Load Voltage ( =ma) Maximum Load Current ( =ma) On-Resistance ( ) Load Current (A) Load Current (ma) Load Voltage (V) Blocking Voltage (V P ) Typical Blocking Voltage Leakage (na) Typical Leakage Measured Between Pins 3 & 4 ( =2mA, V L =3V) Output Capacitance (pf) Output Capacitance vs. Load Voltage ( =2mA, f=mhz). Load Voltage (V). Energy Rating Curve Load Current (A) s s ms ms ms s s s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 4 R3

5 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. ESD Sensitivity Device Moisture Sensitivity Level (MSL) Rating G MSL GR MSL 3 This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be above (T C - )ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the GR, the solder reflow profile given in Technical Brief TB-2 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, G, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Maximum Body Temperature (T c ) Time GR 2ºC seconds IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R3

6 Mechanical Dimensions G.99 (.39) 3.3 ±. (.3 ±.2).24 (.) PC Board Pattern (Top View) DIA. (6 -.3 DIA.) 2.4 ±.27 (. ±.) 6.3 ±.27 (.2 ±.) 7.62 ±.27 (.3 ±.) 4.72 ±.27 (.8 ±.) 9º (ALL).47 ±.76 (.8 ±.3) 2.4 ±.27 (. ±.) PIN 2.9 (.8).8 (.2) 3.7 (.2) 9º (ALL) 9.44 ±.8 (.36 ±.2) 7.62 ±.2 (.3 ±.) 6.3 ±.27 (.2 ±.) Dimensions mm (inches) GR 2.4 ±.27 (. ±.) 3.3 ±. (.3 ±.2) PCB Land Pattern.63 ±.24 (.2 ±.) (.9) 6.3 ±.27 (.2 ±.) 9.2 (.37) 7.62 ±.24 (.3 ±.) 8.8 (.346) 9º ± º (ALL) PIN #.99 (.39) 4.72 ±.27 (.8 ±.).24 (.) 3.48 ±.76 (.37 ±.3).6 (.63).9 (.37) 2.4 ±.27 (. ±.) ±.27 (.9 ±.).2 min /.24 max (.4 min /. max) Dimensions mm (inches) 6 R3

7 GRTR Tape & Reel 33.2 Dia (3. Dia) B =. Top Cover (.97) Tape Thickness.2 Max (.4 Max) K =4.2 (.6) K =3.7 (.46) A =. (.394) P=2. (.472) W=6.±.3 (.63±.2) Embossed Carrier Embossment Dimensions mm (inches) NOTES:. All dimensions meet EIA-48-C requirements 2. Unless otherwise noted, tolerances = ±. (.4) For additional information please visit our website at: IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS--R3 Copyright 26, IXYS Integrated Circuits Division All rights reserved. Printed in USA. /7/26

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