Common - Drain Dual N-Channel 30 V (S1-S2) MOSFET
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1 SiSFDN Common - Drain Dual N-Channel 3 V (S-S2) MOSFET 3.3 mm Top View PowerPAK 22-8SCD S S 8 S 2 7 S mm PRODUCT SUMMARY V SS2 (V) 3 R SS2(on) max. () at V GS = V.5 R SS2(on) max. () at V GS = 4.5 V.7 Q g typ. (nc) 6. h I SS2 (A) 6 a, g Configuration Dual ORDERING INFORMATION Package Lead (Pb)-free and halogen-free S 2 S Bottom View 2 G 3 D 4 D 2 G 2 FEATURES TrenchFET Gen IV power MOSFET Very low source-to-source on resistance Integrated common-drain n-channel MOSFETs in a compact and thermally enhanced package % R g and UIS tested Optimizes circuit layout for bi-directional current flow Material categorization: for definitions of compliance please see APPLICATIONS Battery management Load switching PowerPAK 22-8SCD SiSFDN-T-GE3 G N-Channel MOSFET N-Channel 2 MOSFET G 2 S S 2 ABSOLUTE MAXIMUM RATINGS (T A = 25 C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V SS2 3 V Gate-source voltage V GS +2 / -6 T C = 25 C 6 a T C = 7 C 6 Continuous drain current (T J = 5 C) I a SS2 T A = 25 C 25.5 b, c A T A = 7 C 2.4 b, c Pulsed drain current (t = μs) I SS2M 2 T C = 25 C 69.4 T C = 7 C 44.4 Maximum power dissipation P SS2 W T A = 25 C 5.2 b, c T A = 7 C 3.3 b, c Operating junction and storage temperature range T J, T stg -55 to +5 C Soldering recommendations (peak temperature) c 26 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT Maximum junction-to-ambient b t s R thja 9 24 C/W Maximum junction-to-case (drain) Steady state R thjc.4.8 Notes a. Package limited b. Surface mounted on " x " FR4 board c. t = s d. See solder profile ( The PowerPAK 22-8SCD is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components f. Maximum under steady state conditions is 63 C/W g. T C = 25 C h. Single MOSFET S8-22-Rev. A, 9-Feb-8 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
2 SiSFDN SPECIFICATIONS (T J = 25 C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-source breakdown voltage V DS V GS = V, I D = 25 μa Gate-source threshold voltage V GS(th) V SS2 = V GS, I D = 25 μa - 2. V Gate-source leakage I GSS V SS2 = V, V GS = +2 / -6 V - - na V SS2 = 3 V, V GS = V - - Zero gate voltage drain current I DSS V SS2 = 3 V, V GS = V, T J = 7 C μa On-state drain current a I SS2(on) V SS2 V, V GS = V A Drain-source on-state resistance a V GS = V, I SS2 = A R SS2(on) V GS = 4.5 V, I SS2 = 5 A Forward transconductance a g fs V SS2 = 5 V, I SS2 = 2 A S Dynamic b, c Input capacitance C iss Output capacitance C oss V DS = 5 V, V GS = V, f = MHz pf Reverse transfer capacitance C rss V DS = 5 V, V GS = V, I D = A Total gate charge Q g nc Gate-source charge Q gs V DS = 5 V, V GS = 4.5 V, I D = A Gate-drain charge Q gd Gate resistance R g f = MHz Turn-on delay time t d(on) - 2 Rise time t r V DD = 5 V, R L =, I SS2 A, Turn-off delay time t d(off) V GEN = V, R g = Fall time t f - 2 Turn-on delay time t d(on) ns Rise time t r V DD = 5 V, R L =, I D A, Turn-off delay time t d(off) V GEN = 4.5 V, R g = Fall time t f Drain-Source Body Diode Characteristics c Continuous source-drain diode current I SS2 T C = 25 C Pulse diode forward current I SS2M A Body diode reverse recovery time t rr ns Body diode reverse recovery charge Q rr nc I F = A, di/dt = A/μs, T J = 25 C Reverse recovery fall time t a ns Reverse recovery rise time t b Notes a. Pulse test; pulse width 3 μs, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. On single MOSFET Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S8-22-Rev. A, 9-Feb-8 2 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
3 SiSFDN 2 V GS = V thru 4 V 2 I SS2 - Drain Current (A) V GS = 3 V V SS2 - Drain-to-Source Voltage (V) I SS2 - Drain Current (A) T C = 25 C T C = 25 C T C =-55 C V GS - Gate-to-Source Voltage (V) Output Characteristics Transfer Characteristics.8 35 Note: Axis for one Titlechannel only R SS2(on) - On-Resistance (Ω) V GS = 4.5 V V GS = V C - Capacitance (pf) C rss C oss C iss I SS2 - Drain Current (A) V DS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current and Gate Voltage Capacitance V GS - Gate-to-Source Voltage (V) I D = A Note: for Axis one Title channel only V DS = 7.5 V V DS = 5 V V DS = 24 V Q g - Total Gate Charge (nc) R SS2(on) - On-Resistance (Normalized) I D = A V GS = V V GS = 4.5 V T J - Junction Temperature ( C) Gate Charge On-Resistance vs. Junction Temperature S8-22-Rev. A, 9-Feb-8 3 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
4 SiSFDN 2. T J = 5 C.8 I FSS2 - Source Current (A) T J = 25 C V GS(th) (V) I D = 25 μa V FSS2 - Source-to-Drain Voltage (V) Source-Drain Diode Forward Voltage T J - Temperature ( C) Threshold Voltage I D = A R SS2(on) - On-Resistance (Ω) T J = 25 C T J = 25 C Power (W) V GS - Gate-to-Source Voltage (V)... Time (s) On-Resistance vs. Gate-to-Source Voltage Single Pulse Power, Junction-to-Ambient I SS2(ON) Limited Limited by R SS2(on) () I SS2M Limited I SS2 - Drain Current (A) μs ms ms ms s. T A = 25 C s Single pulse BV DSS2 Limited DC... V SS2 - Drain-to-Source Voltage (V) () V GS > minimum V GS at which R DS(on) is specified Safe Operating Area, Junction-to-Ambient S8-22-Rev. A, 9-Feb-8 4 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
5 SiSFDN 2 8 I SS2 - Drain Current (A) Package limited Power (W) T C - Case Temperature ( C) T C - Case Temperature ( C) Current Derating a Power, Junction-to-Case (Drain) Note a. The power dissipation P D is based on T J max. = 5 C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit Duty Cycle =.5 Normalized Effective Transient Thermal Impedance Single pulse..... Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient S8-22-Rev. A, 9-Feb-8 5 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
6 SiSFDN Normalized Effective Transient Thermal Impedance Duty Cycle = Single pulse..... Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case (Drain) maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and reliability data, see S8-22-Rev. A, 9-Feb-8 6 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
7 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 27 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 8-Feb-7 Document Number: 9
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