Presettable Up/Down Counter High-Voltage Silicon-Gate CMOS

Transcription

1 TECNICA DATA IW029B Presettable Up/Down Counter igh-voltage Silicon-Gate CMOS The IW029B coists of a four-stage binary or BCD-decade up/down counter with provisio for look-ahead carry in both counting modes. The inputs coists of a single COCK, CARRY IN,(COCK ENABE), BINARY/DECADE, UP/DOWN, PRESET ENABE, and four individual JAM signals. Q1, Q2, Q3, Q and a CARRY OUT signal are provided as outputs. A high PRESET ENABE signal allows information on the JAM INPUTS to preset the counter to any state asynchronously with the clock. A low on each JAM line, when the PRESET-ENABE signal is high, resets the counter to its zero count. The counter is advanced one count at the positive traition of the clock when the CARRY IN and PRESET ENABE signals are low. Advancement is inhibited when the CARRY IN or PRESET ENABE signals are high. The CARRY OUT signal is normally high and goes low when the counter reaches its maximum count in the UP mode or the minimum count in the DOWN mode provided the CARRY IN signal is low. The CARRY IN signal in the low state can thus be coidered a COCK ENABE. The CARRY IN terminal must be connected to GND when not in use. Binary counting is accomplished when the BINARY/DECADE input is high; the counter counts in the decade mode when the BINARY/DECADE input is low. The counter counts up when the UP/DOWN input is high, and down when the UP/DOWN input is low. Parallel clocking provides synchronous control and hence faster respoe from all counting outputs. Ripple-clocking allows for longer clock input rise and fall times. Operating Voltage Range: 3.0 to 18 V Maximum input current of 1 μa at 18 V over full packagetemperature range; 0 na at 18 V and 25 C Noise margin (over full package temperature range): 1.0 V V supply 2.0 V V supply 2.5 V V supply OGIC DIAGRAM ORDERING INFORMATION IW029BN Plastic IW029BD SOIC T A = -55 to 125 C for all packages PIN ASSIGNMENT PIN 16=V CC PIN 8= GND

2 MAXIMUM RATINGS * Symbol Parameter Value Unit V CC DC Supply Voltage (Referenced to GND) -0.5 to +20 V V IN DC Input Voltage (Referenced to GND) -0.5 to V CC +0.5 V V OUT DC Output Voltage (Referenced to GND) -0.5 to V CC +0.5 V I IN DC Input Current, per Pin ± ma P D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ P D Power Dissipation per Output Traistor 0 mw Tstg Storage Temperature -65 to +0 C T ead Temperature, 1 mm from Case for Seconds (Plastic DIP or SOIC Package) 2 C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditio. +Derating - Plastic DIP: - mw/ C from 65 to 125 C SOIC Package: : - 7 mw/ C from 65 to 125 C 7 0 mw RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V CC DC Supply Voltage (Referenced to GND) V V IN, V OUT DC Input Voltage, Output Voltage (Referenced to GND) 0 V CC V T A Operating Temperature, All Package Types C This device contai protection circuitry to guard agait damage due to high static voltages or electric fields. owever, precautio must be taken to avoid applicatio of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V IN and V OUT should be cotrained to the range GND (V IN or V OUT ) V CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open.

3 DC EECTRICA CARACTERISTICS(Voltages Referenced to GND) V CC Guaranteed imit Symbol Parameter Test Conditio V -55 C 25 C 125 C V I Minimum igh-evel Input Voltage V I Maximum ow - evel Input Voltage V O V O I IN I CC I O I O Minimum igh-evel Output Voltage Maximum ow-evel Output Voltage Maximum Input eakage Current Maximum Quiescent Supply Current (per Package) Minimum Output ow (Sink) Current Minimum Output igh (Source) Current V OUT = 0.5 V or V CC - 0.5V V OUT = 1.0 V or V CC V V OUT = 1.5 V or V CC - 1.5V V OUT = 0.5 V or V CC - 0.5V V OUT = 1.0 V or V CC V V OUT = 1.5 V or V CC - 1.5V V IN =GND or V CC V IN =GND or V CC Unit V IN = GND or V CC 18 ±0.1 ±0.1 ±1.0 μa V IN = GND or V CC 20 V IN = GND or V CC U O =0. V U O =0.5 V U O =1.5 V V IN = GND or V CC U O =2.5 V U O =.6 V U O =9.5 V U O =13.5 V V V V V μa ma ma

4 AC EECTRICA CARACTERISTICS (C =pf, R =kω, Input t r =t f =20 ) V CC Guaranteed imit Symbol Parameter V -55 C 25 C 125 C Unit t max Maximum Clock Frequency t P, t P t P, t P t P, t P t P, t P t P, t P t T, t T Maximum Propagation Delay, Clock to Q Maximum Propagation Delay, Clock to Carry Output Maximum Propagation Delay, Preset Enable to Q Maximum Propagation Delay, Preset Enable to Carry Output Maximum Propagation Delay, Carry Input to Carry Output Maximum Output Traition Time, Any Output C IN Maximum Input Capacitance pf Mz FUNCTION TABE CONTRO INPUT OGIC EVE ACTION BIN/DEC (B/D) UP/DOWN (U/D) PRESET ENABE (PE) CARRY IN (CI) (COCK ENABE) BINARY COUNT DECADE COUNT UP COUNT DOWN COUNT JAM IN NO JAM NO COUNTER ADVANCE AT POS. COCK TRANSITION ADVANCE COUNTER AT POS. COCK TRANSITION

5 TIMING REQUIREMENTS (C =pf, R = kω, Input t r =t f =20 ) * V CC Guaranteed imit Symbol Parameter V -55 C 25 C 125 C Unit t w Minimum Pulse Width, Clock t w t su * t rem * t h ** t su t r, t f ** Minimum Pulse Width, Preset Enable Minimum Setup Time, Clock to B/D or U/D Minimum Removal Time, Preset Enable (Figure 1) Minimum old Time, Clock to Carry In (Figure 2) Minimum Setup Time, Carry In to Clock Maximum Input Rise and Fall Times,Clock (Figure 2) From Up/Down, Binary/Decode, Carry In, or Preset Enable Control Inputs to Clock Edge. ** From Carry In to Clock Edge μs

6 Figure 1. Switching Waveforms Figure 2. Switching Waveforms

7 TIMING DIAGRAM; binary mode; J1=IG; J2=OW; BIN/DEC=IG TIMING DIAGRAM; decade mode; J1=OW; J=OW; BIN/DEC=OW

8 EXPANDED OGIC DIAGRAM TRUT TABE COCK TE PE J Q Q X X X Q Q X X X Q Q NC X X Q Q NC

9 N SUFFIX PASTIC (MS - 001BB) A 16 1 G F 0.25 (0.0) M T 9 8 D N B C -T- K SEATING PANE NOTES: 1. imeio A, B do not include mold flash or protrusio. Maximum mold flash or protrusio 0.25 mm (0.0) per side. M J Dimeio, mm Symbol MIN MAX A B C 5.33 D F G J 0 K M N 0.38 D SUFFIX SOIC (MS - 012AC) 16 A 9 Dimeio, mm -T- 1 D G 0.25 (0.0) M T C M 8 B K P C SEATING PANE J R x 5 NOTES: 1.Dimeio A and B do not include mold flash or protrusion. 2.Maximum mold flash or protrusion 0. mm (0.006) per side for A, for B mm (0.0) per side. F M Symbol. MIN MAX A B C D F G J 0 8 K M P R