WIRELESS VIBRATION SENSOR FOR TUNNEL CONSTRUCTION
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- Myles Riley
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1 WIRELESS IBRATION SENSOR FOR TUNNEL CONSTRUCTION Soon-Wook Kwon Assisan Professor Dep. of Archiecural Engr. SungKyunKwan Universiy Suwon,Gyeonggido Jung-Yeol Kim Researcher Korea Insiue of Consrucion Technology Goyang, Korea, Hyun-Seok Yoo Researcher Korea Insiue of Consrucion Technology Goyang, Korea, Moon-Young Cho Senior Research Fellow Korea Insiue of Consrucion Technology Goyang, Korea, Absrac: During and afer unnel consrucion, many problems including civil peiions and consrucion delay resul from unnel deformaion, ground selemen, ground vibraion, and unnel lining crack. In relaion o unnel consrucion and mainenance, his sudy explains a developmen background of small wireless vibraion sensors and heir applicaions based on RF(Radio Frequency)-MEMS (Micro Elecro Mechanical Sysem) echnology. The advanages and usefulness of he wireless auomaic monioring sysem is addressed compared wih he convenional wired or survey measuremen sysems. Thus, he sudy provides a framework of he process for monioring, manipulaing, and ransferring daa from MEMS sensor and explains he applicaion of he new developed auomaic monioring sysem for unnel consrucion and mainenance. Keywords: Mems, Sensor Neworks, Srucural Healh Monioring 1. Inroducion Tunnel consrucion is gradually increasing due o he developmen and upgrade of infrasrucures in Korea where 70% of he naion is composed of mounain area, and he mainenance of unnel in operaion is also becoming more imporan due o he complex environmen change in viciniy of he exising unnel and he deerioraion of unnel srucure. A he same ime, public concerns have risen over unnel consrucion because of he effec of he unnel-induced many problems such as damage in nearby srucures and uiliies, vibraion, noise, and environmenal impac. Peck (R. B. Peck ) saed hree issues in unneling, which are firs, mainaining sabiliy and safey during consrucion, second, minimizing unfavorable impac on hird paries, and finally performing inended funcion over he life of a projec [1]. Terzaghi (K. Terzaghi) poined ou ha nearly all quesions raised during unnel design and consrucion may no be answered wihou field measuremens and ess[2]. And as many oher unnel engineers have been experienced, monioring is a key elemen o beer accomplish unnel consrucion and mainenance, and a sysemaic monioring plan should be carried ou for acquisiioning useful and reliable field measuremen daa. Monioring of unnel during consrucion includes he measuremen of ground displacemen and pore waer pressure in he viciniy of a unnel, he measuremen of sress and srain in unnel srucure, and he measuremen of he displacemen in adjacen srucures or uiliies along he unnel roue. Daa acquisiion obained from a sysemaic monioring plan plays many imporan roles in various aspecs[3][4]. The daa can be used o provide a guide of modificaion of consrucion mehods or procedures o complee unnel consrucion more safely and economically and o minimize he consrucion-induced hird pary impac. Besides ha he daa record may be used for he research purpose and he design of similar unnel consrucion in he fuure. For unnels consruced wih he blasing mehod, noise and vibraion could induce significan problems and heir effecs should be moniored. Monioring of unnel in operaion is relaed o he inspecion of he exising sae in a unnel. The consrucion aciviies such as new unnel or building consrucion in he viciniy of he exising unnel can significanly change he sress and srain sae in he exising unnel srucure, frequenly inducing unnel sabiliy and safey problems. In addiion, as ime goes on, a unnel srucure becomes deerioraed and he surrounding environmen can change physically or chemically. Thus, he exising unnel srucure could be in he condiion of insabiliy. Again, he monioring of unnel in operaion should also be kep on in a sysemaic monioring plan o have he exising unnel in beer qualiy and in case o provide he appropriae repair or reinforcemen measures. Monioring insrumens have been changed from he convenional devices such as he level survey o he auomaic devices using he elecric cables and sensors. The auomaic monioring sysems can provide more effecively he daa acquisiion in exensive area and coninuous real ime. However, up o dae, mos monioring of unnel is wire-based sysems for acquisiioning and ransferring he field daa. The wire-based sysems frequenly inerrup consrucion procedure, causing consrucion delays, and are expensive o insall and mainain he sysems during he measuremen period. In addiion, he wire-based sysems can only be applied for a limied area and he sysems become incapable if he wire is cu, which happens frequenly. To overcome hose disadvanages and limiaions of monioring sysems, he wireless-based monioring sysems, which are based on small wireless vibraion sensors and RF (Radio Frequency)-MEMS (MicroElecroMechanical Sysem), have been developed. This paper describes he background of he sysem developmen and he applicaions o unnel monioring and provides a framework of he -614-
2 process for monioring, manipulaing, and ransferring field daa using he new developed sysems. 2. MEMS-based vibraion sensor module 2.1 Developmen objecive Blasing has always been he mos prevalen and effecive means of desroying rocks. However, several problems arise from blasing, such as vibraion of he ground, scaering of rock fragmens and he long-lasing sound. In paricular, according o he Review of Noise and ibraion Tolerance Sandard of Blasing [5], low vibraion can lead o serious damage o livesock, including pigs and roe deer, as well as o he human body. The sandard for vibraion olerance suggesed by he Minisry of Environmen appears o be =0.09cm/sec (70dB), which canno be me when blasing is implemened in an urban area. Consequenly, civil peiions and lawsuis agains blasing ceaselessly ake place. Blasing vibraion is measured o obain daa ha can be uilized o undersand he vibraion around he blased area and he srucure in a consrucion sie and o elucidae he adverse impac of vibraion. In addiion, accurae blasing vibraion daa can be used o calculae he opimal blasing paern, as well as o yield he appropriae amoun of gunpowder o be loaded for a ime. A wide range of effors is being made o uilize he daa o validae is influence on he concree lining during unnel consrucion and o yield he safe disance from he area where concree is being pu. Thus, measuring he blasing vibraion is a very significan and fundamenal iem in unnel digging. Therefore, grea and far-reaching effecs are expeced from he developmen of a MEMS-based vibraion sensor wih simple insallaion o measure vibraion in a more convenien and less expensive way. The objecive of his research is o develop a MEMS-based wireless acceleraion sensor and implemen experimens o verify he possibiliy of replacing he funcions and performance of convenional blasing vibraion sensors. Furhermore, i also aims o easily and convenienly obain blasing vibraion daa by realizing a wireless sensor nework hrough MEMS sensors equipped wih a wireless RF module. 2.2 Problems of exising vibraion sensors Convenional vibraion sensors are composed as shown in Figs. 1 and 2 and are designed o simulaneously measure vibraion and noise. They may vary depending on ype, bu in general, i has 1 o 8 inpu channels so ha a variey of ypes of sensors for vibraion measuremen (acceleraion, velociy and ohers) can be conneced. A vibraion sensor module is comprised as a package consising of a sensor o measure vibraion and noise, a cable and a daa logger for daa analysis. In he invesigaion, an exper is required o operae a vibraion sensor module for blasing and one o wo sensors for vibraion measuremen can be aached o an insrumen. As for he experimenal blasing in a unnel, a vibraion sensor equipped wih wo sensors, one for vibraion and he oher for noise, is evaluaed for operaion in he cener of a securiy building. (When blasing a unnel, 4 o 5 vibraion sensors are needed and as many people are also required. The purchase price for a vibraion sensor module is KRW 8 o 10 million and he value of lease per monh is KRW 600,000 and 800,000). The problem wih convenional vibraion sensors is ha many people and many gauges are needed due o is consrain of only a maximum of one or wo sensors can be equipped even if vibraion needs o be measured a several poins. Therefore, when complicaed vibraions need o be measured a differen posiions, as many vibraion sensors as sensors mus be purchased, which is remendously expensive Figure 1. Composiion of a convenional vibraion sensor module Figure 2. Insalled shape of convenional vibraion sensor modules 3. Developmen of a prooype MEMS-based vibraion sensor module 3.1 Design and Manufacure of MEMs ibraion Sensor The acceleromeer is a capaciy-ype vibraion sensor ha can read changes in he sensing capaciance in accordance wih inpu acceleraion as shown in Figure The acceleromeer consiss of one ineria mass and four suppor beams. The sensing elecrodes are arranged a he righ and lef of he ineria mass and designed so ha he movemen direcion of he ineria mass is reverse o he direcion of he changes in he sensing capaciy. This is called he differenial capaciance sensing mehod, which -615-
3 has he advanage of increased lineariy in comparison wih he single capaciance sensing mehod. MEMS Accelero DC Power Funcion Excier Excier Charge Signal Figure 5. Composiion of Tes Equipmen 3.3 Resuls and analysis of he performance es Figure 3. Concepual map of a prooype MEMS sensor I was analyzed ha he deviaion in he oupu signal was no regular in comparison o he sensors currenly in use. The error rae was shown a 3% and 4% for #2 and #4, respecively as shown in Figure 6 and 7. The reasons were inerpreed o be he noise of he circui, non-homogeneiy during he manufacuring process, and non-homogeneiy of he propery of silicon, which was used as he MEMS elemen Figure 4. Signal processing of an acceleromeer ibraion sensor is manufacured using MEMS manufacuring echnology wih a semiconducor manufacuring process. The sensor was made hrough a oal of wo lihographic processes and a oal of hree eching processes. A hin gold film was formed on he SIO (Silicon On Insulaor) wafer, and hen he hin film became he gold pad ha would connec o he exernal signal processing circui hrough lihography and eching processes. The pad was changed ino a sensor-ype hrough lihography and eching processes, and finally, when he silicon dioxide film ha fixes he moving par of he sensor is removed in he las eching process, he vibraion sensor is compleed. The manufacured MEMS-based vibraion sensor is used by packaging wih a silicon DIP(dual in-line package). 3.2 Tes Mehods for he Mems Sensor In order o evaluae he performance of he manufacured sensor based on MEMS echnology and idenify improvemens, we conduced a precision es a he Korea Tesing Laboraory (KTL). The purpose of he es was o precisely analyze he vibraion measuremen capaciy of he MEMS-based vibraion sensor module. The es of he MEMS-based vibraion module was conduced by aaching he vibraion module o a vibraor as shown in Figure 5, which can provide sandard vibraion, and vibraing i up and down. A reference acceleromeer was also aached in order o compare he measured values. 0.3 ) 0.2 m ( e 0.1 g a l o u p u-0.2 O Frequency(Hz) Figure 6. Measuremen deviaion of he #2 sensor(m) ) 0.2 m ( e 0.1 g a l 0 o u p-0.2 u O Frequency (Hz) Figure 7. Measuremen deviaion of he #4 sensor(m) 3. Improvemen of elemens for he MEMS-based vibraion sensor s design and manufacure Based on he performance analysis and improvemens of he vibraion sensor developed during he firs year of research, we exered effors o improve he elemens for he MEMS sensor. The research was largely performed in wo ypes horizonal and verical. In paricular, he horizonal ype was improved from he ype sudied in he firs year. I is a -616-
4 mehod o deec changes in capaciance resuling from he gap beween elecrodes during he verical vibraion of a mass, which is shown in Fig. 8. he semiconducor manufacuring processes and i is possible o design and implemen differen ypes of elemens on a Wafer a a ime, so ha he horizonal and verical ypes are refleced in designing he wafer. Figure 8. Design improvemen for he horizonal ype (1 s ) The sensing elecrodes are arranged a he righ and lef of he ineria mass and designed so ha he movemen direcion of he ineria mass is reverse o he direcion of he changes in he sensing capaciy. This is called he differenial capaciance sensing mehod, which has he advanage of increased lineariy in comparison wih he single capaciance sensing mehod.. C g C l C r = g ε 0 A d 2 N 2 d 0 = k d m 2 Nε 0 A m = 2 d k o Eq.1 C : difference of capaciy of acceleromeer, g: approved acceleromeer, C l : capaciy of lef comb, C R : capaciy of righ comb, d 0 : iniial gab of comb, d : difference of comb gab, m: magniude of acceleromeer, k: rigidiy of spring in acceleromeer, ε 0 :a dielecric consan of air, A: area of overlap of comb In accordance wih he sensing principles of a vibraion sensor, he relaion beween inpu acceleraion and capaciance change is shown in Eq. 1. As shown in he equaion, sensiiviy is in proporion o he area of he comb and he mass of he inerial mass, while in inverse proporion o he gap beween he sensing elecrodes and he siffness of he suppor beam. The horizonal ype was designed in hree differen ypes depending on he acceleraion range and frequency, as shown in Table 1. A verical ype was newly developed during he second year of research. As shown in Fig. 9, i is a mehod of vibraion measuremen using he changes in capaciance when he sensing elecrodes aached in he same direcion o he vibraion of he mass is insered beween he fixed elecrodes. In he design, i was expeced ha he mass and he number of elecrode can be added enough o demonsrae he desired performance, and i is no longer necessary o design differen ypes like he horizonal ype. Therefore, i was designed as a single ype. In addiion, MEMS is one of Figure 9. Design improvemen for he verical ype (1 s ) nd design and manufacure The yield rae, he rae of complee producs obained from a wafer, was shown o be very low and he problem of durabiliy occurred in he form of an inner shor during operaion. The causes of he problem found wih he elemens manufacured during he firs year of research were analyzed o be as follows: 1 Gold powder accrues in he course of he laser-dicing process (he final process of cuing a sensor from a wafer) and causes conaminaion beween elecrodes. 2 The spring srucure of a sensor is easily broken in he wafer-handling process, bu i is no found during he microscope inspecion. 3 Abnormaliy of he ech profile during he deep si-ech process A new design was implemened by aking he abovemenioned iems ino consideraion. 1 Inspecion of he laser-dicing equipmen and spli es on he laser power 2 Reseing of he safey facor based on he raio of he moving mass agains he spring siffness in he 3 rd acceleromeer 3 To preven he pull-in phenomenon beween he moving comb and he fixed one, he ip srucure was added o each of hem. 4 Progression of he process afer confirming he SEM image of he ech profile in he deep si ech process Above all, here were no srucural changes in he horizonal ype, bu he number and widh of he spring and he moving displacemen of he mass were opimized and 4 differen ypes were designed o fi ino hree differen sensing areas, as shown in Fig
5 Figure 10. Design improvemen for he horizonal ype (2 nd ) 3.3 Developmen of a MEMS-based wireless blasing vibraion sensor The sysem suggesed in he paper is equipped wih a MEMS-based acceleraion sensor, a miniaurized daa logger, and a Zigbee-based wireless sensor nework chip, as shown in Fig. 12. To develop a small sensor like his, he hree cuing-edge echnologies MEMS-based vibraion sensor, developmen of he MCU in replacemen of he daa logger, he Zigbee-based wireless sensor nework echnology - are required. The wireless blasing vibraion sensor presened in he paper consiss of a number of sensors and a noebook compuer (or a PC). The sensor can be added up o a maximum of 255. Each sensor has a Zigbee-based wireless sensor nework chip inside so ha he sensors can wirelessly send and ransmi he sensed daa among each oher. An amplifier can be addiionally equipped o send and receive disan daa, which does no require an addiional daa logger or anoher power faciliy. Wireless Anenna 50mm Wireless Communicaion Daa Buffer Memory ZigBee Chip Daa Encoding Sensor Module Exernal Connecion Daa Transfer Nex, he design of he verical ype developed during he firs year of research was changed by eliminaing he upper elecrodes and insering he elecrodes inside he mass, as shown in Fig. 11. In addiion, he number and widh of he spring and he moving displacemen of he mass were opimized, as shown in Table 2. We obained saisfacory resuls from he ess by designing and manufacuring a es rig in he abovemenioned manner. We plan o verify he performance of he es rig by conducing a precision es a he Korea Tesing Laboraory 100mm 24pin Compue. Core Sensing Inerface Daa Sampling MEMS Acceleromee Micro Processor Board Memory A/D Converer Figure 12. Sensor srucure Wireless Sensor 24pin link Socke Baery Li-ion Baery Noebook Wireless Anenna 50m 100mm Figure 13. Composiion of he wireless blasing vibraion.sensor 4. Conclusion Figure 11. Design improvemen for he verical ype (2 nd ) The final developed produc of his sudy is a MEMS-based vibraion sensor module ha can be applied in he consrucion of a wireless sensor nework for he monioring of a srucure. This module is a SoC produc (Sysem on a Chip) where a sensor, signal processing circui, wireless ransmier/receiver and self-driving power are on a chip. We ried o deermine he appropriae performance wih he -618-
6 prooype of he developed MEMS-based vibraion sensor in order o use he resul in designing he complee produc. The resuls consis of he layou of he MEMS-based vibraion sensor, relaed daa and he complee produc (including packaging). The MEMS-based vibraion sensor can be used wih a commercial wireless ransceiver module where here is a MEMS sensor par and a signal processing circui and is driving power uses he power of a wireless ransmier/receiver Moe. The prooype of he MEMS-based vibraion sensor senses and measures one-way acceleraion wihin he range of -50 and +50g (g: acceleraion of graviy) and has a vibraion measuremen bandwidh beween 0Hz up o 1kHz a 10mg of resoluion. The changes in he measured acceleraion of graviy will be exchanged as daa afer being inerpreed over he wireless ransceiver. We will sabilize he performance of he device and enable i o measure 2-axial and 3-axial acceleraion in succeeding sudies. REFERENCES [1] Peck, R. B., 1969, "Deep excavaions and unneling in sof ground." Pro 7h In'l Conf. Soi. Mech. and Foun. Engr., Mexico Ciy, Sae of The Ar, pp [2] Terzaghi, K., 1942, "Liner-plae unnel on he Chicago subway." ASCE Transacions 108, pp [3] Obada, M., Lee, H. D., Bhai, M. A., and Maclean, B., 2003, Full-Scale Field Evaluaion of Microelecromechanical Sysem-Based Biaxial Srain Transducer and Is Applicaion in Faigue Analysis, Journal of Aerospace Engineering, olume 16, Issue 3, pp [4] Lynch, J. P., Parridge, A., Law, K. H. e al., 2003, Design of Piezoresisive MEMS-Based Acceleromeer for Inegraion wih Wireless Sensing Uni for Srucural Monioring, Journal of Aerospace Engineering, olume 16, Issue 3, pp , July [5] Oh, Y. S., 2002, Tunnel Mainenance Manual, Korea Infrasrucure Safey & Technology Corporaion -619-
7 Table 1. Funcional Improvemens of Mems ibraion Sensor (by Type) 1 s Division olage Sensiiviy Measuremen Frequency Mass Spring Comb (No.) Type1 400m/G 40.8 m/m/s2 5G 49m/s 0~100Hz 2000*500* *10*40 60(*2) Type2 100m/G 10.2 m/m/s2 20G 196m/s 0~300Hz 2000*1000* *10*40 60(*2) Type3 40m/G 4.08 m/m/s2 50G 490m/s 0~1000Hz 3000*1000* *10*40 90(*2) Table 2. Funcional Improvemens of Mems ibraion Sensor (by Type) -2 nd Division olage Sensiiviy Measuremen Frequency Mass Spring Comb (No.) Type 1-1 Type m/G 40.8 m/m/s2 5G 49m/s 0~100Hz 2000*500* *5*40 30(*2) 400m/G 40.8 m/m/s2 5G 49m/s 0~100Hz 2000*500* *10*40 43(*2) Type2 100m/G 10.2 m/m/s2 20G 196m/s 0~300Hz 2000*1000* *10*40 30(*2) Type3 40m/G 4.08 m/m/s2 50G 490m/s 0~1000Hz 3000*1000* *10*40 43(*2) -620-
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