Mirtec MV-3 Series Desktop AOI Systems Now with 5 and 10 MP camera!

Transcription

1 Mirtec MV-3 Series Desktop AOI Systems Now with 5 and 10 MP camera!

2 MV-3 Series MIRTEC's MV-3 Series is the world's first generation of five camera Desktop AOI systems. The MV-3 Series offers advanced 5 and 10 Mega Pixel Digital Colour Camera Technology with telecentric lens in a desktop AOI system. This technology provides the ultimate inspection performance and speed. The optional Side Viewer Camera System provides enhanced inspection capability through the addition of four Five or Ten Mega Pixel Side View Digital Color Cameras. Main Features Inspection Performance Advanced 5 or 10 Mega Pixel Digital Colour Camera Technology yields unsurpassed defect detection, a minimum false call rate, and lightening fast PCB Inspection: up to 173 cm²/sec. Inspection performance which surpasses that of competitive Inline machines MIRTEC's innovative Quad Angle Lighting System provides enhanced solder joint and solder bridge inspection capability The optional Side Viewer Camera System provides four additional Five or ten Mega Pixel Side View Digital Color Cameras for enhanced detection of lifted leads and lifted components. This system also provides solder joint inspection of Jleaded and LCC devices Precision motion control systems provide absolute reproducibility and repeatability. Powerful OCR Engine provides advanced part marking inspection Software Architecture Comprehensive Package Type Library provides simple Drag and Drop component programming Auto Teaching Tool (ATT) Software provides automatic teaching of component locations using CAD centroid data True first article PCB inspection No Golden Board is required Global Component Library provides Automatic Programming of previously taught components True program compatibility with MIRTEC In-line inspection machines Off Line Teach Tool (OLTT) Software Option Remote Monitoring System displays "Real Time" status of AOI system Supports integrated data base management for Remote SPC/Repair through a network server

3 A d v a n c e d T e c h n o l o g y Optional - Side Viewer Camera System Provides enhanced inspection capability with the addition of four Five or Ten Mega Pixel Side View Digital Color Cameras Enhanced detection of lifted leads and lifted components Superior solder joint inspection of Jleaded and LCC devices Provides unsurpassed defect detection, a minimum false call rate, and Lightening Fast PCB inspection Independent Quad Angle Lighting System The angled light source is divided into four independently programmable zones for optimal illumination of the inspection area Provides superior inspection of leaded devices and surface anomalies Optional 3D Beam Laser System Provides laser Z-height measurement capability Four point height measurement for coplanarity testing of BGA and CSP devices

4 Advanced 5,10 or 15 (MV-7 only) Mega Pixel Camera System Absolutely spectacular image quality. Improved inspection speed with larger FOV(Field of View) Excellent inspection performance for 0402 Chip (01005 chip) with a resolution of 9.8μm/pixel Improved Powerful Inspection Performance for Lifted Lead Inspection Solution New lifted inspection techniques with colour (global patent on process) With white LED light/ colour inspection techniques with component gradient The best inspection performance for chip/ IC lifted lead defects Chip Positioning, Solder Ball and Scratch Inspection Inspect the component in the correct position, and that its not moved due to vibration, impact or static electricity Inspection algorithm for scratches, solder balls and chip misplacement, defects based on frame Chip scatter inspection: inspect the chip with incorrect positioning due to vibration, impact or static electricity Solder ball inspection: Inspect solder ball defects on the board Scratch inspection: Inspect scratches on the pad without solder

5 Telecentric Lens Application Non-distortion during image magnification Display the object with the same angle and distance No compensation required for the image edge as with a general lens Advanced inspection performance when using top camera, as depth and height issues with general cameras are eliminated Auto Clamp Option Optional Developed for large and thin boards, the auto clamp option ensures quick and easy positioning of the board, assisting in a high inspection performance

6 F a s t a n d E a s y P r o g r a m m i n g Auto Teaching Tool (ATT) Software Automatic teaching of component locations using CAD centroid data. Provides true first article PCB inspection No "Golden Board" is required Library System Comprehensive Package Type Library provides simple "Drag and Drop" component programming. Global Component Library provides "Automatic Programming" of previously taught components.

7 Total Quality Management Solution Integrated Statistical Process Control (SPC) System Software (Standard) Controls integrated production results for all PCB models Maximize productivity and quality Statistical Process Control Monitor all the defects from the statistical data of the product Promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies Process Management Function Remote Debugging Function Debug the program without interrupting production Its possible to use 1 remote PC to control multiple machines Debug false alarms with previous defect data

8 Integrated Repair System Software (Standard) Provides defect data for simple repair of defective assemblies after inspection. Defect data for all PCB assemblies is stored in a single data base server. Easiest visual display for the operator Optional NG Marking System Makes repair operation more efficient by clearly marking the positions of all defective regions of interest.

9 Examples Top and Sidecamera example of Tombstone component. (Top) (Side) Laser and Sidecamera example lifted leads

10 Option 3 Option 3 Option 3 Option 3 Option 3 MV-3L 3U 50 x x 510 mm 7xi 50 x x 460 mm 3U+ 50 x x 510 mm 7xiD 50 x x 250 mm n.a. n.a. n.a. System Specifications Inspection PCB Thickness 0.5 ~ 3 mm * FOV/Resol ution Inspection Speed Type 5.0 Mega 10.0 Mega 15.0 Mega Smallest Component Inspection PCB Area 50 x 50 ~ 510 x 400 mm * 5.0 Mega 10.0 Mega 15.0 Mega n.a. MV-3U 44.7 x 37.5 mm / 18.2 μm/pixel 32.9 x 27.6 mm / 13.4 μm/pixel 24.1 x 20.1 mm / 9.8 μm/pixel 66.6 x 49.7 mm / 18.2 μm/pixel 49.0 x 36.6 mm / 13.4 μm/pixel 35.9 x 26.8 mm / 9.8 μm/pixel 3,006 mm2/sec (0.32sec/frame) 0603 Chip / 0.4 pitch IC (mm) 0402 Chip / 0.3 Pitch IC (mm) 0402 Chip / 0.3 Pitch IC (mm) MV-7xi 5,986 mm2/sec (0.28sec/frame) 3,492 mm2/sec (0.26sec/frame) 2,028 mm2/sec (0.24sec/frame) 8,977 mm2/sec (0.37sec/frame) 5,299 mm2/sec (0.34sec/frame) MV-7U 77.7 x 77.7mm / 20 μm/pixel 38.8 x 38.8mm / 10 μm/pixel 17,293 mm2/sec (0.35sec/frame) 5,217 mm2/sec (0.29sec/frame) 60 x 60 ~ 660 x 510 mm Inspection Item Options Lift Component, Lift Lead, Flipped Component, Excessive Solder, Insufficient Solder, Open Solder, Missing Component, Shift, Skew Component, Polarity,Tombstone, Solder Ball, Foreign Component, QFP/BGA Package Flied Component Under The QFP/BGA Package(Laser Option), Turnover 3D-Beam Laser System, Side Viewer, NG Marker(Mechanic),Barcode, OLTT, INTELLISYS (Remote SPC, Remote Repair, Remote Management, Remote Debugging), 1D or 2D Guntype Barcode Reader, Intelli-Scan Laser System, Side Viewer Camera System, Barcode Reader, Off-Line Teaching Software, INTELLISYS (Remote SPC, Remote Repair, Remote Management, Remote Debugging), NG Marker(Mechanic Type), 1D or 2D Guntype Barcode Reader, NG Buffer, Turning Conveyor, Loader, Unloader Top Down Camera Lens Side Viewer Camera Robot Driven System Lighting System Laser Sensor PC 5 Mega 10 Mega 15 Mega 5 Mega 10 Mega 7xi 1,000(W) x 1,400(D) x 1,450(H) mm Machine Dimension * 975(W) x 1,200(D) x 630(H) mm 1,185(W) x 1,455(D) x 630(H) mm 1,150(W) x 1,450(D) x 1,450(H) mm 7xiD 1,150(W) x 1,530(D) x 1,450(H) mm Weight Environment Intel Core 2 Duo, 19 LCD Monitor, Windows XP Professional 110KG n.a. Closed Loop Stepping System * Z-Height Repeating Measurement Accuracy:±20μm (Resolution: 15μm/point) 160KG 2,456 x 2,058 Pixels 3,664 x 2,736 Pixels Telecentric Lens 2,592 x 1,944 Pixels / 4 set,664x 2,736 Pixels / 4 set 7xi 800Kg / 7xiD 1,200Kg Power Requirement Single Phase AC 85~264V, 50/60Hz Single Phase AC 220V, 50/60Hz±10%, 50/60Hz Temperature: 0~40 C, Humidity: 30-80%RH 3,888 x 3,888 Pixels Servo Motor System 3 Layer LED (Horizontal, Vertical, Coaxial), Quad Angle Lighting System, User defined settings Z-Height Repeating Measurement Accuracy:±10μm (Resolution: 1μm/point) 1,000KG *1. MV-3L with extra option including NG Maker is enable to inspect max 450x400mm. *2. The biggest Inspection part height: Basic: 25mm / Option: 45mm (Fixed) *3. Closed Loop Stepping Motor System: Application Step Motor System *4. Machine dimension exclude Tower lamp & Extension conveyor *5. 15 Mega Camera release in the first half of 2011 *6. System Specifications of 15 mega camera can be changed for improvement *7. MV-7xiD:Dual lane / 2,3,4 flexible lane The contents and specification in this document can be changed without notice.