Acceptability Criteria for DYCOstrate Micro-Via High Density Interconnects. W e h a v e a p r o g r e s s i v e v i e w

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1 Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects W e h v e p r o g r e s s i v e v i e w

2 Notice This specifiction of the cceptbility criteri for DYCOstrte Micro-Vi High Density Interconnects ws prepred nd issued by the Qulity Assurnce Deprtment, Dyconex Advnced Circuit Technology, Zurich, Switzerlnd. copyright 1998 by Dyconex Ltd. DYCONEX Ltd. Grindelstrsse 40 CH-8303 Bssersdorf, Switzerlnd Phone: FAX: Internet: Emil:

3 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 1 of 28 Chnge Record This pge records the chnges to the specifiction, pge 2 onwrds. The re of the chnge is shown t ech issue by verticl line in the left hnd mrgin. Issue Detils of Chnge Chnge No nd Dte Signture A Initil relese QA/Bug A Address Chnge in Notice-Sheet (No Revision chnge, dte only) QA/Bug Pge: Issue: A A A A A A A A A A A A A A A A A A A A Pge: Issue: A A A A A A A A Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

4 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 2 of 28 Contents 1 Scope 4 2 Performnce Clssifiction 4 3 Applicble Documents Interntionl Stndrds Supplementry DYCONEX Documents Terms nd Definitions 5 4 Requirements Mteril Construction (Build-Up) Mrkings Dimension nd Tolernces Bord Dimensionl Requirement DYCOstrte Technology Relted Tolernces Bord Contour Hole Pttern to Bord Contour Hole Pttern Cut-outs nd holes _9 4.5 Visul Exmintion Conductor Pttern Bord Edges Minimum Conductor Width Reduction of the Minimum Conductor Width Minimum Conductor Spcing Reduction of the Minimum Conductor Spcing Surfce Mount Lnds Wire Bonding Surfce Evenness of Surfce Lnds Annulr Ring Requirements Externl on Blind Micro-Vis Externl on Through-Hole Micro-Vis Surfce Plting nd Coting Solder Coting Coverge Nickel / Gold Plting on Soldering Lnds Nickel / Gold Plting on Wire Bonding Lnds Plting Voids in Blind Micro-Vis Coting Voids in Blind Micro-Vis Solder Resist Solder Resist Thickness Solder Resist Mislignment Solder Resist Coverge Coverge Between Closely Spced Lnds Microsection Exmintion Therml Stress Testing (Solder Flot) Bord Build-Up Requirements Conductor Thickness Nickel / Gold Plting Thickness Minimum Dielectric Thickness 17 Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

5 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 3 of Resin Fill of Micro-Vis Blind Micro-Vis Annulr Ring Externl (Blind Micro-Vis) Annulr Ring Internl (Blind Micro-Vis) Minimum Hole Dimeter of Blind Micro-Vis Mislignment ginst Trget Lnd Copper Plting of Blind Micro-Vis Plting Voids in Blind Micro-Vis Plting Crcks in Blind Micro-Vis Nickel / Gold Plting Voids in the Hole Nickel / Gold Plting over Copper Plting Void Trough-Hole Micro-Vis Annulr Ring (Through-Hole Micro-Vis) Mislignment Hole Brek-Through Non-Open Holes (Through-Hole Micro-Vis) Copper Plting of Through-Hole Micro-Vis Plting Voids in Through-Hole Micro-Vis Plting Crcks in Through-Hole Micro-Vis Nickel / Gold Plting Voids in the Hole Nickel / Gold Plting over Copper Plting Void Specil Purpose Micro-Vis Prllel Micro-Vis Therml Micro-Vis Electricl Testing Rework nd Repir Workmnship Qulity Assurnce Qulity Assurnce nd Inspection System Trcebility Finl Inspection Non-Conformnce Test Coupons Preprtion for Delivery Pcking Documenttion 28 Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

6 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 4 of 28 1 Scope This stndrd covers the qulifiction nd performnce requirements of DYCOstrte Printed Wiring Bords (PWB), High-Density-Interconnects (HDI) nd Multi-Chip-Modules (MCM) utilising plsm generted micro-vis. The substrtes my be single-sided, double-sided nd/or multilyer with or without constrined support crrier or core (i.e. CIC, CMC, CCC, etc.). 2 Performnce Clssifiction The printed bords re clssified by the three performnce clsses ccording IPC-6011: - Clss 1: Generl Electronic Products - Clss 2: Dedicted Service Electronic Products - Clss 3: High Relibility Electronic Products The required performnce clss shll be specified in the procurement documents. 3 Applicble Documents 3.1 Interntionl Stndrds IPC-T-50 Terms nd Definitions for Interconnecting nd Pckging Electronic Circuits IPC-D-275 IPC-6011 IPC-6012 IPC-6016 IPC-A-600 IPC-R-700 MIL-P MIL-P Design Stndrd for Rigid Printed Bords Generic Performnce Specifiction for Printed Bords Qulifiction nd Performnce Specifiction for Rigid Printed Bords Qulifiction nd Performnce Specifiction for High Density Interconnect Structures (HDIS) Acceptbility of Printed Bords (rev. level "E" or higher) Guideline for Modifiction, Rework nd Repir of Printed Bords nd Assemblies Militry specifiction for flexible nd rigid-flex printed wiring bords Militry specifiction for rigid printed wiring bords 3.2. Supplementry DYCONEX Documents DYCOstrte Technology Informtion DYCOstrte Design Rules DYCONEX Workmnship Stndrds Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

7 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 5 of Terms nd Definitions Core Through-Hole Micro Vi Cpture Lnd Plted Through-Hole Blind Micro Vi Trget Lnd Prllel Vis Therml Vis The definition of terms herein shll be s specified in IPC-T-50 or s listed below: DYCOstrte Micro-Vi Blind Micro-Vi Through-Hole Micro-Vi Trget Lnd Cpture Lnd Core Brnd nme for PWBs, HDIs or MCMs produced by using plsm bltion technology invented nd ptented by Dyconex Ltd. Generl term for processed (plted or non plted) hole 150mm (0.006inch) dimeter A micro-vi etched from one side of the bse mteril extending to the next copper lyer A micro-vi etched from both sides of the bse mteril interconnecting the two surfces of copper cld foil The lnd on which the micro-vi ends nd mkes connection The lnd where the micro-vi strts. It my vry in shpe nd size bsed on the intended use (i.e. component mounting, vi entrnce conductor) Pre-mnufctured conventionl PWB (2-n lyer) or electriclly nonfunctionl support crrier, constrined or unconstrined, which is lminted between the micro-vi build-ups. Core mteril cn be ny pproprite mteril, like FR-4, FR-5, G10, etc., constrining mterils cn be copper-invr-copper (CIC), copper-molybdenumcopper (CMC), copper-crbon-copper (CCC), etc. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

8 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 6 of 28 Therml Vis Prllel Vis RCC Therml interconnection between the lyers. Typiclly they re rrnged s n rry of stggered micro-vis in lrger copper pd. The prllel micro-vis re locted in the sme pd which re used for mechniclly drilled holes. These prllel micro-vis re used to enble electricl pre-testing of micro-vi lyer build-up before finl lmintion nd to improve the overll bord relibility. Resin-coted-copper foil (usully, non-reinforced, non-cured epoxy coted onto the bck side of copper foil) 4 Requirements This specifiction describes those requirements which re not covered by the pplicble interntionl stndrds mentioned in prgrph 3.1 s well s ny exceptions relted on the DYCOstrte technology. References printed in Itlic identify criteri's nd requirements for the micro-vi technology which devite from the referenced prgrphs or which re derived from them. 4.1 Mteril Rigid Lmintes Flexible Films Bonding Mterils Rigid glss-reinforced lmintes, metl cld nd uncld, shll be s specified in the procurement documenttion nd shll be selected from IPC-4101, IPC-4104 nd MIL-S Flexible films, metl cld nd uncld, shll be s specified in the procurement documenttion nd shll be selected from IPC-FC-231 nd IPC-FC-232 Bonding mterils shll be s specified in the procurement documenttion nd shll be selected from IPC-FC-232 nd IPC-4101 (substitute for MIL-S-13949) Other Dielectric nd Conductive Mterils Other Mterils shll be s specified in the procurement documenttion nd shll be selected from IPC-4104 Metl Foils Copper foil s well s resin coted copper foil (RCC) shll be selected from IPC-MF-150. Foil type, foil grde, bond enhncement tretment nd foil profile should be specified in the procurement documenttion Polymer Hole Fill Mteril When required, the mteril used for hole fill shll be in ccordnce with IPC-4104 or IPC-SM-840 Nickel Plting Gold Plting Solder Msk Nickel plting shll be in ccordnce with QQ-N-290. If electroless plted nickel is required it shll be specified in the procurement documenttion Gold plting shll be in ccordnce with MIL-G If electroless plted gold is required it shll be specified in the procurement documenttion When permnent solder msk coting is specified, it shll ccording IPC-SM-840 clss 3. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

9 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 7 of 28 If flexible solder msk is required it shll be specified in the procurement documenttion. 4.2 Construction (Build-Up) Printed circuit bords delivered under this specifiction shll be of the mteril, design, nd construction specified in the pplicble procurement documenttion. 4.3 Mrkings In ddition to the customer defined mrkings such s rticle number, revision level, dte code, etc., DYCONEX ttches the following identifiction mrkings to the bords: - Lot-N (e.g. AAA, AAB, AAC...) - Compny code "co" - Seril-N (e.g. 01, 02, 03...) if requested by the customer - Position N (A, B, C...) of the bords if production pnel contins more thn one bord, if requested by the customer Mrkings which do not vry within production lot re usully etched in copper. Vrible mrkings such s seril number will be stmped onto the substrtes in white or blck colour. 4.4 Dimension nd Tolernces Bord Dimensionl Requirement The bord shll meet the dimensionl requirements specified in the procurement documents. All dimensionl chrcteristics such s - bord outline (contour) - thickness - cut-outs nd slots - fixing tbs shll be s specified in the procurement documents DYCOstrte Technology Relted Tolernces Bord Contour The tolernce of the plsm etched bord contours is ±200 mm (0.008inch). M P Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

10 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 8 of 28 The tolernce of mechniclly routed contours is ±100 mm (0.004inch). M P Hole Pttern to Bord Contour The tolernce between plsm etched holes to the plsm etched bord contour is ±75 mm (0.003inch) for 2 lyer structures ±125 mm (0.005inch) for 4 lyer structures. M P The tolernce between plsm etched holes to the mechniclly routed bord contours is ±200 mm (0.008inch). M P The tolernce between mechniclly drilled holes to the mechniclly routed bord contours is ±200 mm (0.008inch). M P The tolernce between mechniclly drilled holes to the plsm etched bord contour is ±200 mm (0.008inch). M P Hole Pttern The tolernce between two mechniclly drilled is ±100 mm (0.004inch). M M Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

11 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 9 of 28 The tolernce between two plsm etched holes is ±50 mm (0.002inch). P P The tolernce between plsm etched holes to mechniclly drilled holes is ±200 mm (0.008inch). M P Cut-outs nd holes The dimeter nd shpe tolernce of plsm etched holes nd cutouts is ±50 mm (0.002inch) on plted holes nd cut-outs ±75 mm (0.003inch) on non-plted holes nd cut-outs d b L 4.5 Visul Exmintion Visul exmintion of the substrtes for the pplicble dimensionl or workmnship ttributes shll be conducted t mgnifiction of minimum 10X ±10 %. If the condition of suspected defect is not pprent, it might be verified t higher mgnifiction (up to 40X) to confirm tht is defect. (Reference IPC-6016, 3.5 nd IPC-6012, 3.3) Conductor Pttern Bord Edges The minimum spcing between the conductor nd the edge of the bord shll be specified in the procurement documents. (Reference IPC-6016, 3.5.3, IPC-6012, 3.5.3) Nicks or hlos on finished substrte edges shll be cceptble provided tht the penetrtion does not bridge djcent conductors or reduce the spcing requirements below the minimum, specified in the procurement documents. (Reference IPC-6016, 3.3.1, IPC-6012, 3.3.1) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

12 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 10 of 28 Non-conductive burrs long the edges of the finished bord shll be cceptble s long s they re not loose nd/or do not ffect fit nd function. (Reference IPC-6016, 3.3.1, IPC-6012, 3.3.1) Minimum Conductor Width If not specified on the mster drwing, the minimum conductor width (b) shll be 80 % of the nominl width () supplied in the procurement documenttion. The conductor width is mesured on the bottom, where the conductor dheres to the bse mteril. b (Reference IPC-6016, 3.5.1, IPC-6012, 3.5.1) Reduction of the Minimum Conductor Width An dditionl reduction of the minimum specified conductor width of 20 %, due to isolted defects (i.e. edge roughness, nicks, pinholes nd scrtches) is cceptble, provided the length (L) of single defect is not longer thn 13mm. L b (Reference IPC-6016, 3.5.1, IPC-6012, 3.5.1) Minimum Conductor Spcing If not specified on the mster drwing the minimum conductor spcing (b) shll be 80 % of the nominl spcing () supplied in the procurement documenttion. The conductor spcing is mesured on the bottom, where the conductor dheres to the bse mteril. b (Reference IPC-6016, 3.5.2, IPC-6012, 3.5.3) Reduction of the Minimum Conductor Spcing Minimum conductor spcing my be reduced by n dditionl 20 % due to conductor edge roughness spikes, etc. L b (Reference IPC-6016, 3.5.2, IPC-6012, nd tb. 3-6) Remining copper between conductors is cceptble, provided they do not reduce the minimum conductor spcing s it is defined bove. (Reference IPC-6016, 3.5.2, IPC-6012, nd tb. 3-6) b Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

13 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 11 of Surfce Mount Lnds Defects such s nicks, dents etc. long the edge of lnd shll not exceed 20 % of either the length or width of the lnd. (Reference IPC.6016, , IPC-6012, ) L b The mximum length of n internl defect shll not exceed 10 % of the length or width of the lnd. (Reference IPC-6016, , IPC-6012, ) L b Wire Bonding Surfce The bonding re shll be free of defects (Reference IPC.6016, ) Edge roughness nd indenttions in bonding re re cceptble s long s more thn 75 % of the wire bonding lnd re is undisturbed. (Reference IPC.6016, , IPC-6012, , Mrtin Mriett Microelectronics Workmnship Stndrd 1-6) Evenness of Surfce Lnds Lyout relted undulted lnds (uneven lnd surfce) re cceptble up to 25 mm (0.001inch) for soldering lnds. 10 mm (0.0004inch) for wire bonding lnds Undulted lnd re usully resulting from non-optiml lyout nd cn only be voided by optimising the copper lyer underneth the surfce lnd. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

14 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 12 of Annulr Ring Requirements Externl on Blind Micro-Vis The minimum nnulr ring for blind micro-vis shll be 0 mm. Tht mens, in minimum, the copper of the vi wll plting shll be visible. (Reference IPC-6016, 3.4.3, IPC-6012, 3.4.3) Surfce view Microsection view Externl on Through-Hole Micro-Vis The minimum nnulr ring () for through-hole micro-vis shll be 60 % of the dielectric thickness (b), i.e. 30 mm (0.0012inch) for 50 mm (0.002inch) mteril. (Reference IPC-6016, 3.4.3, IPC-6012, 3.4.3) Surfce view Microsection view b b Surfce Plting nd Coting The required surfce plting nd coting shll be defined on the procurement documents Solder Coting Coverge If solder coting is required, it shll be performed by Hot-Air-Levelling (HASL). The solder coting shll completely cover the exposed conductor pttern nd shll meet the solderbility requirement of J-STD-003. There is no specific thickness requirement to be met. (Reference IPC-6012, & tble 3-2) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

15 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 13 of Nickel / Gold Plting on Soldering Lnds If nickel/gold plting is required for soldering purpose, chemiclly (electroless) deposited nickel/gold shll be used. Unless otherwise specified in the procurement documents the plting thickness shll be s stted in prgrph of this specifiction. Exposed nickel nd/or copper on res not to be soldered is permitted on mximum 1 % of the conductor surfce (Clss 1 nd 2 up to 5 %). See rework possibility in Prgrph 4.8 (Reference IPC-6012, ) Discolortion shll not be cuse for rejection, provided it does not dversely ffecting solderbility Nickel / Gold Plting on Wire Bonding Lnds The nickel/gold plting for wire bonding purpose shll be specified in the procurement documents. Unless otherwise specified, the plting thickness shll be s stted in prgrph of this specifiction. Exposed nickel nd/or copper outside of the bonding re is permitted on mximum 1 % of the lnd re (Clss 1 nd 2 up to 5 %). (Reference IPC-6012, ) Discolortion shll not be cuse for rejection provided it does not dversely ffect bond pull strength. (Reference IPC-6012, ) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

16 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 14 of Plting Voids in Blind Micro-Vis Plting voids in the hole re not cceptble (see microsection requirements) (Reference IPC-6012, & Tble 3-3) Coting Voids in Blind Micro-Vis Missing nickel / gold plting shll not exceed one void per hole in not more thn 5 % of the holes (see 4.6 Microsection Requirements) (Reference IPC-6012, & Tble 3-3) Solder Resist Solder Resist Thickness Depending on the type of solder resist used, the solder resist thickness my vry considerbly. However, good coverge of the bord surfce is required. The solder resist thickness is not mesured, unless specified in the procurement documents. (Reference IPC-6012, 3.8.3) Solder Resist Mislignment SMD-lnds s well s bonding lnds shll be free of solder resist. Encrochment of solder resist over lnds due to mislignment is cceptble up to 50 mm (0.002inch) for pitch of >1.25mm (0.05inch) 25 mm (0.001inch) for pitch of <1.25mm (0.05inch) (Reference IPC-6012, 3.8.1e & f) Mislignment of solder resist shll not expose djcent isolted lnds or conductors. See rework possibility in Prgrph 4.8 (Reference IPC-6012, 3.8.1e & f) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

17 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 15 of Solder Resist Coverge Pits nd voids re llowed in the non-conductor re See rework possibility in Prgrph 4.8 (Reference IPC-6012, 3.8.1h) Air entrpment in blind micro-vis covered with solder resist is cceptble. (Reference IPC-6012, 3.8.1) Micro-vis which re not or insufficiently covered by solder resist re cceptble, provided the number of ffected vi holes does not exceed 5 % of the totl number of vi holes per bord. (Reference IPC-6012, 3.8.1) Surfce view Microsection view Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

18 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 16 of Coverge Between Closely Spced Lnds Solder resist coverge between closely spced lnds requires to provide sufficient width of solder resist lredy in the design. In cse where the designed minimum width is 150mm (0.006inch), solder resist brekout on the finished bord shll not be cuse for rejection. (Reference IPC-6012, 3.8.1i) 4.6. Microsection Exmintion Microsection shll be ccomplished per IPC-TM-650, method or on test specimens, test coupons or production bords (see chpter 6.5). A minimum of three holes or micro-vis shll be inspected in the verticl cross section. When exmined in microsection the coupons shll meet the requirement of the sections through (Reference IPC-6012, & 3.6.2) Therml Stress Testing (Solder Flot) Specimens shll be thermlly stressed in ccordnce with IPC-TM-650, method Following stress, the specimens shll be microsectioned. (Reference IPC-6012, 3.6.1) Bord Build-Up Requirements Conductor Thickness The minimum externl conductor thickness shll be in ccordnce with the nominl thickness specified in the procurement documents (copper foil plus copper plting). (Reference IPC-6012, 3.5.2, & Tble 3-9) Allowble reduction of the minimum externl conductor thickness due to isolted defects (i.e. edge roughness, nicks, pinholes, depressions nd scrtches) shll not exceed 20 % of the minimum conductor thickness. (Reference IPC-6016, , IPC-6012, 3.5.2) r Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

19 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 17 of 28 The minimum internl conductor thickness fter processing shll be 70 % of the nominl conductor thickness specified in the procurement documents (copper foil plus copper plting). (Reference IPC-6012, & Tble 3-8) Allowble reduction of the minimum conductor thickness due to isolted defects (i.e. edge roughness, nicks, pinholes, depressions nd scrtches) shll not exceed 20 % of the minimum conductor thickness. (Reference IPC-6012, 3.5.2) r Nickel / Gold Plting Thickness Nickel plting used s diffusion brrier between copper nd gold shll hve minimum thickness of 1.3mm (50 micro-inch) for soldering lnds 2.5mm (100 micro-inch) for wire bonding lnds (Reference IPC-6012, & Tble 3-2) Gold plting on soldering lnds shll hve thickness between 0.05mm (2 micro-inch) nd 0.2mm (8 micro-inch) The necessry thickness of gold plting on the wire bonding lnds depends on the bonding method to be used. Therefore, the thickness requirement shll be specified in the procurement documenttion. (Reference IPC-6012, & Tble 3-2) Minimum Dielectric Thickness The minimum dielectric thickness between lyers connected by blind micro-vis shll be 25 mm (0.001inch) unless otherwise specified in the procurement documents. (for RCC-Foil 15 mm (0.0006inch)) (Reference IPC-6016, , IPC-6012, ) The minimum dielectric thickness between lyers connected by through-hole micro-vis shll be 20 mm (0.0008inch) with bse mteril of 25 mm nominl thickness 40 mm (0.0016inch) with bse mteril of 50 mm nominl thickness (Reference IPC-6012, ) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

20 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 18 of Resin Fill of Micro-Vis Buried micro-vis shll be t lest 60 % filled with resin. (Reference IPC-6012, ) Blind Micro-Vis Annulr Ring Externl (Blind Micro-Vis) The minimum nnulr ring for blind micro-vis shll be 0 mm. Tht mens, in minimum the copper of the vi wll plting must be visible. (Reference IPC-6016, nd IPC-6012, 3.4.3) Microsection view Surfce view Annulr Ring Internl (Blind Micro-Vis) The minimum nnulr ring for blind micro-vis on internl lyers shll be 0 mm. Tht mens, the bottom of the micro vi must be locted within the trget lnd. (Reference IPC-6016, nd IPC-6012, 3.4.2) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

21 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 19 of Minimum Hole Dimeter of Blind Micro-Vis The minimum hole dimeter of blind micro-vi on the bottom (b) shll be 50 mm (0.002inch). (Dyconex) b Mislignment ginst Trget Lnd Mislignment of the blind micro-vi ginst the trget lnd is not cceptble Copper Plting of Blind Micro-Vis The verge thickness of the copper plting shll be 7 mm. The minimum thickness shll be 5mm (0.0002inch). (Reference IPC-6012, & Tble 3-2) b Copper foil overhng or bottle necking is cceptble, provided the copper thickness of the hole plting s well s Ni/Au coting thickness (if pplicble) is not reduced below the specified minimum thickness nd the micro-vi is not plced within solder pd. (Dyconex) A reduction of the trget lnd s copper thickness is cceptble, provided the totl copper thickness (trget lnd plus hole plting) is not less thn 70 % of the specified copper thickness for the trget lnd. (Reference IPC-6012, & & Tble 3-8) The minimum plted interconnection re () between micro-vi nd the trget lnd shll hve dimeter of 50 mm (0.002inch) (Dyconex) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

22 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 20 of 28 The filling of blind micro-vis by plted copper is cceptble. (Dyconex) Plting Voids in Blind Micro-Vis No more thn one plting void per test coupon is cceptble provided the size of the plting void is 5 % of the whole plting re. The test coupon hs to be greed between the customer nd Dyconex. (Reference IPC-6012, ) Plting Crcks in Blind Micro-Vis Plting crcks visible before or fter solder-flot testing re not cceptble. (Reference IPC-6012, ) Nickel / Gold Plting Voids in the Hole Missing nickel / gold plting shll not exceed one void per hole in not more thn 5 % of the totl number of holes on the bord. (Reference IPC-6012, & Tble 3-3) Nickel / Gold Plting over Copper Plting Void Acceptble, provided, the minimum copper thickness underneth the Ni/Au plting is 5 mm (0.0002inch). (Reference IPC-6012, & Tble 3-3) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

23 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 21 of Trough-Hole Micro-Vis Annulr Ring (Through-Hole Micro-Vis) The minimum nnulr ring () for through-hole micro-vis shll be 60 % of the dielectric thickness (b), i.e. 30mm (0.0012inch) for 50mm (0.002inch) dielectric mteril. (Reference IPC-6016, nd IPC-6012, 3.4.2) Microsection view b b Top view Mislignment An offset between the top-side ginst the bottom-side is cceptble, provided the plting- nd nnulr ring requirements re met. (Reference IPC-6016, 3.4.3) Hole Brek-Through Brek-through of the hole, cused by excessive plsm etching nd/or mislignment is not cceptble (Dyconex) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

24 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 22 of Non-Open Holes (Through-Hole Micro-Vis) Too short plsm etching is cceptble provided the plted through-hole is still open nd the plting requirements re met. The closing of micro-vis by copper plting is not cceptble. (Dyconex) Copper Plting of Through-Hole Micro-Vis The verge thickness of the copper plting shll be 7 mm. The minimum thickness shll be 5 mm (0.0002inch) (Reference IPC-6012, & Tble 3-2) Plting Voids in Through-Hole Micro-Vis No more thn one plting void per test specimen is cceptble, provided the size of the plting void is 5 % of the whole plting re, nd it is not locted in the interconnection plting re to the trget lnd. The test coupon hs to be greed between the customer nd Dyconex. (Reference IPC-6012, ) Plting Crcks in Through-Hole Micro-Vis Plting crcks visible before or fter solder-flot testing in re not cceptble. (Reference IPC-6012, ) Nickel / Gold Plting Voids in the Hole Missing nickel / gold plting shll not exceed one void per hole in not more thn 5 % of the totl number of holes on the bord. (Reference IPC-6012, & Tble 3-3) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

25 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 23 of Nickel / Gold Plting over Copper Plting Void Acceptble, provided the minimum copper thickness underneth the Ni/Au plting is 5 mm (0.0002inch). (Reference IPC-6012, & Tble 3-3) Specil Purpose Micro-Vis Prllel Micro-Vis Since the prllel micro-vis provide dditionl current pths prllel to mechniclly drilled plted through-hole, some defects (s described below) cn be tolerted without ny influence to fit, form nd function. Prllel micro-vis cut by the mechniclly drilled hole (due to mislignment) shll be cceptble (Dyconex) Plting defects in no more thn 50 % of the prllel micro-vis (due to mislignment) shll be cceptble, provided tht the plting of the mechniclly drilled holes still complies to the specifiction. (Dyconex) Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

26 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 24 of 28 Plting defects in the mechniclly drilled holes such s inner lyer seprtion or plting voids, shll be cceptble, provided tht the corresponding prllel micro-vis do not show plting defects s well. (Dyconex) Plting defects such s inner lyer seprtion or missing plting in res of the copper brrel, which hve no redundnt prllel micro-vis (core re), re not cceptble. (Dyconex) Therml Micro-Vis Therml micro-vis hve no electricl function. Therefore, therml micro-vis re not subject to ny evlution Electricl Testing The testbility s well s the pplicble test prmeters depend on the structure, density nd the size of the substrte to be tested. Unless otherwise specified in the procurement document, electricl testing will be crried out s follows: Test Voltge Test Current Insultion Resistnce Continuity Resistnce Stndrd Test 100 Volts 10mA (mx.) >2 MOhm 100 Ohm Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

27 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 25 of Rework nd Repir Exposed nickel nd/or copper res in soldering pds (i.e. SMD lnds, etc.) ffecting not more thn 3 % of the totl number of solder pds my be reworked by mnul tinning. Touch-up of solder resist discontinuities shll be llowed, provided tht the end product meets the other solder resist requirements. (Reference IPC-SM-840, 3.4.9) Conductor welding on inner lyers shll be ccepted, providing there re no more thn 3 plces with mx. length of 5 mm on bord. The welding shll be performed nd inspected per IPC-R-700 (4.2.5). The weld repir shll not reduce the minimum electricl spce requirements. (Reference IPC-6012, ) Microsection view Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

28 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 26 of 28 Conductor welding on surfce lyers shll be ccepted, providing there re no more thn 3 plces with mx. length of 5 mm on bord. The welding shll be performed nd inspected per IPC-R-700 (4.2.5). The weld repir re must be covered with n pproprite epoxy coting. (Reference IPC-6012, ) Surfce view Microsection view Removl of residul plting mterils or extrneous copper is permitted, provided such ction does not ffect the functionl integrity of the bord (see IPC-R-700). (Reference IPC-6012, 3.12) 5. Workmnship The bords shll be uniform in qulity nd free from - dirt - oil - corrosion - slt grese fingerprints - foreign mterils - nd ny other defects which my ffect qulity, relibility, endurnce nd ppernce. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

29 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 27 of 28 Acceptnce / reject requirements which re not listed herein or in the IPC-A-600, especilly the DYCOstrte nd Micro-vi relted criteri, will be specified in the DYCONEX Workmnship Stndrd. The purpose of the DYCONEX Workmnship Stndrd is to clrify the cceptnce nd rejection criteri for workmnship, where the bsic mesure of qulity is lrgely subjective. Clrifiction is ccomplished through the use of photogrphs which show exmples of common workmnship cses rnging from perfect to rejectble. 6. Qulity Assurnce 6.1. Qulity Assurnce nd Inspection System DYCONEX mintins n estblished Qulity Mngement System ccording to ISO-9002 which is certified by BVQI since Survey udits re being performed every six month by the certifiction body Trcebility Every production lot is identified by unique Lot-Number (i.e. AAA, AAB, etc.) which llows to trce bck to the purchse order, ll mnufcturing documents, ll inspection nd test reports s well s the btch number of the bse mterils used. Where pproprite, the single bords re identified by seril number Finl Inspection Prior to relese for shipment ll bords re being subjected to finl inspection including: - Visul inspection - Dimensionl inspection - Microsection evlution (one test coupon per pnel) - Electricl test (100 %) 6.4. Non-Conformnce Any non-conformnce tht is observed in respect of the process, design, construction, physicl dimensions or tests will be recorded in the mnufcturing document file Test Coupons Unless otherwise specified by the customer, Dyconex uses the Dyconex-Stndrd Test Coupons which represent the relevnt hole configurtion of the bord nd contin ll types of micro-vis nd mechniclly drilled holes. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

30 DYCONEX Specifiction Acceptbility Criteri for DYCOstrte Micro-Vi High Density Interconnects Pge 28 of Preprtion for Delivery 7.1. Pcking In order to prevent dmges to the bords they shll be clened, dried nd individully pcked in vcuum seled polyethylene- or luminium bgs. The requirement for pcking (type of bg, number of bords per bg) shll be s specified in the procurement documents. The bgs re mrked with lbel contining the following informtion: - Suppliers nme - Item identifiction - Lot- nd seril number of the bord - Mnufcturing dte (yer nd week e.g. 9834) 7.2. Documenttion Ech lot will be ccompnied by the following: - Certifiction of Conformity (CoC) (if requested) - Inspection Certifictes of the visul (finl) inspection nd of the microsection inspection, - Test coupons (s required by the customer), - One microsection smple. Copyright Dyconex Ltd. Zurich Alexnder Bugmnn

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