HVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date

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1 HVQFN32 DFN : plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 8 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package body material type JEDE package outline code Mounting method type Q (quad) HVQFN32 HVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Symbol Parameter Min Typ Nom Max Unit D package length mm E package width mm seated height mm 2 package height e nominal pitch mm n 2 actual quantity of termination

2 2. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x D B terminal 1 index area E 1 detail X e 1 L 8 e 1/2 e b e v w B y 1 y E h e 2 1/2 e 1 24 terminal 1 index area D h X Dimensions mm scale Unit (1) (1) 1 b c D (1) D h E (1) E h e e 1 e 2 L v w y y 1 mm max nom min Note 1. Plastic or metal protrusions of mm maximum per side are not included. sot617-3_po Outline version References IE JEDE JEIT MO-220 European projection Issue date Fig. 1. Package outline HVQFN32 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V ll rights reserved Package information 8 June / 5

3 3. Soldering Footprint information for reflow soldering of HVQFN32 package Hx Gx see detail X P nspx Hy Gy SLy By y nspy D SLx Bx x solder land solder paste detail X occupied area Dimensions in mm P x y Bx By D Gx Gy Hx Hy SLx SLy nspx nspy Issue date sot617-3_fr Fig. 2. Reflow soldering footprint for HVQFN32 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V ll rights reserved Package information 8 June / 5

4 4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V ll rights reserved Package information 8 June / 5

5 5. ontents 1. Package summary Package outline Soldering Legal information... 4 NXP Semiconductors N.V ll rights reserved For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 8 June 2016 ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V ll rights reserved Package information 8 June / 5

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