MEMS som byggeklossett SensoNor perspektiv

Transcription

1 MEMS som byggeklossett SensoNor perspektiv 14. mai 2009 SensoNor Technologies AS CTO Terje Kvisterøy Hva er viktig? Hva er tilgjengelig?

2 SensoNor Technologies AS MEMS all the way! Akers Elektronikk (later AME) start up at Horten, NORWAY, 1965; origin from SI (later Sintef) Spun off from AME in 1985 Listed on the Oslo Stock Exchange from Acquired 100% 2003 by Infineon Delisting from Oslo Stock Exchange MBO structured split from Infineon March 2009 Today approximately 150 employees Sales 2008, 323 million NOK SensoNor operate its own Front End (FE) and Back End (BE) production facilities: 150 mm wafer fab for Bulk Micromachining capacity 3000 wafers a month Currently manufacturing approx 1 million sensor dies a week Assembly, packaging, and test capacity approx 15 million devices a year Core competence: Gyro Sensors 10 years of experience 2 million shipped Accelerometers 30 years of experience 35 million shipped Pressure Sensors 40 years of experience 200 million shipped SensoNor Technologies AS 2

3 Everything is technically possible! Silicon + Thin film processing Mite Approaching the Gear Chain Indexing Motor Silicon Mirror and Drive System Optical Encoder SensoNor Technologies AS 3

4 What is MEMS? Micro Electro Mechanical Systems characteristics Wafer based manufacturing (e.g. 6 and 8 today) Use of semiconductor industry infrastructure Examples of technologies complying with above, but are not typ. MEMS Hall sensors Magneto resistive sensors SAW filters / BAW resonators Photo and radiation sensors Examples of technologies not complying with above, not typ. MEMS Quartz resonators (e.g. in clocks) Quartz based sensors (e.g. in gyros) Micro Electro Mechanical Systems value chain MEMS component (e.g. pressure sensor) into sub system (e.g. electronic control unit) into system (e.g. engine) into OEM product (final product; e.g. car) SensoNor Technologies AS 4

5 Why MEMS? (often a strategic issue) Lower costdue to wafer based high volume manufacturing technology Can justify complete installations (no compromise in number of systems) Can improve redundancy (more parallel systems in sensitive applications) Can motivate use of enabling solutions for new or present applications Can save expenditure Smaller size due to semiconductor technology and system in package (SiP) solutions Can motivate use of enabling solutions for new or present applications (not enough roomspace for present state of art technology) Can result in much smaller system weight and size ( amplification factor) Lower weight due to semiconductor technology and system in package (SiP) solutions Can motivate use of enabling solutions for new or present applications (present state of art technology is to heavy) Can result in much smaller system weight and size ( amplification factor) More robust due to lower weight (vibration), more integration (less mechanical and electrical connections) and less power (less self generated heat) Less maintenance and replacement costs No down time (critical factor for sensitive applications) Less redundancy needed (save costs) Less power due to custom MEMS and IC technology Can motivate use of enabling solutions for new or present applications (no compromise in number of systems) More simple power supply systems (save costs) Better reliability and functionality due to less self heating Sensonor Technologies AS 5

6 MEMS principles in use Sensing principles (technologies) Piezoresistive Capacitive Magnetoresistive / hall effect Resistive Piezoelectric Actuating principles (technologies) Electrostatic Thermal (resistive) Piezoelectric SensoNor Technologies AS 6

7 Sensonor Gyro Example Air bag Application Z Pin 1 X=Sensitive axis Y SensoNor Technologies AS 7

8 Sensonor Gyro Example Coriolis Principle F (force) = 2 x M (mass) x Ω (angular rate) x V (excitation velocity) Excitation (typ 5μm) creating radial (V) velocity (on the tip) Detection caused by Coriolis force (open loop shown) SensoNor Technologies AS 8

9 Sensonor Gyro Example Design Triple stack structure Photo through top glass Low-C buried crossing 1 micron gap Interconnects on glass Travel stopper LSON R12 C15 Electrode pattern on glass Press contacts Wire bond pads Glass p-type n-type Glass SensoNor Technologies AS 9

10 Micromachined Single Crystal Silicon Mass thickness 17μm Beam width 10μm SEM image of the butterfly masses SEM image of the wet etched notch and the RIE shaping the asymmetric beam Feature size 10μm Slits for stress relief and holes for damping control SensoNor Technologies AS 10

11 Assembly Manufacturing Process Die attach on copper based leadframe Epoxy over moulding Gyro Chip and ASIC wire bonding SensoNor Technologies AS 11

12 When to use MEMS? Is MEMS available? Can be used in applications for sensors and RF components and fluidics when small size, low weight, low power or low price matters Examples: pressure sensors accelerometers (angular and linear) gyros microphones non cooled bolometers (thermal imaging) Si clock (resonator/oscillator) drug delivery MEMS is mainly available in ranges and mechanical fits as directed by the volume industry SensoNor Technologies AS 12

13 Where do all the chips go? SensoNor Technologies AS 13

14 TOP 30 MEMS Manufactures Print heads DLPs Automotive Laptops & gaming Off-shelf available SensoNor Technologies AS 14

15 Top MEMS devices Compare: semiconductor revenue totaling $261.9 billion in 2008 SensoNor Technologies AS 15

16 MEMS inside Thermal ink jet printers SensoNor Technologies AS 16

17 MEMS inside TI DMD SensoNor Technologies AS 17

18 MEMS inside Sensonor Tire Pressure Module a) SiP with sensor die + ASIC + RF Piezoresistive pressure & acceleration sensor Wheel module w/battery SensoNor Technologies AS 18

19 MEMS inside Sensonor Tire Pressure Module b) Tripple stack sensor die Accelerometer and pressure sensor Chip area Sensitivity (p) Sensitivity (z) Resonance (z) Typ Q factor 2.6 x 2.3 mm2 32 µv/v/kpa 35 µv/v/g 6.5 khz SensoNor Technologies AS 19

20 MEMS inside Sensonor Tire Pressure Module c) Pressure Sensor Temperature Sensor Accelerometer Sensor µc Logic Control Memory Timer RF Transmitter LF Receiver Supply Voltage Sensor SensoNor Technologies AS 20

21 MEMS inside computer & gamepads ST accelerometer in Wii controller SensoNor Technologies AS 21

22 MEMS inside cell phones RF MEMS OMRON RF MEMS Switch SensoNor Technologies AS 22

23 MEMS inside Micro fuidic connector Dolomite s fluidic connector SensoNor Technologies AS 23

24 MEMS inside Replace quartz resonators & oscillators SensoNor Technologies AS 24

25 Sensonor/Sintef/VUC MEMS Energy Harvester a) SensoNor Technologies AS 25

26 Movie showing long travel length for the seismic mass (~200 micrometer) b) SensoNor Technologies AS 26

27 Sensonor/Sintef/VUC MEMS Energy Harvester c) SensoNor Technologies AS 27

28 Some MEMS are for free! The cell-phone market decides! SensoNor Technologies AS 28

29 MEMS products in cell phone SensoNor Technologies AS 29

30 MEMS inside Silicone microphone Infineon Akustica SensoNor Technologies AS 30

31 MEMS global volume / price range pressure die = 500M / 0.25EUR consumer acc = 500M / 0.5EUR consumer microphone = 500M / 0.5EUR automotive accelerometer = 150M / 1EUR automotive sensor w/ microcontroller = 100M / 2EUR consumer gyro = 50M / 2EUR automotive gyro = 10M / 10EUR industrial accelerometer = 1M / 50EUR precision pressure = 500k / 200EUR DLM = 500k / 500EUR precision gyro = 100k / 500EUR bolometer = 100k / 1000EUR SensoNor Technologies AS 31

32 MEMS business model SensoNor Technologies AS 32

33 Major Norwegian MEMS activities mems pressure / inertia / thermal imaging sensors mems pressure sensors mems pressure sensors mems fiber optical components mems for finger print detection mems sensors and actuators research in general mems education and research mainly for 3D packaging mems education SensoNor Technologies AS 33

34 Memscap (fab less) Precision ( low ) pressure sensor Hystereses and repeatability % SensoNor Technologies AS 34

35 Presens (fab less) Precision (high) pressure transducer 0.025% accuracy ASTRIX SensoNor Technologies AS 35

36 SensoNor (fab based) Precision gyros & pressure sensor 3 deg/hr 0.3deg/sqrHz SensoNor Technologies AS 36

37 MEMS specifications varies according to complexity of product! 1 page 38 pages SensoNor Technologies AS 37

38 Application Specific MEMS What costs? What time? (scale of order) As with ASICs, so custom made MEMS => can only be justified as part of a strategic decision! What time (minimum) Concept => 6 M 1st design => 6 M MPW / samples => 6M 2nd design => 3M Custom wafer run / samples => 4M Qualification / samples => 4M What cost (minimum) Concept => 0.5 MEUR 1st design => 0.5 MEUR MPW / samples => 0.02 MEUR 2nd design => 0.2 MEUR Custom wafer run / samples => 0.3 MEUR Qualification / samples => 0.2 MEUR 1st sample = 1.5 Y Commercial device = 2.5 Y 1st sample = 1 MEUR Commercial device = 2 MEUR SensoNor Technologies AS 38

39 Sensonor Foundry Service (Norway) SensoNor Technologies AS 39

40 Silex Foundry Service (Sweden) SensoNor Technologies AS 40

41 Tronics Foundry Service (France) mst.com SensoNor Technologies AS 41

42 Dalsa Foundry Service (Canada) SensoNor Technologies AS 42

43 imt Foundry Service (USA) SensoNor Technologies AS 43

44 Sources for MEMS info (starter) Interesting sites: leti.cea.fr Journals and magazines IEEE/ASME Journal of Microelectromechanical Systems MEMS industry associations Global Conferences and/or Exhibitions test.de (Nürenberg) (Chicago + China + Japan) coms2009.org (global tour) (each second year, global tour) (global tour) Market Research and Strategy Consulting Companies (Micronews) SensoNor Technologies AS 44