Growing the Semiconductor Industry in New York: Challenges and Opportunities

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1 Accelerating the next technology revolution The SEMATECH New York Experience Growing the Semiconductor Industry in New York: Challenges and Opportunities Dan Armbrust President and CEO, SEMATECH April 4, 2013 Copyright 2013 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative and ISMI are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 Semiconductor Industry Virtuous cycle More R&D (innovation) Lower cost/function $ s Increasing semiconductor revenue Expanding applications (more silicon) 2

3 Moore s Law Microprocessor Transistor Counts & Moore s Law 26 April

4 Semiconductor Industry Virtuous cycle More R&D (innovation) Lower cost/function $ s Increasing semiconductor revenue Expanding applications (more silicon) 4

5 SEMATECH Context Semiconductor supply chain Industry structure: then and now System Integrated Device Manufacturer (IDM) Systems Design Packaging and Assembly Chip Technology EDA Tools Memory Logic IDM Fabless Fablite Foundries Package and Assembly Equipment and Materials EDA Equipment Materials 5

6 Industry Challenges Key stakeholders 6

7 Too Many Challenges to Solve Alone Success in semiconductors is driven by technology innovation and advances in manufacturing Success depends on comprehensive industry-wide collaboration Challenges are global, and cut across industry ecosystem Solutions require significant investment, leveraged funding 7

8 SEMATECH Overview History SEMATECH created Entered alliance with New York State (Phase I) Expanded membership to include industry supply chain companies Continued alliance with New York State (Phase II) SEMATECH and CNSE launch PVMC Formed subsidiary for 300 mm wafer conversion Expanded membership to international companies Created subsidiary for manufacturing 450 mm wafer conversion G450C 8

9 Bridging Research, Development, and Manufacturing A membership-driven global consortium Driving technical consensus for the industry Pulling research into the industry mainstream Leading major programs to address critical industry transitions Focus on manufacturability 9

10 SEMATECH Members 10

11 Membership Agreements SEMATECH Programs Attract Growth (YTD) TEL (3D) Accretech (3D) NEXX (3D) TEL (Litho) TSMC Invensas (3D) Advantest (Met) Rudolph (Met) Asahi Glass (Litho) Atotech (3D) Dow (Litho) Qualcomm Inpria (Litho) Air Products (FEP) Rudolph (3D) AMAT (ESH) Altera (3D) Centrotherm (FEP) Araca (ISMI) TEL (FEP) ASML (Litho) ON Semiconductor (3D) SSEC (3D) Morgan Ceramics (ISMI) Metrosol (FEP) JSR (Litho) LSI (3D, ISMI) Kumho (Litho) Poongsan (FEP) New members since 2007 Canon-Anelva (FEP) AZ Electric (Litho) SK Hynix (3D) Vishay (ISMI) TOK (Litho) Qualcomm (3D) Fujifilm (3D) SK Hynix (Litho) Shin-Etsu (Litho) Edwards (ESH) ADI (3D) Winbond (ISMI) FEI Company (Met) Lasertec (3D) ASE (3D) LinTec (3D) Core Wafer Sys. (FEP) DNP (Litho) 4DS (FEP) Hewlett-Packard (ISMI) SUSS (FEP) Panasonic (ISMI) Matheson (ESH) Pall (ISMI) ASML (FEP) Nanosys (FEP) NIST (3D) Renesas (ISMI) AMD (ISMI) Sumitomo (Litho) SRC (3D) Spansion (ISMI) Nissan Chem (Litho) KLA-Tencor (Litho) Cabot (FEP) Freescale (ISMI) Applied Seals (Litho) Infineon (ISMI) Infineon (ISMI) Micronix (ISMI) Micron (ISMI) NXP (ISMI) Aixtron (FEP) STMicro (ISMI) Soitec (FEP,Met) Dai Nippon Screen (FEP) Hoya (Litho) Texas Instruments (ESH)

12 Consortium Success Factors A clear industry-led model and mission Leadership from industry champions Industry with adequate revenue and maturity Ideally, a crisis Leveraging of government and industry funds Member engagement Agility to adapt to changing needs 12

13 Industry/University/Government Collaboration in Albany 13

14 R&D Costs 14

15 Trends & Challenges Rising R&D costs; fewer funders Consolidation device makers, supply chain Supply chain challenges Insufficient early feedback Affordable infrastructure Broken business models Greater share of the R&D burden Increasing need/pressure to collaborate A growing and compelling collaborative model in Albany and clear pathway to 450 mm activities 15

16 MEMORY LOGIC SEMATECH Focused on Materials & Nanostructures Advanced Materials Advanced Structures Beyond CMOS Materials/Structures

17 Technology Gap Early learning and infrastructure development Solution SEMATECH Center for Next-Generation Devices Applied Research Development Manufacturing Systems & Design IDMs & Foundries Equipment & Materials Atomic-level chemistries <10 nm advanced structures Simulation Fabrication flows Nanoscale equipment R&D center that champions and enables next-generation technologies Participation from universities, equipment and materials makers, and chip manufacturers Establishes complete pilot line for research, development, manufacturing enablement 17

18 Lithography Scaling 18

19 EUV Progress Critical enablers First EUV tools installed in Albany & Belgium EUV is REAL Bacus/EUV Symposium EUV Mask Consortium EMI 3100 s in the Field EUV in IDMS Source power Defect-free mask Resist resolution Reticle protection Optics quality Overcome 30 nm resolution brick wall Integrated reticle handling 0 defects <4% flare optics ~10-20 >100 IF reliable source required ~10-50X defect reduction required for HVM LWR needs 2X improvement for MPU (OK for Memory) Commercial reticle handling solution available 3300 optics complete 19

20 Technology Gap Underinvestment in EUV mask metrology equipment Solution SEMATECH EUV Equipment Manufacturing Initiative (EMI) Applied Research Development Manufacturing Systems & Design IDMs & Foundries Equipment & Materials Advanced defect metrology for EUV Large prototype investment Uncertainty in timing Common infrastructure Connects multiple segments of the EUV supply chain in a partnership to collectively fund the development of needed metrology tools by equipment suppliers 20

21 Technology Gap Lack of affordable early access to EUV imaging Solution SEMATECH Resist and Materials Development Center (RMDC) Applied Research Development Manufacturing Systems & Design IDMs & Foundries Equipment & Materials Limited access to EUV tools for research Need for early full-field exposures Materials Processed by RMDC

22 Technology Gap Insufficient defect identification and mitigation Solution SEMATECH Nanodefect Center Applied Research Development Manufacturing Systems & Design IDMs & Foundries Equipment & Materials As defect requirements become more stringent, interdisciplinary knowledge is needed to understand defect generation processes Characterizing small-sized defects is costly and time consuming Centralized facility providing a critical mass of expensive infrastructure with extensive forensics and analytical capabilities 22

23 New Solar Consortium U.S. PVMC Launched the U.S. Photovoltaic Manufacturing Consortium (PVMC) in September 2011 with CNSE Public/private investment of ~$300M over 5 years from U.S. Department of Energy ($62M from SunShot Initiative), industry, New York State Partnership with ~40 companies and organizations throughout the industry supply chain Facilities and Equipment Scale-Up Strategy R&D Pilot Prototyping Manufacturing Development Manufacturing Lab Scale & Testing 100 kw 10 MW >100 MW NREL, Sandia, CNSE, Industry, University PVMC, Halfmoon, NY PVMC, NY Industry Sites 23

24 Lessons Learned from SEMATECH s Proven Consortium Model Need an ambitious national and regional strategy to drive broad collaboration at sufficient scale to: Build R&D and manufacturing infrastructure Provide access to pilot facilities to demonstrate innovations at manufacturing scale Create technology roadmaps and standards Conduct both collaborative and proprietary technology programs SEMATECH has benefited enormously from the shared capabilities at CNSE in Albany, with consistent NY State government support Industry participation in NY will continue to expand across the semiconductor industry s supply chain and into adjacent industries It s all about shared public and private investments in infrastructure and ecosystems 24

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